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WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595
FEATURES
n
n Access Times of 15, 17, 20, 25, 35, 45, 55ns n MIL-STD-883 Compliant Devices Available n
Low Power Data Retention - only available in G2T package type
n Commercial, Industrial and Military Temperature Ranges n 5 Volt Power Supply n Low Power CMOS n TTL Compatible Inputs and Outputs n Built in Decoupling Caps and Multiple Ground Pins for
Packaging
* 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400) * 68 lead, 40mm CQFP (G4T)1, 3.56mm (0.140") (Package 502). * 68 lead, 22.4mm CQFP (G2T)1, 4.57mm (0.180"), (Package 509) * 68 lead, 23.9mm Low Profile CQFP (G1U), 3.57mm (0.140"), (Package 519) * 68 lead, 23.9mm Low Profile CQFP (G1T), 4.06 mm (0.160"), (Package 524) n Organized as 128Kx32; User Configurable as 256Kx16 or 512Kx8
Low Noise Operation
n
Weight: WS128K32-XG1UX - 5 grams typical WS128K32-XG1TX - 5 grams typical WS128K32-XG2TX 1 - 8 grams typical WS128K32-XH1X - 13 grams typical WS128K32-XG4TX1 - 20 grams typical
n All devices are upgradeable to 512Kx32
Note 1: Package Not Recommended For New Design
FIG. 1 PIN CONFIGURATION FOR WS128K32N-XH1X
TOP VIEW
PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs A0-16 WE1-4 CS1-4 OE VCC GND NC Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected
BLOCK DIAGRAM
November 2001 Rev. 9
1
White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com
WS128K32-XXX
FIG. 2 PIN CONFIGURATION FOR WS128K32-XG4TX 1
TOP VIEW PIN DESCRIPTION
I/O0-31 A0-16 WE CS1-4 OE VCC GND NC
Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected
BLOCK DIAGRAM
Note 1: Package Not Recommended For New Design
FIG. 3 PIN CONFIGURATION FOR WS128K32-XG2TX1, WS128K32-XG1TX
TOP VIEW
AND
WS128K32-XG1UX
PIN DESCRIPTION
I/O0-31 A0-16 WE1-4 CS1-4 OE VCC GND NC
Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected
BLOCK DIAGRAM
Note 1: Package Not Recommended For New Design
White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com
2
WS128K32-XXX
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Min Max Unit
TRUTH TABLE
CS H L L L
OE X L X H
WE X H L H
Mode Standby Read Write Out Disable
CAPACITANCE (TA = +25C)
Data I/O High Z Data Out Data In High Z
Power Standby Active Active Active
Operating Temperature Storage Temperature Signal Voltage Relative to GND Junction Temperature Supply Voltage
TA TSTG VG TJ VCC
-55 -65 -0.5
+125 +150 Vcc+0.5 150
C C V C V
-0.5
7.0
RECOMMENDED OPERATING CONDITIONS
Parameter Parameter Symbol Min Max Unit Symbol Conditions Max Unit
OE capacitance WE1-4 capacitance HIP (PGA) H1 CQFP G4 CQFP G2T CQFP G1U/G1T CS1-4 capacitance Data I/O capacitance Address input capacitance
COE CWE
VIN = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz
50 20 50 20 20
pF pF
Supply Voltage Input High Voltage Input Low Voltage Operating Temp. (Mil.)
VCC VIH VIL TA
4.5 2.2 -0.3 -55
5.5 VCC + 0.3 +0.8 +125
V V V C
CCS CI/O CAD
VIN = 0 V, f = 1.0 MHz VI/O = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz
20 20 50
pF pF pF
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS (VCC = 5.0V, GND = 0V, TA = -55C
Parameter Sym Conditions Min -15 Max Min TO
+125C)
-17 Max Min -20 Max Min -25 Max Units
Input Leakage Current Output Leakage Current Operating Supply Current Standby Current Output Low Voltage Output High Voltage
Parameter
ILI ILO ICC ISB VOL VOH
Sym
VCC = 5.5, VIN = GND to VCC CS = VIH, OE = VIH, VOUT = GND to VCC CS = VIL, OE = VIH, f = 5MHz, Vcc = 5.5 CS = VIH, OE = VIH, f = 5MHz, Vcc = 5.5 IOL = 8mA, VCC = 4.5 IOH = -4.0mA, VCC = 4.5
Conditions
10 10 600 80 0.4 2.4 2.4
-35 Min Max
10 10 600 80 0.4 2.4
-45 Min
10 10 600 80 0.4 2.4
-55 Max Min
10 10 600 60 0.4
A A mA mA V V
Units
Max
Input Leakage Current Output Leakage Current Operating Supply Current Standby Current Output Low Voltage
ILI ILO ICC ISB VOL
VCC = 5.5, VIN = GND to VCC CS = VIH, OE = VIH, VOUT = GND to VCC CS = VIL, OE = VIH, f = 5MHz, Vcc = 5.5 CS = VIH, OE = VIH, f = 5MHz, Vcc = 5.5 IOL = 2.1mA, VCC = 4.5 2.4
10 10 600 60 0.4 2.4
10 10 600 60 0.4 2.4
10 10 600 60 0.4
A A mA mA V V
IOH = -1.0mA, VCC = 4.5 Output High Voltage VOH NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V
DATA (TA = -55C
Characteristic Sym TO RETENTION
CHARACTERISTICS*
TO
+125C), (TA = -40C
Conditions
+85C)
Typ Max Units
Min
Data Retention Voltage Data Retention Quiescent Current Chip Disable to Data Retention Time (1)
VCC ICCDR TCDR
VCC = 2.0V CS * VCC -0.2V VIN * VCC -0.2V
2 0 TRC
1 -
2 -
V mA ns ns
or VIN - 0.2V Operation Recovery Time (1) TR NOTE: Parameter guaranteed, but not tested. *Low Power Data Retention available only in G2T Package Type.
3
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WS128K32-XXX
AC CHARACTERISTICS
(VCC = 5.0V, GND = 0V, TA = -55C
Parameter Read Cycle Symbol -15 Min Max -17 Min Max Min -20 Max
TO
+125C)
-35 Max Min Max Min -45 Max -55 Min Max Units
-25 Min
Read Cycle Time Address Access Time Output Hold from Address Change Chip Select Access Time Output Enable to Output Valid Chip Select to Output in Low Z Output Enable to Output in Low Z Chip Disable to Output in High Z Output Disable to Output in High Z
tRC tAA tOH tACS tOE tCLZ 1 tOLZ 1 tCHZ 1 tOHZ 1
15 15 0 15 10 3 0 12 12
17 17 0 17 10 3 0 12 12
20 20 0 20 12 3 0 12 12
25 25 0 25 15 3 0 12 12
35 35 0 35 20 3 0 20 20
45 45 0 45 25 3 0 20 20
55 55 0 55 30 3 0 20 20
ns ns ns ns ns ns ns ns ns
1. This parameter is guaranteed by design but not tested.
AC CHARACTERISTICS
(VCC = 5.0V, GND = 0V, TA = -55C
Parameter Write Cycle Symbol Min -15 Max -17 Min Max Min -20 Max
TO
+125C)
-35 Max Min Max Min -45 Max Min -55 Max Units
-25 Min
Write Cycle Time Chip Select to End of Write Address Valid to End of Write Data Valid to End of Write Write Pulse Width Address Setup Time Address Hold Time Output Active from End of Write Write Enable to Output in High Z Data Hold Time
tWC tCW tAW tDW tWP tAS tAH tOW 1 tWHZ 1 tDH
15 14 14 10 14 0 0 3 10 0
17 14 15 10 14 0 0 3 10 0
20 15 15 12 15 0 0 3 12 0
25 20 20 15 20 0 0 3 15 0
35 25 25 20 25 0 0 4 20 0
45 30 30 25 30 0 0 4
WS128K32-XXX / 55 EDI8C32128C 45
45 25 45 0 0 4 25 25 0
ns ns ns ns ns ns ns ns ns ns
0
1. This parameter is guaranteed by design but not tested.
FIG. 4 AC TEST CIRCUIT
Parameter
AC TEST CONDITIONS
Typ Unit
Input Pulse Levels Input Rise and Fall Input and Output Reference Level Output Timing Reference Level
VIL = 0, VIH = 3.0 5 1.5 1.5
V ns V V
Notes: VZ is programmable from -2V to +7V. IOL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 W. VZ is typically the midpoint of VOH and VOL. IOL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance.
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4
WS128K32-XXX
FIG. 5 TIMING WAVEFORM -
READ C YCLE
FIG. 6
WRITE CYCLE - WE CONTROLLED
FIG. 7 WRITE CYCLE - CS CONTROLLED
WS32K32-XHX
5
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WS128K32-XXX
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 502: 68 LEAD, CERAMIC QUAD FL AT PACK, LOW PROFILE CQFP (G4T)1
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES Note 1: Package Not Recommended For New Design
White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com
6
WS128K32-XXX
PACKAGE 509: 68 LEAD, LOW PROFILE CERAMIC QUAD FL AT PACK, CQFP (G2T)1
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES Note 1: Package Not Recommended For New Design
PACKAGE 519:
68 LEAD, CERAMIC QUAD FL AT PACK, LOW PROFILE CQFP (G1U)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
7
White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com
WS128K32-XXX
PACKAGE 524:
68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G1T)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com
8
WS128K32-XXX
ORDERING INFORMATION
WS
128K 32 X - XXX X X X
LEAD FINISH:
Blank = Gold plated leads A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant M = Military Screened -55C to +125C I = Industrial -40C to +85C C = Commercial 0C to +70C
PACKAGE TYPE:
H1= 1.075" sq. Ceramic Hex-In-line Package, HIP (Package 400) G2T 1 = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 509) G1U = 23.9mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 519) G1T = 23.9mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 524) G4T1 = 40 mm Low Profile CQFP (Package 502)
ACCESS TIME (ns) IMPROVEMENT MARK:
N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrades L = Low Power *
ORGANIZATION, 128Kx32
User configurable as 256Kx16 or 512Kx8
SRAM WHITE ELECTRONIC DESIGNS CORPORATION
* Low Power Data Retention only available in G2T Package Type Note 1: Package Not Recommended For New Design
9
White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com
WS128K32-XXX
DEVICE TYPE
128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module
SPEED
55ns 45ns 35ns 25ns 20ns 17ns 15ns 55ns 45ns 35ns 25ns 20ns 17ns 15ns 55ns 45ns 35ns 25ns 20ns 17ns 15ns 55ns 45ns 35ns 25ns 20ns 17ns 15ns
PACKAGE
66 pin HIP (H1) 66 pin HIP (H1) 66 pin HIP (H1) 66 pin HIP (H1) 66 pin HIP (H1) 66 pin HIP (H1) 66 pin HIP (H1) 68 lead CQFP Low Profile (G4T)1 68 lead CQFP Low Profile (G4T) 68 lead CQFP Low Profile (G4T) 68 lead CQFP Low Profile (G4T) 68 lead CQFP Low Profile (G4T)
1 1 1 1
SMD NO.
5962-93187 05H4X 5962-93187 06H4X 5962-93187 07H4X 5962-93187 08H4X 5962-93187 09H4X 5962-93187 10H4X 5962-93187 11H4X 5962-95595 05HYX1 5962-95595 06HYX1 5962-95595 07HYX1 5962-95595 08HYX1 5962-95595 09HYX1 5962-95595 10HYX1 5962-95595 11HYX1 5962-95595 05HMX1 5962-95595 06HMX1 5962-95595 07HMX1 5962-95595 08HMX1 5962-95595 09HMX1 5962-95595 10HMX1 5962-95595 11HMX1 5962-95595 05H9X 5962-95595 06H9X 5962-95595 07H9X 5962-95595 08H9X 5962-95595 09H9X 5962-95595 10H9X 5962-95595 11H9X
Note 1: Package Not Recommended For New Design
68 lead CQFP Low Profile (G4T)1 68 lead CQFP Low Profile (G4T)1 68 lead CQFP/J (G2T)1 68 lead CQFP/J (G2T)
1
68 lead CQFP/J (G2T)1 68 lead CQFP/J (G2T)1 68 lead CQFP/J (G2T) 68 lead CQFP/J (G2T) 68 lead CQFP/J (G2T) 68 lead CQFP/J(G1U) 68 lead CQFP/J (G1U) 68 lead CQFP/J (G1U) 68 lead CQFP/J (G1U) 68 lead CQFP/J (G1U) 68 lead CQFP/J (G1U) 68 lead CQFP/J (G1U)
1 1 1
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