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NTD3055-094 Advance Information Power MOSFET 12 Amps, 60 Volts
N-Channel DPAK
Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls and bridge circuits.
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Lower RDS(on) Lower VDS(on) Lower and Tighter VSD Lower Diode Reverse Recovery Time Lower Reverse Recovery Stored Charge Power Supplies Converters Power Motor Controls Bridge Circuits
12 3
12 AMPERES 60 VOLTS RDS(on) = 94 m
N-Channel D
Typical Applications
G S 4 4
MAXIMUM RATINGS (TJ = 25C unless otherwise noted)
Rating Drain-to-Source Voltage Drain-to-Gate Voltage (RGS = 10 M) Gate-to-Source Voltage - Continuous - Non-Repetitive (tpv10 ms) Drain Current - Continuous @ TA = 25C - Continuous @ TA = 100C - Single Pulse (tpv10 s) Total Power Dissipation @ TA = 25C Derate above 25C Total Power Dissipation @ TA = 25C (Note 1.) Total Power Dissipation @ TA = 25C (Note 2.) Operating and Storage Temperature Range Single Pulse Drain-to-Source Avalanche Energy - Starting TJ = 25C (VDD = 25 Vdc, VGS = 10 Vdc, L = 1.0 mH IL(pk) = 11 A, VDS = 60 Vdc) Thermal Resistance - Junction-to-Case - Junction-to-Ambient (Note 1.) - Junction-to-Ambient (Note 2.) Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds Symbol VDSS VDGR VGS VGS ID ID IDM PD Value 60 60 "20 "30 12 10 45 48 0.32 2.1 1.5 -55 to +175 61 Adc Apk W W/C W W C mJ Unit Vdc Vdc Vdc
1
2
3
CASE 369A DPAK (Bent Lead) STYLE 2 NTD3055-094 Y WW
CASE 369 DPAK (Straight Lead) STYLE 2 = Device Code = Year = Work Week
MARKING DIAGRAMS & PIN ASSIGNMENTS
4 Drain 4 Drain YWW NTD 3055-094 1 Gate 2 Drain 3 Source 1 Gate 2 Drain YWW NTD 3055-094
TJ, Tstg EAS
RJC RJA RJA TL
3.13 71.4 100 260
C/W
3 Source
C
ORDERING INFORMATION
Device NTD3055-094 Package DPAK Shipping 75 Units/Rail 75 Units/Rail 2500 Tape & Reel
1. When surface mounted to an FR4 board using 1 pad size, (Cu Area 1.127 in2). 2. When surface mounted to an FR4 board using the minimum recommended pad size, (Cu Area 0.412 in2).
This document contains information on a new product. Specifications and information herein are subject to change without notice.
DPAK NTD3055-094-1 Straight Lead NTD3055-094T4 DPAK
(c) Semiconductor Components Industries, LLC, 2001
1
March, 2001 - Rev. 1
Publication Order Number: NTD3055-094/D
NTD3055-094
ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted)
Characteristic OFF CHARACTERISTICS Drain-to-Source Breakdown Voltage (Note 3.) (VGS = 0 Vdc, ID = 250 Adc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current (VDS = 60 Vdc, VGS = 0 Vdc) (VDS = 60 Vdc, VGS = 0 Vdc, TJ = 150C) Gate-Body Leakage Current (VGS = 20 Vdc, VDS = 0 Vdc) ON CHARACTERISTICS (Note 3.) Gate Threshold Voltage (Note 3.) (VDS = VGS, ID = 250 Adc) Threshold Temperature Coefficient (Negative) Static Drain-to-Source On-Resistance (Note 3.) (VGS = 10 Vdc, ID = 6.0 Adc) Static Drain-to-Source On-Voltage (Note 3.) (VGS = 10 Vdc, ID = 12 Adc) (VGS = 10 Vdc, ID = 6.0 Adc, TJ = 150C) Forward Transconductance (Note 3.) (VDS = 7.0 Vdc, ID = 6.0 Adc) DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Transfer Capacitance SWITCHING CHARACTERISTICS (Note 4.) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Gate Charge (VDS = 48 Vdc, ID = 12 Adc, Vd Ad VGS = 10 Vdc) (Note 3.) SOURCE-DRAIN DIODE CHARACTERISTICS Forward On-Voltage Reverse Recovery Time (IS = 12 Adc, VGS = 0 Vdc, Ad Vd dIS/dt = 100 A/s) (Note 3.) Reverse Recovery Stored Charge 3. Pulse Test: Pulse Width 300 s, Duty Cycle 2%. 4. Switching characteristics are independent of operating junction temperatures. (IS = 12 Adc, VGS = 0 Vdc) (Note 3.) (IS = 12 Adc, VGS = 0 Vdc, TJ = 150C) VSD trr ta tb QRR - - - - - - 0.94 0.82 33.1 24 8.9 0.047 1.15 - - - - - C Vdc ns (VDD = 48 Vdc, ID = 12 Adc, VGS = 10 Vdc, RG = 9.1 ) (Note 3.) td(on) tr td(off) tf QT Q1 Q2 - - - - - - - 7.7 32.3 25.2 23.9 10.9 3.1 4.2 15 70 50 50 20 - - nC ns (VDS = 25 Vd VGS = 0 Vdc, Vdc, Vd f = 1.0 MHz) Ciss Coss Crss - - - 323 107 34 450 150 70 pF VGS(th) 2.0 - RDS(on) - VDS(on) - - gFS - 0.85 0.77 6.7 1.35 - - mhos 84 94 Vdc 2.9 6.3 4.0 - Vdc mV/C mOhm V(BR)DSS 60 - IDSS - - IGSS - - - - 1.0 10 100 nAdc 68 54.4 - - Vdc mV/C Adc Symbol Min Typ Max Unit
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NTD3055-094
PACKAGE DIMENSIONS
DPAK CASE 369A-13 ISSUE AA
SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G H J K L R S U V Z INCHES MIN MAX 0.235 0.250 0.250 0.265 0.086 0.094 0.027 0.035 0.033 0.040 0.037 0.047 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.175 0.215 0.020 0.050 0.020 --0.030 0.050 0.138 --MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.84 1.01 0.94 1.19 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.45 5.46 0.51 1.27 0.51 --0.77 1.27 3.51 ---
-T- B V R
4
C E
A S
1 2 3
Z U
K F L D G
2 PL
J H 0.13 (0.005)
M
T
STYLE 2: PIN 1. 2. 3. 4.
GATE DRAIN SOURCE DRAIN
DPAK CASE 369-07 ISSUE M
B V R
4
C E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G H J K R S V INCHES MIN MAX 0.235 0.250 0.250 0.265 0.086 0.094 0.027 0.035 0.033 0.040 0.037 0.047 0.090 BSC 0.034 0.040 0.018 0.023 0.350 0.380 0.175 0.215 0.050 0.090 0.030 0.050 MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.84 1.01 0.94 1.19 2.29 BSC 0.87 1.01 0.46 0.58 8.89 9.65 4.45 5.46 1.27 2.28 0.77 1.27
A
1 2 3
S -T-
SEATING PLANE
K
F D G
3 PL M
J H 0.13 (0.005) T
STYLE 2: PIN 1. 2. 3. 4.
GATE DRAIN SOURCE DRAIN
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NTD3055-094
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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NTD3055-094/D

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