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 ZigBitTM 700/800/900 MHz Wireless Modules
....................................................................................................................
ATZB-900-B0
Datasheet
8227C-MCU Wireless-06/09
ZigBitTM 700/800/900 MHz Wireless Modules
1-2
8227C-MCU Wireless-06/09
Section 1
1.1 1.2 1.3 1.4 1.5 1.6 Summary............................................................................................................................ 1-1 Applications........................................................................................................................ 1-1 Key Features...................................................................................................................... 1-2 Benefits .............................................................................................................................. 1-2 Abbreviations and Acronyms ............................................................................................. 1-2 Related Documents............................................................................................................ 1-3
Section 2
2.1 Overview ............................................................................................................................ 2-1
Section 3
3.1 Electrical Characteristics.................................................................................................... 3-3 3.1.1 3.1.2 3.1.3 3.1.4 3.1.5 3.2 3.3 3.4 3.5 3.6 Absolute Maximum Ratings ................................................................................. 3-3 Test Conditions .................................................................................................... 3-3 RF Characteristics ............................................................................................... 3-4 ATmega1281V Microcontroller Characteristics ................................................... 3-4 Module Interfaces characteristics ........................................................................ 3-5
Physical/Environmental Characteristics and Outline.......................................................... 3-5 Pin Configuration................................................................................................................ 3-6 Mounting Information ......................................................................................................... 3-9 Soldering Profile............................................................................................................... 3-10 Antenna Reference Design .............................................................................................. 3-10 3.6.1 General recommendations ................................................................................ 3-11
Section 4
4.1 Ordering Information ........................................................................................................ 4-12
ZigBitTM 700/800/900 MHz Wireless Modules
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Section 1 Introduction
1.1 Summary
ZigBit TM 900 is an ultra-compact, extended range, low-power, high-sensitivity 784/868/915 MHz IEEE 802.15.4/ZigBee(R) OEM module, based on the innovative Atmel's mixed-signal hardware platform. It is designed for wireless sensing, control and data acquisition applications. ZigBit modules eliminate the need for costly and time-consuming RF development, and shortens time to market for a wide range of wireless applications. This module is the latest addition to the ZigBit family also represented by 2.4 GHz modules ATZB-24A2/B0 [1], and ATZB-A24-UFL/U0 [3].
1.2
Applications
ZigBit 900 module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, self-organizing mesh network, while optimizing network traffic and minimizing power consumption. Atmel offers two stack configurations: BitCloud and SerialNet. BitCloud is a ZigBee PRO certified software development platform supporting reliable, scalable, and secure wireless applications running on Atmel's ZigBit modules. SerialNet allows programming of the module via serial AT-command interface. The applications include, but are not limited to: * Building automation & monitoring
- Lighting controls - Wireless smoke and CO detectors - Structural integrity monitoring HVAC monitoring & control Inventory management Environmental monitoring Security Water metering Industrial monitoring - Machinery condition and performance monitoring - Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity, vibration, etc. Automated meter reading (AMR)
* * * * * *
*
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Introduction
1.3
Key Features
* * * * * * *
Ultra compact size (18.8 x 13.5 mm) High RX sensitivity (-110 dBm) Outperforming link budget (120 dB) Up to 11 dBm output power Very low power consumption (< 6 A in Sleep mode) Ample memory resources (128K bytes of flash memory, 8K bytes RAM, 4K bytes EEPROM) Wide range of interfaces (both analog and digital): - 9 spare GPIO, 2 spare IRQ lines - 4 ADC lines + 1 line for supply voltage control (up to 9 lines with JTAG disabled) - UART with CTS/RTS control - USART - I2C - SPI - 1-Wire - Up to 30 lines configurable as GPIO Capability to write own MAC address into the EEPROM Optional antenna reference designs IEEE 802.15.4 compliant transceiver 868 / 915 MHz band 784 MHz Chinese band BitCloud embedded software, including serial bootloader and AT command set
* * * * * *
1.4
Benefits
* * * * * *
Over 6 km (4 miles) outdoor line-of-sight range Small physical footprint and low profile for optimum fit in even the smallest of devices(1) Extended battery life Mesh networking capability Easy-to-use low cost Evaluation Kit Single source of support for HW and SW
Note:
1. The module is to be certified
1.5
Abbreviations and Acronyms
ADC API BPSK DC DTR EEPROM ESD
Analog-to -Digital Converter Application Programming Interface Binary Phase-Shift Keying modulation scheme Direct Current Data Terminal Ready Electrically Erasable Programmable Read-Only Memory Electrostatic Discharge
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Introduction
GPIO HVAC HW I2C IEEE IRQ ISM JTAG MAC MCU O-QPSK OEM OTA PCB PER RAM RF RTS/CTS RX SMA SPI SW TTM TX UART USART USB ZDK ZigBee, ZigBee PRO 802.15.4 General Purpose Input/Output Heating, Ventilating and Air Conditioning Hardware Inter-Integrated Circuit Institute of Electrical and Electrionics Engineers Interrupt Request Industrial, Scientific and Medical radio band Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard interface Medium Access Control layer Microcontroller Unit. In this document it also means the processor, which is the core of ZigBit module Offset Quadrature Phase-Shift Keying modulation scheme Original Equipment Manufacturer Over-The-Air upgrade Printed Circuit Board Package Error Ratio Random Access Memory Radio Frequency Request to Send/ Clear to Send Receiver Surface Mount Assembly Serial Peripheral Interface Software Time To Market Transmitter Universal Asynchronous Receiver/Transmitter Universal Synchronous/Asynchronous Receiver/Transmitter Universal Serial Bus ZigBit Development Kit Wireless networking standards targeted at low-power applications The IEEE 802.15.4-2006 standard applicable to low-rate wireless Personal Area Network
1.6
Related Documents
[1] ZigBitTM 2.4 GHz Wireless Modules ATZB-24-A2/B0 Datasheet. Atmel's doc8226.pdf [2] ZigBitTM Development Kit. User Guide. MeshNetics Doc. S-ZDK-451 - TBD [3] ZigBitTM Amplified 2.4 GHz Wireless Modules datasheet. Atmel's doc8228.pdf
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Introduction [4] Atmel 8-bit AVR Microcontroller with 64K/128K/256K Bytes In-System Programmable Flash. 2549F AVR 04/06 [5] Atmel AT86RF212 Low Power 800/900 MHz Transceiver for IEEE 802.15.4b, Zigbee, and ISM Applications. Preliminary specification [6] Ultra Small Surface Mount Coaxial Connectors - Low Profile 1.9mm or 2.4mm Mated Height. http://www.hirose.co.jp/cataloge_hp/e32119372.pdf [7] ZigBit 900 Development Kit. User's Guide. MeshNetics Doc. S-ZDK-451~03 TBD [8] IEEE Std 802.15.4-2006 IEEE Standard for Information technology - Part 15.4 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) [9] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007 [10] BitCloudTM IEEE 802.15.4/ZigBee Software. AVR2050: BitCloud User Guide. Atmel's doc8199.pdf
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Section 2 ZigbitTM700/800/900 MHz Wireless Modules Overview
2.1 Overview
ZigBit 900 is an extended-range low-power, a low-power, high-sensitivity IEEE 802.15.4/ ZigBee-compliant OEM module, which occupies less than a square inch. Based on a solid combination of Atmel's latest MCU Wireless hardware platform [5], power amplifier and low-noise amplifier, the ZigBit 900 offers superior radio performance, ultra-low power consumption and exceptional ease of integration. Figure 2-1. ATZB-900-B0 Block Diagram
VCC (1.8 - 3.6V)
IRQ UART USART/SPI I2C JTAG ANALOG
ATmega1281
AT86RF212 RF Tranceiver
RF I/O
GPIO
SPI Bus
ZigBit 900 contains Atmel's ATmega1281V Microcontroller [4] and AT86RF212 RF Transceiver [5]. The module features 128 Kbytes flash memory and 8 Kbytes RAM. The ZigBit 900 already contains a complete RF/MCU-related design with all the necessary passive components included. The module can be easily mounted on a simple 2-layer PCB with a minimum of required external connection. Compared to a custom RF/MCU design, a module-based solution offers considerable savings in development time and NRE cost per unit during the design, prototyping, and mass production phases of product development. To jumpstart evaluation and development, Atmel also offers a complete set of evaluation and development tools. The new ZigBit 900 Development Kit [7] comes with everything you need to create custom applications featuring ZigBit 900 module. The kit features MeshBean development boards (ATZB-EVB-900-SMA) with an easy-to-access extension connector for attaching third party sensors and other peripherals, and a JTAG connector for easy application uploading and debugging. The kit also includes reference applications to speed up application development, source code for hardware interface layer and reference drivers for the all the module interfaces, intuitive development environment from Atmel, and comprehensive set of application notes and product documentation.
ZigBitTM 700/800/900 MHz Wireless Modules
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ZigbitTM700/800/900 MHz Wireless Modules Overview ZigBit 900 modules come bundled with BitCloud, a 2nd generation embedded software stack from Atmel. BitCloud is fully compliant with ZigBee PRO and ZigBee standards for wireless sensing and control [8], [9], [10] and it provides an augmented set of APIs which, while maintaining 100% compliance with the standard, offer extended functionality designed with developer's convenience and ease-of-use in mind. Depending on end-user design requirements, ZigBit 900 can operate as a self-contained sensor node, where it would function as a single MCU, or it can be paired with a host processor driving the module over a serial interface. In the former case, a user application may be used with the BitCloud software allowing customization of embedded applications through BitCloud's C API. In the latter case, the host processor controls data transmission and manages module peripherals via an extensive set of SerialNet AT commands. Thus, no firmware customization is required for a successful module design-in. Additionally, third-party sensors can be connected directly to the module, thus expanding the existing set of peripheral interfaces.
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Section 3 Specifications
3.1
3.1.1
Electrical Characteristics
Absolute Maximum Ratings
Table 3-1. Absolute Maximum Ratings(1)(2)
Parameters Voltage on any pin, except RESET with respect to Ground DC Current per I/O Pin DC Current DVCC and DGND pins Input RF Level Notes: Min -0.5V Max VCC + 0.5V 40 mA 300 mA +5 dBm
1. Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no circumstances must the absolute maximum ratings given in this table be violated. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only. Functional operation of the device at these or other conditions, beyond those indicated in the operational sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. Attention! ZigBit 900 is an ESD-sensitive device. Precaution should be taken when handling the device in order to prevent permanent damage.
3.1.2
Test Conditions
Table 3-2. Test conditions (unless otherwise stated), VCC = 3V, Tamb = 25C
Parameters Supply Voltage, VCC Current Consumption: RX mode Current Consumption: TX mode
(1) (1) (1)
Condition
Range 1.8 to 3.6 15
Unit V mA mA A
PTX = 5 dBm
20 6
Current Consumption: Power-save mode Note: 1. Preliminary data
Current consumption actually depends on multiple factors, including but not limited to, the board design and materials, BitCloud settings, network activity, EEPROM read/write operations. It also depends on MCU load and/or peripherals used by an application.
ZigBitTM 700/800/900 MHz Wireless Modules
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Specifications 3.1.3 RF Characteristics
Table 3-3. RF Characteristics
Parameters Frequency Band Number of Channels Channel Spacing Transmitter Output Power Receiver Sensitivity 20 kbit/s 40 kbit/s
(2) (2) (2) (2)
Condition
Range 779 to 787 868 to 868.6 902 to 928 15 2 -11 to +11
Unit MHz
MHz dBm
AWGN channel, PER = 1% -110 -108 PSDU length of 20 octets -101 -100 dBm -97 -90 PSDU length of 127 octets -97 -92 BPSK modulation 20 (at 868 MHz), 40 (at 915 MHz) 100 (at 868 MHz) 250 (at 915 MHz and 784 MHz) 100 6 kbps
100 kbit/s 250 kbit/s 200 kbit/s 400 kbit/s 500 kbit/s
1000 kbit/s
On-Air Data Rate O-QPSK modulation TX Output/ RX Input Nominal Impedance Range, outdoors Notes:
(1)
For balanced output For balanced output
km
1. Preliminary data 2. IEEE 802.15.4-2006 compliant
3.1.4
ATmega1281V Microcontroller Characteristics
Table 3-4. ATmega1281V Characteristics
Parameters On-chip Flash Memory size On-chip RAM size On-chip EEPROM size Operation Frequency Condition Range 128 8 4 4 Unit Kbytes Kbytes Kbytes MHz
ZigBitTM 700/800/900 MHz Wireless Modules
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Specifications
3.1.5
Module Interfaces characteristics
Table 3-5. Module Interfaces characteristics
Parameters UART Maximum Baud Rate ADC Resolution/ Conversion Time ADC Input Resistance ADC Reference Voltage (VREF) ADC Input Voltage I C Maximum Clock GPIO Output Voltage (High/Low) Real Time Oscillator Frequency -10/ 5 mA, VCC=3V
2
Condition
Range 38.4
Unit kbps Bits/s M V V kHz V kHz
In the single conversion mode
10/200 >1 1.0 to VCC - 3 0 - VREF 222 2.3/ 0.5 32.768
3.2
Physical/Environmental Characteristics and Outline
Parameters Size Operating Temperature Range Operating Relative Humidity Range Note:
Value 18.8 x 13.5 x 2.0 mm -20C to +70C no more than 80%
Comments ATZB-900-B0 -40C to +85C operational(1)
1. Minor degration of clock stability may occur.
Figure 3-1.
ATZB-900-B0 Mechanical drawing
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Specifications
3.3
Pin Configuration
Figure 3-2. ATZB-900-B0 Pinout
Table 3-6. Pin descriptions
Connector Pin 1 2 3 4 5 6 7 8 9,22,23 Default State after Power on
Pin Name SPI_CLK SPI_MISO SPI_MOSI GPIO0 GPIO1 GPIO2 OSC32K_OUT RESET DGND
Description Reserved for stack operation
(4)
I/O O I/O I/O I/O I/O I/O O
Reserved for stack operation(4) Reserved for stack operation(4) General Purpose digital Input/Output 0 General Purpose digital Input/Output 1 General Purpose digital Input/Output 2 32.768 kHz clock output(4)(5) Reset input (active low) Digital Ground RF clock output. When module is in active state, 4 MHz signal is present on this line. While module is in the sleeping state, clock generation is also stopped(4). I2C serial clock output(2)(3)(4)(7) I C serial clock input/output UART transmit output
2
(2)(3)(4)(7) (2)(3)(4)(7) (2)(3)(4)(7)
tri-state tri-state tri-state
(4)
10
CPU_CLK
O
11 12 13 14 15
I2C_CLK I2C_DATA UART_TXD UART_RXD UART_RTS
O I/O O I I
tri-state tri-state tri-state tri-state tri-state
(2)(3)(4)(7)
(1)(2)(3)(4)(7)
UART receive input(1)(2)(3)(4)(7) RTS input (Request To send) for UART hardware flow control. Active low(2)(3)(4)(7)
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Specifications Table 3-6. Pin descriptions (Continued)
Connector Pin 16 17 18 19 20 21 24,25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44,46,48 45 47 Notes: Default State after Power on tri-state tri-state tri-state tri-state tri-state tri-state
Pin Name UART_CTS GPIO6 GPIO7 GPIO3 GPIO4 GPIO5 D_VCC JTAG_TMS JTAG_TDI JTAG_TDO JTAG_TCK ADC_INPUT_3 ADC_INPUT_2 ADC_INPUT_1 BAT A_VREF AGND GPIO_1WR UART_DTR USART0_RXD USART0_TXD USART0_EXTCLK GPIO8 IRQ_7 IRQ_6 RF GND RFP_IO RFN_IO
Description CTS output (Clear To send) for UART hardware flow control. Active low(2)(3)(4)(7) General Purpose digital Input/Output 6(2)(3)(4)(7) General Purpose digital Input/Output 7 General Purpose digital Input/Output 3
(2)(3)(4)(7) (2)(3)(4)(7)
I/O O I/O I/O I/O I/O I/O
General Purpose digital Input/Output 4(2)(3)(4)(7) General Purpose digital Input/Output 5 Digital Supply Voltage (VCC)
(9) (2)(3)(4)(7)
JTAG Test Mode Select(2)(3)(4)(6) JTAG Test Data Input
(2)(3)(4)(6) (2)(3)(4)(6)
I I O I I I I I I/O tri-state tri-state tri-state tri-state tri-state
JTAG Test Data Output JTAG Test Clock
(2)(3)(4)(6) (2)(3)(7)
ADC Input Channel 3
ADC Input Channel 2(2)(3)(7) ADC Input Channel 1(2)(3)(7) ADC Input Channel 0, used for battery level measurement. This pin equals VCC/3.(2)(3)(7) Input/Output reference voltage for ADC Analog ground 1-wire interface(2)(3)(4)(7) DTR input (Data Terminal Ready) for UART. Active low(2)(3)(4)(7) USART/SPI Receive pin(2)(3)(4)(7) USART /SPI Transmit pin
(2)(3)(4)(7) (2)(3)(4)(7)
I/O I I O I/O I/O I I tri-state tri-state tri-state tri-state tri-state tri-state tri-state
USART/SPI External Clock
General Purpose Digital Input/Output 8(2)(3)(4)(7) Digital Input Interrupt request 7(2)(3)(4)(7) Digital Input Interrupt request 6 RF Analog Ground Differential RF Input/Output Differential RF Input/Output
(2)(3)(4)(7)
I/O I/O
1. The UART_TXD pin is intended for input (i.e. its designation as "TXD" implies some complex system containing ZigBit 900 as its RF terminal unit), while UART_RXD pin, vice versa, is for output. 2. Most of pins can be configured for general purpose I/O or for some alternate functions as described in details in the ATmega1281V Datasheet [1]. 3. GPIO pins can be programmed either for output, or for input with/without pull-up resistors. Output pin drivers are strong enough to drive LED displays directly (refer to figures on pages 387-388, [1]). 4. All digital pins are provided with protection diodes to D_VCC and DGND
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Specifications
5. It is strongly recommended to avoid assigning an alternate function for OSC32K_OUT pin because it is used by BitCloud. However, this signal can be used if another peripheral or host processor requires 32.768 kHz clock, otherwise this pin can be disconnected. 6. Normally, JTAG_TMS, JTAG_TDI, JTAG_TDO, JTAG_TCK pins are used for on-chip debugging and flash burning. They can be used for A/D conversion if JTAGEN fuse is disabled. 7. The following pins can be configured with the BitCloud software to be general-purpose I/O lines: GPIO0, GPIO1, GPIO2, GPIO3, GPIO4, GPIO5, GPIO6, GPIO7, GPIO8, GPIO_1WR, I2C_CLK, I2C_DATA, UART_TXD, UART_RXD, UART_RTS, UART_CTS, ADC_INPUT_3, ADC_INPUT_2, ADC_INPUT_1, BAT, UART_DTR, USART0_RXD, USART0_TXD, USART0_EXTCLK, IRQ_7, IRQ_6. Additionally, four JTAG lines can be programmed with software as GPIO as well, but this requires changing the fuse bits and will disable JTAG debugging. 8. With BitCloud, CTS pin can be configured to indicate sleep/active condition of the module thus providing mechanism for power management of host processor. If this function is necessary, connection of this pin to external pull-down resistor is recommended to prevent the undesirable transients during module reset process. 9. Using ferrite bead and 1 F capacitor located closely to the power supply pin is recommended, as shown below.
10. In SPI mode, USART0_EXTCLK is output. In USART mode, this pin can be configured as either input or output pin.
ZigBitTM 700/800/900 MHz Wireless Modules
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Specifications Figure 3-3. Typical Reference Schematic
1 2 3 4 5 6 7 RST 8 9 10 11 Host MCU UART_TXD UART_RXD UART_RTS UART_CTS 12 13 14 15 16 17 18 19 20 21 22 23 VCC 1,8..3,6V 24 1uF 25
SPI_CLK SPI_MISO SPI_MOSI GPIO0 GPIO1 GPIO2 OSC32K_OUT RESET DGND CPU_CLK I2C_CLK I2C_DATA UART_TXD UART_RXD UART_RTS UART_CTS GPIO6 GPIO7 GPIO3 GPIO4 GPIO5 DGND DGND D_VCC D_VCC
JTAG_TMS JTAG_TDI JTAG_TDO JTAG_TCK ADC_INPUT_3 ADC_INPUT_2 ADC_INPUT_1 BAT A_VREF AGND GPIO9 UART_DTR USART0_RXD USART0_TXD USART0_EXTCLK GPIO8 IRQ_7 IRQ_6 RF_GND RFP_IO RF_GND RFN_IO RF_GND
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 two capacitors* VCC 100k
5 9 3 1 4 7 8 6 2 10
JTAG_TMS JTAG_TDI JTAG_TDO JTAG_TCK JTAG_VCC NC NC JTAG_RST JTAG_GND JTAG_GND
Balun 0900BL18B100 6 3 5 2 4 1
*) 68 pF GRM 1555C1H101JZ01D
3.4
Mounting Information
The below diagrams show the PCB layout recommended for ZigBit 900 module. Neither via-holes nor wires are allowed on the PCB upper layer in area occupied by the module. As a critical requirement, RF_GND pins should be grounded via several holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and losses.
ZigBitTM 700/800/900 MHz Wireless Modules
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Specifications Figure 3-4. ATZB-900-B0 PCB Recommended Layout, Top View
3.5
Soldering Profile
The J-STD-020C-compliant soldering profile is recommended, as given below.
Table 3-7. Soldering Profile(1)
Profile Feature Average ramp-up rate (217 C to peak) Preheat temperature 175 C 25 C Temperature maintained above 217 C Time within 5 C of actual peak temperature Peak temperature range Ramp-down rate Note: 1. The package is backward compatible with Pb/Sn soldering profile Green Package 3 C/s max. 180 s max. 60 s to 150 s 20 s to 40 s 6 C/s max. 8 minutes max.
3.6
Antenna Reference Design
This section presents PCB design which may be used to combine ZigBit 900 with an external antenna This antenna reference designs is recommended for successful design-in.
ZigBitTM 700/800/900 MHz Wireless Modules
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Specifications Figure 3-5. FCC/CE compliant RF reference design with RP-SMA connector recommended for ATZB-900-B0
Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors are the board material and thickness, shields, the material used for enclosure, the board neighborhood, and other components adjacent to antenna. 3.6.1 General recommendations Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning. Placing high profile components next to antenna should be avoided. Having holes punched around the periphery of the board eliminates parasitic radiation from the board edges also distorting antenna pattern. ZigBit 900 module should not be placed next to the consumer electronics which might interfere with ZigBit 900's RF frequency band. The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna pattern. To eliminate this effect, metalized and grounded holes must be placed around the board's edges.
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Section 4 Ordering Information
4.1 Ordering Information
Part Number ATZB-900-B0R(1) Note:
Description 783/868/915 MHz IEEE802.15.4/ZigBee Wireless Module w/ Balanced RF Port
1. Tape and Reel quantity: 200
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Headquarters
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International
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Product Contact
Web Site www.atmel.com Technical Support avr@atmel.com Sales Contact www.atmel.com/contacts
Literature Requests www.atmel.com/literature
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8227C-MCU Wireless-06/09


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