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PHOTOCOUPLER
PS2513-1,PS2513L-1
HIGH-SPEED SWITCHING/HIGH ISOLATION VOLTAGE -NEPOC PHOTOCOUPLER SERIES
Series-
DESCRIPTION
The PS2513-1 and PS2513L-1 are optically coupled isolators containing a GaAs light emitting diode and an NPN silicon phototransistor. The PS2513-1 is in a plastic DIP (Dual In-line Package) and the PS2513L-1 is lead bending type (Gull-wing) for surface mount.
FEATURES
* High isolation voltage (BV = 5 000 Vr.m.s.) * High collector to emitter voltage (VCEO = 120 V) * Guaranteed maximum switching speed (toff 60 s @ IF = 5 mA, VCC = 5 V, RL = 1.9 k) * High-speed switching (ton = 5 s TYP. @ IF = 5 mA, VCC = 5 V, RL = 1.9 k) (toff = 25 s TYP. @ IF = 5 mA, VCC = 5 V, RL = 1.9 k) * Ordering number of tape product: PS2513L-1-E3, E4, F3, F4 * Safety standards * UL approved: File No. E72422 * DIN EN60747-5-2 (VDE0884 Part2) approved (Option)
APPLICATIONS
* Power supply * Air conditioner * FA equipment
Document No. PN10163EJ03V0DS (3rd edition) Date Published March 2006 CP(K)
The mark
shows major revised points. (c) NEC Compound Semiconductor Devices, Ltd. 2002, 2006
PS2513-1,PS2513L-1
PACKAGE DIMENSIONS (UNIT: mm) DIP Type
PS2513-1
4.60.35 4
TOP VIEW
3 1. Anode 2. Cathode 3. Emitter 4. Collector
6.50.5
1
2 7.62
3.20.4 4.150.4
3.50.3
1.250.15
0 to 15 +0.1 0.25 -0.05 0.500.10 0.25 M 2.54
Lead Bneding Type
PS2513L-1 TOP VIEW
4.60.35 4 3 1. Anode 2. Cathode 3. Emitter 4. Collector 1 2
6.50.5
0.25 +0.1 -0.05
3.50.3
1.250.15 0.25 M 2.54 0.15
0.90.25 9.600.4
2
0.1 +0.1 -0.05
Data Sheet PN10163EJ03V0DS
PS2513-1,PS2513L-1
MARKING EXAMPLE
No. 1 pin Mark
2513 NJ601
Assembly Lot
N
J
6 01
Week Assembled Year Assembled (Last 1 Digit) In-house Code CTR Rank Code
Data Sheet PN10163EJ03V0DS
3
PS2513-1,PS2513L-1
ORDERING INFORMATION
Part Number Order Number Solder Plating Specification PS2513-1 PS2513L-1 PS2513L-1-E3 PS2513L-1-E4 PS2513L-1-F3 PS2513L-1-F4 PS2513-1-V PS2513L-1-V PS2513L-1-V-E3 PS2513L-1-V-E4 PS2513L-1-V-F3 PS2513L-1-V-F4 PS2513-1-A PS2513L-1-A PS2513L-1-E3-A PS2513L-1-E4-A PS2513L-1-F3-A PS2513L-1-F4-A PS2513-1-V-A PS2513L-1-V-A PS2513L-1-V-E3-A PS2513L-1-V-E4-A PS2513L-1-V-F3-A PS2513L-1-V-F4-A Embossed Tape 2 000 pcs/reel Embossed Tape 1 000 pcs/reel Magazine case 100 pcs DIN EN60747-5-2 (VDE0884 Part2) approved products (Option) Embossed Tape 2 000 pcs/reel Embossed Tape 1 000 pcs/reel Pb-Free Magazine case 100 pcs Packing Style Safety Standard Approval Standard products (UL Approved) Application Part Number PS2513-1
*1
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified)
Ratings Parameter Symbol PS2513-1, PS2513L-1 Diode Reverse Voltage Forward Current (DC) Power Dissipation Derating Power Dissipation Peak Forward Current Transistor
*1
Unit
VR IF
6 60 1.5 150 1 120 6 30 1.5 150 5 000 -55 to +100 -55 to +150
V mA mW/C mW A V V mA mW/C mW Vr.m.s. C C
PD/C
PD IFP VCEO VECO IC
Collector to Emitter Voltage Emitter to Collector Voltage Collector Current Power Dissipation Derating Power Dissipation
PC/C
PC BV TA Tstg
Isolation Voltage
*2
Operating Ambient Temperature Storage Temperature
*1 PW = 100 s, Duty Cycle = 1% *2 AC voltage for 1 minute at TA = 25C, RH = 60% between input and output Pins 1-2 shorted together, 3-4 shorted together.
4
Data Sheet PN10163EJ03V0DS
PS2513-1,PS2513L-1
ELECTRICAL CHARACTERISTICS (TA = 25C)
Parameter Diode Forward Voltage Reverse Current Terminal Capacitance Transistor Collector to Emitter Dark Current Coupled Current Transfer Ratio (IC/IF) Collector Saturation Voltage Isolation Resistance Isolation Capacitance Rise Time Fall Time
*1
Symbol VF IR Ct ICEO IF = 5 mA VR = 5 V
Conditions
MIN.
TYP. 1.1
MAX. 1.3 5
Unit V
A
pF
V = 0 V, f = 1.0 MHz VCE = 120 V, IF = 0 mA
30 100
nA
CTR1 CTR2 VCE(sat)
IF = 1 mA, VCE = 5 V IF = 5 mA, VCE = 5 V IF = 10 mA, IC = 2 mA
25 50
75 125
100 200 0.3
% % V
RI-O CI-O tr tf
VI-O = 1.0 kVDC V = 0 V, f = 1.0 MHz VCC = 5 V, IC = 2 mA, RL = 100
10
11
0.5 3 4
pF
s
*1 *1 *1
Turn-on Time
ton toff
VCC = 5 V, IF = 5 mA, RL = 1.9 k
5 25
60 60
s
Turn-off Time
*1 Test circuit for switching time
Pulse Input IF VCC
PW = 100 s Duty Cycle = 1/10 VOUT RL = 100 , 1.9 k
50
Data Sheet PN10163EJ03V0DS
5
PS2513-1,PS2513L-1
TYPICAL CHARACTERISTICS (TA = 25C, unless otherwise specified)
DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE
Transistor Power Dissipation PC (mW)
TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE
175 150 125 100 75 50 25 0 25 50 75 100 125
175
Diode Power Dissipation PD (mW)
150 125 100 75 50 25 0 25 50 75 100 125
Ambient Temperature TA (C)
Ambient Temperature TA (C)
FORWARD CURRENT vs. FORWARD VOLTAGE
100 50
Forward Current IF (mA)
COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE
35
Collector Current IC (mA)
TA = +100C +60C +25C
30 25 20 15 10 5
50 mA
10 5 0C -25C -55C
20
mA
1 0.5
10 m
A
IF = 5 mA
0.1 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5
0
2
4
6
8
10
Forward Voltage VF (V)
Collector to Emitter Voltage VCE (V)
COLLECTOR TO EMITTER DARK CURRENT vs. AMBIENT TEMPERATURE
Collector to Emitter Dark Current ICEO (nA)
COLLECTOR CURRENT vs. COLLECTOR SATURATION VOLTAGE
40
10 000
Collector Current IC (mA)
1 000
VCE = 5 V 10 V 24 V 40 V 120 V
10 5
20 mA 10 mA 5 mA 2 mA
100
1 0.5
IF = 1 mA
10
1 - 50 -25 0 25 50 75 100
0.1 0
0.2
0.4
0.6
0.8
1.0
Ambient Temperature TA (C)
Collector Saturation Voltage VCE(sat) (V)
Remark The graphs indicate nominal characteristics.
6
Data Sheet PN10163EJ03V0DS
PS2513-1,PS2513L-1
NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE
Normalized Current Transfer Ratio CTR Current Transfer Ratio CTR (%)
CURRENT TRANSFER RATIO vs. FORWARD CURRENT
250 VCC = 5 V, n=3 200 Sample A B C
;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;; 1.0 ;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;; 0.8 ;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;; 0.6
1.2 0.4 0.2 0 Normalized to 1.0 at TA = 25C, IF = 5 mA, VCE = 5 V -50 -25 0 25 50 75 100
150
100
50 0 0.1
0.5
1
5
10
50
Ambient Temperature TA (C)
Forward Current IF (mA)
SWITCHING TIME vs. LOAD RESISTANCE
100 IC = 2 mA, VCC = 10 V, CTR = 130% 1 000
SWITCHING TIME vs. LOAD RESISTANCE
IF = 5 mA, VCC = 5 V, CTR = 130% tr tf td
tf
Switching Time t ( s)
10
Switching Time t ( s)
100
ts
1
ts
10
0.1 10
50 100
500 1 k
5 k 10 k
1 1k
tr td 5k 10 k 50 k 100 k
Load Resistance RL ()
Load Resistance RL ()
TURN-ON TIME vs. AMBIENT TEMPERATURE
10 IF = 5 mA, VCC = 5 V, RL = 1.9 k, CTR = 150% 100
TURN-OFF TIME vs. AMBIENT TEMPERATURE
IF = 5 mA, VCC = 5 V, 80 RL = 1.9 k, CTR = 150% 60
Turn-on Time ton ( s)
6
4
Turn-off Time toff ( s)
0 25 50 75 100
8
40
2
20
0 -50
-25
0 -50
-25
0
25
50
75
100
Ambient Temperature TA (C)
Ambient Temperature TA (C)
Remark The graphs indicate nominal characteristics.
Data Sheet PN10163EJ03V0DS
7
PS2513-1,PS2513L-1
LONG TERM CTR DEGRADATION
1.2 TYP. 1.0
CTR (Relative Value)
0.8 0.6 0.4 0.2 0
IF = 5 mA TA = 25C IF = 5 mA TA = 60C
102
103 Time (Hr)
104
105
Remark The graph indicates nominal characteristics.
8
Data Sheet PN10163EJ03V0DS
PS2513-1,PS2513L-1
TAPING SPECIFICATIONS (UNIT: mm)
Outline and Dimensions (Tape)
2.00.1 4.00.1
1.750.1
1.5 +0.1 -0
4.5 MAX.
16.00.3
7.50.1
1.550.1
8.00.1
10.30.1
5.30.1
4.00.1 0.4
Tape Direction
PS2513L-1-E3 PS2513L-1-E4
Outline and Dimensions (Reel)
2.00.5
2.00.5 13.00.2
R 1.0
21.00.8
80.01.0
2542.0
17.51.0 21.51.0
Packing: 1 000 pcs/reel
15.9 to 19.4 Outer edge of flange
Data Sheet PN10163EJ03V0DS
9
PS2513-1,PS2513L-1
Outline and Dimensions (Tape)
2.00.1 4.00.1
1.750.1
1.5 +0.1 -0
4.5 MAX.
16.00.3
7.50.1
1.550.1
8.00.1
10.30.1
5.30.1
4.00.1 0.4
Tape Direction
PS2513L-1-F3 PS2513L-1-F4
Outline and Dimensions (Reel)
2.00.5
2.00.5 13.00.2
R 1.0
21.00.8
3302.0
1001.0
17.51.0 21.51.0
Packing: 2 000 pcs/reel
15.9 to 19.4 Outer edge of flange
10
Data Sheet PN10163EJ03V0DS
PS2513-1,PS2513L-1
NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering
* Peak reflow temperature * Time of peak reflow temperature * Time of temperature higher than 220C * Time to preheat temperature from 120 to 180C * Number of reflows * Flux 260C or below (package surface temperature) 10 seconds or less 60 seconds or less 12030 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
Package Surface Temperature T (C)
(heating) to 10 s 260C MAX. 220C to 60 s 180C 120C 12030 s (preheating)
Time (s)
(2) Wave soldering * Temperature * Time * Preheating conditions * Number of times * Flux 260C or below (molten solder temperature) 10 seconds or less 120C or below (package surface temperature) One (Allowed to be dipped in solder including plastic mold portion.) Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by soldering iron * Peak temperature (lead part temperature) * Time (each pins) * Flux 350C or below 3 seconds or less Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100C.
Data Sheet PN10163EJ03V0DS
11
PS2513-1,PS2513L-1
(4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler's input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler
Check the setting values before use, since the forward current conditions at CTR measurement differ according to product. When using products other than at the specified forward current, the characteristics curves may differ from the standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual operating conditions and thoroughly take variations or the like into consideration before use.
USAGE CAUTIONS
1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity.
12
Data Sheet PN10163EJ03V0DS
PS2513-1,PS2513L-1
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter Application classification (DIN VDE 0109) for rated line voltages 300 Vr.m.s. for rated line voltages 600 Vr.m.s. Climatic test class (DIN IEC 68 Teil 1/09.80) Dielectric strength maximum operating isolation voltage Test voltage (partial discharge test, procedure a for type test and random test) Upr = 1.2 x UIORM, Pd < 5 pC Test voltage (partial discharge test, procedure b for all devices test) Upr = 1.6 x UIORM, Pd < 5 pC Highest permissible overvoltage Degree of pollution (DIN VDE 0109) Clearance distance Creepage distance Comparative tracking index (DIN IEC 112/VDE 0303 part 1) Material group (DIN VDE 0109) Storage temperature range Operating temperature range Isolation resistance, minimum value VIO = 500 V dc at TA = 25 C VIO = 500 V dc at TA MAX. at least 100 C Safety maximum ratings (maximum permissible in case of fault, see thermal derating curve) Package temperature Current (input current IF, Psi = 0) Power (output or total power dissipation) Isolation resistance VIO = 500 V dc at TA = 175 C (Tsi) Ris MIN. 10
9
Symbol
Speck
Unit
IV III 55/100/21
UIORM Upr
890 1 068
Vpeak Vpeak
Upr
1 424
Vpeak
UTR
8 000 2 > 7.0 > 7.0
Vpeak
mm mm
CTI
175 III a
Tstg TA
-55 to +150 -55 to +100
12 11
C C
Ris MIN. Ris MIN.
10 10
Tsi Isi Psi
175 400 700
C mA mW
Data Sheet PN10163EJ03V0DS
13
PS2513-1,PS2513L-1
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.
* The information in this document is current as of March, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
M8E 00. 4 - 0110
14
Data Sheet PN10163EJ03V0DS
PS2513-1,PS2513L-1
Caution
GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1573 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279
0504

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