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| HS-26CLV31RH TM Data Sheet August 2000 File Number 4898 Radiation Hardened 3.3V Quad Differential Line Driver The Intersil HS-26CLV31RH is a radiation hardened 3.3V quad differential line driver designed for digital data transmission over balanced lines, in low voltage, RS-422 protocol applications. CMOS processing assures low power consumption, high speed, and reliable operation in the most severe radiation environments. The HS-26CLV31RH accepts CMOS level inputs and converts them to differential outputs. Enable pins allow several devices to be connected to the same data source and addressed independently. The device has unique outputs that become high impedance when the driver is disabled or powered-down, maintaining signal integrity in multi-driver applications. Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed here must be used when ordering. Detailed Electrical Specifications for these devices are contained in SMD 5962-96663. A "hot-link" is provided on our homepage for downloading. www.intersil.com/spacedefense/space.htm Features * Electrically Screened to SMD # 5962-96663 * QML Qualified per MIL-PRF-38535 Requirements * 1.2 Micron Radiation Hardened CMOS - Total Dose. . . . . . . . . . . . . . . . . . . . . 300 krad(Si)(Max) - Single Event Upset LET . . . . . . . . . . .100MeV/mg/cm2) - Single Event Latch-up Immune * Extremely Low Stand-by Current . . . . . . . . . 100A (Max) * Operating Supply Range . . . . . . . . . . . . . . . . 3.0V to 3.6V * CMOS Level Inputs . . . . VIH > (.7)(VDD); VIL < (.3)(VDD) * Differential Outputs. . . . . . . . . . . VOH > 1.8V; VOL < 0.5V * High Impedance Outputs when Disabled or Powered Down * Low Output Impedance . . . . . . . . . . . . . . . . . 10 or Less * Full -55oC to 125oC Military Temperature Range Pinouts HS1-26CLV31RH (SBDIP) CDIP2-T16 TOP VIEW AIN 1 AO 2 AO 3 ENABLE 4 BO 5 BO 6 BIN 7 GND 8 16 VDD 15 DIN 14 DO 13 DO 12 ENABLE 11 CO 10 CO 9 CIN Ordering Information ORDERING NUMBER 5962F9666302QEC 5962F9666302QXC 5962F9666302V9A 5962F9666302VEC 5962F9666302VXC INTERNAL MKT. NUMBER HS1-26CLV31RH-8 HS9-26CLV31RH-8 HS0-26CLV31RH-Q HS1-26CLV31RH-Q HS9-26CLV31RH-Q TEMP. RANGE (oC) -55 to 125 -55 to 125 25 -55 to 125 -55 to 125 -55 to 125 -55 to 125 HS1-26CLV31RH/PROTO HS1-26CLV31RH/PROTO HS9-26CLV31RH/PROTO HS9-26CLV31RH/PROTO Logic Diagram ENABLE ENABLE DIN CIN BIN AIN HS9-26CLV31RH (FLATPACK) CDFP4-F16 TOP VIEW AIN AO AO ENABLE 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VDD DIN DO DO ENABLE CO CO CIN DO DO CO CO BO BO AO AO BO BO BIN GND 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright (c) Intersil Corporation 2000 HS-26CLV31RH Die Characteristics DIE DIMENSIONS: 96.5 mils x 195 mils x 21 mils (2450 x 4950) INTERFACE MATERIALS: Glassivation: Type: PSG (Phosphorus Silicon Glass) Thickness: 8kA 1kA Metallization: Bottom: Mo/TiW Thickness: 5800A 1kA Top: AlSiCu (Top) Thickness: 10kA 1kA Substrate: AVLSI1RA Backside Finish: Silicon ASSEMBLY RELATED INFORMATION: Substrate Potential (Powered Up): VDD ADDITIONAL INFORMATION: Worst Case Current Density: <2.0 x 105A/cm2 Bond Pad Size: 110m x 100m Metallization Mask Layout HS-26CLV31RH (16) VDD (16) VDD (15) DIN (14) DO (13) DO (12) ENABLE (11) CO (10) CO CIN (9) (1) AIN AO (2) AO (3) ENABLE (4) BO (5) BO (6) BIN (7) ND (8) All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com 2 ND (8) |
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