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SPMB250-A1
MOTIONBEETM family acceleration sensor
Preliminary Data
Features

Ready-to-use IEEE 802.15.4 compliant wireless acceleration sensor Integrated three axis MEMS-based linear accelerometer Antenna on board No external components required excluding power supplier Possibility to be programmed via SIF connector with EMZNET ZigBee(R) protocol stack and custom applications Board fixing with screws or pads for SMD soldering Reset and commissioning push buttons externally available Power connector and power switch externally available Two LEDs externally available for connection check and debugging Board dimensions: 49 x 27 x 5 mm CE / FCC compliant

The ZigBee(R) module contains the SN250 SoC integrating a fully compliant 802.15.4 radio together with a microcontroller that can be used to elaborate sensor data and networking functionalities. SN250 can be programmed to run the EMZNET ZigBee(R) protocol stack from Ember Corporation. The module is programmable thanks to the SIF connector available on the SPZB250 module. The LIS3LV02DL three axis accelerometer is a low power low voltage linear accelerometer with digital output that can operate in the user selectable range +/-2 g or +/-6 g and with programmable data rate. The controller inside SPZB250 module handles all the networking functions and it can be used to implement custom procedures to elaborate and send data collected by the acceleration sensor. The board is ready-to-use, requiring only an external power supplier to connect to the integrated standard two pole connector. A switch is present in series to the supply connection to power on / off the board.
Description
SPMB250-A1 board is a ready-to-use wireless acceleration sensor based on an IEEE 802.15.4 compliant radio. It is designed to enable development of applications for remote motion monitoring in wireless sensor networks systems. The board is based on the ZigBee(R) module SPZB250 which performs both the RF radio and controlling functions and the three axis linear accelerometer sensor LIS3LV02DL.
February 2009
Rev 1
1/17
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This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
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Contents
SPMB250-A1
Contents
1 2 3 Connections - pad out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1 3.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4.1 DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5
Board description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.1 5.2 5.3 5.4 5.5 Power supply connector (J1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 ON / OFF switch (SW2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 SIF connector (J2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Pad description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 LED indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6 7 8 9 10 11 12
Board layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Radiation pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
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SPMB250-A1
Connections - pad out
1
Connections - pad out
Figure 1. Connections
2
Block diagram
Figure 2. Block diagram
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Maximum ratings
SPMB250-A1
3
3.1
Maximum ratings
Absolute maximum ratings
Table 1.
Symbol VCC TOPmax TSTG Board supply voltage Operating ambient temperature Storage temperature -40 -40
Absolute maximum ratings
Values Parameter Min Max 7 +85 +85 V C C Unit
3.2
Operating ranges
Operating ranges define the limits for functional operation and parametric characteristics of the module. Functionality outside these limits is not implied Table 2.
Symbol VCC TSTG
Operating ranges
Values Parameter Module supply voltage Operating ambient temperature Vin = 4 V stand by Conditions Min -40 C < T < 85 C 3.6 -40 16 37 36 9 Typ Max 6 +85 V C A mA mA mA Unit
IOP
Operation current (1)
Vin = 4 V TX mode Vin = 4 V RX mode Vin = 4 V CPU only
1. Values indicated in the table are referred to the single states (Standby TX,RX,...); the overall current depends on the working strategy used by the application
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SPMB250-A1
Electrical characteristics
4
4.1
Electrical characteristics
DC I/O specification
Table 3.
Symbol
DC input / output specification
Values Parameter Low level input voltage SW1 (Reset) and SW3 Low level output voltage P8 (L1) and P10 (L2) High level output voltage P8 (L1) and P10 (L2) Conditions Min Typ Max 0.6 0.2 2.7 3.3 4 V V V mA Unit
VIL VOL VOH IOLed
Vin = 4 V Vin = 4 V Vin = 4 V Vin = 4 V
RFin RX sens RFout TXpout FS
Input frequency range Receiver sensitivity Output frequency range Nominal output power Acceleration sensor Measurement Range Acceleration sensor Resolution Full-scale = 2 g Output data rate = 40 Hz Full-scale = 2 g 12 bit representation Full-scale = 6 g 12 bit representation @ 2402 - 2480 MHz @PER 1 %
2405 -92 2405 0 1.7 5.3 2.0 6.0 1.0 920 306 1024 340
2480
MHz dBm
2480
MHz dBm g g mg
Dres
1126 374
LSb/g LSB/g
So
Acceleration sensor Sensitivity
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Board description
SPMB250-A1
5
5.1
Board description
Power supply connector (J1)
When used directly connected to the system to be monitored in terms of vibration / acceleration the only connection needed is the one related to the power source. To have a standard and in the same time miniaturized connection a two pole connector has been chosen (i.e. Molex 53261-0271 or equivalent) Figure 3. J1 connector
J1
5.2
ON / OFF switch (SW2)
To power on / off the board a switch has been provided aboard. Figure 4. SW2 switch
SW2
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SPMB250-A1
Board description
5.3
SIF connector (J2)
To allow the user to program the board, a SIF connector is available. Signals available on this connector are: Figure 5. SIF - pin description
Vdd GND GND SIF_LOADB PTI_EN
1 3 5 7 9
2 4 6 8 10
SIF_MISO SIF_MOSI SIF_CLK RSTB PTI_DATA
Figure 6.
SIF connector
J2
1
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Board description
SPMB250-A1
5.4
Pad description
When used on a motherboard the boundary pads on the SPMB250-A1 can be used to get the connections with the remaining part of the circuit present on the motherboard itself. The meaning of the pads is listed in the following table: Table 4.
N. P1 P2 P3 P4 P5 P6 P7 P8 P9 P10
Pad description
Pin name J1 - Vcc- (GND) J1 - Vcc + SW2-O SW2-I GND SW1 (RESET / RSTB) GND GPIO8 SW3 L3 - GPIO13 I/O Description
Power GND input voltage supply Power Positive input voltage supply Power Power switch pole connected to the circuit Power Power switch pole connected to Vin + Power I Power I/O I O GPIO8 of SPZB250 module General purpose push button / commissioning push button. It can used also as I/O pin Led 3 general purpose (connected to SPZB250 GPIUO13) A resistor is needed to limit the current Reset push button. Reset occurs when this pad is tied to GND
5.5
LED indicators
Two LED L2 (Led2) and L3 (Led3) are connected to the GPIO of SPZB250 module to be used to monitor the module activity. Driving pin of L3 is also available as pad out (P10).
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SPMB250-A1
Board layout
6
Board layout
Figure 7. Board layout
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Soldering
SPMB250-A1
7
Soldering
Soldering phase has to be carefully carried out: in order to avoid undesired melting phenomenon, particular attention has to be paid on the set up of the peak temperature. Here following some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C, July 2004 recommendations. Table 5. Soldering
Profile feature Average ramp up rate (TSMAX to TP) Preheat Temperature min (TS min) Temperature max (TS max) Time (tS min to tS max) (tS) Time maintained above: Temperature TL Time tL Peak temperature (Tp) Time within 5 C of actual peak temperature (tP) Ramp down rate Time from 25 C to peak temperature PB free assembly 3 C / sec max 150 C 200 C 60 - 100 sec 217 C 40 - 70 sec 240 + 0 C 10 - 20 sec 6 C / sec 8 minutes max
Figure 8.
Soldering
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SPMB250-A1
Recommendations
8
Recommendations
An integrated antenna is present on the board: - - - Assembly the board in the application avoiding any shielding of the antenna Avoid metallic parts close to the antenna Do not use metallic case In case of fixing on metallic base insert an insulator foil between the board and the base in order to avoid any potential short circuit
Board fixing can be done with 4 screws: -
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Radiation pattern
SPMB250-A1
9
Radiation pattern
SPMB250-A1 is based on the SPZB250 module which incorporates an RF section with an integrated antenna (Murata ANCV12G44SAA127). The antenna radiation pattern (as measured on the SPZB250 module) follows. Figure 9. Measurement direction
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SPMB250-A1
Mechanical dimensions
10
Mechanical dimensions
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Figure 10. Mechanical dimensions
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Mechanical dimensions Figure 11. Recommended land pattern
SPMB250-A1
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SPMB250-A1
Ordering information scheme
11
Ordering information scheme
Table 6. Ordering information scheme
SP Subsystem product
MB
250
-A
1
MOTIONBEETM family
SN250 -based board
Accelerometer sensor
Version 1
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Revision history
SPMB250-A1
12
Revision history
Table 7.
Date 16-Feb-2009
Document revision history
Revision 1 Initial release Changes
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SPMB250-A1
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