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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DUAL DIGIT LED DISPLAY (0.4 Inch)
LDD495/64-10/SRPX-X
DATA SHEET
DOC. NO REV. DATE
: :
QW0905- LDD495/64-10/SRPX-X A
: 24 - May - 2005
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDD495/64-10/SRPX-X Page 1/8
Detailed
1. LDD495/64-10/SRP9-3 2. LDD495/64-10/SRP12-6 3. LDD495/64-10/SRP15-9 4. LDD495/64-10/SRP18-12 5. LDD495/64-10/SRP21-15 6. LDD495/64-10/SRP24-18
LDD495/64-10/SRPX-X
A BCDE F G HI J K L
A: Ligitek B: Number Of Digital C: Display D: Digit Height Of Characters E: Modification F: Polarization G: Emitted Color & Material H: Black Color I: Original Color J: Space K: Pin length count from the ref edge. L: Space heigth
For Example
LDD495/64-10/SRP9-3
SRP9: Pin length count from the ref edge is 9.0mm. -3: Space heigth
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDD495/64-10/SRPX-X Page 2/8
Package Dimensions
15.4(0.606") 3.0
DIG.1
10.16 (0.4")
DIG.2
15.0 (0.591") 12.0 (0.472")
r 1.15(0.045")
LDD495/64-10/SRP9-3 LIGITEK
7.2(0.283")
0.51 TYP.
9.0O 0.5
2.54X4= 10.16(0.4")
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDD495/64-10/SRPX-X Page 3/8
Internal Circuit Diagram
LDD4954-10/SRPX-X 10 DIG.1
ABCDEFG
5 DIG.2
ABCDEFG
3986741
LDD4964-10/SRPX-X 10 DIG.1
ABCDEFG
5 DIG.2
ABCDEFG
3986741
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDD495/64-10/SRPX-X Page 4/8
Electrical Connection
PIN NO. 1 2 3 4 5 6 7 8 9 10
LDD4954-10/SRPX-X Anode No Pin Anode Anode A F G
PIN NO. 1 2 3 4 5 6 7 8 9 10
LDD4964-10/SRPX-X Cathode No Pin Cathode Cathode A F G
Common Cathode Dig.2 Anode Anode Anode Anode D E C B
Common Anode Dig.2 Cathode Cathode Cathode Cathode D E C B
Common Cathode Dig.1
Common Anode Dig.1
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDD495/64-10/SRPX-X Page 5/8
Absolute Maximum Ratings at Ta=25 J
Ratings Parameter Symbol E Forward Current Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Reverse Current Per Any Chip Operating Temperature Storage Temperature IF 30 mA UNIT
IFP
120
mA
PD Ir Topr Tstg
100 10 -25 ~ +85 -25 ~ +85
mW
g A J J
Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 J
Part Selection And Application Information(Ratings at 25J )
Electrical
PART NO
common cathode or anode Material Emitted
CHIP Common Anode
GaAsP/GaP Orange
f P (nm)
f
(nm)
Min.
Vf(v)
Iv(mcd) Typ.
IV-M
Typ. Max. Min.
LDD4954- 10/SRPX-X
635 Common Cathode
45
1.7
2.1
2.6
1.35 2.35
2:1
LDD49 64-10/SRPX-X
Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDD495/64-10/SRPX-X Page 6/8
Test Condition For Each Parameter
Parameter Forward Voltage Per Chip Luminous Intensity Per Chip Peak Emission Wavelength Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio
Symbol Vf Iv
Unit volt mcd nm nm
Test Condition If=20mA If=10mA If=20mA If=20mA Vr=5V
f P f
Ir IV-M
g A
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDD495/64-10/SRPX-X Page7/8
Typical Electro-Optical Characteristics Curve
E CHIP
Fig.1 Forward current vs. Forward Voltage
1000
Fig.2 Relative Intensity vs. Forward Current
3.0
Forward Current(mA)
100
Relative Intensity Normalize @20mA
2.0 3.0 4.0 5.0
2.5 2.0 1.5 1.0 0.5 0.0
10
1.0 0.1 1.0
1.0
10
100
1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Forward Voltage@20mA Normalize @25J
Relative Intensity@20mA Normalize @25J
80 100
1.1
2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.0
0.9
0.8 -40 -20 0 20 40 60
Ambient Temperature(J )
Ambient Temperature(J )
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 550 600 650 700 750
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDD495/64-10/SRPX-X Page 8/8
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs
The purpose of this test is the resistance of the device under tropical for hous.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 JO 5J &-40JO (10min) (10min) 2.total 10 cycles
5J
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 J O 5J 2.Dwell time= 10 O 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 J O 5J 2.Dwell time=5 O 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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