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| BBY53... Silicon Tuning Diode * High Q hyperabrupt tuning diode * Designed for low tuning voltage operation for VCO's in mobile communications equipment * High ratio at low reverse voltage * Pb-free (RoHS compliant) package1) * Qualified according AEC Q101 BBY53-02L BBY53-02V BBY53-02W BBY53-03W BBY53 BBY53-05W ! , , Type BBY53 BBY53-02L BBY53-02V BBY53-02W BBY53-03W BBY53-05W Package SOT23 TSLP-2-1 SC79 SCD80 SOD323 SOT323 Configuration common cathode single, leadless single single single common cathode LS(nH) 2 0.4 0.6 0.6 1.8 1.4 Marking S7s LL L LL white/5 S7s Maximum Ratings at TA = 25C, unless otherwise specified Parameter Diode reverse voltage Forward current Operating temperature range Storage temperature 1Pb-containing Symbol VR IF Top Tstg Value 6 20 -55 ... 125 -55 ... 150 Unit V mA C package may be available upon special request 1 2007-09-18 BBY53... Electrical Characteristics at T A = 25C, unless otherwise specified Parameter DC Characteristics Reverse current VR = 4 V VR = 4 V, TA = 85 C AC Characteristics Diode capacitance VR = 1 V, f = 1 MHz VR = 3 V, f = 1 MHz Capacitance ratio VR = 1 V, VR = 3 V, f = 1 MHz Series resistance VR = 1 V, f = 1 GHz rS 0.47 CT1/C T3 CT 4.8 1.85 1.8 5.3 2.4 2.2 5.8 3.1 2.6 pF Symbol min. IR - Values typ. max. Unit nA 10 200 2 2007-09-18 BBY53... Diode capacitance CT = (VR) f = 1MHz Capacitance change C = (TA) f = 1 MHz 10 pF 5.25 % 3V 8 7 6 5 4 3 2 3.75 3 1V CT V CT 2.25 1.5 0.75 0 -0.75 -1.5 -2.25 1 0 0 -3 0.5 1 1.5 2 3 -3.75 -40 -20 0 20 40 60 C 100 VR TA Temperature coefficient of the diode capacitance TCC = (VR ) f = 1 MHz 10 -2 1/C TCC 10 -3 10 -4 0 0.5 1 1.5 2 2.5 3 V 4 VR 3 2007-09-18 Package SC79 BBY53... Package Outline 0.2 0.8 0.1 10MAX. M A 0.13 -0.03 +0.05 2 1.6 0.1 0.55 0.04 Foot Print 1.35 0.35 Marking Layout (Example) 2005, June Date code 0.35 BAR63-02V Type code Cathode marking Laser marking Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel o330 mm = 10.000 Pieces/Reel Standard 4 Reel with 2 mm Pitch 2 0.2 1.33 1.96 Cathode marking 0.4 0.93 8 0.2 0.05 0.66 Cathode marking 1 0.3 0.05 Cathode marking 10MAX. 1.2 0.1 A 4 2007-09-18 Package SCD80 BBY53... Package Outline 0.2 0.8 0.1 10MAX. M A +0.05 0.13 -0.03 A 7 1.5 1.3 0.1 2 1.7 0.1 0.7 0.1 Foot Print 1.45 0.35 Marking Layout (Example) 2005, June Date code 0.35 BAR63-02W Type code Cathode marking Laser marking Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel o330 mm = 10.000 Pieces/Reel Standard 4 Reel with 2 mm Pitch 2 0.2 1.45 2.5 8 0.2 0.05 Cathode marking 1 0.3 0.05 Cathode marking 0.4 0.9 Cathode marking 0.7 5 2007-09-18 BBY53... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code Month 2 0 03 01 02 03 04 05 06 07 08 09 10 11 12 a b c d e f g h j k l n 2 0 04 p q r s t u v x y z 2 3 2005 A B C D E F G H J K L N 2006 P Q R S T U V X Y Z 4 5 2 0 07 a b c d e f g h j k l n 2008 p q r s t u v x y z 2 3 2009 A B C D E F G H J K L N 2010 P Q R S T U V X Y Z 4 5 2011 a b c d e f g h j k l n 2012 p q r s t u v x y z 2 3 2 0 13 A B C D E F G H J K L N 2014 P Q R S T U V X Y Z 4 5 1) New Marking Layout for SC75, implemented at October 2005. . 6 2007-09-18 Package SOD323 BBY53... Package Outline 0.9 +0.2 -0.1 +0.2 1.25 -0.1 0 0.05 A 1.7 +0.2 -0.1 +0.05 0.3 -0.2 2 Cathode marking 1 0.3 +0.1 -0.05 0.25 M A 0.45 0.15 2.5 0.2 0.15 +0.1 -0.06 Foot Print 0.6 Marking Layout (Example) 0.8 1.7 0.8 BAR63-03W Type code Cathode marking Laser marking Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 4 0.2 2 2.9 8 Cathode marking 0.65 1.35 1 7 2007-09-18 Package SOT23 BBY53... Package Outline 0.15 MIN. 1 0.1 0.1 MAX. 1.3 0.1 2.9 0.1 3 B 2.4 0.15 10 MAX. 0.4 +0.1 -0.05 1) 1 2 10 MAX. C 0.95 1.9 0.08...0.1 0...8 A 5 0.25 M B C 0.2 M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s Pin 1 0.9 1.3 2005, June Date code (YM) BCW66 Type code Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 4 0.9 2.13 2.65 0.2 8 Pin 1 3.15 1.15 8 2007-09-18 Package SOT323 BBY53... Package Outline 2 0.2 0.3 +0.1 -0.05 3 1.25 0.1 2.1 0.1 0.9 0.1 3x 0.1 M 0.1 MAX. 0.1 A 1 0.65 0.65 2 0.1 MIN. 0.15 +0.1 -0.05 0.2 M A Foot Print 0.6 0.8 0.65 0.65 Marking Layout (Example) Manufacturer 1.6 2005, June Date code (YM) Pin 1 BCR108W Type code Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 4 0.2 Pin 1 2.15 2.3 8 1.1 9 2007-09-18 Package TSLP-2-1 BBY53... Package Outline Top view 0.05 MAX. 2 0.4 +0.1 Bottom view 0.6 0.05 0.650.05 2 1 1 1) 1) Cathode marking 1) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" 0.45 0.35 0.275 0.6 0.35 0.925 0.3 1 Copper Solder mask Stencil apertures Marking Layout (Example) BAS16-02L Type code Cathode marking Laser marking Standard Packing Reel o180 mm = 15.000 Pieces/Reel Reel o330 mm = 50.000 Pieces/Reel (optional) 4 0.5 1.16 Cathode marking 0.76 8 0.275 0.375 0.25 0.035 0.5 0.035 1 0.05 10 2007-09-18 BBY53... Edition 2006-02-01 Published by Infineon Technologies AG 81726 Munchen, Germany (c) Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 11 2007-09-18 |
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