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| SPA02N80C3 CoolMOSTM Power Transistor Features * New revolutionary high voltage technology * Extreme dv/dt rated * High peak current capability * Qualified according to JEDEC1) for target applications * Pb-free lead plating; RoHS compliant * Ultra low gate charge * Ultra low effective capacitances * Fully isolated package (2500 VAC; 1 minute) CoolMOSTM 800V designed for: * Industrial application with high DC bulk voltage * Switching Application (i.e. active clamp forward) Product Summary V DS R DS(on)max @ Tj = 25C Q g,typ 800 2.7 12 V nC Type SPA02N80C3 Package PG-TO220-3 Marking 02N80C3 Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous drain current2) Symbol Conditions ID T C=25 C T C=100 C Pulsed drain current3) Avalanche energy, single pulse Avalanche energy, repetitive t AR3),4) Avalanche current, repetitive t AR3),4) MOSFET dv /dt ruggedness Gate source voltage I D,pulse E AS E AR I AR dv /dt V GS V DS=0...640 V static AC (f >1 Hz) Power dissipation Operating and storage temperature Mounting torque P tot T j, T stg M2.5 screws T C=25 C T C=25 C I D=1 A, V DD=50 V I D=2 A, V DD=50 V Value 2 1.2 6 90 0.05 2 50 20 30 30.5 -55 ... 150 50 W C Ncm A V/ns V mJ Unit A Rev. 2.9 page 1 2008-10-15 SPA02N80C3 Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous diode forward current Diode pulse current3) Reverse diode dv /dt 5) Symbol Conditions IS I S,pulse dv /dt T C=25 C 6 4 V/ns Value 2 Unit A Parameter Symbol Conditions min. Values typ. max. Unit Thermal characteristics Thermal resistance, junction - case Thermal resistance, junction ambient R thJC R thJA leaded 4.1 80 K/W Soldering temperature, T sold wave soldering only allowed at leads 1.6 mm (0.063 in.) from case for 10s - - 260 C Electrical characteristics, at T j=25 C, unless otherwise specified Static characteristics Drain-source breakdown voltage Avalanche breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D=250 A V (BR)DS V GS(th) I DSS V GS=0 V, I D=2 A V DS=V GS, I D=0.12 mA V DS=800 V, V GS=0 V, T j=25 C V DS=800 V, V GS=0 V, T j=150 C Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=20 V, V DS=0 V V GS=10 V, I D=1.2 A, T j=25 C V GS=10 V, I D=12 A, T j=150 C Gate resistance RG f =1 MHz, open drain 800 2.1 870 3 3.9 5 A V - 25 2.4 100 2.7 nA - 6.5 1.2 Rev. 2.9 page 2 2008-10-15 SPA02N80C3 Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance C iss C oss V GS=0 V, V DS=100 V, f =1 MHz V GS=0 V, V DS=0 V to 480 V V DD=400 V, V GS=0/10 V, I D=2 A, R G=47 ? , T j=25C 26 25 15 72 18 ns 290 13 11 pF Values typ. max. Unit Effective output capacitance, energy C o(er) related6) Effective output capacitance, time related7) Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Diode forward voltage Reverse recovery time Reverse recovery charge Peak reverse recovery current 1) 2) 3) 4) 5) C o(tr) t d(on) tr t d(off) tf Q gs Q gd Qg V plateau V DD=640 V, I D=2 A, V GS=0 to 10 V - 1.5 6 12 5.5 16 - nC V V SD t rr Q rr I rrm V GS=0 V, I F=I S=2 A, T j=25 C - 1 520 2 6 1.2 - V ns C A V R=400 V, I F=I S=2A, di F/dt =100 A/s - J-STD20 and JESD22 Limited only by maximum temperature Pulse width t p limited by T j,max Repetitive avalanche causes additional power losses that can be calculated as P AV=E AR*f. ISD=ID, di/dt=400A/s, VDClink = 400V, Vpeak Rev. 2.9 page 3 2008-10-15 SPA02N80C3 1 Power dissipation P tot=f(T C) 2 Safe operating area I D=f(V DS); T C=25 C; D =0 parameter: t p 101 limited by on-state resistance 30 10 s 1 s 100 100 s 1 ms P tot [W] I D [A] 20 DC 10 ms 10-1 10 0 0 25 50 75 100 125 150 10-2 1 10 100 1000 T C [C] V DS [V] 3 Max. transient thermal impedance ZthJC=f(tP) parameter: D=t p/T 101 4 Typ. output characteristics I D=f(V DS); T j=25 C; t p=10 s parameter: V GS 7 20 V 6 5 0.5 10 V Z thJC [K/W] 4 10 0 0.2 I D [A] 6V 0.1 0.05 3 2 0.02 0.01 5.5 V 5V 1 single pulse 4.5 V 10-1 10-5 10-4 10-3 10-2 10-1 100 101 0 0 5 10 15 20 25 t p [s] V DS [V] Rev. 2.9 page 4 2008-10-15 SPA02N80C3 5 Typ. output characteristics I D=f(V DS); T j=150 C; t p=10 s parameter: V GS 3 20 V 10 V 6 Typ. drain-source on-state resistance R DS(on)=f(I D); T j=150 C parameter: V GS 9 8.6 8.2 20 V 5.5 V 2.5 6V 7.8 10 V 2 R DS(on) [] 7.4 7 6.6 6.2 4V 4.5 V 5V 5.5 V 6V I D [A] 1.5 5V 1 4.5 V 5.8 0.5 5.4 0 0 5 10 15 20 25 5 0 1 2 3 4 5 6 V DS [V] I D [A] 7 Drain-source on-state resistance R DS(on)=f(T j); I D=1.2 A; V GS=10 V 8 Typ. transfer characteristics I D=f(V GS); |V DS|>2|I D|R DS(on)max; t p=10 s parameter: T j 5.6 7 25 C 4.8 6 4 5 R DS(on) [] 3.2 98 % 4 I D [A] 150 C 2.4 typ 3 1.6 2 0.8 1 0 -60 -20 20 60 100 140 180 0 0 2 4 6 8 10 T j [C] V GS [V] Rev. 2.9 page 5 2008-10-15 SPA02N80C3 9 Typ. gate charge V GS=f(Q gate); I D=2 A pulsed parameter: V DD 10 10 Forward characteristics of reverse diode I F=f(V SD); t p=10 s parameter: T j 102 160 V 8 640 V 150 C 101 25C (98C) 6 V GS [V] I F [A] 25 C 150C (98%) 4 100 2 0 0 2 4 6 8 10 12 10-1 0 0.5 1 1.5 2 Q gate [nC] V SD [V] 11 Avalanche energy E AS=f(T j); I D=1 A; V DD=50 V 12 Drain-source breakdown voltage V BR(DSS)=f(T j); I D=0.25 mA 960 80 920 60 880 V BR(DSS) [V] 25 50 75 100 125 150 E AS [mJ] 840 40 800 760 20 720 0 680 -60 -20 20 60 100 140 180 T j [C] T j [C] Rev. 2.9 page 6 2008-10-15 SPA02N80C3 13 Typ. capacitances C =f(V DS); V GS=0 V; f =1 MHz 14 Typ. Coss stored energy E oss= f(V DS) 103 2.5 Ciss 2 102 1.5 Coss E oss [J] 1 10 1 C [pF] Crss 0.5 100 0 100 200 300 400 500 0 0 100 200 300 400 500 600 700 800 V DS [V] V DS [V] Rev. 2.9 page 7 2008-10-15 SPA02N80C3 Definition of diode switching characteristics Rev. 2.9 page 8 2008-10-15 SPA02N80C3 PG-TO220-3 (fully isolated): Outline dimensions in mm/inches Rev. 2.9 page 9 2008-10-15 SPA02N80C3 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.9 page 10 2008-10-15 |
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