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| SHARC Processor ADSP-21371/ADSP-21375 SUMMARY High performance 32-bit/40-bit floating point processor optimized for high performance audio processing Single-instruction, multiple-data (SIMD) computational architecture On-chip memory, ADSP-21371--1M bits of on-chip SRAM and 4M bits of on-chip mask-programmable ROM On-chip memory, ADSP-21375--0.5M bits of on-chip SRAM and 2M bits of on-chip mask-programmable ROM Code compatible with all other members of the SHARC family The ADSP-21371/ADSP-21375 processors are available with a 200/266 MHz core instruction rate with unique audiocentric peripherals such as the digital applications interface, S/PDIF transceiver, serial ports, precision clock generators, and more. For complete ordering information, see Ordering Guide on Page 52. DEDICATED AUDIO COMPONENTS ADSP-21371--S/PDIF-compatible digital audio receiver/transmitter ADSP-21371--8 dual data line serial ports that operate at up to 50 Mbps on each data line -- each has a clock, frame sync, and two data lines that can be configured as either a receiver or transmitter pair 16 PWM outputs configured as four groups of four outputs ROM-based security features include JTAG access to memory permitted with a 64-bit key Protected memory regions that can be assigned to limit access under program control to sensitive code PLL has a wide variety of software and hardware multiplier/divider ratios Available in a 208-lead LQFP_EP package Internal Memory SIMD Core Instruction Cache 5 stage Sequencer Block 0 RAM/ROM Block 1 RAM/ROM Block 2 RAM Block 3 RAM DAG1/2 Timer DMD 64-BIT S DMD 64-BIT PMD 64-BIT B0D 64-BIT B1D 64-BIT B2D 64-BIT B3D 64-BIT PEx PEy Core Bus Cross Bar Internal Memory I/F PMD 64-BIT EPD BUS 48-BIT IODO 32-BIT FLAGx/IRQx/ TMREXP JTAG PERIPHERAL BUS 32-BIT IOD1 32-BIT IOD0 BUS MTM/ DTCP PERIPHERAL BUS EP CORE PCG FLAGS C-D TIMER 1-0 TWI SPI/B UART PCG A-D S/PDIF IDP/ SPORT Tx/Rx PDAP 7-0 7-0 CORE PWM FLAGS 3-0 AMI SDRAM DPI Routing/Pins DAI Routing/Pins External Port Pin MUX DPI Peripherals DAI Peripherals Peripherals External Port Figure 1. Functional Block Diagram SHARC and the SHARC logo are registered trademarks of Analog Devices, Inc. Rev. C Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.326.3113 (c) 2009 Analog Devices, Inc. All rights reserved. ADSP-21371/ADSP-21375 TABLE OF CONTENTS Summary ............................................................... 1 Dedicated Audio Components .................................... 1 Revision History ...................................................... 2 General Description ................................................. 3 SHARC Family Core Architecture ............................ 4 Family Peripheral Architecture ................................ 6 I/O Processor Features ......................................... 10 System Design .................................................... 11 Development Tools ............................................. 11 Additional Information ........................................ 12 Pin Function Descriptions ....................................... 13 ADSP-21371/ADSP-21375 Specifications .................... 16 Operating Conditions .......................................... 16 Electrical Characteristics ....................................... 16 Package Information ........................................... 17 Maximum Power Dissipation ................................. 17 Absolute Maximum Ratings ................................... 17 ESD Sensitivity ................................................... 17 Timing Specifications ........................................... 17 Output Drive Currents ......................................... 45 Test Conditions .................................................. 45 Capacitive Loading .............................................. 45 Thermal Characteristics ........................................ 46 208-Lead LQFP_EP Pinout ....................................... 47 Package Dimensions ............................................... 51 Automotive Products .............................................. 52 Ordering Guide ..................................................... 52 REVISION HISTORY 9/09--Rev. B to Rev. C Corrected all outstanding document errata. Also replaced core clock references (CCLK) in the timing specifications with peripheral clock references (PCLK). Added operating conditions and electrical characteristics for the 1.0 V, 200 MHz parts. For this revision the following sections have been removed. For information see the ADSP-2137x SHARC Processor Hardware Reference: "Address Data Pins as Flags", "Address/Data Modes", Core Instruction Rate to CLKIN Ratio Modes." Revised Figure 1, Functional Block Diagram ....................1 Added Table 2, ADSP-21371/ADSP-21375 Features ..........3 Added Figure 2, SHARC Core Block Diagram ..................4 Added Context Switch ...............................................5 Added Universal Registers ..........................................5 Added Timer ...........................................................5 Added On-Chip Memory Bandwidth ............................ 5 Added External Port Throughput ................................. 8 Added Input Data Port (IDP) ...................................... 9 Added Precision Clock Generator (PCG) ....................... 9 Added Scatter/Gather DMA .......................................11 Clarified VCO operations in Voltage Controlled Oscillator .....................................18 Corrected the pins names for the DAI and DPI in 208-Lead LQFP_EP Pinout .....................................................47 Added Automotive Products ......................................52 Rev. C | Page 2 of 52 | September 2009 ADSP-21371/ADSP-21375 GENERAL DESCRIPTION The ADSP-21371/ADSP-21375 SHARC(R) processors are members of the SIMD SHARC family of DSPs that feature Analog Devices' Super Harvard Architecture. The processors are source code compatible with the ADSP-2126x, ADSP-2136x, and ADSP-2116x DSPs, as well as with first generation ADSP-2106x SHARC processors in SISD (single-instruction, single-data) mode. The processors are 32-bit/40-bit floating-point processors optimized for high performance automotive audio applications with their large on-chip SRAM and mask-programmable ROM, multiple internal buses to eliminate I/O bottlenecks, and an innovative digital applications interface (DAI). As shown in the functional block diagram on Page 1, the processors use two computational units to deliver a significant performance increase over the previous SHARC processors on a range of DSP algorithms. Fabricated in a state-of-the-art, high speed, CMOS process, the processors achieve an instruction cycle time of 3.75 ns at 266 MHz. With its SIMD computational hardware, the processors can perform 1.596 GFLOPS running at 266 MHz. Table 1 shows performance benchmarks for these devices. Table 2 shows the features of the individual product offerings. Table 1. Processor Benchmarks (at 266 MHz) Speed Benchmark Algorithm (at 266 MHz) 1024 Point Complex FFT (Radix 4, With Reversal) 34.5 s FIR Filter (per Tap)1 1.88 ns IIR Filter (per Biquad)1 7.5 ns Matrix Multiply (Pipelined) [3 x 3] x [3 x 1] 16.91 ns [4 x 4] x [4 x 1] 30.07 ns Divide (y/x) 13.1 ns Inverse Square Root 20.4 ns 1 Table 2. ADSP-21371/ADSP-21375 Features (Continued) Feature Digital Peripheral Interface (DPI) S/PDIF Transceiver SPI TWI Package ADSP-21371 Yes Yes 2 Yes 208-Lead LQFP_EP ADSP-21375 Yes No 2 Yes 208-Lead LQFP_EP The diagram on Page 1 shows the two clock domains that make up the ADSP-2137x processors. The core clock domain contains the following features: * Two processing elements, each of which comprises an ALU, multiplier, shifter, and data register file * Data address generators (DAG1, DAG2) * Program sequencer with instruction cache * PM and DM buses capable of supporting four 32-bit data transfers between memory and the core at every core processor cycle * One periodic interval timer with pinout * On-chip SRAM (1M bit, ADSP-21371; 0.5M bit, ADSP-21375) * On-chip mask-programmable ROM (4M bit, ADSP-21371; 2M bit, ADSP-21375) * JTAG test access port for emulation and boundary scan. The JTAG provides software debug through user breakpoints which allow flexible exception handling. The diagram on Page 1 also shows the peripheral clock domains (also known as the I/O processor) and contains the following features: * IOD0 (peripheral DMA) and IOD1 (external port DMA) buses for 32-bit data transfers * Peripheral and external port bus for core connection * Digital applications interface that includes four precision clock generators (PCG), an S/PDIF-compatible digital audio receiver/transmitter, an input data port (IDP), eight serial ports, eight serial interfaces, a 20-bit parallel input port (PDAP), and a flexible signal routing unit (DAI SRU). * Digital peripheral interface that includes two timers, one UART, two serial peripheral interfaces (SPI), a 2-wire interface (TWI), and a flexible signal routing unit (DPI SRU). * External port with AMI and SDRAM controller * Four units for PWM control * One MTM for internal to internal memory transfers Assumes two files in multichannel SIMD mode Table 2. ADSP-21371/ADSP-21375 Features Feature Frequency RAM ROM Pulse-Width Modulation Serial Ports UART Digital Application Interface (DAI) ADSP-21371 266 MHz (3.75 ns) 1M bit 4M bits Yes 8 1 Yes ADSP-21375 266 MHz (3.75 ns) 0.5M bit 2M bits No 4 1 Yes Rev. C | Page 3 of 52 | September 2009 ADSP-21371/ADSP-21375 SHARC FAMILY CORE ARCHITECTURE The ADSP-21371/ADSP-21375 processors are code compatible at the assembly level with the ADSP-2136x, ADSP-2126x, ADSP-21160x, and ADSP-21161N, and with the first generation ADSP-2106x SHARC processors. The ADSP-21371/ ADSP-21375 processors share architectural features with the ADSP-2126x, ADSP-2136x, and ADSP-2116x SIMD SHARC processors, as shown in Figure 2 and detailed in the following sections. Entering SIMD mode also has an effect on the way data is transferred between memory and the processing elements. When in SIMD mode, twice the data bandwidth is required to sustain computational operation in the processing elements. Because of this requirement, entering SIMD mode also doubles the bandwidth between memory and the processing elements. When using the DAGs to transfer data in SIMD mode, two data values are transferred with each access of memory or the register file. Independent, Parallel Computation Units Within each processing element is a set of computational units. The computational units consist of an arithmetic/logic unit (ALU), multiplier, and shifter. These units perform all operations in a single cycle. The three units within each processing element are arranged in parallel, maximizing computational throughput. Single multifunction instructions execute parallel ALU and multiplier operations. In SIMD mode, the parallel ALU and multiplier operations occur in both processing elements. These computation units support IEEE 32-bit singleprecision floating-point, 40-bit extended precision floatingpoint, and 32-bit fixed-point data formats. SIMD Computational Engine The processors contain two computational processing elements that operate as a single-instruction, multiple-data (SIMD) engine. The processing elements are referred to as PEX and PEY, and each contains an ALU, multiplier, shifter, and register file. PEX is always active, and PEY may be enabled by setting the PEYEN mode bit in the MODE1 register. When this mode is enabled, the same instruction is executed in both processing elements, but each processing element operates on different data. This architecture is efficient at executing math intensive DSP algorithms. S JTAG FLAG TIMER INTERRUPT CACHE SIMD Core PM ADDRESS 24 DMD/PMD 64 5 STAGE PROGRAM SEQUENCER PM DATA 48 DAG1 16x32 DAG2 16x32 PM ADDRESS 32 DM ADDRESS 32 PM DATA 64 SYSTEM I/F USTAT 4x32-BIT PX 64-BIT DM DATA 64 MULTIPLIER SHIFTER ALU RF Rx/Fx PEx 16x40-BIT DATA SWAP RF Sx/SFx PEy 16x40-BIT ALU SHIFTER MULTIPLIER MRF 80-BIT MRB 80-BIT ASTATx STYKx ASTATy STYKy MSB 80-BIT MSF 80-BIT Figure 2. SHARC Core Block Diagram Rev. C | Page 4 of 52 | September 2009 ADSP-21371/ADSP-21375 Data Register File Each processing element contains a general-purpose data register file. The register files transfer data between the computation units and the data buses, and store intermediate results. These 10-port, 32-register (16 primary, 16 secondary) register files, combined with the SHARC's enhanced Harvard architecture, allow unconstrained data flow between computation units and internal memory. The registers in PEX are referred to as R0-R15 and in PEY as S0-S15. processing, and are commonly used in digital filters and Fourier transforms. The two DAGs contain sufficient registers to allow the creation of up to 32 circular buffers (16 primary register sets, 16 secondary). The DAGs automatically handle address pointer wraparound, reduce overhead, increase performance, and simplify implementation. Circular buffers can start and end at any memory location. Flexible Instruction Set The 48-bit instruction word accommodates a variety of parallel operations, for concise programming. For example, the processors can conditionally execute a multiply, an add, and a subtract in both processing elements while branching and fetching up to four 32-bit values from memory--all in a single instruction. Context Switch Many of the processor's registers have secondary registers that can be activated during interrupt servicing for a fast context switch. The data registers in the register file, the DAG registers, and the multiplier result register all have secondary registers. The primary registers are active at reset, while the secondary registers are activated by control bits in a mode control register. On-Chip Memory The ADSP-21371 processor contains 1 megabit of internal RAM and four megabits of internal mask-programmable ROM (see Table 3 on Page 6) and the ADSP-21375 processor contains 0.5 megabits of internal RAM and two megabits of internal maskprogrammable ROM (see Table 4 on Page 7). Each block can be configured for different combinations of code and data storage. Each memory block supports single-cycle, independent accesses by the core processor and I/O processor. The processor's memory architecture, in combination with its separate on-chip buses, allow two data transfers from the core and one from the I/O processor, in a single cycle. The ADSP-21371 processor's SRAM can be configured as a maximum of 32k words of 32-bit data, 64k words of 16-bit data, 21.3k words of 48-bit instructions (or 40-bit data), or combinations of different word sizes up to 1 megabit. All of the memory can be accessed as 16-bit, 32-bit, 48-bit, or 64-bit words. A 16bit floating-point storage format is supported that effectively doubles the amount of data that may be stored on-chip. Conversion between the 32-bit floating-point and 16-bit floating-point formats is performed in a single instruction. While each memory block can store combinations of code and data, accesses are most efficient when one block stores data using the DM bus for transfers, and the other block stores instructions and data using the PM bus for transfers. Using the DM bus and PM buses, with one bus dedicated to a memory block, assures single-cycle execution with two data transfers. In this case, the instruction must be available in the cache. Universal Registers Universal registers can be used for general purpose tasks. The USTAT (4) registers allow easy bit manipulations (Set, Clear, Toggle, Test, XOR) for all system registers (control/status) of the core. The data bus exchange register PX permits data to be passed between the 64-bit PM data bus and the 64-bit DM data bus, or between the 40-bit register file and the PM data bus. These registers contain hardware to handle the data width difference. Timer The processors contain a core timer that can generate periodic software interrupts. The core timer can be configured to use FLAG3 as a timer expired signal. Single-Cycle Fetch of an Instruction and Four Operands The processors feature an enhanced Harvard architecture in which the data memory (DM) bus transfers data and the program memory (PM) bus transfers both instructions and data (see Figure 2). With the processor's separate program and data memory buses and on-chip instruction cache, the processor can simultaneously fetch four operands (two over each data bus) and one instruction (from the cache), all in a single cycle. Instruction Cache The processors include an on-chip instruction cache that enables three-bus operation for fetching an instruction and four data values. The cache is selective--only the instructions whose fetches conflict with PM bus data accesses are cached. This cache allows full speed execution of core, looped operations such as digital filter multiply-accumulates, and FFT butterfly processing. On-Chip Memory Bandwidth The internal memory architecture allows four accesses at the same time to any of the four blocks, assuming no block conflicts. The total bandwidth is gained with DMD and PMD buses (2 x 64-bits, core CLK) and the IOD0/1 buses (2 x 32-bit, PCLK). Data Address Generators with Zero-Overhead Hardware Circular Buffer Support The processors's two data address generators (DAGs) are used for indirect addressing and implementing circular data buffers in hardware. Circular buffers allow efficient programming of delay lines and other data structures required in digital signal ROM-Based Security The processors have a ROM security feature that provides hardware support for securing user software code by preventing unauthorized reading from the internal code when enabled. When using this feature, the processor does not boot-load any Rev. C | Page 5 of 52 | September 2009 ADSP-21371/ADSP-21375 Table 3. ADSP-21371 Internal Memory Space IOP Registers 0x0000 0000-0x0003 FFFF Long Word (64 bits) BLOCK 0 ROM 0x0004 0000-0x0004 7FFF Reserved 0x0004 8000-0x0004 BFFF BLOCK 0 RAM 0x0004 C000-0x0004 CFFF Reserved 0x0004 D000-0x0004 FFFF BLOCK 1 ROM 0x0005 0000-0x0005 7FFF Reserved 0x0005 8000-0x0005 BFFF BLOCK 1 RAM 0x0005 C000-0x0005 CFFF Reserved 0x0005 D000-0x0005 FFFF BLOCK 2 RAM 0x0006 0000-0x0006 0FFF Reserved 0x0006 1000-0x0006 FFFF BLOCK 3 RAM 0x0007 0000-0x0007 0FFF Reserved 0x0007 1000-0x0007 FFFF Extended Precision Normal or Instruction Word (48 bits) BLOCK 0 ROM 0x0008 0000-0x0008 AAA9 Reserved 0x0008 AAAA-0x0008 FFFF BLOCK 0 RAM 0x0009 0000-0x0009 1554 Reserved 0x0009 1555-0x0009 FFFF BLOCK 1 ROM 0x000A 0000-0x000A AAA9 Reserved 0x000A AAAA-0x000A FFFF BLOCK 1 RAM 0x000B 0000-0x000B 1554 Reserved 0x000B 1555-0x000B FFFF BLOCK 2 RAM 0x000C 0000-0x000C 1554 Reserved 0x000C 1555-0x000D FFFF BLOCK 3 RAM 0x000E 0000-0x000E 1554 Reserved 0x000E 1555-0x000F FFFF Normal Word (32 bits) BLOCK 0 ROM 0x0008 0000-0x0008 FFFF Reserved 0x0009 0000-0x0009 7FFF BLOCK 0 RAM 0x0009 8000-0x0009 9FFF Reserved 0x0009 A000-0x0009 FFFF BLOCK 1 ROM 0x000A 0000-0x000A FFFF Reserved 0x000B 0000-0x000B 7FFF BLOCK 1 RAM 0x000B 8000-0x000B 9FFF Reserved 0x000B A000-0x000B FFFF BLOCK 2 RAM 0x000C 0000-0x000C 1FFF Reserved 0x000C 2000-0x000D FFFF BLOCK 3 RAM 0x000E 0000-0x000E 1FFF Reserved 0x000E 2000-0x000F FFFF Short Word (16 bits) BLOCK 0 ROM 0x0010 0000-0x0011 FFFF Reserved 0x0012 0000-0x0012 FFFF BLOCK 0 RAM 0x0013 0000-0x0013 3FFF Reserved 0x0013 4000-0x0013 FFFF BLOCK 1 ROM 0x0014 0000-0x0015 FFFF Reserved 0x0016 0000-0x0016 FFFF BLOCK 1 RAM 0x0017 0000-0x0017 3FFF Reserved 0x0017 4000-0x0017 FFFF BLOCK 2 RAM 0x0018 0000-0x0018 3FFF Reserved 0x0018 4000-0x001B FFFF BLOCK 3 RAM 0x001C 0000-0x001C 3FFF Reserved 0x001C 4000-0x001F FFFF external code, executing exclusively from internal ROM. Additionally, the processor is not freely accessible via the JTAG port. Instead, a unique 64-bit key, which must be scanned in through the JTAG or Test Access Port will be assigned to each customer. The device will ignore a wrong key. Emulation features and external boot modes are only available after the correct key is scanned. External Port The external port on the ADSP-21371/ADSP-21375 SHARC processors provide a high performance, glueless interface to a wide variety of industry-standard memory devices. The 32-bit wide bus (ADSP-21371) may be used to interface to synchronous and/or asynchronous memory devices through the use of its separate internal memory controllers: the first is an SDRAM controller for connection of industry-standard synchronous DRAM devices and DIMMs (dual inline memory module), while the second is an asynchronous memory controller intended to interface to a variety of memory devices. Four memory select pins enable up to four separate devices to coexist, supporting any desired combination of synchronous and asynchronous device types. FAMILY PERIPHERAL ARCHITECTURE The ADSP-21371/ADSP-21375 family contains a rich set of peripherals that support a wide variety of applications, including high quality audio, medical imaging, communications, military, test equipment, 3D graphics, speech recognition, monitor control, imaging, and other applications. Rev. C | Page 6 of 52 | September 2009 ADSP-21371/ADSP-21375 Table 4. ADSP-21375 Internal Memory Space IOP Registers 0x0000 0000-0x0003 FFFF Long Word (64 bits) BLOCK 0 ROM 0x0004 0000-0x0004 3FFF Reserved 0x0004 4000-0x0004 BFFF BLOCK 0 RAM 0x0004 C000-0x0004 C7FF Reserved 0x0004 C800-0x0004 FFFF BLOCK 1 ROM 0x0005 0000-0x0005 3FFF Reserved 0x0005 4000-0x0005 BFFF BLOCK 1 RAM 0x0005 C000-0x0005 C7FF Reserved 0x0005 C800-0x0005 FFFF BLOCK 2 RAM 0x0006 0000-0x0006 07FF Reserved 0x0006 0800-0x0006 FFFF BLOCK 3 RAM 0x0007 0000-0x0007 07FF Reserved 0x0007 0800-0x0007 FFFF Extended Precision Normal or Instruction Word (48 bits) BLOCK 0 ROM 0x0008 0000-0x0008 5554 Reserved 0x0008 5555-0x0008 FFFF BLOCK 0 RAM 0x0009 0000-0x0009 0AAA Reserved 0x0009 0AAB-0x0009 FFFF BLOCK 1 ROM 0x000A 0000-0x000A 5554 Reserved 0x000A 5555-0x000A FFFF BLOCK 1 RAM 0x000B 0000-0x000B 0AAA Reserved 0x000B 0AAB-0x000B FFFF BLOCK 2 RAM 0x000C 0000-0x000C 0AAA Reserved 0x000C 0AAB-0x000D FFFF BLOCK 3 RAM 0x000E 0000-0x000E 0AAA Reserved 0x000E 0AAB-0x000F FFFF Normal Word (32 bits) BLOCK 0 ROM 0x0008 0000-0x0008 7FFF Reserved 0x0008 8000-0x0009 7FFF BLOCK 0 RAM 0x0009 8000-0x0009 8FFF Reserved 0x0009 9000-0x0009 FFFF BLOCK 1 ROM 0x000A 0000-0x000A 7FFF Reserved 0x000A 8000-0x000B 7FFF BLOCK 1 RAM 0x000B 8000-0x000B 8FFF Reserved 0x000B 9000-0x000B FFFF BLOCK 2 RAM 0x000C 0000-0x000C 0FFF Reserved 0x000C 1000-0x000D FFFF BLOCK 3 RAM 0x000E 0000-0x000E 0FFF Reserved 0x000E 1000-0x000F FFFF Short Word (16 bits) BLOCK 0 ROM 0x0010 0000-0x0010 FFFF Reserved 0x0011 0000-0x0012 FFFF BLOCK 0 RAM 0x0013 0000-0x0013 1FFF Reserved 0x0013 2000-0x0013 FFFF BLOCK 1 ROM 0x0014 0000-0x0014 FFFF Reserved 0x0015 0000-0x0016 FFFF BLOCK 1 RAM 0x0017 0000-0x0017 1FFF Reserved 0x0017 2000-0x0017 FFFF BLOCK 2 RAM 0x0018 0000-0x0018 1FFF Reserved 0x0018 2000-0x001B FFFF BLOCK 3 RAM 0x001C 0000-0x001C 1FFF Reserved 0x001C 2000-0x001F FFFF Rev. C | Page 7 of 52 | September 2009 ADSP-21371/ADSP-21375 SDRAM Controller The SDRAM controller provides an interface to up to four separate banks of industry-standard SDRAM devices or DIMMs. Fully compliant with the SDRAM standard, each bank has its own memory select line (MS0-MS3), and can be configured to contain between 16M bytes and 256M bytes of memory. SDRAM external memory address space is shown in Table 5. The controller maintains all of the banks as a contiguous address space so that the processor sees this as a single address space, even if different size devices are used in the different banks. A set of programmable timing parameters is available to configure the SDRAM banks to support slower memory devices. The memory banks can be configured as 16 bits wide or as 32 bits wide. The SDRAM controller address, data, clock, and command pins can drive loads up to 30 pF. For larger memory systems, the SDRAM controller external buffer timing should be selected and external buffering should be provided so that the load on the SDRAM controller pins does not exceed 30 pF. Table 5. External Memory for SDRAM Addresses Bank Bank 0 Bank 1 Bank 2 Bank 3 Size in Words 62M 64M 64M 64M Address Range 0x0020 0000-0x03FF FFFF 0x0400 0000-0x07FF FFFF 0x0800 0000-0x0BFF FFFF 0x0C00 0000-0x0FFF FFFF External Port Throughput The throughput for the external port, based on 133 MHz clock and 32-bit data bus, is 177M bytes/s for the AMI and 532M bytes/s for SDRAM. Asynchronous Memory Controller The asynchronous memory controller provides a configurable interface for up to four separate banks of memory or I/O devices. Each bank can be independently programmed with different timing parameters, enabling connection to a wide variety of memory devices including SRAM, ROM, flash, and EPROM, as well as I/O devices that interface with standard memory control lines. Bank 0 occupies a 14.7M word window and banks 1, 2, and 3 occupy a 16M word window in the processor's address space but, if not fully populated, these windows are not made contiguous by the memory controller logic. The banks can also be configured as 8-bit or 16-bit wide buses for ease of interfacing to a range of memories and I/O devices tailored either to high performance or to low cost and power. Pulse-Width Modulation The PWM module is a flexible, programmable, PWM waveform generator that can be programmed to generate the required switching patterns for various applications related to motor and engine control or audio power control. The PWM generator can generate either center-aligned or edge-aligned PWM waveforms. In addition, it can generate complementary signals on two outputs in paired mode or independent signals in nonpaired mode (applicable to a single group of four PWM waveforms). The entire PWM module has four groups of four PWM outputs each. Therefore, this module generates 16 PWM outputs in total. Each PWM group produces two pairs of PWM signals on the four PWM outputs. The PWM generator is capable of operating in two distinct modes while generating center-aligned PWM waveforms: single update mode or double update mode. In single update mode the duty cycle values are programmable only once per PWM period. This results in PWM patterns that are symmetrical about the mid-point of the PWM period. In double update mode, a second updating of the PWM registers is implemented at the midpoint of the PWM period. In this mode, it is possible to produce asymmetrical PWM patterns that produce lower harmonic distortion in three-phase PWM inverters. Note that the external memory bank addresses shown in Table 5 are for normal word accesses. If 48-bit instructions are placed in any such bank (with two instructions packed into three 32-bit locations), then care must be taken to map data buffers in the same bank. For example, if 2k instructions are placed starting at the bank 0 base address (0x0020 0000), then the data buffers can be placed starting at an address that is offset by 3k words (0x0020 0C00). External Memory Code Execution The program sequencer can execute code directly from external memory bank 0 (SRAM, SDRAM) over the 48-bit external port data bus (EPD). This allows a reduction in internal memory size, thereby reducing the die area. With external execution, programs run at slower speeds since 48-bit instructions are fetched in parts from a 16-bit external bus coupled with the inherent latency of fetching instructions from SDRAM. Fetching instructions from external memory generally takes 1.5 peripheral clock cycles per instruction. Non SDRAM external memory address space is shown in Table 6. Table 6. External Memory for Non SDRAM Addresses Bank Bank 0 Bank 1 Bank 2 Bank 3 Size in Words 14M 16M 16M 16M Address Range 0x0020 0000-0x00FF FFFF 0x0400 0000-0x04FF FFFF 0x0800 0000-0x08FF FFFF 0x0C00 0000-0x0CFF FFFF Digital Applications Interface (DAI) The digital applications interface (DAI) provides the ability to connect various peripherals to any of the processor's DAI pins (DAI_P1 to DAI_P20). Programs make these connections using the signal routing unit (SRU), shown in Figure 1. The SRU is a matrix routing unit (or group of multiplexers) that enables the peripherals provided by the DAI to be interconnected under software control. This allows easy use of the DAI Rev. C | Page 8 of 52 | September 2009 ADSP-21371/ADSP-21375 associated peripherals for a much wider variety of applications by using a larger set of algorithms than is possible with nonconfigurable signal paths. In the ADSP-21371, the DAI includes eight serial ports, four precision clock generators (PCG), and an input data port (IDP). For the ADSP-21375, the DAI includes four serial ports, four precision clock generators (PCG) and an input data port (IDP). The IDP provides an additional input path to the core of the processor, configurable as either eight channels of I2S serial data, or a single 20-bit wide synchronous parallel data acquisition port. Each data channel has its own DMA channel that is independent from the processor's serial ports. Serial Ports The processors feature eight synchronous serial ports on the ADSP-21371 and four on the ADSP-21375. The SPORTs provide an inexpensive interface to a wide variety of digital and mixed-signal peripheral devices such as Analog Devices' AD183x family of audio codecs, ADCs, and DACs. The serial ports are made up of two data lines, a clock, and frame sync. The data lines can be programmed to either transmit or receive and each data line has a dedicated DMA channel. For the ADSP-21371, serial ports are enabled via 16 programmable pins and simultaneous receive or transmit pins that support up to 32 transmit or 32 receive channels of audio data when all eight SPORTs are enabled, or eight duplex TDM streams of 128 channels per frame. For the ADSP-21375, serial ports are enabled via eight programmable pins and simultaneous receive or transmit pins that support up to 16 transmit or 16 receive channels of audio data when all four SPORTs are enabled, or four duplex TDM streams of 128 channels per frame. The serial ports operate at a maximum data rate of 50 Mbps. Serial port data can be automatically transferred to and from on-chip memory via dedicated DMA channels. Each of the serial ports can work in conjunction with another serial port to provide TDM support. One SPORT provides two transmit signals while the other SPORT provides the two receive signals. The frame sync and clock are shared. Serial ports operate in five modes: * Standard DSP serial mode * Multichannel (TDM) mode with support for packed I2S mode * I2S mode * Packed I2S mode * Left-justified sample pair mode Left-justified sample pair mode is a mode where in each frame sync cycle two samples of data are transmitted/received--one sample on the high segment of the frame sync, the other on the low segment of the frame sync. Programs have control over various attributes of this mode. Each of the serial ports supports the left-justified sample pair and I2S protocols (I2S is an industry-standard interface commonly used by audio codecs, ADCs, and DACs such as the Rev. C | Page 9 of 52 | September 2009 Analog Devices AD183x family), with two data pins, allowing four left-justified sample pair or I2S channels (using two stereo devices) per serial port, with a maximum of up to 32 I2S channels. The serial ports permit little-endian or big-endian transmission formats and word lengths selectable from 3 bits to 32 bits. For the left-justified sample pair and I2S modes, dataword lengths are selectable between 8 bits and 32 bits. Serial ports offer selectable synchronization and transmit modes as well as optional -law or A-law companding selection on a per channel basis. Serial port clocks and frame syncs can be internally or externally generated. The serial ports also contain frame sync error detection logic where the serial ports detect frame syncs that arrive early (for example frame syncs that arrive while the transmission/reception of the previous word is occurring). All the serial ports also share one dedicated error interrupt. S/PDIF-Compatible Digital Audio Receiver/Transmitter The ADSP-21371 S/PDIF receiver/transmitter has no separate DMA channels. It receives audio data in serial format and converts it into a biphase encoded signal. The serial data input to the receiver/transmitter can be formatted as left justified, I2S or right justified with word widths of 16, 18, 20, or 24 bits. The serial data, clock, and frame sync inputs to the S/PDIF receiver/transmitter are routed through the signal routing unit (SRU). They can come from a variety of sources such as the SPORTs, external pins, the precision clock generators (PCGs), and are controlled by the SRU control registers. The ADSP-21375 does not have an S/PDIF-compatible digital receiver/transmitter. Input Data Port (IDP) The IDP provides up to eight serial input channels--each with its own clock, frame sync, and data inputs. The eight channels are automatically multiplexed into a single 32-bit by eight-deep FIFO. Data is always formatted as a 64-bit frame and divided into two 32-bit words. The serial protocol is designed to receive audio channels in I2S, left-justified sample pair, or right-justified mode. One frame sync cycle indicates one 64-bit left/right pair, but data is sent to the FIFO as 32-bit words (that is, one-half of a frame at a time). The processor supports 24- and 32-bit I2S, 24and 32-bit left-justified, and 24-, 20-, 18- and 16-bit right-justified formats. Precision Clock Generator (PCG) The precision clock generators (PCG) consist of four units, each of which generates a pair of signals (clock and frame sync) derived from a clock input signal. The units, A B, C, and D, are identical in functionality and operate independently of each other. The two signals generated by each unit are normally used as a serial bit clock/frame sync pair. ADSP-21371/ADSP-21375 Digital Peripheral Interface (DPI) The digital peripheral interface provides connections to two serial peripheral interface (SPI) ports, one universal asynchronous receiver-transmitter (UART), 12 flags, a 2-wire interface (TWI), and two general-purpose timers. Serial Peripheral (Compatible) Interface The ADSP-21371/ADSP-21375 SHARC processors contain two serial peripheral interface ports (SPIs). The SPI is an industrystandard synchronous serial link, enabling the SPI-compatible ports of the processors to communicate with other SPI compatible devices. The SPI consists of two data pins, one device select pin, and one clock pin. It is a full-duplex synchronous serial interface, supporting both master and slave modes. The SPI port can operate in a multimaster environment by interfacing with up to four other SPI-compatible devices, either acting as a master or slave device. The SPI-compatible peripheral implementation also features programmable baud rates and clock phases and polarities. The SPI-compatible port uses open drain drivers to support a multimaster configuration and to avoid data contention. UART Port The processors provide a full-duplex Universal Asynchronous Receiver/Transmitter (UART) port, which is fully compatible with PC-standard UARTs. The UART port provides a simplified UART interface to other peripherals or hosts, supporting full-duplex, DMA-supported, asynchronous transfers of serial data. The UART also has multiprocessor communication capability using 9-bit address detection. This allows it to be used in multidrop networks through the RS-485 data interface standard. The UART port also includes support for 5 to 8 data bits, 1 or 2 stop bits, and none, even, or odd parity. The UART port supports two modes of operation: * PIO (programmed I/O) - The processor sends or receives data by writing or reading I/O-mapped UART registers. The data is double-buffered on both transmit and receive. * DMA (direct memory access) - The DMA controller transfers both transmit and receive data. This reduces the number and frequency of interrupts required to transfer data to and from memory. The UART has two dedicated DMA channels, one for transmit and one for receive. These DMA channels have lower default priority than most DMA channels because of their relatively low service rates. The UART port's baud rate, serial data format, error code generation and status, and interrupts are programmable. The port: * Supports bit rates ranging from (fPCLK/1,048,576) to (fPCLK/16) bits per second. * Supports data formats from 7 to 12 bits per frame. * Can be configured to generate maskable interrupts for both transmit and receive operations. In conjunction with the general-purpose timer functions, autobaud detection is supported. Peripheral Timers Two general-purpose timers can generate periodic interrupts and be independently set to operate in one of three modes: * Pulse waveform generation mode * Pulse width count/capture mode * External event watchdog mode Each general-purpose timer has one bidirectional pin and four registers that implement its mode of operation: a 6-bit configuration register, a 32-bit count register, a 32-bit period register, and a 32-bit pulse width register. A single control and status register enables or disables the general-purpose timers independently. 2-Wire Interface Port (TWI) The TWI is a bidirectional 2-wire serial bus used to move 8-bit data while maintaining compliance with the I2C bus protocol. The TWI master incorporates the following features: * Simultaneous master and slave operation on multiple device systems with support for multi master data arbitration * Digital filtering and timed event processing * 7-bit addressing * 100 kbps and 400 kbps data rates * Low interrupt rate I/O PROCESSOR FEATURES The I/O processor provides many channels of DMA and controls the extensive set of peripherals described in the previous sections. DMA Controller The processor's on-chip DMA controller allows data transfers without processor intervention. The DMA controller operates independently and invisibly to the processor core, allowing DMA operations to occur while the core is simultaneously executing its program instructions. DMA transfers can occur between the ADSP-2137x processor's internal memory and its serial ports, the SPI-compatible (serial peripheral interface) ports, the IDP (input data port), the parallel data acquisition port (PDAP), or the UART (see Table 7). Table 7. DMA Channels Peripheral SPORT PDAP SPI UART EP MTM/DTCP Total DMA Channels ADSP-21371 16 8 2 2 2 2 32 ADSP-21375 8 8 2 2 2 2 24 Rev. C | Page 10 of 52 | September 2009 ADSP-21371/ADSP-21375 Delay Line DMA The processors provide delay line DMA functionality. This allows processor reads and writes to external delay line buffers (and hence to external memory) with limited core interaction. Scatter/Gather DMA The ADSP-2137x processor provides scatter/gather DMA functionality. This allows processor DMA reads/writes to/from noncontiguous memory blocks. DEVELOPMENT TOOLS The processors are supported with a complete set of CROSSCORE(R) software and hardware development tools, including Analog Devices emulators and VisualDSP++(R) development environment. The same emulator hardware that supports other SHARC processors also fully emulates the ADSP-21371/ADSP-21375. The VisualDSP++ project management environment lets programmers develop and debug an application. This environment includes an easy to use assembler (which is based on an algebraic syntax), an archiver (librarian/library builder), a linker, a loader, a cycle-accurate instruction-level simulator, a C/C++ compiler, and a C/C++ runtime library that includes DSP and mathematical functions. A key point for these tools is C/C++ code efficiency. The compiler has been developed for efficient translation of C/C++ code to DSP assembly. The SHARC processor has architectural features that improve the efficiency of compiled C/C++ code. The VisualDSP++ debugger has a number of important features. Data visualization is enhanced by a plotting package that offers a significant level of flexibility. This graphical representation of user data enables the programmer to quickly determine the performance of an algorithm. As algorithms grow in complexity, this capability can have increasing significance on the designer's development schedule, increasing productivity. Statistical profiling enables the programmer to nonintrusively poll the processor as it is running the program. This feature, unique to VisualDSP++, enables the software developer to passively gather important code execution metrics without interrupting the real-time characteristics of the program. Essentially, the developer can identify bottlenecks in software quickly and efficiently. By using the profiler, the programmer can focus on those areas in the program that impact performance and take corrective action. Debugging both C/C++ and assembly programs with the VisualDSP++ debugger, programmers can * View mixed C/C++ and assembly code (interleaved source and object information) * Insert breakpoints * Set conditional breakpoints on registers, memory, and stacks * Perform linear or statistical profiling of program execution * Fill, dump, and graphically plot the contents of memory * Perform source level debugging * Create custom debugger windows The VisualDSP++ IDDE lets programmers define and manage DSP software development. Its dialog boxes and property pages let programmers configure and manage all of the SHARC development tools, including the color syntax highlighting in the VisualDSP++ editor. This capability permits programmers to: * Control how the development tools process inputs and generate outputs SYSTEM DESIGN The following sections provide an introduction to system design options and power supply issues. For complete system design information, see the ADSP-2137x SHARC Processor Hardware Reference. Program Booting The internal memory of the processor boots at system power-up from an 8-bit EPROM via the external port, an SPI master, or an SPI slave. Booting is determined by the boot configuration (BOOT_CFG1-0) pins in Table 8. Selection of the boot source is controlled via the SPI as either a master or slave device, or it can immediately begin executing from ROM. Table 8. Boot Mode Selection BOOT_CFG1-0 00 01 10 11 Booting Mode SPI Slave Boot SPI Master Boot EPROM/FLASH Boot Reserved The "Running Reset" feature allows programs to perform a reset of the processor core and peripherals, but without resetting the PLL and SDRAM controller, or performing a boot. The RESETOUT pin acts as the input for initiating a running reset. Power Supplies The processors have separate power supply connections for the internal (VDDINT), and external (VDDEXT) power supplies. The internal supplies must meet the 1.2 V requirement. The external supply must meet the 3.3 V requirement. All external supply pins must be connected to the same power supply. Target Board JTAG Emulator Connector Analog Devices DSP Tools product line of JTAG emulators uses the IEEE 1149.1 JTAG test access port of the processor to monitor and control the target board processor during emulation. Analog Devices DSP Tools product line of JTAG emulators provides emulation at full processor speed, allowing inspection and modification of memory, registers, and processor stacks. The processor's JTAG interface ensures that the emulator will not affect target system loading or timing. For complete information on Analog Devices' SHARC DSP Tools product line of JTAG emulator operation, see the appropriate "Emulator Hardware User's Guide". Rev. C | Page 11 of 52 | September 2009 ADSP-21371/ADSP-21375 * Maintain a one-to-one correspondence with the tool's command line switches The VisualDSP++ Kernel (VDK) incorporates scheduling and resource management tailored specifically to address the memory and timing constraints of DSP programming. These capabilities enable engineers to develop code more effectively, eliminating the need to start from the very beginning, when developing new application code. The VDK features include threads, critical and unscheduled regions, semaphores, events, and device flags. The VDK also supports priority-based, preemptive, cooperative, and time-sliced scheduling approaches. In addition, the VDK was designed to be scalable. If the application does not use a specific feature, the support code for that feature is excluded from the target system. Because the VDK is a library, a developer can decide whether to use it or not. The VDK is integrated into the VisualDSP++ development environment, but can also be used via standard command line tools. When the VDK is used, the development environment assists the developer with many error-prone tasks and assists in managing system resources, automating the generation of various VDK based objects, and visualizing the system state, when debugging an application that uses the VDK. Use the Expert Linker to visually manipulate the placement of code and data on the embedded system. View memory utilization in a color-coded graphical form, easily move code and data to different areas of the processor or external memory with the drag of the mouse, examine run time stack and heap usage. The Expert Linker is fully compatible with the existing Linker Definition File (LDF), allowing the developer to move between the graphical and textual environments. In addition to the software and hardware development tools available from Analog Devices, third parties provide a wide range of tools supporting the SHARC processor family. Hardware tools include SHARC processor PC plug-in cards. Third party software tools include DSP libraries, real-time operating systems, and block diagram design tools. JTAG Emulation Technical Reference on the Analog Devices website (www.analog.com)--use site search on "EE-68." This document is updated regularly to keep pace with improvements to emulator support. Evaluation Kit Analog Devices offers a range of EZ-KIT Lite(R) evaluation platforms to use as a cost effective method to learn more about developing or prototyping applications with Analog Devices processors, platforms, and software tools. Each EZ-KIT Lite includes an evaluation board along with an evaluation suite of the VisualDSP++ development and debugging environment with the C/C++ compiler, assembler, and linker. Also included are sample application programs, power supply, and a USB cable. All evaluation versions of the software tools are limited for use only with the EZ-KIT Lite product. The USB controller on the EZ-KIT Lite board connects the board to the USB port of the user's PC, enabling the VisualDSP++ evaluation suite to emulate the on-board processor in-circuit. This permits the customer to download, execute, and debug programs for the EZ-KIT Lite system. It also allows in-circuit programming of the on-board Flash device to store user-specific boot code, enabling the board to run as a standalone unit without being connected to the PC. With a full version of VisualDSP++ installed (sold separately), engineers can develop software for the EZ-KIT Lite or any custom defined system. Connecting one of Analog Devices JTAG emulators to the EZ-KIT Lite board enables high speed, nonintrusive emulation. ADDITIONAL INFORMATION This data sheet provides a general overview of the processor's architecture and functionality. For detailed information on the core architecture and instruction set, refer to the ADSP-2137x SHARC Processor Hardware Reference. Designing an Emulator-Compatible DSP Board (Target) The Analog Devices family of emulators are tools that every DSP developer needs to test and debug hardware and software systems. Analog Devices has supplied an IEEE 1149.1 JTAG Test Access Port (TAP) on each JTAG DSP. Nonintrusive incircuit emulation is assured by the use of the processor's JTAG interface--the emulator does not affect target system loading or timing. The emulator uses the TAP to access the internal features of the processor, allowing the developer to load code, set breakpoints, observe variables, observe memory, and examine registers. The processor must be halted to send data and commands, but once an operation has been completed by the emulator, the DSP system is set running at full speed with no impact on system timing. To use these emulators, the target board must include a header that connects the DSP's JTAG port to the emulator. For details on target board design issues including mechanical layout, single processor connections, signal buffering, signal termination, and emulator pod logic, see the EE-68: Analog Devices Rev. C | Page 12 of 52 | September 2009 ADSP-21371/ADSP-21375 PIN FUNCTION DESCRIPTIONS The following symbols appear in the Type column of Table 9: A = asynchronous, I = input, O = output, S = synchronous, (A/D) = active drive, (O/D) = open drain, and T = three-state, (pd) = pull-down resistor, (pu) = pull-up resistor. Table 9. Pin Descriptions State During and After Reset Pulled high/ driven low Pulled high/ pulled high Name ADDR23-0 DATA31-0 Type O/T (pu) I/O (pu) Description External Address. The processor outputs addresses for external memory and peripherals on these pins. External Data. The data pins can be multiplexed to support the external memory interface data (I/O), the PDAP (I) (PDAP for ADSP-21371), FLAGS (I/O) and PWM (O). After reset, all DATA pins are in EMIF mode and FLAG(0-3) pins are in FLAGS mode (default). When configured in the IDP_PDAP_CTL register, IDP channel 0 scans the external port data pins for parallel input data. PDAP over 16-bit external port DATA is not supported on the ADSP-21375 processor. Digital Applications Interface Pins. These pins provide the physical interface to the DAI SRU. The DAI SRU configuration registers define the combination of on-chip audiocentric peripheral inputs or outputs connected to the pin and to the pin's output enable. The configuration registers of these peripherals then determine the exact behavior of the pin. Any input or output signal present in the DAI SRU may be routed to any of these pins. The DAI SRU provides the connection from the serial ports, the S/PDIF module (ADSP-21371), IDP (2), and the PCGs (4), to the DAI_P20-1 pins. Pullups can be disabled via the DAI_PIN_PULLUP register. Digital Peripheral Interface. These pins provide the physical interface to the DPI SRU. The DPI SRU configuration registers define the combination of on-chip peripheral inputs or outputs connected to the pin and to the pin's output enable. The configuration registers of these peripherals then determines the exact behavior of the pin. Any input or output signal present in the DPI SRU may be routed to any of these pins. The DPI SRU provides the connection from the timers (2), SPIs (2), UART (1), flags (12), and generalpurpose I/O (9) to the DPI_P14-1 pins. Pull-ups can be disabled via the DPI_PIN_PULLUP register. Memory Acknowledge. External devices can deassert ACK (low) to add wait states to an external memory access. ACK is used by I/O devices, memory controllers, or other peripherals to hold off completion of an external memory access. DAI _P20-1 I/O with programmable (pu)1 Pulled high/ pulled high DPI _P14-1 I/O with programmable (pu)1 Pulled high/ pulled high ACK I (pu) RD WR SDRAS SDCAS SDWE O/T (pu) O/T (pu) O/T (pu) O/T (pu) O/T (pu) Pulled high/ driven high Pulled high/ driven high Pulled high/ driven high Pulled high/ driven high Pulled high/ driven high External Port Read Enable. RD is asserted whenever the processor reads a word from external memory. RD has a 22.5 k internal pull-up resistor. External Port Write Enable. WR is asserted when the processor writes a word to external memory. WR has a 22.5 k internal pull-up resistor. SDRAM Row Address Strobe. Connect to SDRAM's RAS pin. In conjunction with other SDRAM command pins, defines the operation for the SDRAM to perform. SDRAM Column Address Select. Connect to SDRAM's CAS pin. In conjunction with other SDRAM command pins, defines the operation for the SDRAM to perform. SDRAM Write Enable. Connect to SDRAM's WE or W buffer pin. Rev. C | Page 13 of 52 | September 2009 ADSP-21371/ADSP-21375 Table 9. Pin Descriptions (Continued) State During and After Reset Pulled high/ driven high Pulled high/ driven low High-Z/driving Pulled high/ driven high Name SDCKE SDA10 Type O/T (pu) O/T (pu) Description SDRAM Clock Enable. Connect to SDRAM's CKE pin. Enables and disables the CLK signal. For details, see the data sheet supplied with the SDRAM device. SDRAM A10 Pin. Enables applications to refresh an SDRAM in parallel with a nonSDRAM accesses. This pin replaces the DSP's A10 pin only during SDRAM accesses. SDRAM Clock. Memory Select Lines 0-1. These lines are asserted (low) as chip selects for the corresponding banks of external memory. The MS3-0 lines are decoded memory address lines that change at the same time as the other address lines. When no external memory access is occurring the MS3-0 lines are inactive; they are active however when a conditional memory access instruction is executed, whether or not the condition is true. The MS1 pin can be used in EPORT/FLASH boot mode. For more information, see the ADSP-2137x SHARC Processor Hardware Reference. FLAG0/Interrupt Request0. FLAG1/Interrupt Request1. FLAG2/Interrupt Request/Memory Select2. SDCLK MS0-1 O/T O/T (pu) FLAG[0]/IRQ0 FLAG[1]/IRQ1 FLAG[2]/IRQ2/ MS2 FLAG[3]/ TMREXP/ MS3 TDI TDO TMS TCK TRST I/O I/O I/O with programmable pu (for MS mode) I/O with programmable pu (for MS mode) I (pu) O/T I (pu) I I (pu) FLAG[0] INPUT FLAG[1] INPUT FLAG[2] INPUT FLAG[3] INPUT FLAG3/Timer Expired/Memory Select3. Test Data Input (JTAG). Provides serial data for the boundary scan logic. TDI has a 22.5 k internal pull-up resistor. Test Data Output (JTAG). Serial scan output of the boundary scan path. Test Mode Select (JTAG). Used to control the test state machine. TMS has a 22.5 k internal pull-up resistor. Test Clock (JTAG). Provides a clock for JTAG boundary scan. TCK must be asserted (pulsed low) after power-up or held low for proper operation of the processor. Test Reset (JTAG). Resets the test state machine. TRST must be asserted (pulsed low) after power-up or held low for proper operation of the processor. TRST has a 22.5 k internal pull-up resistor. Emulation Status. Must be connected to the processor. Analog Devices DSP Tools product line of JTAG emulators target board connector only. EMU has a 22.5 k internal pull-up resistor. Core to CLKIN Ratio Control. These pins set the start up clock frequency. See the ADSP-2137x SHARC Processor Hardware Reference for a description of the clock configuration modes. Note that the operating frequency can be changed by programming the PLL multiplier and divider in the PMCTL register at any time after the core comes out of reset. Boot Configuration Select. These pins select the boot mode for the processor. The BOOT_CFG pins must be valid before reset is asserted. See the ADSP-2137x SHARC Processor Hardware Reference for information about boot modes. EMU O/T (pu) CLK_CFG1-0 I BOOT_CFG1-0 I Rev. C | Page 14 of 52 | September 2009 ADSP-21371/ADSP-21375 Table 9. Pin Descriptions (Continued) State During and After Reset Name RESET Type I Description Processor Reset. Resets the processor to a known state. Upon deassertion, there is a 4096 CLKIN cycle latency for the PLL to lock. After this time, the core begins program execution from the hardware reset vector address. The RESET input must be asserted (low) at power-up. Crystal Oscillator Terminal. Used in conjunction with CLKIN to drive an external crystal. Local Clock In. Used in conjunction with XTAL. CLKIN is the processor clock input. It configures the processor to use either its internal clock generator or an external clock source. Connecting the necessary components to CLKIN and XTAL enables the internal clock generator. Connecting the external clock to CLKIN while leaving XTAL unconnected configures the processor to use the external clock source such as an external clock oscillator. CLKIN may not be halted, changed, or operated below the specified frequency. Reset Out/Running Reset In. The default setting is reset out. This pin also has a second function as RUNRSTIN, which is enabled by setting bit 0 of the RUNRSTCTL register. For more information, see the ADSP-2137x SHARC Processor Hardware Reference. XTAL CLKIN O I RESETOUT/ RUNRSTIN 1 I/O (pu) Pull-up can be enabled/disabled, value of pull-up cannot be programmed. Rev. C | Page 15 of 52 | September 2009 ADSP-21371/ADSP-21375 ADSP-21371/ADSP-21375 SPECIFICATIONS OPERATING CONDITIONS 1.0 V, 200 MHz Parameter1 Description VDDINT VDDEXT VIH2 VIL2 VIH_CLKIN3 VIL_CLKIN3 TJUNCTION TAMBIENT 1 2 1.2 V, 266 MHz Min 1.14 3.13 2.0 -0.5 1.74 -0.5 0 -40 Max 1.26 3.47 VDDEXT + 0.5 +0.8 VDDEXT + 0.5 +1.10 115 105 Unit V V V V V V C C Min 0.95 3.13 2.0 -0.5 1.74 -0.5 0 -40 Max 1.05 3.47 VDDEXT + 0.5 +0.8 VDDEXT + 0.5 +1.10 115 105 Internal (Core) Supply Voltage External (I/O) Supply Voltage High Level Input Voltage @ VDDEXT = max Low Level Input Voltage @ VDDEXT = min High Level Input Voltage @ VDDEXT = max Low Level Input Voltage @ VDDEXT = min Junction Temperature 208-Lead LQFP_EP @ TAMBIENT 0C to +70C Ambient Temperature 208-Lead LQFP_EP @ TAMBIENT 0C to +70C Specifications subject to change without notice. Applies to input and bidirectional pins: ADDR23-0, DATA31-0 (DATA15-0 on ADSP-21375), FLAG3-0, DAI_Px, DPI_Px, SPIDS, BOOT_CFGx, CLKCFGx, RUNRSTIN, RESET, TCK, TMS, TDI, TRST. 3 Applies to input pin CLKIN. ELECTRICAL CHARACTERISTICS 1.0 V, 200 MHz Parameter1 Description VOH2 VOL2 IIH4, 5 IIL4 IILPU5 IOZH6, 7 IOZL6 IOZLPU7 IDD-INTYP8, 9 High Level Output Voltage Low Level Output Voltage High Level Input Current Low Level Input Current Low Level Input Current Pull-up Three-State Leakage Current Three-State Leakage Current Three-State Leakage Current Pull-up Supply Current (Internal) Test Conditions @ VDDEXT = min, IOH = -1.0 mA3 @ VDDEXT = min, IOL = 1.0 mA3 @ VDDEXT = max, VIN = VDDEXT max @ VDDEXT = max, VIN = 0 V @ VDDEXT = max, VIN = 0 V @ VDDEXT = max, VIN = VDDEXT max @ VDDEXT= max, VIN = 0 V @ VDDEXT= max, VIN = 0 V 1.0V, 200 MHz: tCCLK = 5.00 ns, VDDINT = 1.0 V, 25C 1.2V, 266 MHz: tCCLK = 3.75 ns, VDDINT = 1.2 V, 25C fIN = 1 MHz, TCASE = 25C, VIN= 1.2 V Min 2.4 0.4 10 10 200 10 10 200 Typ Max 1.2 V, 266 MHz Min 2.4 0.4 10 10 200 10 10 200 Typ Max Unit V V A A A A A A 400 600 4.7 4.7 mA mA pF CIN 1 10, 11 Input Capacitance Specifications subject to change without notice. 2 Applies to output and bidirectional pins: ADDR23-0, DATA31-0 (DATA15-0 on ADSP-21375), RD, WR, FLAG3-0, DAI_Px, DPI_Px, EMU, TDO, SDRAS, SDCAS, SDWE, SDCKE, SDA10, and SDCLK. 3 See Output Drive Currents on Page 45 for typical drive current capabilities. 4 Applies to input pins: BOOT_CFGx, CLKCFGx, TCK, RESET, CLKIN. 5 Applies to input pins with 22.5 k internal pull-ups: TRST, TMS, TDI. 6 Applies to three-statable pins: FLAG3-0. 7 Applies to three-statable pins with 22.5 k pull-ups: DAI_Px, DPI_Px, EMU. 8 Typical internal current data reflects nominal operating conditions. 9 See Engineer-to-Engineer Note "Estimating Power Dissipation for ADSP-2137x SHARC Processors" (EE-318) for further information. 10 Applies to all signal pins. 11 Guaranteed, but not tested. Rev. C | Page 16 of 52 | September 2009 ADSP-21371/ADSP-21375 PACKAGE INFORMATION The information presented in Figure 3 provides details about the package branding for the ADSP-21371/ADSP-21375 processor. For a complete listing of product availability, see Ordering Guide on Page 52. Table 11. Absolute Maximum Ratings (Continued) Parameter Load Capacitance Storage Temperature Range Junction Temperature under Bias Rating 200 pF -65C to +150C 125C a ADSP-2137x tppZ-cc vvvvvv.x n.n yyww country_of_origin ESD SENSITIVITY ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality. S Figure 3. Typical Package Brand Table 10. Package Brand Information Brand Key t pp Z ccc vvvvvv.x n.n yyww Field Description Temperature Range Package Type RoHS Compliant Part See Ordering Guide Assembly Lot Code Silicon Revision Date Code TIMING SPECIFICATIONS Use the exact timing information given. Do not attempt to derive parameters from the addition or subtraction of others. While addition or subtraction would yield meaningful results for an individual device, the values given in this data sheet reflect statistical variations and worst cases. Consequently, it is not meaningful to add parameters to derive longer times. See Figure 37 on Page 45 under Test Conditions for voltage reference levels. Switching Characteristics specify how the processor changes its signals. Circuitry external to the processor must be designed for compatibility with these signal characteristics. Switching characteristics describe what the processor will do in a given circumstance. Use switching characteristics to ensure that any timing requirement of a device connected to the processor (such as memory) is satisfied. Timing Requirements apply to signals that are controlled by circuitry external to the processor, such as the data input for a read operation. Timing requirements guarantee that the processor operates correctly with other devices. MAXIMUM POWER DISSIPATION See Engineer-to-Engineer Note "Estimating Power Dissipation for ADSP-2137x SHARC Processors" (EE-318) for detailed thermal and power information regarding maximum power dissipation. For information on package thermal specifications, see Thermal Characteristics on Page 46. ABSOLUTE MAXIMUM RATINGS Stresses greater than those listed in Table 11 may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 11. Absolute Maximum Ratings Parameter Internal (Core) Supply Voltage (VDDINT) External (I/O) Supply Voltage (VDDEXT) Input Voltage -0.5 V to VDDEXT Output Voltage Swing -0.5 V to VDDEXT Rating -0.3 V to +1.5 V -0.3 V to +4.6 V +0.5 V +0.5 V Core Clock Requirements The processor's internal clock (a multiple of CLKIN) provides the clock signal for timing internal memory, processor core, and serial ports. During reset, program the ratio between the processor's internal clock frequency and external (CLKIN) clock frequency with the CLK_CFG1-0 pins. The processor's internal clock switches at higher frequencies than the system input clock (CLKIN). To generate the internal clock, the processor uses an internal phase-locked loop (PLL, see Figure 4). This PLL-based clocking minimizes the skew between the system clock (CLKIN) signal and the processor's internal clock. Rev. C | Page 17 of 52 | September 2009 ADSP-21371/ADSP-21375 Voltage Controlled Oscillator In application designs, the PLL multiplier value should be selected in such a way that the VCO frequency never exceeds fVCO specified in Table 14. * The product of CLKIN and PLLM must never exceed 1/2 fVCO (max) in Table 14 if the input divider is not enabled (INDIV = 0). * The product of CLKIN and PLLM must never exceed fVCO (max) in Table 14 if the input divider is enabled (INDIV = 1). The VCO frequency is calculated as follows: fVCO = 2 x PLLM x fINPUT fCCLK = (2 x PLLM x fINPUT) / (2 x PLLD) where: fVCO = VCO output PLLM = Multiplier value programmed in the PMCTL register. During reset, the PLLM value is derived from the ratio selected using the CLK_CFG pins in hardware. PLLD = 1, 2, 4, 8 based on the PLLD value programmed on the PMCTL register. During reset this value is 1. fINPUT = Input frequency to the PLL. fINPUT = CLKIN when the input divider is disabled or fINPUT = CLKIN / 2 when the input divider is enabled Note the definitions of the clock periods that are a function of CLKIN and the appropriate ratio control shown in Table 12. All of the timing specifications for the ADSP-2137x peripherals are defined in relation to tPCLK. See the peripheral specific section for each peripheral's timing information. Table 12. Clock Periods Timing Requirements tCK tCCLK tPCLK Description CLKIN Clock Period Processor Core Clock Period Peripheral Clock Period = 2 x tCCLK Figure 4 shows core to CLKIN relationships with external oscillator or crystal. The shaded divider/multiplier blocks denote where clock ratios can be set through hardware or software using the power management control register (PMCTL). For more information, see the ADSP-2137x SHARC Processor Hardware Reference. PMCTL (SDCKR) PLL CLKIN CLKIN DIVIDER fINPUT LOOP FILTER fVCO VCO BYPASS MUX PMCTL (PLLBP) PLL DIVIDER fCCLK PMCTL (2xPLLD) CCLK SDRAM DIVIDER BYPASS MUX SDCLK XTAL BUF PMCTL (INDIV) PLL MULTIPLIER PMCTL (PLLBP) DIVIDE BY 2 PCLK PCLK CLK_CFGx/PMCTL (2xPLLM) CCLK CLKOUT (TEST ONLY) PIN MUX RESET DELAY OF 4096 CLKIN CYCLES RESETOUT BUF RESETOUT CORERST Figure 4. Core Clock and System Clock Relationship to CLKIN Rev. C | Page 18 of 52 | September 2009 ADSP-21371/ADSP-21375 Power-Up Sequencing The timing requirements for processor startup are given in Table 13. Note that during power-up, a leakage current of approximately 200 A may be observed on the RESET pin. This leakage current results from the weak internal pull-up resistor on this pin being enabled during power-up. Table 13. Power Up Sequencing Timing Requirements (Processor Startup) Parameter Timing Requirements tRSTVDD RESET Low Before VDDINT/VDDEXT On tIVDDEVDD VDDINT on Before VDDEXT 1 tCLKVDD CLKIN Valid After VDDINT/VDDEXT Valid tCLKRST CLKIN Valid Before RESET Deasserted PLL Control Setup Before RESET Deasserted tPLLRST Switching Characteristic tCORERST Core Reset Deasserted After RESET Deasserted 1 Min 0 -50 0 102 203 4096 x tCK + 2 x tCCLK 4, 5 Max Unit ns ms ms s s +200 200 Valid VDDINT/VDDEXT assumes that the supplies are fully ramped to their 1.2 and 3.3 volt rails. Voltage ramp rates can vary from microseconds to hundreds of milliseconds depending on the design of the power supply subsystem. 2 Assumes a stable CLKIN signal, after meeting worst-case startup timing of crystal oscillators. Refer to your crystal oscillator manufacturer's datasheet for startup time. Assume a 25 ms maximum oscillator startup time if using the XTAL pin and internal oscillator circuit in conjunction with an external crystal. 3 Based on CLKIN cycles. 4 Applies after the power-up sequence is complete. Subsequent resets require a minimum of four CLKIN cycles for RESET to be held low in order to properly initialize and propagate default states at all I/O pins. 5 The 4096 cycle count depends on tSRST specification in Table 15. If setup time is not met, one additional CLKIN cycle may be added to the core reset time, resulting in 4097 cycles maximum. RESET tRSTVDD VDDINT tIVDDEVDD VDDEXT tCLKVDD CLKIN tCLKRST CLK_CFG1-0 tPLLRST RESETOUT tCORERST Figure 5. Power-Up Sequencing Rev. C | Page 19 of 52 | September 2009 ADSP-21371/ADSP-21375 Clock Input Table 14. Clock Input 266 MHz Max 100 45 45 6 10 800 Unit ns ns ns ns ns MHz Parameter Timing Requirements tCK tCKL tCKH tCKRF tCCLK2 fVCO 1 2 Min CLKIN Period CLKIN Width Low CLKIN Width High CLKIN Rise/Fall (0.4 V to 2.0 V) CCLK Period VCO Frequency 22.51 11.251 11.251 3.75 200 Applies only for CLKCFG1-0 = 00 and default values for PLL control bits in the PMCTL register. Any changes to PLL control bits in the PMCTL register must meet core clock timing specification tCCLK. tCK CLKIN tCKH tCKL Figure 6. Clock Input Clock Signals The processor can use an external clock or a crystal. See the CLKIN pin description in Table 9. Programs can configure the processor to use its internal clock generator by connecting the necessary components to CLKIN and XTAL. Figure 7 shows the component connections used for a crystal operating in fundamental mode. Note that the clock rate is achieved using a 16.67 MHz crystal and a PLL multiplier ratio 16:1 (CCLK:CLKIN achieves a clock speed of 266 MHz). To achieve the full core clock rate, programs need to configure the multiplier bits in the PMCTL register. ADSP-2137x CLKIN R1 1M * XTAL R2 47 * C1 22pF Y1 16.67 MHz C2 22pF R2 SHOULD BE CHOSEN TO LIMIT CRYSTAL DRIVE POWER. REFER TO CRYSTAL MANUFACTURER'S SPECIFICATIONS *TYPICAL VALUES Figure 7. 266 MHz Operation (Fundamental Mode Crystal) Rev. C | Page 20 of 52 | September 2009 ADSP-21371/ADSP-21375 Reset Table 15. Reset Parameter Timing Requirements tWRST1 RESET Pulse Width Low tSRST RESET Setup Before CLKIN Low 1 Min 4 x tCK 8 Max Unit ns ns Applies after the power-up sequence is complete. At power-up, the processor's internal phase-locked loop requires no more than 100 s while RESET is low, assuming stable VDD and CLKIN (not including start-up time of external clock oscillator). CLKIN tWRST RESET tSRST Figure 8. Reset Running Reset The following timing specification applies to RESETOUT/RUNRSTIN pin when it is configured as RUNRSTIN. Table 16. Running Reset Parameter Timing Requirements tWRUNRST Running RESET Pulse Width Low tSRUNRST Running RESET Setup Before CLKIN High Min 4 x tCK 8 Max Unit ns ns CLKIN tWRUNRST RUNRSTIN tSRUNRST Figure 9. Running Reset Rev. C | Page 21 of 52 | September 2009 ADSP-21371/ADSP-21375 Core Timer The following timing specification applies to FLAG3 when it is configured as the core timer (TMREXP pin). Table 17. Core Timer Parameter Switching Characteristic tWCTIM TMREXP Pulse Width Min 4 x tPCLK - 1 Max Unit ns FLAG3 (TMREXP) tWCTIM Figure 10. Core Timer Interrupts The following timing specification applies to the FLAG0, FLAG1, and FLAG2 pins when they are configured as IRQ0, IRQ1, and IRQ2 interrupts as well as the DAI_P20-1 and DPI_P14-1 pins when they are configured as interrupts. Table 18. Interrupts Parameter Timing Requirement tIPW IRQx Pulse Width Min 2 x tPCLK +2 Max Unit ns DAI_P20-1 DPI_P14-1 FLAG2-0 (IRQ2-0) tIPW Figure 11. Interrupts Rev. C | Page 22 of 52 | September 2009 ADSP-21371/ADSP-21375 Timer PWM_OUT Cycle Timing The following timing specification applies to Timer0 and Timer1 in PWM_OUT (pulse-width modulation) mode. Timer signals are routed to the DPI_P14-1 pins through the DPI SRU. Therefore, the specifications provided below are valid at the DPI_P14-1 pins. Table 19. Timer PWM_OUT Timing Parameter Switching Characteristic tPWMO Timer Pulse Width Output Min 2 x tPCLK - 2 Max 2 x (231 - 1) x tPCLK Unit ns tPWMO DPI_P14-1 (TIMER1-0) Figure 12. Timer PWM_OUT Timing Timer WDTH_CAP Timing The following timing specification applies to Timer0 and Timer1 in WDTH_CAP (pulse width count and capture) mode. Timer signals are routed to the DPI_P14-1 pins through the SRU. Therefore, the specifications provided below are valid at the DPI_P14-1 pins. Table 20. Timer Width Capture Timing Parameter Timing Requirement tPWI Timer Pulse Width Min 2 x tPCLK Max 2 x (231- 1) x tPCLK Unit ns tPWI DPI_P14-1 (TIMER1-0) Figure 13. Timer Width Capture Timing Rev. C | Page 23 of 52 | September 2009 ADSP-21371/ADSP-21375 Pin to Pin Direct Routing (DAI and DPI) For direct pin connections only (for example, DAI_PB01_I to DAI_PB02_O). Table 21. DAI/DPI Pin to Pin Routing Parameter Timing Requirement tDPIO Delay DAI/DPI Pin Input Valid to DAI/DPI Output Valid Min 1.5 Max 10 Unit ns DAI_Pn DPI_Pn DAI_Pm DPI_Pm tDPIO Figure 14. DAI/DPI Pin to Pin Direct Routing Rev. C | Page 24 of 52 | September 2009 ADSP-21371/ADSP-21375 Precision Clock Generator (Direct Pin Routing) This timing is only valid when the SRU is configured such that the precision clock generator (PCG) takes its inputs directly from the DAI pins (via pin buffers) and sends its outputs directly to the DAI pins. For the other cases, where the PCG's Table 22. Precision Clock Generator (Direct Pin Routing) 1.2 V, 266 MHz Parameter Min Max Unit Timing Requirements tPCGIP Input Clock Period tPCLK x 4 ns PCG Trigger Setup Before Falling Edge of PCG 4.5 ns tSTRIG Input Clock tHTRIG PCG Trigger Hold After Falling Edge of PCG 3 ns Input Clock Switching Characteristics tDPCGIO PCG Output Clock and Frame Sync Active Edge Delay After PCG Input Clock 2.5 10 ns tDTRIGCLK PCG Output Clock Delay After PCG Trigger 2.5 + ((2.5) x tPCGIW) 10 + ((2.5) x tPCGIW) ns tDTRIGFS PCG Frame Sync Delay After PCG Trigger 2.5 + ((2.5 + D - PH) x tPCGIW) 10 + ((2.5 + D - PH) x tPCGIW) ns Output Clock Period 2 x tPCGIW - 1 ns tPCGOW1 D = FSxDIV, PH = FSxPHASE. For more information, see the ADSP-2137x SHARC Processor Hardware Reference, "Precision Clock Generators" chapter. 1 inputs and outputs are not directly routed to/from DAI pins (via pin buffers) there is no timing data available. All timing parameters and switching characteristics apply to external DAI pins (DAI_P01 through DAI_P20). Normal mode of operation. tSTRIG DAI_Pn DPI_Pn PCG_TRIGx_I tHTRIG tPCGIW DAI_Pm DPI_Pm PCG_EXTx_I (CLKIN) DAI_Py DPI_Py PCG_CLKx_O tDPCGIO tDTRIGCLK DAI_Pz DPI_Pz PCG_FSx_O tDPCGIO tPCGOW tDTRIGFS Figure 15. Precision Clock Generator (Direct Pin Routing) Rev. C | Page 25 of 52 | September 2009 ADSP-21371/ADSP-21375 Flags The timing specifications provided below apply to the FLAG3-0 and DPI_P14-1 pins, and the DATA31-0 pins. See Table 9 on Page 13 for more information on flag use. Table 23. Flags Parameter Timing Requirement DPI_P14-1, DATA31-0, FLAG3-0 IN Pulse Width tFIPW Switching Characteristic tFOPW DPI_P14-1, DATA31-0, FLAG3-0 OUT Pulse Width Min 2 x tPCLK + 3 2 x tPCLK - 2 Max Unit ns ns DPI_P14-1 (FLAG3-0IN) (DATA31-0) tFIPW DPI_P14-1 (FLAG3-0OUT) (DATA31-0) tFOPW Figure 16. Flags Rev. C | Page 26 of 52 | September 2009 ADSP-21371/ADSP-21375 SDRAM Interface Timing Maximum SDRAM frequency for 1.2 V is 133 MHz SDCLK. Table 24. SDRAM Interface Timing1 1.2 V, 266 MHz Max Parameter Timing Requirements tSSDAT DATA Setup Before SDCLK DATA Hold After SDCLK tHSDAT Switching Characteristics tSDCLK SDCLK Period tSDCLKH SDCLK Width High tSDCLKL SDCLK Width Low tDCAD Command, ADDR, Data Delay After SDCLK2 Command, ADDR, Data Hold After SDCLK2 tHCAD tDSDAT Data Disable After SDCLK tENSDAT Data Enable After SDCLK 1 2 Min 0.58 2.2 7.5 3 3 Unit ns ns ns ns ns ns ns ns ns 5.3 1.3 5.3 1.6 For FCCLK = 133 MHz (SDCLK ratio = 1:2). Command pins include: SDCAS, SDRAS, SDWE, MSx, SDA10, and SDCKE. tSDCLK SDCLK tSDCLKH tSSDAT tHSDAT tSDCLKL DATA (IN) tDCAD tENSDAT DATA (OUT) tDSDAT tHCAD tDCAD CMND ADDR (OUT) tHCAD Figure 17. SDRAM Interface Timing for 133 MHz SDCLK Rev. C | Page 27 of 52 | September 2009 ADSP-21371/ADSP-21375 Memory Read--Bus Master Use these specifications for asynchronous interfacing to memories. Note that timing for ACK, DATA, RD, WR, and strobe timing parameters only apply to asynchronous access mode. Table 25. Memory Read--Bus Master 1.2 V, 266 MHz Max W + tSDCLK - 5.12 W-3 Parameter Min Timing Requirements tDAD Address, Selects Delay to Data Valid1, 2 tDRLD RD Low to Data Valid1 tSDS Data Setup to RD High 2.2 tHDRH Data Hold from RD High3, 4 0 2, 5 tDAAK ACK Delay from Address, Selects tDSAK ACK Delay from RD Low4 Switching Characteristics tDRHA Address Selects Hold After RD High RHC + 0.38 tDARL Address Selects to RD Low2 tSDCLK - 3.3 tRW RD Pulse Width W - 1.4 tRWR RD High to WR, RD, Low HI + tSDCLK - 0.8 W = (number of wait states specified in AMICTLx register) x tSDCLK HI = RHC + IC (RHC = (number of Read Hold Cycles specified in AMICTLx register) x tSDCLK IC = (number of idle cycles specified in AMICTLx register) x tSDCLK) H = (number of hold cycles specified in AMICTLx register) x tSDCLK 1 2 Unit ns ns ns ns ns ns ns ns ns ns tSCDCLK - 10. + W W - 7.0 Data delay/setup: System must meet tDAD, tDRLD, or tSDS. The falling edge of MSx, is referenced. 3 Note that timing for ACK, DATA, RD, WR, and strobe timing parameters only apply to asynchronous access mode. 4 Data hold: User must meet tHDRH in asynchronous access mode. See Test Conditions on Page 45 for the calculation of hold times given capacitive and dc loads. 5 ACK delay/setup: User must meet tDAAK, or tDSAK, for deassertion of ACK (low). For asynchronous assertion of ACK (high) user must meet tDAAK or tDSAK. ADDR MSx tDARL RD tRW tDRHA tDRLD tDAD DATA tSDS tHDRH tDSAK tDAAK ACK tRWR WR Figure 18. Memory Read--Bus Master Rev. C | Page 28 of 52 | September 2009 ADSP-21371/ADSP-21375 Memory Write--Bus Master Use these specifications for asynchronous interfacing to memories. Note that timing for ACK, DATA, RD, WR, and strobe timing parameters only apply to asynchronous access mode. Table 26. Memory Write--Bus Master 1.2 V, 266 MHz Parameter Min Max Unit Timing Requirements tDAAK ACK Delay from Address, Selects1, 2 tSDCLK - 10.1 + W ns tDSAK ACK Delay from WR Low 1, 3 W - 7.1 ns Switching Characteristics tDAWH Address, Selects to WR Deasserted2 tSDCLK - 3.6 + W ns tDAWL Address, Selects to WR Low2 tSDCLK - 2.7 ns WR Pulse Width W - 1.3 ns tWW tDDWH Data Setup Before WR High tSDCLK - 3.0 + W ns tDWHA Address Hold After WR Deasserted H + 0.15 ns tDWHD Data Hold After WR Deasserted H + 0.02 ns tDATRWH Data Disable After WR Deasserted4 tSDCLK - 1.37 + H tSDCLK + 4.9+ H ns tWWR WR High to WR, RD Low tSDCLK - 1.5+ H ns Data Disable Before RD Low 2tSDCLK - 5.1 ns tDDWR tWDE WR Low to Data Enabled tSDCLK - 4.1 ns W = (number of wait states specified in AMICTLx register) x tSDCLK, H = (number of hold cycles specified in AMICTLx register) x tSDCLK 1 2 ACK delay/setup: System must meet tDAAK, or tDSAK, for deassertion of ACK (low). For asynchronous assertion of ACK (high) user must meet tDAAK or tDSAK. The falling edge of MSx is referenced. 3 Note that timing for ACK, DATA, RD, WR, and strobe timing parameters only applies to asynchronous access mode. 4 See Test Conditions on Page 45 for calculation of hold times given capacitive and dc loads. ADDR MSx tDAWH tDAWL WR tDWHA tWW tWDE tDDWH DATA tWWR tDATRWH tDDWR tDSAK tDAAK ACK tDWHD RD Figure 19. Memory Write--Bus Master Rev. C | Page 29 of 52 | September 2009 ADSP-21371/ADSP-21375 Serial Ports To determine whether communication is possible between two devices at clock speed n, the following specifications must be confirmed: 1) frame sync delay and frame sync setup and hold, 2) data delay and data setup and hold, and 3) serial clock (SCLK) width. Table 27. Serial Ports--External Clock 1.2 V, 266 MHz Max Serial port signals are routed to the DAI_P20-1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DAI_P20-1 pins. Parameter Timing Requirements tSFSE1 Frame Sync Setup Before SCLK (Externally Generated Frame Sync in either Transmit or Receive Mode) 1 tHFSE Frame Sync Hold After SCLK (Externally Generated Frame Sync in either Transmit or Receive Mode) 1 tSDRE Receive Data Setup Before Receive SCLK tHDRE1 Receive Data Hold After SCLK tSCLKW SCLK Width tSCLK SCLK Period Switching Characteristics tDFSE2 Frame Sync Delay After SCLK (Internally Generated Frame Sync in either Transmit or Receive Mode) tHOFSE2 Frame Sync Hold After SCLK (Internally Generated Frame Sync in either Transmit or Receive Mode) tDDTE2 Transmit Data Delay After Transmit SCLK 2 tHDTE Transmit Data Hold After Transmit SCLK 1 Min Unit 2.5 2.5 2.5 2.5 (tPCLK x 4) / 2 - 0.5 tPCLK x 4 ns ns ns ns ns ns 10.5 2 11 2 ns ns ns ns Referenced to sample edge. 2 Referenced to drive edge. Table 28. Serial Ports--Internal Clock 1.2 V, 266 MHz Max Parameter Timing Requirements tSFSI1 Frame Sync Setup Before SCLK (Externally Generated Frame Sync in either Transmit or Receive Mode) tHFSI1 Frame Sync Hold After SCLK (Externally Generated Frame Sync in either Transmit or Receive Mode) Receive Data Setup Before SCLK tSDRI1 tHDRI1 Receive Data Hold After SCLK Switching Characteristics tDFSI2 Frame Sync Delay After SCLK (Internally Generated Frame Sync in Transmit Mode) tHOFSI2 Frame Sync Hold After SCLK (Internally Generated Frame Sync in Transmit Mode) 2 tDFSIR Frame Sync Delay After SCLK (Internally Generated Frame Sync in Receive Mode) Frame Sync Hold After SCLK (Internally Generated Frame Sync in Receive Mode) tHOFSIR2 tDDTI2 Transmit Data Delay After SCLK 2 tHDTI Transmit Data Hold After SCLK tSCKLIW3 Transmit or Receive SCLK Width 1 Min Unit 7 2.5 7 2.5 4 -1.0 10.7 -1.0 3.6 -1.0 0.5tPCLK - 2 0.5tPCLK + 2 ns ns ns ns ns ns ns ns ns ns ns Referenced to the sample edge. 2 Referenced to drive edge. 3 Minimum SPORT divisor register value. Rev. C | Page 30 of 52 | September 2009 ADSP-21371/ADSP-21375 Table 29. Serial Ports--Enable and Three-State 1.2 V, 266 MHz Min Max Unit 2 10 -1 ns ns ns Parameter Switching Characteristics tDDTEN1 Data Enable from External Transmit SCLK tDDTTE1 Data Disable from External Transmit SCLK 1 tDDTIN Data Enable from Internal Transmit SCLK 1 Referenced to drive edge. Table 30. Serial Ports--External Late Frame Sync 1.2 V, 266 MHz Min Max Unit 10 0.5 ns ns Parameter Switching Characteristics tDDTLFSE1 Data Delay from Late External Transmit Frame Sync or External Receive Frame Sync with MCE = 1, MFD = 0 tDDTENFS1 Data Enable for MCE = 1, MFD = 0 1 The tDDTLFSE and tDDTENFS parameters apply to left-justified sample pair as well as DSP serial mode, and MCE = 1, MFD = 0. Rev. C | Page 31 of 52 | September 2009 ADSP-21371/ADSP-21375 EXTERNAL RECEIVE FS WITH MCE = 1, MFD = 0 DRIVE DAI_P20-1 (SCLK) SAMPLE DRIVE tSFSE/I DAI_P20-1 (FRAME SYNC) tHFSE/I tDDTENFS DAI_P20-1 (DATA CHANNEL A/B) 1ST BIT tDDTE/I tHDTE/I 2ND BIT tDDTLFSE LATE EXTERNAL TRANSMIT FS DRIVE DAI_P20-1 (SCLK) SAMPLE DRIVE tSFSE/I DAI_P20-1 (FRAME SYNC) tHFSE/I tDDTENFS DAI_P20-1 (DATA CHANNEL A/B) 1ST BIT tDDTE/I tHDTE/I 2ND BIT tDDTLFSE NOTES 1. SERIAL PORT SIGNALS (SCLK, FS, DATA CHANNEL A/B) ARE ROUTED TO THE DAI_P20-1 PINS USING THE SRU. THE TIMING SPECIFICATIONS PROVIDED HERE ARE VALID AT THE DAI_P20-1 PINS. THE CHARACTERIZED SPORT AC TIMINGS ARE APPLICABLE WHEN INTERNAL CLOCKS AND FRAMES ARE LOOPED BACK FROM THE PIN, NOT ROUTED DIRECTLY THROUGH THE SRU. Figure 20. External Late Frame Sync1 1 This figure reflects changes made to support left-justified sample pair mode. Rev. C | Page 32 of 52 | September 2009 ADSP-21371/ADSP-21375 DATA RECEIVE--INTERNAL CLOCK DRIVE EDGE DATA RECEIVE--EXTERNAL CLOCK DRIVE EDGE SAMPLE EDGE SAMPLE EDGE tSCLKIW tSCLKW DAI_P20-1 (SCLK) DAI_P20-1 (SCLK) tDFSIR tHOFSIR DAI_P20-1 (FRAME SYNC) tDFSE tSFSI tHFSI tHOFSE DAI_P20-1 (FRAME SYNC) tSFSE tHFSE tSDRI DAI_P20-1 (DATA CHANNEL A/B) tHDRI DAI_P20-1 (DATA CHANNEL A/B) tSDRE tHDRE NOTES 1. EITHER THE RISING EDGE OR THE FALLING EDGE OF SCLK (EXTERNAL OR INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE. DATA TRANSMIT--INTERNAL CLOCK DRIVE EDGE DATA TRANSMIT--EXTERNAL CLOCK DRIVE EDGE tSCLKIW SAMPLE EDGE tSCLKW SAMPLE EDGE DAI_P20-1 (SCLK) DAI_P20-1 (SCLK) tDFSI tHOFSI DAI_P20-1 (SCLK) tDFSE tSFSI tHFSI tHOFSE DAI_P20-1 (FRAME SYNC) tSFSE tHFSE tHDTI DAI_P20-1 (DATA CHANNEL A/B) tDDTI DAI_P20-1 (DATA CHANNEL A/B) tHDTE tDDTE NOTES 1. EITHER THE RISING EDGE OR THE FALLING EDGE OF SCLK (EXTERNAL OR INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE. DRIVE EDGE DAI_P20-1 (SCLK, EXT) SCLK DRIVE EDGE tDDTEN DAI_P20-1 (FRAME SYNC) DRIVE EDGE DAI_P20-1 (DATA CHANNEL A/B) tDDTTE tDDTIN Figure 21. Serial Ports Rev. C | Page 33 of 52 | September 2009 ADSP-21371/ADSP-21375 Input Data Port (IDP) The timing requirements for the IDP are given in Table 31. IDP signals are routed to the DAI_P20-1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DAI_P20-1 pins. Table 31. Input Data Port (IDP) 1.2 V, 266 MHz Max Parameter Timing Requirements tSISFS1 Frame Sync Setup Before Serial Clock Rising Edge Frame Sync Hold After Serial Clock Rising Edge tSIHFS1 tSISD1 Data Setup Before Serial Clock Rising Edge 1 tSIHD Data Hold After Serial Clock Rising Edge tIDPCLKW Clock Width tIDPCLK Clock Period 1 Min Unit ns ns ns ns ns ns 3.8 2.5 2.5 2.5 (tPCLK x 4) / 2 - 1 tPCLK x 4 The data, serial clock, and frame sync signals can come from any of the DAI pins. Serial clock and frame sync can also come via PCG or SPORTs. PCG's input can be either CLKIN or any of the DAI pins. SAMPLE EDGE tIPDCLK DAI_P20-1 (SERIAL CLOCK) tIPDCLKW tSISFS DAI_P20-1 (FRAME SYNC) tSIHFS tSISD DAI_P20-1 (DATA) tSIHD Figure 22. IDP Master Timing Rev. C | Page 34 of 52 | September 2009 ADSP-21371/ADSP-21375 Parallel Data Acquisition Port (PDAP) The timing requirements for the PDAP are provided in Table 32. PDAP is the parallel mode operation of Channel 0 of the IDP. For details on the operation of the PDAP, see the PDAP chapter of the ADSP-2137x SHARC Processor Hardware Reference. Table 32. Parallel Data Acquisition Port (PDAP) Parameter Timing Requirements tSPCLKEN1 PDAP_CLKEN Setup Before PDAP_CLK Sample Edge tHPCLKEN1 PDAP_CLKEN Hold After PDAP_CLK Sample Edge tPDSD1 PDAP_DAT Setup Before Serial Clock PDAP_CLK Sample Edge tPDHD1 PDAP_DAT Hold After Serial Clock PDAP_CLK Sample Edge Clock Width tPDCLKW tPDCLK Clock Period Switching Characteristics tPDHLDD Delay of PDAP Strobe After Last PDAP_CLK Capture Edge for a Word tPDSTRIB PDAP Strobe Pulse Width 1 Note that the 20-bits of external PDAP data can be provided through the external port DATA31-12 pins. On the ADSP-21375 processors, PDAP can not be multiplexed on the external port (since only DATA15-0). Use the SRU DAI instead. Min 2.5 2.5 3.85 2.5 (tPCLK x 4) / 2 - 3 tPCLK x 4 2 x tPCLK + 3 2 x tPCLK - 1 Max Unit ns ns ns ns ns ns ns ns Data source pins are DATA31-12 or DAI pins. Source pins for serial clock and frame sync are: 1) DATA11-10 pins, 2) DAI pins SAMPLE EDGE tPDCLK tPDCLKW DAI_P20-1 (PDAP_CLK) tSPCLKEN DAI_P20-1 (PDAP_CLKEN) tHPCLKEN tPDSD DATA tPDHD DAI_P20-1 (PDAP_STROBE) tPDHLDD tPDSTRB Figure 23. PDAP Timing Rev. C | Page 35 of 52 | September 2009 ADSP-21371/ADSP-21375 Pulse-Width Modulation Generators (PWM) For the ADSP-21371, the following timing specifications apply when the DATA31-16 pins are configured as PWM. Table 33. Pulse-Width Modulation (PWM) Timing Parameter Switching Characteristics tPWMW PWM Output Pulse Width tPWMP PWM Output Period Min tPCLK - 2.5 2 x tPCLK - 2.5 Max (216 - 2) x tPCLK - 2.5 (216 - 1) x tPCLK - 2.5 Unit ns ns Pulse-width modulation generator information does not apply to the ADSP-21375. tPWMW PWM OUTPUTS tPWMP Figure 24. PWM Timing Rev. C | Page 36 of 52 | September 2009 ADSP-21371/ADSP-21375 S/PDIF Transmitter For the ADSP-21371, serial data input to the S/PDIF transmitter can be formatted as left-justified, I2S, or right-justified with word widths of 16-, 18-, 20-, or 24-bits. The following sections provide timing for the transmitter. S/PDIF Transmitter-Serial Input Waveforms Figure 25 shows the right-justified mode. LRCLK is high for the left channel and low for the right channel. Data is valid on the rising edge of serial clock. The MSB is delayed 12-bit clock periods (in 20-bit output mode) or 16-bit clock periods (in 16-bit output mode) from an LRCLK transition, so that when there are 64 serial clock periods per LRCLK period, the LSB of the data will be right-justified to the next LRCLK transition. S/PDIF transmitter information does not apply to the ADSP-21375. Figure 26 shows the default I2S-justified mode. LRCLK is low for the left channel and high for the right channel. Data is valid on the rising edge of serial clock. The MSB is left-justified to an LRCLK transition but with a single serial clock period delay. Figure 27 shows the left-justified mode. LRCLK is high for the left channel and low for the right channel. Data is valid on the rising edge of serial clock. The MSB is left-justified to an LRCLK transition with no MSB delay. DAI_P20-1 LRCLK DAI_P20-1 SCLK DAI_P20-1 SDATA LEFT CHANNEL RIGHT CHANNEL MSB - 2 LSB MSB MSB - 1 LSB + 1 LSB LSB + 2 MSB MSB - 2 MSB - 1 LSB + 1 LSB LSB + 2 Figure 25. Right-Justified Mode DAI_P20-1 LRCLK DAI_P20-1 SCLK DAI_P20-1 SDATA MSB - 2 MSB MSB - 1 RIGHT CHANNEL LEFT CHANNEL LSB + 1 LSB LSB + 2 MSB MSB - 2 MSB - 1 LSB + 1 LSB LSB + 2 MSB Figure 26. I2S-Justified Mode DAI_P20-1 LRCLK DAI_P20-1 SCLK DAI_P20-1 SDATA MSB - 2 MSB MSB - 1 LEFT CHANNEL RIGHT CHANNEL LSB + 1 LSB LSB + 2 MSB MSB - 2 MSB - 1 LSB + 1 LSB LSB + 2 MSB MSB + 1 Figure 27. Left-Justified Mode Rev. C | Page 37 of 52 | September 2009 ADSP-21371/ADSP-21375 S/PDIF Transmitter Input Data Timing The timing requirements for the S/PDIF transmitter are given in Table 34. Input signals are routed to the DAI_P20-1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DAI_P20-1 pins. Table 34. S/PDIF Transmitter Input Data Timing 1.2 V, 266 MHz Max Parameter Timing Requirements tSISFS1 Frame Sync Setup Before Serial Clock Rising Edge tSIHRS1 Frame Sync Hold After Serial Clock Rising Edge tSISD1 Data Setup Before Serial Clock Rising Edge Data Hold After Serial Clock Rising Edge tSIHD1 tSITXCLKW Transmit Clock Width tSITXCLK Transmit Clock Period tSISCLKW Clock Width tSISCLK Clock Period 1 Min 3 3 3 3 9 20 36 80 Unit ns ns ns ns ns ns ns ns The data, serial clock, and frame sync can come from any of the DAI pins. Serial clock and frame sync can also come via PCG or SPORTs. PCG's input can be either CLKIN or any of the DAI pins. SAMPLE EDGE tSITXCLKW DAI_P20-1 (TxCLK) tSITXCLK tSISCLKW DAI_P20-1 (SERIAL CLOCK) tSISCLK tSISFS DAI_P20-1 (FRAME SYNC) tSIHFS tSISD DAI_P20-1 (DATA) tSIHD Figure 28. S/PDIF Transmitter Input Timing Oversampling Clock (TxCLK) Switching Characteristics The S/PDIF transmitter has an oversampling clock. This TxCLK input is divided down to generate the biphase clock. Table 35. Oversampling Clock (TxCLK) Switching Characteristics Parameter TxCLK Frequency for TxCLK = 384 x Frame Sync TxCLK Frequency for TxCLK = 256 x Frame Sync Frame Rate (FS) Max Oversampling Ratio x Frame Sync <= 1/tSITXCLK 49.2 192.0 Unit MHz MHz kHz Rev. C | Page 38 of 52 | September 2009 ADSP-21371/ADSP-21375 S/PDIF Receiver For the ADSP-21371, the following section describes timing as it relates to the S/PDIF receiver. Table 36. S/PDIF Receiver Internal Digital PLL Mode Timing 1.2 V, 266 MHz Max 5 -2 5 -2 38.5 Internal Digital PLL Mode In the internal digital phase-locked loop mode the internal PLL (digital PLL) generates the 512 x Frame Sync clock. The S/PDIF receiver information does not apply to the ADSP-21375. Parameter Switching Characteristics tDFSI LRCLK Delay After Serial Clock LRCLK Hold After Serial Clock tHOFSI tDDTI Transmit Data Delay After Serial Clock tHDTI Transmit Data Hold After Serial Clock tSCLKIW1 Transmit Serial Clock Width 1 Min Unit ns ns ns ns ns Serial lock frequency is 64 x Frame Sync where FS = the frequency of LRCLK. DRIVE EDGE SAMPLE EDGE tSCLKIW DAI_P20-1 (SERIAL CLOCK) tDFSI tHOFSI DAI_P20-1 (FRAME SYNC) tDDTI tHDTI DAI_P20-1 (DATA CHANNEL A/B) Figure 29. S/PDIF Receiver Internal Digital PLL Mode Timing Rev. C | Page 39 of 52 | September 2009 ADSP-21371/ADSP-21375 SPI Interface--Master The processor contains two SPI ports. Both primary and secondary are available through DPI only. The timing provided in Table 37 and Table 38 applies to both. Table 37. SPI Interface Protocol--Master Switching and Timing Specifications Parameter Timing Requirements Data Input Valid To SPICLK Edge (Data Input Setup Time) tSSPIDM tHSPIDM SPICLK Last Sampling Edge To Data Input Not Valid Switching Characteristics tSPICLKM Serial Clock Cycle tSPICHM Serial Clock High Period tSPICLM Serial Clock Low Period SPICLK Edge to Data Out Valid (Data Out Delay Time) tDDSPIDM tHDSPIDM SPICLK Edge to Data Out Not Valid (Data Out Hold Time) tSDSCIM FLAG3-0IN (SPI device select) Low to First SPICLK Edge tHDSM Last SPICLK Edge to FLAG3-0IN High tSPITDM Sequential Transfer Delay Min 8.2 2 8 x tPCLK - 2 4 x tPCLK - 2 4 x tPCLK - 2 2.5 4 x tPCLK - 2 4 x tPCLK - 2 4 x tPCLK - 2 4 x tPCLK - 1 Max Unit ns ns ns ns ns ns ns ns ns ns FLAG3-0 (OUTPUT) tSDSCIM SPICLK (CP = 0) (OUTPUT) tSPICHM tSPICLM tSPICLKM tHDSM tSPITDM tSPICLM SPICLK (CP = 1) (OUTPUT) tSPICHM tDDSPIDM MOSI (OUTPUT) CPHASE = 1 MISO (INPUT) MSB VALID MSB tHDSPIDM LSB tSSPIDM tHSPIDM tSSPIDM tHSPIDM LSB VALID tDDSPIDM MOSI (OUTPUT) CPHASE = 0 MISO (INPUT) MSB tHDSPIDM LSB tSSPIDM tHSPIDM MSB VALID LSB VALID Figure 30. SPI Master Timing Rev. C | Page 40 of 52 | September 2009 ADSP-21371/ADSP-21375 SPI Interface--Slave Table 38. SPI Interface Protocol--Slave Switching and Timing Specifications 1.2 V, 266 MHz Max Serial Clock Cycle Serial Clock High Period Serial Clock Low Period SPIDS Assertion to First SPICLK Edge CPHASE = 0 CPHASE = 1 tHDS Last SPICLK Edge to SPIDS Not Asserted (CPHASE=0) tSSPIDS Data Input Valid to SPICLK edge (Data Input Set-up Time) tHSPIDS SPICLK Last Sampling Edge to Data Input Not Valid tSDPPW SPIDS Deassertion Pulse Width (CPHASE=0) Switching Characteristics tDSOE SPIDS Assertion to Data Out Active tDSDHI SPIDS Deassertion to Data High Impedance tDDSPIDS SPICLK Edge to Data Out Valid (Data Out Delay Time) tHDSPIDS SPICLK Edge to Data Out Not Valid (Data Out Hold Time) tDSOV SPIDS Assertion to Data Out Valid (CPHASE = 0) Parameter Timing Requirements tSPICLKS tSPICHS tSPICLS tSDSCO Min Unit ns ns ns ns 4 x tPCLK - 2 2 x tPCLK - 2 2 x tPCLK - 2 2 x tPCLK 2 x tPCLK 2 x tPCLK 2 2 2 x tPCLK 0 0 2 x tPCLK 5 x tPCLK 6.8 6.8 9.5 ns ns ns ns ns ns ns ns ns SPIDS (INPUT) tSPICHS SPICLK (CP = 0) (INPUT) tSPICLS tSPICLKS tHDS tSDPPW tSDSCO SPICLK (CP = 1) (INPUT) tSPICLS tSPICHS tDSOE MISO (OUTPUT) CPHASE = 1 MOSI (INPUT) tDDSPIDS tDDSPIDS MSB LSB tDSDHI tHDSPIDS tSSPIDS MSB VALID tSSPIDS tHSPIDS LSB VALID tDDSPIDS MISO (OUTPUT) CPHASE = 0 MOSI (INPUT) MSB tHDSPIDS LSB tDSDHI tDSOV tSSPIDS MSB VALID LSB VALID tHSPIDS Figure 31. SPI Slave Timing Rev. C | Page 41 of 52 | September 2009 ADSP-21371/ADSP-21375 Universal Asynchronous Receiver-Transmitter (UART) Port--Receive and Transmit Timing Figure 32 describes UART port receive and transmit operations. The maximum baud rate is PCLK/16 where PCLK = 1/tPCLK. As shown in Figure 32 there is some latency between the Table 39. UART Port Parameter Timing Requirement Incoming Data Pulse Width tTXD1 Switching Characteristic tRXD1 Incoming Data Pulse Width 1 generation of internal UART interrupts and the external data operations. These latencies are negligible at the data transmission rates for the UART. Min 16tPCLK-1 16tPCLK-1 Max Unit ns ns UART signals TXD and RXD are routed through DPI P14-1 pins using the SRU. DPI_P14-1 [RxD] RECEIVE INTERNAL UART RECEIVE INTERRUPT START DPI_P14-1 [TxD] TRANSMIT INTERNAL UART TRANSMIT INTERRUPT DATA (5-8) STOP tRXD UART RECEIVE BIT SET BY DATA STOP; CLEARED BY FIFO READ DATA (5-8) STOP (1-2) tTXD UART TRANSMIT BIT SET BY PROGRAM; CLEARED BY WRITE TO TRANSMIT Figure 32. UART Port--Receive and Transmit Timing Rev. C | Page 42 of 52 | September 2009 ADSP-21371/ADSP-21375 TWI Controller Timing Table 40 and Figure 33 provide timing information for the TWI interface. Input signals (SCL, SDA) are routed to the DPI_P14-1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DPI_P14-1 pins. Table 40. Characteristics of the SDA and SCL Bus Lines for F/S-Mode TWI Bus Devices1 Parameter fSCL tHDSTA tLOW tHIGH tSUSTA tHDDAT tSUDAT tSUSTO tBUF tSP 1 SCL Clock Frequency Hold Time (repeated) Start Condition. After This Period, the First Clock Pulse is Generated. Low Period of the SCL Clock High Period of the SCL Clock Setup Time for a Repeated Start Condition Data Hold Time for TWI-Bus Devices Data Setup Time Setup Time for Stop Condition Bus Free Time Between a Stop and Start Condition Pulse Width of Spikes Suppressed By the Input Filter Min 0 4.0 4.7 4.0 4.7 0 250 4.0 4.7 n/a Standard Mode Max 100 Min 0 0.6 1.3 0.6 0.6 0 100 0.6 1.3 0 Fast Mode Max 400 Unit kHz s s s s s ns s s ns n/a 50 All values referred to VIHmin and VILmax levels. For more information, see Electrical Characteristics on page 16. DPI_P14-1 SDA tLOW DPI_P14-1 SCL S tSUDAT tHDSTA tSP tBUF tHDSTA tHDDAT tHIGH tSUSTA Sr tSUSTO P S Figure 33. Fast and Standard Mode Timing on the TWI Bus Rev. C | Page 43 of 52 | September 2009 ADSP-21371/ADSP-21375 JTAG Test Access Port and Emulation Table 41. JTAG Test Access Port and Emulation Parameter Timing Requirements tTCK TCK Period tSTAP TDI, TMS Setup Before TCK High tHTAP TDI, TMS Hold After TCK High tSSYS1 System Inputs Setup Before TCK High 1 tHSYS System Inputs Hold After TCK High tTRSTW TRST Pulse Width Switching Characteristics tDTDO TDO Delay from TCK Low 2 tDSYS System Outputs Delay After TCK Low 1 2 Min tCK 5 6 7 18 4 x tCK Max Unit ns ns ns ns ns ns 7 tCK / 2 + 7 ns ns System Inputs = ADDR15-0, CLKCFG1-0, RESET, BOOT_CFG1-0, DAI_Px, and FLAG3-0. System Outputs = DAI_Px, ADDR15-0, RD, WR, FLAG3-0, EMU, and ALE. tTCK TCK tSTAP TMS TDI tHTAP tDTDO TDO tSSYS SYSTEM INPUTS tHSYS tDSYS SYSTEM OUTPUTS Figure 34. IEEE 1149.1 JTAG Test Access Port Rev. C | Page 44 of 52 | September 2009 ADSP-21371/ADSP-21375 OUTPUT DRIVE CURRENTS Figure 35 shows typical I-V characteristics for the output drivers of the processors. The curves represent the current drive capability of the output drivers as a function of output voltage. CAPACITIVE LOADING Output delays and holds are based on standard capacitive loads: 30 pF on all pins (see Figure 36). Figure 40 shows graphically how output delays and holds vary with load capacitance. The graphs of Figure 38, Figure 39, and Figure 40 may not be linear outside the ranges shown for Typical Output Delay vs. Load Capacitance and Typical Output Rise Time (20% to 80%, V = Min) vs. Load Capacitance. 40 30 SOURCE (VDDEXT) CURRENT (mA) VOH 3.3V, 25C 3.47V, -45C 20 10 0 12 3.11V, 125C 10 RISE AND FALL TIMES (ns) y = 0.0467x + 1.6323 8 RISE FALL - 10 3.11V, 125C - 20 3.3V, 25C - 30 - 40 6 VOL 3.47V, -45C 0 0.5 1.0 1.5 2.0 2.5 SWEEP (VDDEXT ) VOLTAGE (V) 3.0 3.5 4 y = 0.045x + 1.524 2 Figure 35. Typical Drive at Junction Temperature 0 0 50 100 150 200 250 TEST CONDITIONS The ac signal specifications (timing parameters) appear in Table 15 on Page 21 through Table 41 on Page 44. These include output disable time, output enable time, and capacitive loading. The timing specifications for the SHARC apply for the voltage reference levels in Figure 36. Timing is measured on signals when they cross the 1.5 V level as described in Figure 37. All delays (in nanoseconds) are measured between the point that the first signal reaches 1.5 V and the point that the second signal reaches 1.5 V. LOAD CAPACITANCE (pF) Figure 38. Typical Output Rise/Fall Time (20% to 80%, VDDEXT = Max) 12 RISE 10 RISE AND FALL TIMES (ns) y = 0.049x + 1.5105 8 FALL 6 y = 0.0482x + 1.4604 4 TO OUTPUT PIN VLOAD 30pF 2 0 0 50 100 150 200 250 Figure 36. Equivalent Device Loading for AC Measurements (Includes All Fixtures) LOAD CAPACITANCE (pF) Figure 39. Typical Output Rise/Fall Time (20% to 80%, VDDEXT = Min) INPUT 1.5V OR OUTPUT 1.5V Figure 37. Voltage Reference Levels for AC Measurements Rev. C | Page 45 of 52 | September 2009 ADSP-21371/ADSP-21375 10 8 OUTPUT DELAY OR HOLD (ns) Values of JB are provided for package comparison and PCB design considerations. Note that the thermal characteristics values provided in Table 42 are modeled values. Y = 0.0488X - 1.5923 6 4 Table 42. Thermal Characteristics for 208-Lead LQFP E_PAD (With Exposed Pad Soldered to PCB) Parameter JA JMA JMA JC JT JMT JMT JB JMB JMB Condition Airflow = 0 m/s Airflow = 1 m/s Airflow = 2 m/s Airflow = 0 m/s Airflow = 1 m/s Airflow = 2 m/s Airflow = 0 m/s Airflow = 1 m/s Airflow = 2 m/s Typical 17.1 14.7 14.0 9.6 0.23 0.39 0.45 11.5 11.2 11.0 Unit C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W 2 0 -2 -4 0 50 100 150 200 LOAD CAPACITANCE (pF) Figure 40. Typical Output Delay or Hold vs. Load Capacitance (at Ambient Temperature) THERMAL CHARACTERISTICS The processor is rated for performance over the temperature range specified in Operating Conditions on Page 16. Table 42 airflow measurements comply with JEDEC standards JESD51-2 and JESD51-6 and the junction-to-board measurement complies with JESD51-8. Test board design complies with JEDEC standard JESD51-7 (LQFP_EP). The junction-to-case measurement complies with MIL- STD-883. All measurements use a 2S2P JEDEC test board. To determine the junction temperature of the device while on the application PCB, use T J = T CASE + ( JT x P D ) where: TJ = junction temperature C TCASE = case temperature (C) measured at the top center of the package JT = junction-to-top (of package) characterization parameter is the Typical value from Table 42. PD = power dissipation Values of JA are provided for package comparison and PCB design considerations. JA can be used for a first order approximation of TJ by the equation T J = T A + ( JA x P D ) where: TA = ambient temperature C Values of JC are provided for package comparison and PCB design considerations when an external heatsink is required. Rev. C | Page 46 of 52 | September 2009 ADSP-21371/ADSP-21375 208-LEAD LQFP_EP PINOUT Table 43. ADSP-21371, 208-Lead LQFP_EP Pin Assignment (Numerical by Lead Number) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 Signal VDDINT DATA28 DATA27 GND VDDEXT DATA26 DATA25 DATA24 DATA23 GND VDDINT DATA22 DATA21 DATA20 VDDEXT GND DATA19 DATA18 VDDINT GND DATA17 VDDINT GND VDDINT GND DATA16 DATA15 DATA14 DATA13 DATA12 VDDEXT GND VDDINT GND DATA11 DATA10 DATA9 DATA8 DATA7 DATA6 VDDEXT GND VDDINT DATA4 Pin No. 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 Signal VDDINT GND VDDEXT ADDR0 ADDR2 ADDR1 ADDR4 ADDR3 ADDR5 GND VDDINT GND VDDEXT ADDR6 ADDR7 ADDR8 ADDR9 ADDR10 GND VDDINT GND VDDEXT ADDR11 ADDR12 ADDR13 GND VDDINT NC NC GND CLKIN XTAL VDDEXT GND VDDINT ADDR14 GND VDDEXT ADDR15 ADDR16 ADDR17 ADDR18 GND VDDEXT Pin No. 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 Signal VDDINT GND VDDEXT SDCAS SDRAS SDCKE SDWE WR SDA10 GND VDDEXT SDCLK GND VDDINT RD ACK FLAG3 FLAG2 FLAG1 FLAG0 DAI_P20 (SFS5) GND VDDINT GND VDDEXT DAI_P19 (SCLK5) DAI_P18 (SD5B) DAI_P17 (SD5A) DAI_P16 (SD4B) DAI_P15 (SD4A) DAI_P14 (SFS3) DAI_P13 (SCLK3) DAI_P12 (SD3B) VDDINT VDDEXT GND VDDINT GND DAI_P11 (SD3A) DAI_P10 (SD2B) DAI_P8 (SFS1) DAI_P9 (SD2A) DAI_P6 (SD1B) DAI_P7 (SCLK1) Pin No. 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 Signal VDDINT VDDINT GND VDDINT VDDINT VDDINT TDI TRST TCK GND VDDINT TMS CLK_CFG0 BOOT_CFG0 CLK_CFG1 EMU BOOT_CFG1 TDO DAI_P4 (SFS0) DAI_P2 (SD0B) DAI_P3 (SCLK0) DAI_P1 (SD0A) VDDEXT GND VDDINT GND DPI_P14 (TIMER1) DPI_P13 (TIMER0) DPI_P12 (TWI_CLK) DPI_P11 (TWI_DATA) DPI_P10 (UART0RX) DPI_P09 (UART0TX) DPI_P08 (SPIFLG3) DPI_P07 (SPIFLG2) VDDEXT GND VDDINT GND DPI_P06 (SPIFLG1) DPI_P05 (SPIFLG0) DPI_P04 (SPIDS) DPI_P03 (SPICLK) DPI_P01 (SPIMOSI) DPI_P02 (SPIMISO) Rev. C | Page 47 of 52 | September 2009 ADSP-21371/ADSP-21375 Table 43. ADSP-21371, 208-Lead LQFP_EP Pin Assignment (Numerical by Lead Number) (Continued) Pin No. 45 46 47 48 49 50 51 52 Signal DATA5 DATA2 DATA3 DATA0 DATA1 VDDEXT GND VDDINT Pin No. 97 98 99 100 101 102 103 104 Signal ADDR19 ADDR20 ADDR21 ADDR23 ADDR22 MS1 MS0 VDDINT Pin No. 149 150 151 152 153 154 155 156 Signal DAI_P5 (SD1A) VDDEXT GND VDDINT GND VDDINT GND VDDINT Pin No. 201 202 203 204 205 206 207 208 Signal RESETOUT/ RUNRSTIN RESET VDDEXT GND DATA30 DATA31 DATA29 VDDINT Rev. C | Page 48 of 52 | September 2009 ADSP-21371/ADSP-21375 Table 44. ADSP-21375, 208-Lead LQFP_EP Pin Assignment (Numerical by Lead Number) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 Signal VDDINT NC NC GND VDDEXT NC NC NC NC GND VDDINT NC NC NC NC NC NC NC NC NC NC VDDINT GND VDDINT GND NC DATA15 DATA14 DATA13 DATA12 VDDEXT GND VDDINT GND DATA11 DATA10 DATA9 DATA8 DATA7 DATA6 VDDEXT GND VDDINT DATA4 Pin No. 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 Signal VDDINT GND VDDEXT ADDR0 ADDR2 ADDR1 ADDR4 ADDR3 ADDR5 GND VDDINT GND VDDEXT ADDR6 ADDR7 ADDR8 ADDR9 ADDR10 GND VDDINT GND VDDEXT ADDR11 ADDR12 ADDR13 GND VDDINT NC NC GND CLKIN XTAL VDDEXT GND VDDINT ADDR14 GND VDDEXT ADDR15 ADDR16 ADDR17 ADDR18 GND VDDEXT Pin No. 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 Signal VDDINT GND VDDEXT SDCAS SDRAS SDCKE SDWE WR SDA10 GND VDDEXT SDCLK GND VDDINT RD ACK FLAG3 FLAG2 FLAG1 FLAG0 DAI_P20 (SFS5) GND VDDINT GND VDDEXT DAI_P19 (SCLK5) DAI_P18 (SD5B) DAI_P17 (SD5A) DAI_P16 (SD4B) DAI_P15 (SD4A) DAI_P14 (SFS3) DAI_P13 (SCLK3) DAI_P12 (SD3B) VDDINT VDDEXT GND VDDINT GND DAI_P11 (SD3A) DAI_P10 (SD2B) DAI_P8 (SFS1) DAI_P9 (SD2A) DAI_P6 (SD1B) DAI_P7 (SCLK1) Pin No. 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 Signal VDDINT VDDINT GND VDDINT VDDINT VDDINT TDI TRST TCK GND VDDINT TMS CLK_CFG0 BOOT_CFG0 CLK_CFG1 EMU BOOT_CFG1 TDO DAI_P4 (SFS0) DAI_P2 (SD0B) DAI_P3 (SCLK0) DAI_P1 (SD0A) VDDEXT GND VDDINT GND DPI_P14 (TIMER1) DPI_P13 (TIMER0) DPI_P12 (TWI_CLK) DPI_P11 (TWI_DATA) DPI_P10 (UART0RX) DPI_P09 (UART0TX) DPI_P08 (SPIFLG3) DPI_P07 (SPIFLG2) VDDEXT GND VDDINT GND DPI_P06 (SPIFLG1) DPI_P05 (SPIFLG0) DPI_P04 (SPIDS) DPI_P03 (SPICLK) DPI_P01 (SPIMOSI) DPI_P02 (SPIMISO) Rev. C | Page 49 of 52 | September 2009 ADSP-21371/ADSP-21375 Table 44. ADSP-21375, 208-Lead LQFP_EP Pin Assignment (Numerical by Lead Number) (Continued) Pin No. 45 46 47 48 49 50 51 52 Signal DATA5 DATA2 DATA3 DATA0 DATA1 VDDEXT GND VDDINT Pin No. 97 98 99 100 101 102 103 104 Signal ADDR19 ADDR20 ADDR21 ADDR23 ADDR22 MS1 MS0 VDDINT Pin No. 149 150 151 152 153 154 155 156 Signal DAI_P5 (SD1A) VDDEXT GND VDDINT GND VDDINT GND VDDINT Pin No. 201 202 203 204 205 206 207 208 Signal RESETOUT/ RUNRSTIN RESET VDDEXT GND DATA30 DATA31 DATA29 VDDINT Rev. C | Page 50 of 52 | September 2009 ADSP-21371/ADSP-21375 PACKAGE DIMENSIONS The processors are available in a 208-lead RoHS compliant LQFP_EP package. 0.75 0.60 0.45 1.00 REF SEATING PLANE 1.60 MAX 30.20 30.00 SQ 29.80 28.10 28.00 SQ 27.90 157 156 157 156 25.50 REF 8.712 REF 208 1 208 1 PIN 1 (PINS DOWN) TOP VIEW *EXPOSED PAD 8.890 REF 1.45 1.40 1.35 0.15 0.10 0.05 0.08 COPLANARITY 0.20 0.15 0.09 7 3.5 0 52 BOTTOM VIEW 53 105 104 105 104 (PINS UP) 52 53 ROTATED 90 CCW VIEW A VIEW A 0.50 BSC LEAD PITCH 0.27 0.22 0.17 COMPLIANT TO JEDEC STANDARDS MS-026-BJB-HD *NOTE: THE EXPOSED PAD IS REQUIRED TO BE ELECTRICALLY AND THERMALLY CONNECTED TO GND. THIS SHOULD BE IMPLEMENTED BY SOLDERING THE EXPOSED PAD TO A GND PCB LAND THAT IS THE SAME SIZE AS THE EXPOSED PAD. THE GND PCB LAND SHOULD BE ROBUSTLY CONNECTED TO THE GND PLANE IN THE PCB WITH AN ARRAY OF THERMAL VIAS FOR BEST PERFORMANCE. Figure 41. 208-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP] (SW-208-1) Dimensions shown in millimeters Rev. C | Page 51 of 52 | September 2009 ADSP-21371/ADSP-21375 AUTOMOTIVE PRODUCTS Some ADSP-21371/ADSP-21375 models are available for automotive applications with controlled manufacturing. Note that this special model may have specifications that differ from the general release models. Table 45. Automotive Products Model AD21371WBSWZ2xx AD21371WYSWZ1xx AD21375WBSWZ2xx AD21375WYSWZ1xx 1 The automotive grade products shown in Table 45 are available for use in automotive applications. Contact your local ADI account representative or authorized ADI product distributor for specific product ordering information. Note that all automotive products are RoHS compliant. Temperature Range1 -40C to 85C -40C to 105C -40C to 85C -40C to 105C Instruction Rate 266 MHz 200 MHz 266 MHz 200 MHz On-Chip SRAM 1M bit 1M bit 0.5M bit 0.5M bit ROM 4M bit 4M bit 2M bit 2M bit Package Description 208-Lead LQFP_EP 208-Lead LQFP_EP 208-Lead LQFP_EP 208-Lead LQFP_EP Package Option SW-208-1 SW-208-1 SW-208-1 SW-208-1 Referenced temperature is ambient temperature. ORDERING GUIDE Temperature Range1 0C to +70C 0C to +70C -40C to +85C 0C to +70C -40C to +85C Instruction Rate 200 MHz 266 MHz 266 MHz 266 MHz 266 MHz On-Chip SRAM 1M bit 1M bit 1M bit 0.5M bit 0.5M bit Model ADSP-21371KSWZ-2A2 ADSP-21371KSWZ-2B2 ADSP-21371BSWZ-2B2, 3 ADSP-21375KSWZ-2B2 ADSP-21375BSWZ-2B2, 3 1 2 ROM 4M bit 4M bit 4M bit 2M bit 2M bit Package Description 208-Lead LQFP_EP 208-Lead LQFP_EP 208-Lead LQFP_EP 208-Lead LQFP_EP 208-Lead LQFP_EP Package Option SW-208-1 SW-208-1 SW-208-1 SW-208-1 SW-208-1 Referenced temperature is ambient temperature. Z = RoHS Compliant Part 3 Available with a wide variety of audio algorithm combinations sold as part of a chipset and bundled with necessary software. For a complete list, visit our website at www.analog.com/SHARC (c)2009 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D07170-0-9/09(C) Rev. C | Page 52 of 52 | September 2009 |
Price & Availability of ADSP-2137109
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