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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
NPN SILICON PHOTOTRANSISTOR LED LAMPS
Pb
Lead-Free Parts
LPT2021-R-PF
DATA SHEET
DOC. NO : REV. DATE : :
QW0905- LPT2021-R-PF A 17 - Aug. - 2006
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO.LPT2021-R-PF
Package Dimension
Page 1/3
Features
3.0
4.0
. High illumination sensitivity . Stable characteristics . Spectrally and mechanically matched with IR emitter
4.2 1.5 MAX
5.2
Description
12.5MIN
1/40.5 TYP
2.3TYP 1.0MIN
2 1
1.EMITTER 2.COLLECTOR
The LPT2021-R-PF series are silicon nitride passivated NPN planar phototransistors with exceptionally stable characteristics and high illumination sensitivity the cases of LPT2021-R-PF are encapsulated in transparent plastic T1 3/4 package individuallt
Note:1.All dimension are in millimeter tolerance is O .25mm unless otherwise noted 0 2.Specifications are subject to change without notice
MAXIMUM RATINGS(Ta=25 ) E
PARAMETER Power Dissipation Collector-Emitter Voltage Emitter-Collector Voltage Operating Temperature Storage Temperature Lead Soldering Temperature(1.6mm From Body)
MAXIMUM RATINGS 100 30 5 -50J TO +100J -50J TO +100J 260J for 5 seconds UNIT mw V V
J
ELECTRICAL CHARACTERISTICS(Ta=25 ) E
PARAMETER Collector-Emitter Breakdown Voltage Emitter-Collector Breakdown Voltage Collector-Emitter Saturation Voltage Rise Time Fall Time Collector Dark Current On State Collector Current SYMBOL V(BR)CEO V(BR)ECO VCE(sat) Tr Tf ICEO Ip(on) 1 2 4 8 5 5 100 2 4 8 Min. 30 5 0.4 Typ. Max. UNIT V V V
TEST CONDITION Ic=1mA Ee=0mw/cT IE=100gA Ee=0mw/cT Ic=0.5mA Ee=20mw/cT VCE=30V IC=800gA, RL=1K[ VCE=10V Ee=0mw/cT VCE=5v Ee=1mw/cT f P=940nm
gs gs
nA mA mA mA mA
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO.LPT2021-R-PF Page 2/3
Soldering Condition(Pb-Free) 1.Iron:
Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering Preheat: 120C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5C/sec(max) Solder Bath:260C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)
Temp( C) 260 C3sec Max
260
5 /sec max
120
2 /sec max Preheat
25 0 0
50
100
150
Time(sec)
60 Seconds Max
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO.LPT2021-R-PF Page 3/3
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=85 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 5 2.RH=90 %~95 % 3.t=240hrs 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 5 2.Dwell time= 10 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 5 2.Dwell time=5 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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