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| D a t a S h e e t , V 1. 1 , M ay 2 00 8 SMM310 S i l i c on M E M S M i c r op h o n e S m a l l S i g n a l D i s c r et e s Edition 2008-05-28 Published by Infineon Technologies AG 81726 Munchen, Germany (c) Infineon Technologies AG 2008. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. SMM310 SMM310 Revision History: 2008-05-28, V1.1 Previous Version: 2007-08-31, V1.0 Page 4 9 11 Subjects (major changes since last revision) Halogen-free package Typical measurement of output impedance added Marking layout example removed Data Sheet 3 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone Silicon MEMS Microphone Features * SMD MEMS microphone for automated surface mount assembly * Reflow soldering up to 260 C (lead free) * High long-term temperature stability * Stable sensitivity over power supply range of 1.5 - 3.3 V * Low current consumption of 80 A * Excellent power supply rejection of -55 dB * High integrated immunity to EMI * RoHS-compliant, halogen-free package with small footprint and low height of 1.25 mm Applications The SMM310 is designed for * * * * Mobile Phones (Handsets, Headsets) Consumer (Game Consoles, PDA's) Computer (Personal Computers, Notebooks) Cameras (Digital Still Cameras, Video Cameras) Product Description Miniature Silicon MEMS (Micro Electro Mechanical System) omni-directional Microphone with single-ended analog interface designed for automated reflow soldering assembly as SMD (Surface Mounted Device) component. It is an alternative to conventional ECMs (Electret Condenser Microphones). Due to its robust design with a metallic lid and monolithic integrated EMI-blocking capacitors and utilization of Silicon MEMS technology, the SMM310 shows high immunity to EMI (Electromagnetic Interference) and heat. The capped Chip-On-Board package solution contains the micromechanical sensor chip and an amplifier chip. The RoHS-compliant halogen-free device has a size of 4.72 x 3.76 x 1.25 mm3. VDD (4) OUT (1) GND (2,3) Figure 1 Type SMM310 Block Diagram Package HG-MMA-4-2 Marking S310 Data Sheet 4 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone Pin Definition and Function Table 1 Pin No. 1 2 3 4 Maximum Ratings Table 2 Maximum Ratings Pin Definition and Function Symbol Function Output Ground Ground Power OUT GND GND VDD Storage Temperature Operating Temperature Range Operating Voltage Range ESD robustness Table 3 TSTG TA VDD -40 C - 125 C -40 C - 85 C 1.5 V - 3.3 V Typical robustness to electrostatic discharge ESD capability all pins (HBM, JESD22-A114) ESD capability all pins (MM, JESD22-A115) Acoustical and Electrical Characteristics Table 4 Parameter Sensitivity 1 kHz Relative Sensitivity 4 kHz Relative Sensitivity 240 Hz Equivalent Noise Level Signal-to-Noise Ratio Total Harmonic Distortion Current Consumption VESD_HBM VESD_MM 4 kV 400 V Unless otherwise noted, typical test conditions are TA = 23 C, VDD = 2.1 V and R.H. = 50 % measured in a pressure chamber test setup. All voltages refer to GND node Symbol Min. Values Typ. -42 Max. -39 +4 +1 29.5 35 61.5 64.5 59 0.1 80 -55 1.2 7 0.5 140 -40 32.5 dB(V/Pa) dB dB dB(pso) dB(A) dB(pso) dB(A) % A dBr V 1 kHz, 94 dB SPL Relative to sensitivity 1 kHz Relative to sensitivity 1 kHz CCITT-weighted1) A-weighted2) CCITT-weighted A-weighted 104 dB SPL, 1 kHz -45 -1 -1 Unit Note / Test Condition S1kHz S4kHz S240Hz ENL SNR THD ICC Power Supply Rejection Ratio PSRR DC Output Voltage Output Impedance VDD = 2.1 V 100 mV superimposed on VDD = 2.1 V, 1 kHz DC Voltage at Pin 1 1 kHz VOUT ZOUT 1) Psophometrically weighted noise measurement with CCITT-filter (ITU-T Rec. P.53) 2) Noise measurement with A-weighting filter (IEC 651) Data Sheet 5 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone Typical Measurements Results 10 8 Sensitivity relative to 1kHz [dB] 6 4 2 0 -2 -4 -6 -8 -10 100 1000 10000 -1 +1 -1 +4 Frequency [Hz] Figure 2 Typical frequency response curve relative to the sensitivity at a frequency of 1 kHz 5 5 4 Sensitivity relative to TA=23 C 4 3 2 1 Equivalent Noise Level relative to T A=23 C [dB] -40 -20 0 20 40 60 80 100 3 2 1 0 -1 -2 -3 -4 -5 -40 -20 0 20 40 60 80 100 [dB] 0 -1 -2 -3 -4 -5 Temperature / C Temperature / C Figure 3 Typical change of sensitivity at 1 kHz and equivalent noise level over temperature relative to TA = 23 C Data Sheet 6 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone -39 -40 -41 -42 -43 -44 -45 1.4 1.7 2 2.3 2.6 2.9 3.2 Equivalent Noise 32.5 31.5 90 85 DC Output Voltage 1.5 1.4 1.3 1.2 1 0.9 0.8 Current Consumption ENL [dB(pso)] S [dBV/Pa] 30.5 29.5 28.5 27.5 26.5 80 75 70 65 60 1.4 1.7 2 2.3 2.6 2.9 3.2 3.5 Sensitivity 0.7 0.6 0.5 VDD [V] Figure 4 VDD [V] Typical measurement of sensitivity, equivalent noise level, current consumption and DC output voltage over power supply VDD 2 1.8 1.6 1.4 THD [%] 1.2 1 0.8 0.6 0.4 0.2 0 90 100 110 Sound Pressure [dB SPL] Figure 5 Typical total harmonic distortion over sound pressure level (1 kHz, VDD = 2.1 V) 120 130 Data Sheet 7 V1.1, 2008-05-28 Vout [V] ICC [A] 1.1 SMM310 Silicon MEMS Microphone 1000 Noise densitiy (nV/Hz ) A-weighted 0.5 100 CCITT-weighted 10 1 100 1000 10000 Frequency [Hz] Figure 6 Typical noise density measurement with A-weighting and CCITT-weighting filter -30 -35 -40 -45 -50 -55 -60 -65 -70 10 100 1000 10000 100000 PSRR [dBr] Frequency [Hz] Figure 7 Typical power supply rejection ratio (relative to 100 mV sinewave superimposed on the supply voltage VDD) Data Sheet 8 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone -10 Demodulated RF-signal relative to acoustical sensitivity [dB] -20 -30 -40 -50 -60 -70 -80 100 WCDMA GSM850/900 GSM1800/1900 300 500 700 900 1100 1300 1500 1700 1900 2100 2300 2500 Frequency of RF disturbance [MHz] Figure 8 Typical RF demodulation relative to the microphone signal (1 kHz, 1 Pa). RF disturbance (100 MHz - 2.5 GHz, 80%-AM-modulated with 1 kHz) is directly injected in the power supply 100 90 Output Impedance [Ohm] 80 70 60 50 40 30 20 10 0 10 100 1000 10000 100000 Frequency [Hz] Figure 9 Typical output impedance measurement (VDD = 2.1 V) Data Sheet 9 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone Package Outline 1.250.1 0.1 4x 0.84 0.1 4 3 3.76 0.1 1) 1 1.32 0.2 4.72 0.1 2 0.15 TYP. 2 1 0.15 TYP. (2.97) 1.45 TYP. 1) Area for acoustic seal diam. 1.64 mm typ. GHG01248 Figure 10 Table 5 Item Height Length Width Package outline Dimensions Dimension (mm) 1.25 4.72 3.76 0.84 Tolerance (mm) 0.1 0.1 0.1 0.1 Sound Port Diameter Recommended Customer Land Pattern 1.45 1.24 2.22 2.97 4.42 HLGF1250 Figure 11 Recommended customer land pattern Data Sheet 10 3.45 1.24 TYP. (2.22) 1.88 0.2 3 4 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone Solder Reflow Table 6 Solder Reflow Conditions Compliant to J-STD-020-C 260 C 3 times reflow soldering Board washing can damage the microphone if the sound inlet hole is uncovered MSL 2 classified Solder Reflow Profile Maximum Peak Temperature Number of Reflow Board washing after Reflow Moisture Sensitivity Level Recommended Vacuum Handling 0.5 mm MIN Figure 12 Recommended minimum distance between sound port hole and vacuum pick tool opening is 0.50 mm Data Sheet 11 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone Tape Outline Figure 13 Table 7 W 120.3 E2 10.25 MIN Tape Outline, 1) Cumulative tolerance of 10 sprocket holes is 0.2 mm Tape Dimensions (mm) P0 40.1 F 5.50.05 P1 80.1 D1 1.5 MIN P2 20.05 T 0.30.05 D0 1.50.1 T1 0.050.015 A0 4.10.1 T2 2.10.2 B0 50.1 G 1.95 NOM E1 1.750.1 K0 1.750.1 Data Sheet 12 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone Reel Outline Figure 14 Table 8 A O 330 Reel Dimension (mm) and Quantity per Reel W1 12.41.5 W2 18.4 MAX N O 100 Quantity per Reel 4000 Data Sheet 13 V1.1, 2008-05-28 |
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