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| High-Voltage Power MOSFET & IGBT Driver Driver Characteristics Parameter VOFFSET IO +/- (Source/Sink) VCSth tON / tOFF (Typical) IX2127 Description Units V mA mV ns Rating 600 250/500 250 100 The IX2127 is a high-voltage, high-speed power MOSFET and IGBT driver. High-voltage level-shift circuitry enables this device to operate up to 600V. Clare's proprietary common-mode design techniques provide stable operation in high dV/dt noise environments. An on-board comparator can be used to detect an over-current condition in the driven MOSFET or IGBT device, and then shut down drive to that device. An open-drain output, FAULT, indicates that an over-current shutdown has occurred. The gate driver output typically can source 250mA and sink 500mA, which is suitable for fluorescent lamp ballast, motor control, SMPS, and other converter drive topologies. The IX2127 is provided in 8-pin DIP and 8-pin SOIC packages, and is available in Tape & Reel versions. See ordering information below. Features * Floating Channel Designed for Bootstrap Operation up to 600V * Tolerant to Negative Transient Voltages; dV/dt Immune * Undervoltage Lockout * 3.3V, 5V, and 12V Input Logic Compatible * Open-Drain FAULT Indicator Pin Shows Over-Current Shutdown * Output in Phase with the Input Applications * High-Speed Gate Driver * Motor Drive Inverter Ordering Information Pb RoHS 2002/95/EC e3 Part IX2127G IX2127N IX2127NTR Description 8-Pin DIP (50/Tube) 8-Pin SOIC (100/Tube) 8-Pin SOIC (2000/Reel) IX2127 Block Diagram VCC VCC Low Side High Side VB Undervoltage Lockout Buffer Data Latch IN Enable Blanking Signal FAULT Enable Receiver COM S High-Low Level Shift Transmitter Data Latch Comparator + _ Transmitter Low-High Level Shift Receiver HO VS Delay Q R CS DS-IX2127 - R01 www.clare.com 1 IX2127 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 General Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 4 4 4 5 2. Performance Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 Washing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 10 11 11 R01 www.clare.com 2 IX2127 1 Specifications 1.1 Package Pinout 1.2 Pin Description Pin# Name VCC IN FAULT COM VS CS HO VB Description Logic Supply Voltage Logic Input Fault Indicator Output Logic Ground High Side Return Comparator Input, Over-Current Detect High Side Gate Drive Output High Side Supply Voltage VCC IN FAULT COM 1 2 3 4 8 7 6 5 VB HO CS VS 1 2 3 4 5 6 7 8 1.3 Absolute Maximum Ratings Unless otherwise specified, ratings are provided at TA=25C and all bias levels are with respect to COM. Parameter Logic Supply Voltage High Side Floating Supply Voltage High Side Floating Offset Voltage Logic Input Voltage High Side Floating Output Voltage Current Sense Voltage FAULT Output Voltage Allowable Offset Supply Voltage Transient Package Power Dissipation 8-Lead DIP 8-Lead SOIC Junction Temperature Storage Temperature Absolute maximum electrical ratings are at 25C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Symbol VCC VB VS VIN VHO VCS VFLT dVS/dt Minimum -0.3 -0.3 VB-12 -0.3 VS-0.3 VS-0.3 -0.3 -55 Maximum 15 625 VB+0.3 VCC+0.3 VB+0.3 VB+0.3 VCC+0.3 50 1 0.625 150 150 Units V V/ns PD TJ TS W C R01 www.clare.com 3 IX2127 1.4 Recommended Operating Conditions Parameter Logic Supply High Side Floating Supply High Side Offset Voltage Logic Input Voltage High Side Floating Output Current Sense Signal Voltage FAULT Output Voltage Ambient Temperature 1.5 General Conditions Typical values are characteristic of the device at 25C and are the result of engineering evaluations. They are provided for information purposes only and are not part of the manufacturing testing requirements. Unless otherwise noted, all electrical specifications are listed for TA=25C. Symbol VCC VB VS VIN VHO VCS VFLT TA Minimum 9 VS+9 -5 0 VS VS 0 -40 Maximum 12 VS+12 600 VCC VB VS+5 VCC +125 Units V C 1.6 Electrical Characteristics Unless otherwise specified, the test conditions are: VCC=VBS=12V; VCC, IN, FAULT, and Leakage voltages and currents are referenced to COM; VB, HO, and CS voltages and currents are referenced to VS . 1.6.1 Power Supply Specifications Parameter Quiescent VCC Supply Current Quiescent VBS Supply Current VBS UVLO Positive-Going Threshold VBS UVLO Negative-Going Threshold Offset Supply Leakage Current 1.6.2 Gate Drive and Shutdown Specifications Parameter High Level Output Voltage, VB-VHO Low Level Output Voltage, VHO Output Short Circuit Pulsed Current Conditions IHO=0A IHO=0A VHO=0V, VIN=5V, PW<10s, RGATE=20* (see Figure 1) VHO=12V, VIN=0V, PW<10s, RGATE=20* (see Figure 1) VCC=9V to 12V VCS=3V VCS=0V * RGATE value must be 20 or greater. Symbol VOH VOL Conditions VIN=0V VIN=0V VB=VS=600V Symbol IQCC IQBS VBS_UV+ VBS_UVILKG Minimum 6.8 6.3 - Typical 280 500 7.7 7.2 - Maximum 400 1000 8.6 8.1 2 Units A V A Minimum - Typical - Maximum 100 100 Units mV IHO+ IHOVCS_TH+ ICS+ ICS- -200 420 180 - -250 500 260 - mA 320 1 -1 mV A CS Input, Positive-Going Threshold "High" CS Bias Current 4 www.clare.com R01 IX2127 1.6.3 Logic I/O Specifications Parameter Logic "1" Input Voltage Logic "0" Input Voltage Logic "1" Input Bias Current Logic "0" Input Bias Current FAULT On-Resistance 1.6.4 Thermal Specifications Parameter Thermal Resistance, Junction to Ambient: 8-Lead DIP 8-Lead SOIC Conditions Symbol Minimum - Conditions VCC=9V to 12V VCC=9V to 12V VIN=5V VIN=0V - Symbol VIH VIL IIN+ IINFLT, RON Minimum 3.0 - Typical 2.6 72 Maximum 0.8 15 -1 - Units V A Typical - Maximum 125 200 Units - RJA C/W 1.7 Timing Characteristics Parameter Turn-On Propagation Delay Turn-Off Propagation Delay Turn-On Rise Time Turn-Off Fall Time Start-Up Blanking Delay CS Shutdown Propagation Delay CS to FLT Propagation Delay 1.7.1 Typical Connection Diagram VCC=VBS=12V, CL=1nF, TA=25C Conditions Symbol ton toff tr tf tblk tCS tFLT Minimum 550 - Typical 100 73 23 20 766 220 236 Maximum 200 200 130 65 950 360 510 Units ns VCC IN FAULT 1 VCC 2 IN 3 FAULT 4 COM VB 8 RGATE HO 7 CS 6 VS 5 R01 www.clare.com 5 IX2127 1.7.2 I/O Timing Diagram 1.7.5 CS Shutdown Waveforms IN CS FAULT HO CS tcs HO 90% VCS_TH+ 1.7.3 Switching Time Waveforms 50% IN 90% 10% ton tr toff tf FAULT 1.7.4 Startup Blanking Time Waveforms 1.7.6 CS to FLT Waveforms VCS_TH+ CS tflt 90% HO 50% IN tblk CS 90% HO FAULT 6 www.clare.com R01 IX2127 2 Performance Data Quiescent VCC Supply Current IQCC vs. Voltage 250 200 500 400 Quiescent VBS Supply Current IQBS vs. Voltage Threshold UVLO+ (V) VBS Undervoltage Lockout Positive-Going Threshold UVLO+ vs. Temperature 10 8 6 4 2 0 IQBS (A) IQCC (A) 150 100 50 0 9.0 9.5 10.0 10.5 11.0 VCC Supply Voltage (V) 11.5 12.0 300 200 100 0 9.0 9.5 10.0 10.5 11.0 VBS Supply Voltage (V) 11.5 12.0 -50 -25 0 25 50 75 Temperature (C) 100 125 Quiescent VCC Supply Current IQCC vs. Temperature 300 250 IQBS (A) IQCC (A) 500 400 300 200 100 Quiescent VBS Supply Current IQBS vs. Temperature 10 VBS Undervoltage Lockout Negative-Going Threshold UVLOvs. Temperature Threshold UVLO- (V) 8 6 4 2 0 200 150 100 50 0 -50 -25 0 25 50 75 Temperature (C) 100 125 0 -50 -25 0 25 50 75 Temperature (C) 100 125 -50 -25 0 25 50 75 Temperature (C) 100 125 3.0 2.5 Logic "1" Input Threshold Voltage vs. VCC 3.0 2.5 Input Voltage (V) Logic "0" Input Threshold Voltage vs. VCC 350 300 CS Input Positive Going Threshold vs. VCC Input Voltage (V) Threshold (mV) 2.0 1.5 1.0 0.5 0.0 9.0 9.5 10.0 10.5 11.0 VCC Supply (V) 11.5 12.0 2.0 1.5 1.0 0.5 0.0 9.0 250 200 150 100 50 0 9.0 9.5 10.0 10.5 11.0 VCC Supply Voltage (V) 11.5 12.0 9.5 10.0 10.5 11.0 VCC Supply Voltage (V) 11.5 12.0 3.0 2.5 Logic "1" Input Threshold Voltage vs. Temperature (VCC=12V) 3.0 2.5 Logic "0" Input Threshold Voltage vs. Temperature (VCC=12V) 350 300 CS Input Positive Going Threshold vs. Temperature (VCC=12V) Input Voltage (V) Input Voltage (V) Threshold (mV) -50 -25 0 25 50 75 Temperature (C) 100 125 2.0 1.5 1.0 0.5 2.0 1.5 1.0 0.5 0.0 250 200 150 100 50 0 -50 -25 0 25 50 75 Temperature (C) 100 125 0.0 -50 -25 0 25 50 75 Temperature (C) 100 125 R01 www.clare.com 7 IX2127 Logic "1" Input Current IIN+ vs. Voltage 5 200 Turn-On Time vs. Supply Voltage 200 175 Turn-On Rise Time vs. Supply Voltage Input Current (A) 4 3 2 1 0 9.0 9.5 10.0 10.5 11.0 Voltage (V) 11.5 12.0 Turn-On Delay Time (ns) 175 Rise Time (ns) 150 125 100 75 50 25 0 9.0 9.5 10.0 10.5 11.0 11.5 VBIAS Supply Voltage (V) 12.0 150 125 100 75 50 25 0 9.0 9.5 10.0 10.5 11.0 Supply Voltage (V) 11.5 12.0 Logic "1" Input Current IIN+ vs. Temperature 4.0 3.5 200 175 Turn-On Time (ns) Turn-On Time vs. Temperature (VCC=VBS=12V) 200 Turn-On Rise Time vs. Temperature (VCC=VBS=12V) Input Current (A) 2.5 2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 Temperature (C) 100 125 125 100 75 50 25 0 -50 -25 0 25 50 75 Temperature (C) 100 125 Rise Time (ns) 3.0 150 150 100 50 0 -50 -25 0 25 50 75 Temperature (C) 100 125 Logic "0" Input Current IINvs. Voltage 1.0 Turn-Off Time vs. Supply Voltage 200 Turn-Off Fall Time vs. Supply Voltage 25 Turn-Off Delay Time (ns) Turn-Off Fall Time (ns) 175 150 125 100 75 50 25 0 9.0 9.5 10.0 10.5 11.0 11.5 VBIAS Supply Voltage (V) 12.0 Input Current (A) 0.5 20 15 10 5 0 9.0 9.5 10.0 10.5 11.0 Supply Voltage (V) 11.5 12.0 0.0 -0.5 -1.0 9.0 9.5 10.0 10.5 11.0 Voltage (V) 11.5 12.0 Logic "0" Input Current IINvs. Temperature 1.0 Turn-Off Delay Time (ns) Input Current (A) 200 175 150 125 100 75 50 25 0 -50 Turn-Off Time vs. Temperature (VCC=VBS=12V) Turn-Off Fall Time (ns) 50 40 30 20 10 0 -50 Turn-Off Fall Time vs. Temperature (VCC=VBS=12V) 0.5 0.0 -0.5 -1.0 -50 -25 0 25 50 75 Temperature (C) 100 125 -25 0 25 50 75 Temperature (C) 100 125 -25 0 25 50 75 Temperature (C) 100 125 8 www.clare.com R01 IX2127 High-Level Output Voltage VOH (VB-VHO) vs. Temperature 100 90 80 70 60 50 40 30 20 10 0 -10 -50 -25 0 25 50 75 Temperature (C) 100 125 Output Source Current (mA) 300 250 200 150 100 Output Source Current vs. Voltage (VCC=VBS=VBIAS, VIN=5V, PW10s) Output Sink Current (mA) 600 500 400 300 200 100 0 10.0 Output Sink Current vs. V Bias Voltage (VCC=VBS=VBIAS, VIN=0V, PW10s) Output Voltage (mV) Ref. Fig. 1: RGATE=20 50 0 10.0 Ref. Fig. 1: RGATE=20 10.5 11.0 11.5 VBIAS Voltage (V) 12.0 10.5 11.0 11.5 VBIAS Voltage (V) 12.0 Low-Level Output Voltage VOL vs. Temperature 100 90 80 70 60 50 40 30 20 10 0 -10 -50 -25 0 25 50 75 Temperature (C) 100 125 Output Source Current (mA) 350 300 250 200 150 100 50 0 -50 Output Source Current vs. Temperature (VCC=VBS=12V, VIN=5V, PW10s) Output Sink Current (mA) 600 500 400 300 200 Output Sink Current vs. Temperature (VCC=VBS=12V, VIN=0V, PW10s) Output Voltage (mV) Ref. Fig. 1: RGATE=20 100 0 -50 -25 0 Ref. Fig. 1: RGATE=20 -25 0 25 50 75 Temperature (C) 100 125 25 50 75 Temperature (C) 100 125 Start-Up Blanking Delay vs. Input Voltage 700 600 500 Delay (nS) CS Shutdown Propagation Delay vs. Input Voltage 250 200 Delay (ns) 350 300 250 200 150 100 50 0 9.0 CS to FLT Propagation Delay vs. VCC Supply Voltage Delay (ns) 400 300 200 100 0 9.0 9.5 10.0 10.5 11.0 Input Voltage (V) 11.5 12.0 150 100 50 0 9.0 9.5 10.0 10.5 11.0 Input Voltage (V) 11.5 12.0 9.5 10.0 10.5 11.0 VCC Supply Voltage (V) 11.5 12.0 800 700 600 Delay (ns) Start-Up Blanking Delay vs. Temperature (VCC=VBS=12V) CS Shutdown Propogation Delay vs. Temperature 300 250 Delay (ns) Delay (ns) 350 300 250 CS to FLT Propagation Delay vs. Temperature (VCC=VBS=12V) 500 400 300 200 100 0 -50 -25 0 25 50 75 Temperature (C) 100 125 200 150 100 50 0 -50 -25 0 25 50 75 Temperature (C) 100 125 200 150 100 50 0 -50 -25 0 25 50 75 Temperature (C) 100 125 R01 www.clare.com 9 IX2127 3 Manufacturing Information 3.1 Mechanical Dimensions 3.1.1 8-Pin DIP Through-Hole Package 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) 7.239 TYP. (0.285) 0.254 TYP (0.01) 9.652 0.381 (0.380 0.015) 7.620 0.254 (0.300 0.010) PCB Hole Pattern 8-0.800 DIA. (8-0.031 DIA.) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 0.457 0.076 (0.018 0.003) 4.064 TYP (0.160) 7.620 0.127 (0.300 0.005) 7.620 0.127 (0.300 0.005) 0.889 0.102 (0.035 0.004) Dimensions mm (inches) 3.1.2 8-Pin SOIC Package PCB Land Pattern 0.1905 / 0.2489 (0.0075 / 0.0098) 5.8014 / 6.1976 (0.2284 / 0.2440) 3.810 / 3.988 (0.150 / 0.157) 0.406 / 1.270 (0.016 / 0.050) 1.50 (0.059) 5.30 (0.209) 0.356 / 0.457 (0.014 / 0.018) 4.801 / 4.978 (0.189 / 0.196) 1.27 TYP (0.05 TYP) 1.372 / 1.575 (0.054 / 0.062) 0.60 (0.024) 1.27 (0.050) 0.1016 / 0.2489 (0.0040 / 0.0098) 0.533 REF (0.021 REF) 1.524 / 1.727 (0.060 / 0.068) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 10 www.clare.com R01 IX2127 3.1.3 Tape & Reel Packaging for 8-Pin SOIC Package 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=12.00 (0.472) B0=5.30 (0.209) K0= 2.10 (0.083) A0=6.50 (0.256) P=8.00 (0.315) Dimensions mm (inches) Embossed Carrier User Direction of Feed Embossment NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 3.2 Soldering For proper assembly, the component must be processed in accordance with the current revision of IPC/JEDEC standard J-STD-020. Failure to follow the recommended guidelines may cause permanent damage to the device resulting in impaired performance and/or a reduced lifetime expectancy. 3.3 Washing Clare does not recommend ultrasonic cleaning or the use of chlorinated hydrocarbons. Pb RoHS 2002/95/EC e3 For additional information please visit our website at: www.clare.com Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare's Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IX2127-R01 (c)Copyright 2010, Clare, Inc. All rights reserved. Printed in USA. 2/22/2010 R01 www.clare.com 11 |
Price & Availability of IX2127
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