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73S8014R Smart Card Interface
Simplifying System IntegrationTM
DATA SHEET
September 2008
DESCRIPTION
The Teridian 73S8014R is a single smart card (ICC) interface circuit, firmware compatible with 8024-type devices for configurations where only asynchronous cards must be supported. It is derived from the 73S8024RN industrystandard electrical interface. The 73S8014R has been optimized to match most of the typical Set-Top-Box / A/V Conditional Access applications. Optimization essentially involved a smaller pin-count, support for single I/O, and maximum card current of 65mA (ISO-7816 / EMV compliance). The 73S8014R interfaces with the host processor through the same bus (digital I/Os) as the 73S8024RN, which is compatible with any other 8024-type IC. As a result, the 73S8014R is a very attractive cost-reduction path from traditional 8024 ICs. The 73S8014R has been designed to provide full electrical compliance with ISO 7816-3 and EMV 4.0 specifications. Interfacing with the system controller is done through a control bus, composed of digital inputs to control the interface, and one interrupt output to inform the system controller of the card presence and faults. The card clock can be generated by an on-chip oscillator using an external crystal or by connection to an externally supplied clock signal. The 73S8014R incorporates an ISO 7816-3 activation/deactivation sequencer that controls the card signals. Level-shifters drive the card signals with the selected card voltage (3V or 5V), coming from an internal Low Drop-Out (LDO) voltage regulator. This LDO regulator is powered by a dedicated power supply input VPC. Digital circuitry is powered separately by a digital power supply VDD. With its embedded LDO regulator, the 73S8024RN is a cost-effective solution for any application where a 5V (typically -5% +10%) power supply is available. Emergency card deactivation is initiated upon card extraction or upon any fault detected by the protection circuitry. The fault can be a card over-current, VCC undervoltage or power supply fault (VDD). The card over-current circuitry is a true current detection function, as opposed to VCC voltage drop detection, as usually implemented in non-Teridian 8024 interface ICs. The VDD voltage fault has a threshold voltage that can be adjusted with an external resistor network. It allows automated card deactivation at a customized VDD voltage threshold value. It can be used, for instance, to match the system controller operating voltage range.
APPLICATIONS
* * Set-Top-Box Conditional Access and Pay-per-View General purpose smart card readers
ADVANTAGES
* Same advantages as the Teridian 73S80xxR family: VCC card generated by an LDO regulator Very low power dissipation (saves up to 1/2W) Fewer external components are required Better noise performance True card over-current detection Firmware compatibility with all 8024 ICs Small format 20SO package
* * *
FEATURES
* Card Interface: Complies with ISO 7816-3 and EMV 4.0 Supports 3V / 5V cards ISO 7816-3 Activation / Deactivation sequencer Automated deactivation upon hardware fault (i.e. upon drop on VDD power supply or card overcurrent) The VDD voltage supervisor threshold value (fault) can be externally adjusted Over-current detection 130mA max Card CLK clock frequency up to 20MHz System Controller Interface: 3 Digital inputs control the card activation / deactivation, card reset and card voltage 2 Digital inputs control the card clock frequency 1 Digital output, interrupt to the system controller, reports to the host the card presence and faults Crystal oscillator or host clock, up to 27MHz Regulator Power Supply: 4.75V to 5.5V Digital Interfacing: 2.7V to 5.5V 6kV ESD protection on the card interface Package: SO 20-pin RoHS compliant (6/6) lead-free package
*
* * * * *
Rev. 1.0
(c) 2008 Teridian Semiconductor Corporation
1
73S8014R Data Sheet FUNCTIONAL DIAGRAM
VDD VPC
DS_8014R_012
vdd circuits VCC FAULT
VDDF_ADJ
INTERNAL POWER SUPPLY VOLTAGE REFERENCE
VPD - internal supply
VDD FAULT vref bias currents
LDO REGULATOR
R-C OSC.
GND VCC
CMDVCC RSTIN 5V/#V TEST
CONTROLLER AND REGISTERS FAULT LOGIC
1.5MHz
RESET BUFFER
RST
OFF CKDIV1 CKDIV2 XTALIN XTAL OSC XTALOUT
vdd circuits CLOCK
SC SEQUENCER
CLOCK BUFFER
CLK
CLOCK GENERATION
VDD CKT
PRES
I/O IOUC
SMART CARD I/O BUFFER
vcc circuits
GND
Figure 1: 73S8014R Block Diagram
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73S8014R Data Sheet
Table of Contents
1 2 Pinout ................................................................................................................................................................ 5 Electrical Specifications .................................................................................................................................. 8 2.1 Absolute Maximum Ratings ........................................................................................................................ 8 2.2 Recommended Operating Conditions ......................................................................................................... 8 2.3 Package Thermal Parameters .................................................................................................................... 9 2.4 Smart Card Interface Requirements ........................................................................................................... 9 2.5 Characteristics: Digital Signals.................................................................................................................. 11 2.6 DC Characteristics .................................................................................................................................... 12 2.7 Voltage Fault Detection Circuits ................................................................................................................ 13 3 Applications Information ............................................................................................................................... 14 3.1 Example 73S8014R Schematics .............................................................................................................. 14 3.2 System Controller Interface....................................................................................................................... 16 3.3 Power Supply and Voltage Supervision .................................................................................................... 16 3.4 Card Power Supply ................................................................................................................................... 17 3.5 On-Chip Oscillator and Card Clock ........................................................................................................... 17 3.6 Activation Sequence ................................................................................................................................. 18 3.7 Deactivation Sequence ............................................................................................................................. 19 3.8 Fault Detection and OFF ........................................................................................................................... 20 3.9 I/O Circuitry and Timing ............................................................................................................................ 20 4 Equivalent Circuits ......................................................................................................................................... 22 5 Mechanical Drawing ....................................................................................................................................... 27 6 Ordering Information ..................................................................................................................................... 28 7 Related Documentation ................................................................................................................................. 28 8 Contact Information ....................................................................................................................................... 28
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73S8014R Data Sheet
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Figures
Figure 1: 73S8014R Block Diagram .......................................................................................................................... 2 Figure 2: 73S8014R 20-SOP Pin Out........................................................................................................................ 5 Figure 3: 73S8014R - Typical Application Schematic ............................................................................................ 15 Figure 4: Activation Sequence - RSTIN Low When CMDVCC Goes Low ............................................................. 18 Figure 5: Activation Sequence - RSTIN High When CMDVCC Goes Low............................................................. 19 Figure 6: Deactivation Sequence ............................................................................................................................ 19 Figure 7: Timing Diagram - Management of the Interrupt Line OFF ...................................................................... 20 Figure 8: I/O and I/OUC State Diagram................................................................................................................... 21 Figure 9: I/O - I/OUC Delays - Timing Diagram ..................................................................................................... 21 Figure 10: Open Drain type - OFF .......................................................................................................................... 22 Figure 11: Power Input/Output Circuit, VDD, VPC, VCC ........................................................................................ 22 Figure 12: Smart Card CLK Driver Circuit ............................................................................................................... 23 Figure 13: Smart Card RST Driver Circuit ............................................................................................................... 23 Figure 14: Smart Card IO Interface Circuit .............................................................................................................. 24 Figure 15: Smart Card IOUC Interface Circuit ......................................................................................................... 24 Figure 16: General Input Circuit .............................................................................................................................. 25 Figure 17: Oscillator Circuit ..................................................................................................................................... 25 Figure 18: VDDF_ADJ ............................................................................................................................................. 26 Figure 19: Mechanical Drawing 20-Pin SO Package .............................................................................................. 27
Tables
Table 1: 73S8014R 20-Pin SOP Pin Definitions ....................................................................................................... 6 Table 2: Absolute Maximum Device Ratings ............................................................................................................. 8 Table 3: Recommended Operating Conditions ......................................................................................................... 8 Table 4: Package Thermal Parameters ..................................................................................................................... 9 Table 5: DC Smart Card Interface Requirements ..................................................................................................... 9 Table 6: Digital Signals Characteristics ................................................................................................................... 11 Table 7: DC Characteristics ..................................................................................................................................... 12 Table 8: Voltage Fault Detection Circuits ................................................................................................................ 13 Table 9: Order Numbers and Packaging Marks ...................................................................................................... 28
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73S8014R Data Sheet
1 Pinout
The 73S8014R is supplied as a 20-pin SO package.
OFF RSTIN I/OUC VPC CLKDIV2 CMDVCC 5V/#V GND XTALIN XTALOUT
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
CLKDIV1 PRES VCC CLK GND RST I/O VDD VDDF_ADJ GND
73S8014R
Figure 2: 73S8014R 20-SOP Pin Out
Rev. 1.0
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73S8014R Data Sheet
DS_8014R_012
Table 1 provides the 73S8014R pin names, pin numbers, type, equivalent circuits and descriptions. Table 1: 73S8014R 20-Pin SOP Pin Definitions Pin Name Pin Number Type Equivalent Circuit Description
Card Interface I/O RST CLK 14 15 17 IO O O Figure 14 Figure 13 Figure 12 Card I/O: Data signal to/from card. Includes an 11k pull-up resistor to VCC. Card reset: provides reset (RST) signal to card. Card clock: provides clock signal (CLK) to card. The rate of this clock is determined by the external crystal frequency or frequency of the external clock signal applied on XTALIN and CLKDIV selections. Card Presence switch: active high indicates card is present. Includes a high-impedance pull-down current source. Card power supply - logically controlled by sequencer, output of LDO regulator. Requires an external filter capacitor to the card GND. Card ground. Command VCC (negative assertion): Logic low on this pin causes the LDO regulator to ramp the VCC supply to the card and initiates a card activation sequence, if a card is present. 5 volt / 3 volt card selection: Logic one selects 5 volts for VCC and card interface, logic low selects 3 volt operation. When the part is to be used with a single card voltage, this pin should be tied to either GND or VDD. However, it includes a high impedance pull-up resistor to default this pin high (selection of 5V card) when not connected. This pin shall not be changed when CMDVCC is low. Sets the divide ratio from the XTAL oscillator (or external clock input) to the card clock. These pins include a pull-up resistor for CLKDIV1 and CLKLDIV2 to provide a default rate of divide by two. CLKDIV1 CLKDIV2 20 5 I Figure 16 CLKDIV1 0 0 1 1 OFF RSTIN I/OUC 1 2 3 O I IO Figure 10 Figure 16 Figure 15 CLKDIV2 0 1 1 0 CLOCK RATE XTALIN/8 XTALIN/4 XTALIN/2 XTALIN
PRES VCC GND
19 18 16
I PSO GND
Figure 16 Figure 11 -
Host Processor Interface CMDVCC 6 I Figure 16
5V/#V
7
I
Figure 16
Interrupt signal to the processor. Active Low - Multi-function indicating fault conditions and card presence. Open drain output configuration - It includes an internal 20k pull-up to VDD. Reset Input: This signal is the reset command to the card. System controller data I/O to/from the card. Includes an 11K pull-up resistor to VDD.
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73S8014R Data Sheet
Miscellaneous Inputs and Outputs XTALIN 9 Figure 17 Crystal oscillator input: can either be connected to crystal or driven as a source for the card clock. Note: When not using the crystal, the capacitors must be removed. Crystal oscillator output: connected to crystal. Left open if XTALIN is being used as external clock input. Note: When not using the crystal, the capacitors must be removed. VDD fault threshold adjustment input: this pin can be used to adjust the VDDF value (that controls deactivation of the card). Must be left open if unused. System interface supply voltage and supply voltage for internal circuitry. LDO regulator power supply source. Digital ground.
XTALOUT
10
Figure 17
VDDF_ADJ
12
Figure 18
Power Supply and Ground VDD VPC GND 13 4 8, 11 PSO PSO GND Figure 11 Figure 11 -
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73S8014R Data Sheet
DS_8014R_012
2 Electrical Specifications
This section provides the following: Absolute maximum ratings Recommended operating conditions Package thermal parameters Smart card interface requirements Digital signals characteristics DC Characteristics Voltage Fault Detection Circuits
2.1
Absolute Maximum Ratings
Table 2 lists the maximum operating conditions for the 73S8014R. Permanent device damage may occur if absolute maximum ratings are exceeded. Exposure to the extremes of the absolute maximum rating for extended periods may affect device reliability. The smart card interface pins are protected against short circuits to VCC, ground, and each other. Table 2: Absolute Maximum Device Ratings Parameter Supply Voltage VDD Supply Voltage VPC Input Voltage for Digital Inputs Storage Temperature Pin Voltage (except card interface) Pin Voltage (card interface) ESD Tolerance - Card interface pins ESD Tolerance - Other pins Rating -0.5 to 6.0 VDC -0.5 to 6.0 VDC -0.3 to (VDD +0.5) VDC -60 to 150C -0.3 to (VDD +0.5) VDC -0.3 to (VCC + 0.5) VDC +/- 6kV +/- 2kV
*Note: ESD testing on smart card pins is HBM condition, 3 pulses, each polarity referenced to ground. Note: Smart Card pins are protected against shorts between any combinations of Smart Card pins.
2.2
Recommended Operating Conditions
Function operation should be restricted to the recommended operating conditions specified in Table 3. Table 3: Recommended Operating Conditions Parameter Supply Voltage VDD Supply Voltage VPC Ambient Operating Temperature Input Voltage for Digital Inputs Rating 2.7 to 5.5 VDC 4.75 to 5.5 VDC -40C to +85C 0V to VDD + 0.3V
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73S8014R Data Sheet
2.3
Package Thermal Parameters
Table 4 lists the 73S8014R Smart Card interface requirements. Table 4: Package Thermal Parameters Parameter 20 SO Rating 50 C / W
2.4
Smart Card Interface Requirements
Table 5 lists the 73S8014R Smart Card interface requirements. Table 5: DC Smart Card Interface Requirements Symbol Parameter Condition Min Nom Max Unit
Card Power Supply (VCC) Regulator General conditions, -40C < T < 85C, 4.75V < VPC < 5.5V, 2.7V < VDD < 5.5V Inactive mode Inactive mode, ICC = 1mA Active mode; ICC <65mA; 5V Active mode; ICC <65mA; 3V Active mode; ICC <40mA; 1.8V VCC Card supply voltage including ripple and noise Active mode; single pulse of 100mA for 2s; 5 volt, fixed load = 25mA Active mode; single pulse of 100mA for 2s; 3v, fixed load = 25mA Active mode; current pulses of 40nAs with peak |ICC | <200mA, t <400ns; 5V Active mode; current pulses of 40nAs with peak |ICC | <200mA, t <400ns; 3V VCCrip ICCmax ICCF VSR VSF CF VCC Ripple Card supply output current ICC fault current VCC slew rate, rise VCC slew rate, fall External filter cap (VCC to GND) CF = 1.0F on VCC CF = 1.0F on VCC CF should be ceramic with low ESR (<100m). fRIPPLE = 20K - 200MHz Static load current, VCC>4.6V or 2.7V as selected 65 70 0.06 0.075 0.5 0.150 0.150 1.0 130 0.30 0.60 1.5 -0.1 -0.1 4.65 2.85 1.68 4.6 2.76 4.6 0.1 0.4 5.25 3.15 1.92 5.25 3.2 5.25 V V V V V V V V
2.7
3.15 350
V mV mA mA V/s V/s F
Rev. 1.0
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73S8014R Data Sheet
DS_8014R_012
Symbol
Parameter
Condition
Min
Nom
Max
Unit
Interface Requirements - Data Signals: I/Oand host interfaces: I/OUC. ISHORTL, ISHORTH, and VINACT requirements do not pertain to I/OUC. Output level, high (I/O) VOH Output level, high (I/OUC) Output level, low (I/O) Output level, low (I/OUC) Input level, high (I/O) Input level, high (I/OUC) Input level, low (I/O) Input level, low (I/OUC) Output voltage when outside of session Input leakage Input current, low Short circuit output current IOL = 0 IOL = 1mA VIH = VCC VIL = 0 For output low, shorted to VCC through 33 For output high, shorted to ground through 33 CL = 80pF, 10% to 90%. IOL=1mA 0.6 VCC 1.8 -0.15 -0.3 IOH =0 IOH = -40A IOH =0 IOH = -40A 0.9 VCC 0.75 VCC 0.9 VDD 0.75 VDD VCC+0.1 VCC+0.1 VDD+0.1 VDD+0.1 0.15 VCC 0.3
VCC+0.30 VDD + 0.3
V V V V V V V V V V V V A mA mA
VOL
VIH
VIL
0.2 VCC 0.8 0.1 0.3 10 0.65 15
VINACT ILEAK IIL ISHORTL
ISHORTH
Short circuit output current
15
mA
tR, tF tIR, tIF RPU FDMAX TFDIO TRDIO CIN
Output rise time, fall times Input rise, fall times Internal pull-up resistor Maximum data rate Delay, I/O to I/OUC, I/OUC to I/O, (respectively falling edge to falling edge and rising edge to rising edge) Input capacitance
100 1
ns s k
MHz
Output stable for >400ns
8
11
14 1
Edge from master to slave, measured at 50%
60
100 15
200
ns ns
10
pF
10
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73S8014R Data Sheet
Symbol
Parameter
Condition
Min
Nom
Max
Unit
Reset and Clock for card interface, RST, CLK VOH VOL VINACT IRST_LIM ICLK_LIM CLKSR3V CLKSR5V Output level, high Output level, low Output voltage when outside of session Output current limit, RST Output current limit, CLK CLK slew rate CLK slew rate Vcc = 3V Vcc = 5V CL = 35pF for CLK, 10% to 90% CL = 200pF for RST, 10% to 90% CL =35pF, FCLK 20MHz 45 0.3 0.5 8 100 55 IOH =-200A IOL=200A IOL = 0 IOL = 1mA 0.9 VCC 0 VCC 0.15 VCC 0.1 0.3 30 70 V V V V mA mA V/ns V/ns ns ns %
tR, tF
Output rise time, fall time
Duty cycle for CLK
2.5
Characteristics: Digital Signals
Table 6: Digital Signals Characteristics
Table 6 lists the 73S8014R digital signals characteristics.
Symbol VIL VIH VOL VOH ROUT |IIL1|
Parameter Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage Pull-up resistor, OFF Input Leakage Current
Condition
Min -0.3 1.8
Nom
Max 0.8 VDD + 0.3 0.45
Unit V V V V
Digital I/O except for XTALIN and XTALOUT
IOL = 2mA IOH = -1mA VDD - 0.45 16 GND < VIN < VDD -5 20
24 5
k A
Rev. 1.0
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73S8014R Data Sheet
DS_8014R_012
Oscillator (XTALIN) I/O Parameters VILXTAL VIHXTAL IILXTAL fMAX Input Low Voltage - XTALIN Input High Voltage - XTALIN Input Current XTALIN Max freq. Osc or external clock External input duty cycle limit tR/F < 10% fIN, 45% < CLK < 55% 48 GND < VIN < VDD -0.3 0.7 VDD -30 0.3 VDD VDD+0.3 30 27 52 V V A MHz %
in
2.6
DC Characteristics
Table 7: DC Characteristics
Table 7 lists the 73S8014R DC characteristics.
Symbol
Parameter
Condition 12 MHz XTAL Ext CLK, VDD = 2.7 - 3.6V, VCC Off Ext CLK, VDD = 2.7 - 3.6V, VCC On
Min
Nom 2.7 1.7
Max 7.0
Unit mA mA
mA 2.2
IDD Supply Current
Ext CLK, VDD = 4.5 - 5.5V, VCC Off Ext CLK, VDD = 4.5 - 5.5V, VCC On
2.7
mA
3
mA
IPC
Supply Current VPC supply current when VCC = 0
VCC on, ICC=0 I/O, AUX1, AUX2=high, Clock not toggling CMDVCC High
450
700
A
IPCOFF
345
650
A
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73S8014R Data Sheet
2.7
Voltage Fault Detection Circuits
Table 8: Voltage Fault Detection Circuits
Table 8 lists the 73S8014R Voltage Fault Detection Circuits.
Symbol VDDF
Parameter VDD fault (VDD Voltage supervisor threshold) VCC fault (VCC Voltage supervisor threshold)
Condition No external resistor on VDDF_ADJ pin VCC = 5v VCC= 3v
Min 2.15
Nom
Max 2.4 4.6 2.7
Unit V V V
VCCF
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73S8014R Data Sheet
DS_8014R_012
3 Applications Information
This section provides general usage information for the design and implementation of the 73S8014R. The documents listed in Related Documentation provide more detailed information.
3.1
Example 73S8014R Schematics
Figure 3 shows a typical application schematic for the implementation of the 73S8014R. Note that minor changes may occur to the reference material from time to time and the reader is encouraged to contact Teridian for the latest information.
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73S8014R Data Sheet
CLKDIV1_from_uC OFF_interrupt_to_uC RSTIN_from_uC I/OUC_to/from_uC CLKDIV2_from_uC VPC 1 2 3 4 5 6 7 8 9 10 Y1 OFF RSTIN I/OUC VPC CLKDIV2 CMDVCC 5V3V GND XTALIN XTALOUT 73S8014R CLKDIV1 PRES VCC CLK GND RST I/O VDD VDDF_ADJ TEST 20 19 18 17 16 15 14 13 12 11 VDD R3 Rext2 See note 5
100nF See NOTE 2 C4
10uF C5
VDD See NOTE 1 C6 R1 Rext1 100nF
22pF CMDVCC_from_uC 5V/#V_select_from_uC See NOTE 3 External_clock_from uC - OR 22pF
C2
CRYSTAL C3
See NOTE 4
R2 47K
SW-2 SW-1
C8 I/O VPP GND C4 CLK RST VCC
NOTES: 1) VDD = 2.7V to 5.5V DC. VDD 2) VPC = 4.75V to 5.5V DC R4 3) Required if external clock from uP is used. 10K 4) Required if crystal is used. Card detection Y1, C2 and C3 must be removed if external clock is used. switch is 5) R1 and R3 are external resistors that adjust the VDD fault voltage. Can be left open.
normally open
C1 10 9 8 7 6 5 4 3 2 1
EMV & ISO7816=1uF Low ESR (<100mohms) C1 should be placed near the SC connecter contact
CLK track should be routed far from RST, I/O, C4 and C8.
Smart Card Connector
Figure 3: 73S8014R - Typical Application Schematic
Rev. 1.0
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73S8014R Data Sheet
DS_8014R_012
3.2
System Controller Interface
Pin CMDVCC: When asserted low, starts an activation sequence Pin RSTIN: controls the card RST signal (when enabled by the sequencer) Pin 5V/#V: Defines the card VCC voltage (5V when high and 3V when low)
Three digital inputs allow direct control of the card interface by the host. The 73S8014R is controlled as follows:
Card clock frequency can be controlled by 2 digital inputs: CLKDIV1 and CLKDIV2 define the division rate for the clock frequency, from the input clock frequency (crystal or external clock) Note: The maximum CLK frequency is 20MHz. Therefore, if using an input clock source greater than 20MHz, a divisor rate of 2X or higher must be used. Interrupt output to the host: As long as the card is not activated, the OFF pin informs the host about the card presence only (Low = No card in the reader). When CMDVCC is asserted low (Card activation sequence requested from the host), low level on OFF means a fault has been detected (e.g. card removal during card session, voltage fault, or over-current fault) that automatically initiates a deactivation sequence.
3.3
Power Supply and Voltage Supervision
The 73S8014R smart card interface IC incorporates a LDO voltage regulator. The voltage output is controlled by the digital input 5V/#V of the 73S8014R. This regulator is able to provide either 3V or 5V card voltage from the power supply applied on the VPC pin. The voltage regulator can provide a current of at least 65mA on VCC for both 3V and 5V that complies with EMV 4.0. Digital circuitry is powered by the power supply applied on the VDD pin. VDD also defines the voltage range to interface with the system controller. A card deactivation sequence is forced upon fault of any of this voltage supervisor. One voltage supervisor constantly monitors the VDD voltage. It is used to initialize the ISO 7816-3 sequencer at power-on, and to deactivate the card at power-off or upon fault. The voltage threshold of the VDD voltage supervisor is internally set by default to 2.33V nominal. However, it may be desirable, in some applications, to modify this threshold value. The pin VDDF_ADJ is used to connect an external resistor REXT to ground to change the VDD fault voltage to another value, VDDF. The resistor value is defined as follows: REXT = 56k /(VDDF - 2.33) An alternative (more accurate) method of adjusting the VDD fault voltage is to use a resistive network of R3 from the pin to supply and R1 from the pin to ground (see Figure 3). In order to set the new threshold voltage, the equivalent resistance must be determined. This resistance value will be designated Kx. Kx is defined as R1/(R1+R3). Kx is calculated as: Kx = (2.789 / VTH) - 0.6125 where VTH is the desired new threshold voltage. To determine the values of R1 and R3, use the following formulas. R3 = 24000 / Kx R1 = R3*(Kx / (1 - Kx))
Taking the example above, where a VDD fault threshold voltage of 2.7V is desired, solving for Kx gives: Kx = (2.789 / 2.7) - 0.6125 = 0.42046. Solving for R3 gives: R3 = 24000 / 0.42046 = 57080. Solving for R1 gives: R1 = 57080 *(0.42046 / (1 - 0.42046)) = 41412. Using standard 1 % resistor values gives R3 = 57.6K and R1 = 42.4K. These values give an equivalent resistance of Kx = 0.4228, a 0.6% error. If the 2.33V default threshold is used, this pin must be left unconnected.
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73S8014R Data Sheet
3.4
Card Power Supply
The card power supply is internally provided by the LDO regulator, and controlled by the digital ISO 7816-3 sequencer. Card voltage selection on the 73S8014R is carried out by the digital input 5V/#V. Choice of the VCC capacitor: Depending on the application, the requirements in terms of both VCC minimum voltage and transient currents that the interface must be able to provide to the card are different. An external capacitor must be connected between the VCC pin and to the card ground in order to guarantee stability of the LDO regulator, and to handle the transient requirements. The type of capacitor should be an X5R/X7R with ERS<100 m.
3.5
On-Chip Oscillator and Card Clock
The 73S8014R device has an on-chip oscillator that can generate the smart card clock using an external crystal (connected between the pins XTALIN and XTALOUT) to set the oscillator frequency. When the clock signal is available from another source, it can be connected to the pin XTALIN, and the pin XTALOUT should be left unconnected. The card clock frequency may be chosen between 4 different division rates, defined by digital inputs CLKDIV 1 and CLKDIV 2, as per the following table: CLKDIV1 0 0 1 1 CLKDIV2 0 1 0 1 CLK 1/8 XTALIN 1/4 XTALIN XTALIN 1/2 XTALIN Max XTALIN 27MHz 27MHz 20MHz 27MHz
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73S8014R Data Sheet
DS_8014R_012
3.6
Activation Sequence
The 73S8014R smart card interface ICs have an internal 10ms delay on the application of VDD where VDD > VDDF. No activation is allowed during this 10ms period. The CMDVCC (edge triggered) signal must then be set low to activate the card. In order to initiate activation, the card must be present; there can be no VDD fault. The following steps show the activation sequence and the timing of the card control signals when the system controller sets CMDVCC low while the RSTIN is low: CMDVCC is set low at t0. VCC will rise to the selected level and then the internal VCC control circuit checks the presence of VCC at the end of t1. In normal operation, the voltage VCC to the card becomes valid before t1. If VCC is not valid at t1, the OFF goes low to report a fault to the system controller, and VCC to the card is shut off. Turn I/O to reception mode at t2. CLK is applied to the card at t3. RST is a copy of RSTIN after t3.
-
CMDVCC VCC I/O CLK RSTIN RST
t0
t1
t2
t3
t1 = 0.510 ms (timing by 1.5MHz internal Oscillator) t2 = 1.5s, I/O goes to reception state t3 = >0.5s, CLK starts, RST to become the copy of RSTIN Figure 4: Activation Sequence - RSTIN Low When CMDVCC Goes Low The following steps show the activation sequence and the timing of the card control signals when the system controller pulls the CMDVCC low while the RSTIN is high: CMDVCC is set low at t0. VCC will rise to the selected level and then the internal VCC control circuit checks the presence of VCC at the end of t1. In normal operation, the voltage VCC to the card becomes valid before t1. If VCC is not valid at t1, the OFF goes low to report a fault to the system controller, and VCC to the card is shut off. At the fall of RSTIN at t2, CLK is applied to the card RST is a copy of RSTIN after t2.
-
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73S8014R Data Sheet
CMDVCC VCC I/O CLK RSTIN RST
t0
t1
t2
t1 = 0.510 ms (timing by 1.5MHz internal oscillator, I/O goes to reception state) t2 = RSTIN goes low and CLK becomes active t3 = > 0.5s, CLK active, RST to become the copy of RSTIN Figure 5: Activation Sequence - RSTIN High When CMDVCC Goes Low
3.7
Deactivation Sequence
Deactivation is initiated either by the system controller by setting the CMDVCC high, or automatically in the event of hardware faults. Hardware faults are over-current, VDD fault, VCC fault, and card extraction during the session. The following steps show the deactivation sequence and the timing of the card control signals when the system controller sets the CMDVCC high or OFF goes low due to a fault or card removal: RST goes low at the end of t1. CLK is set low at the end of t2. I/O goes low at the end of t3. Out of reception mode. VCC is shut down at the end of time t4. After a delay t5 (discharge of the VCC capacitor), VCC is low.
CMDVCC OFF
-- OR --
RST CLK I/O VCC
t1
t2
t3
t4
t5
t1 = t2 = t3 = t4 = t5 =
> 0.5s, timing by 1.5MHz internal Oscillator > 7.5s > 0.5s > 0.5s depends on VCC filter capacitor. Figure 6: Deactivation Sequence
Rev. 1.0
19
73S8014R Data Sheet
DS_8014R_012
3.8
Fault Detection and OFF
There are two different cases that the system controller can monitor the OFF signal: to query regarding the card presence outside card sessions, or for fault detection during card sessions. Outside a card session: In this condition, CMDVCC is/are always high, OFF is low if the card is not present, and high if the card is present. Because it is outside a card session, any fault detection will not act upon the OFF signal. No deactivation is required during this time. During a card session: CMDVCC is/are always low, and OFF falls low if the card is extracted or if any fault detection is detected. At the same time that OFF is set low, the sequencer starts the deactivation process. Figure 7 shows the timing diagram for the signals CMDVCC, PRES, and OFF during a card session and outside e the card session:
OFF is low by card extracted
PRES OFF CMDVCC VCC
OFF is low by any fault
outside card session
within card session
within card session
Figure 7: Timing Diagram - Management of the Interrupt Line OFF
3.9
I/O Circuitry and Timing
The state of the I/O pin is low after power on reset and it goes high when the activation sequencer turns on the I/O reception state. See the Activation Sequence section for details on when the I/O reception is enabled. The state of I/OUC is high after power on reset. Within a card session and when the I/O reception state is turned on, the first I/O line on which a falling edge is detected becomes the input I/O line and the other becomes the output I/O line. When the input I/O line rising edge is detected then both I/O lines return to their neutral state. Figure 8 shows the state diagram of how the I/O and I/OUC lines are managed to become input or output. The delay between the I/O signals is shown in Figure 9.
20
Rev. 1.0
DS_8014R_012
73S8014R Data Sheet
Neutral State
No
I/O reception
Yes I/O & not I/OUC No Yes No I/OUC & not I/O Yes I/OUC in No I/OUC yes I/O yes I/OICC in No
Figure 8: I/O and I/OUC State Diagram
I/O
I/OUC
tI/O_HL
Delay from I/O to I/OUC: Delay from I/OUC to I/O:
tI/O_LH
tI/O_HL = 100ns tI/OUC_HL = 100ns
tI/OUC_HL
tI/OUC_LH
tI/O_LH = 25ns tI/OUC_LH = 25ns
Figure 9: I/O - I/OUC Delays - Timing Diagram
Rev. 1.0
21
73S8014R Data Sheet
DS_8014R_012
4 Equivalent Circuits
This section provides illustrations of circuits equivalent to those described in the pinout section.
VDD
Output Disable
20K
Data From circuit
PIN
ESD
STRONG NFET
Figure 10: Open Drain type - OFF
PIN
ESD
To Internal circuits
Figure 11: Power Input/Output Circuit, VDD, VPC, VCC
22
Rev. 1.0
DS_8014R_012
73S8014R Data Sheet
VCC
VERY STRONG PFET
ESD
From circuit
VERY STRONG NFET
ESD
CLK
PIN
Figure 12: Smart Card CLK Driver Circuit
VCC
STRONG PFET
ESD
From circuit
ESD
RST
PIN
STRONG NFET
Figure 13: Smart Card RST Driver Circuit
Rev. 1.0
23
73S8014R Data Sheet
VCC
DS_8014R_012
ESD
STRONG PFET
400ns DELAY
RL=11K
From circuit
STRONG NFET
IO
PIN
To circuit
CMOS
ESD
Figure 14: Smart Card IO Interface Circuit
VDD
ESD
STRONG PFET
400ns DELAY
RL=11K
From circuit
STRONG NFET
UC
PIN
To circuit
CMOS
ESD
Figure 15: Smart Card IOUC Interface Circuit
24
Rev. 1.0
DS_8014R_012
VDD
73S8014R Data Sheet
Pull-up Disable
VERY WEAK PFET
ESD
To circuit Pull-down Enable
TTL
PIN
VERY WEAK NFET
ESD
Note:
Pins CMDVCC,5V/#V, CLKDIV1 and CLKDIV2 have the pull-up enabled. Pins RSTIN, CLKIN, PRES have the pull-down enabled. Figure 16: General Input Circuit
VDD
ENABLEB VERY WEAK FETs
ESD
STRONG PFET
ESD
XTALIN
STRONG PFET
XTALOUT
PIN
STRONG NFET
PIN
ESD
ESD
ENABLE
STRONG NFET
Figure 17: Oscillator Circuit
Rev. 1.0
25
73S8014R Data Sheet
VDD
DS_8014R_012
PIN
ESD
R = 40k
VREF = 1.400v +
VDD FAULT DETECTION
ESD
VDDF_ ADJ
PIN
R = 60k R = 0.4k (approx.)
ESD
Figure 18: VDDF_ADJ
26
Rev. 1.0
DS_8014R_012
73S8014R Data Sheet
5 Mechanical Drawing
+ .005(.127)
Inches (mm)
0.5050(12.82) - .009(.228)
.0125(.318)
0.4065(10.32)
0.2960(7.51) - .004(.101)
+ .003(.076)
0.5050(12.82) 0.1000 + .004(.101) - .007(.178) (2.54)
+ .005(.127) - .009(.228)
BASE PLANE
0.01(.254) - .0010(.0254)
0- 8
+ .0025(.0634)
Detail A
Detail "A"
Figure 19: Mechanical Drawing 20-Pin SO Package
Rev. 1.0
0.0082 (.208)
.033 (.838)
.017(.431)
0.016(.406)
+ .004(.101) - .003(.076)
0.050(1.27) TYP
SEATING PLANE
27
73S8014R Data Sheet
DS_8014R_012
6 Ordering Information
Table 9 lists the order numbers and packaging marks used to identify 73S8014R products. Table 9: Order Numbers and Packaging Marks Part Description 73S8014R 20-pin Lead-Free 73S8014R 20-pin Lead-Free Tape / Reel Order Number 73S8014R-IL/F 73S8014R-ILR/F Packaging Mark 73S8014R 73S8014R
7 Related Documentation
The following 73S8014R document is available from Teridian Semiconductor Corporation: 73S8014R/RN/RT 20SO Demo Board User Manual
8 Contact Information
For more information about Teridian Semiconductor products or to check the availability of the 73S8014R, contact us at: 6440 Oak Canyon Road Irvine, CA 92618-5201 Telephone: (714) 508-8800 FAX: (714) 508-8878 Email: scr.support@teridian.com For a complete list of worldwide sales offices, go to http://www.teridian.com.
28
Rev. 1.0
DS_8014R_012
73S8014R Data Sheet
Revision History
Revision 1.0 Date 9/3/2008 First publication. Description
(c) 2008 Teridian Semiconductor Corporation. All rights reserved. Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation. Simplifying System Integration is a trademark of Teridian Semiconductor Corporation. All other trademarks are the property of their respective owners. Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly contained in the Company's warranty detailed in the Teridian Semiconductor Corporation standard Terms and Conditions. The company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice and does not make any commitment to update the information contained herein. Accordingly, the reader is cautioned to verify that this document is current by comparing it to the latest version on http://www.teridian.com or by checking with your sales representative. Teridian Semiconductor Corp., 6440 Oak Canyon Rd., Suite 100, Irvine, CA 92618 TEL (714) 508-8800, FAX (714) 508-8877, http://www.Teridian.com Rev. 1.0 29

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