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 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
LED ARRAY
LA112B/GX
DATA SHEET
DOC. NO : REV. DATE : :
QW0905-LA112B/GX A 04 - Feb - 2005
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA112B/GX Page 1/4
Package Dimensions
4.3 2.5O 0.5 8.2
G
5.0
2.9
9.6
X
2.65
1/4 0.5 TYP
2.54TYP
3.2O 0.3
6.99O 0.5
+
-
LG2640-1
2.9 3.1
3.3
4.3
1.5 MAX 25.0MIN 0.5 TYP 1.0MIN 2.54TYP Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without not ice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA112B/GX Page 2/4
Absolute Maximum Ratings at Ta=25 J
Absolute Maximum Ratings Parameter Symbol G Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir Topr Tstg Tsol 30 120 100 10 -40 ~ +85 -40 ~ +100 Max 260J for 5 sec Max (2mm from body) mA mA mW UNIT
g A J J
Typical Electrical & Optical Characteristics (Ta=25 J )
PART NO
MATERIAL Emitted
COLOR Lens
Green Diffused
Forward Peak Spectral voltage wave halfwidth length f nm @20mA(V) f Pnm
Luminous intensity
@10mA(mcd)
Viewing angle 2c 1/2 (deg)
Min. Max. Min. 565 30 1.7 2.6 12
Typ. 20 50
LA112B/GX
GaP
Green
Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA112B/GX Page 3/4
Typical Electro-Optical Characteristics Curve
G CHIP
Fig.1 Forward current vs. Forward Voltage
1000
Fig.2 Relative Intensity vs. Forward Current
3.5
Forward Current(mA)
100 10 1.0 0.1 1.0 2.0 3.0 4.0 5.0
Relative Intensity Normalize @20mA
3.0 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
Forward Voltage@20mA Normalize @25J
Relative Intensity@20mA Normalize @25J
Ambient Temperature(J )
Ambient Temperature(J )
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA112B/GX Page 4/4
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs
The purpose of this test is the resistance of the device under tropical for hous.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 JO 5J &-40JO (10min) (10min) 2.total 10 cycles
5J
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 J O 5J 2.Dwell time= 10 O 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2
Solderability Test
1.T.Sol=230 J O 5J 2.Dwell time=5 O 1sec


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