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| NCP3120 Dual 2.0 A, Step-Down DC/DC Switching Regulator The NCP3120 is a dual buck converter designed for low voltage applications requiring high efficiency. This device is capable of producing an output voltage as low as 0.8 V. The NCP3120 provides dual 2.0 A switching regulators with an adjustable 200 kHz - 750 kHz switching frequency. The switching frequency is set by an external resistor. The NCP3120 also incorporates an auto-tracking and sequencing feature. Protection features include cycle-by-cycle current limit and undervoltage lockout (UVLO). The NCP3120 comes in a 32-pin QFN package. Features http://onsemi.com MARKING DIAGRAM 1 1 32 NCP3120 AWLYYWWG G * * * * * * * * * * * Input Voltage Range from 4.5 V to 13.2 V 12 Vin to 5.0 Vout = 87% Efficiency Min @ 2.0 A 200-750 kHz Operation Stable with Low ESR Ceramic Output Capacitor 0.8 1.5% FB Reference Voltage External Soft-Start Out of Phase Operation of OUT1 & OUT2 Auto-Tracking and Sequencing Enable/Disable Capability Hiccup Overload Protection Low Shutdown Power (Iq < 100 mA) QFN32 CASE 488AM NCP3120 = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 38 of this data sheet. Typical Applications * Set-Top Boxes, Portable Applications, Networking and * Telecommunications DSP/mP/FPGA Core VIN RVIN FB1 R_TRACK PG1 PG2 Enable Disable Enable Disable EN2 EN1 R14 R24 C3 AVIN GND OUT1 SW1 L11 D11 GND VIN R12 GND GND OUT2 C1 COMP2 COMP1 GND SW2 SS1 L21 D21 C12 GND R22 R13 C13 GND GND GND R21 C2 GND R11 PG1 PG2 EN1 SEQ1 EN2 SEQ2 AGND AGND TRACK1,2 FB2 RT C11 NCP3120 GND SS2 C21 RT C22 R23 GND C23 GND GND Figure 1. Typical Application Circuit (c) Semiconductor Components Industries, LLC, 2008 1 January, 2008 - Rev. 0 Publication Order Number: NCP3120/D NCP3120 0 .1. ref Falling comp SHDN 1 PG 1 0 .9 . ref HS protection 1 pg 1 Delay VIN COMP 1 Error Amplifier FB 1 EOTA 1 0o PWM R CON TR OL LOGIC 1 S HS1 SW 1 1V 10 u SS 1 Soft Start & Tracking Control (MUX1) 10 u OSCILLATOR RT ref (0.8 V) SEQ1 EN 1 Power Sequencing 1 SHDN 1 SHDN2 STAR TU P UVL O TH ER MAL SH U TD OWN FB1 0. 5V Overload Protection SHDN 1 AVIN ref (0 .8V ) ref (0.8 V) Signal Voltage AGND AVIN GND 1 SS 1 TRACK 1 Reference 0. 8V EN 2 SEQ 2 SS2 Power Sequencing 2 1V 10u SS 2 Soft Start & Tracking Control (MUX2) FB2 10u 0 .5V SHDN1 SHDN2 SHDN 2 GND 2 TRACK 2 HS protection 2 VIN Overload Protection S HS 2 180o COMP 2 Error Amplifier R EOTA 2 FB 2 PWM CON TR OL LOGIC 2 SW 2 pg 2 Delay 0 .9 . ref 0 .1. ref Falling comp SHDN 2 PG 2 Figure 2. Block Diagram http://onsemi.com 2 NCP3120 PIN DESCRIPTION Pin 1, 31, 32 2-7 8 - 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Symbol SW1 VIN SW2 GND2 SS2 COMP2 AGND FB2 RT TRACK 2 TRACK 1 SEQ2 EN2 SEQ1 EN1 PG2 PG1 AVIN FB1 AGND COMP1 SS1 GND1 Exposed Pad (GND) Description Switch node of Channel 1. Connect an inductor between SW1 and the regulator output. Input power supply voltage pins. These pins should be connected together to the input signal sup ply voltage pin. Switch node of Channel 2. Connect an inductor between SW2 and the regulator output. Power ground for Channel 2 Soft-start control input for Channel 2. An internal current source charges an external capacitor connected to this pin to set the soft-start time. Compensation pin of Channel 2. This is the output of the error amplifier and inverting input of the PWM comparator. Analog ground; connect to GND1 and GND2. Feedback Pin. Used to set the output voltage of Channel 2 with a resistive divider from the output. Resistor select for the oscillator frequency. Connect a resistor from the RT pin to AGND to set the frequency of the master oscillator. Tracking input for Channel 2. This pin allows the user to control the rise time of the second output. This pin must be tied high in the normal operation (except in the tracking mode). Tracking input for Channel 1. This pin allows the user to control the rise time of the first output. This pin must be tied high in the normal operation (except in the tracking mode). Sequence pin for Channel 2. I/O used in power sequencing. Connect SEQ to EN for normal opera tion of a standalone device. Enable input for Channel 2. Sequence pin for Channel 1. I/O used in power sequencing. Connect SEQ to EN for normal opera tion of a standalone device. Enable input for Channel 1. Power good, open-drain output of Channel 2. Output logic is pulled to ground when the output is less than 90% of the desired output voltage. Tied to an external pull-up resistor. Power good, open-drain output of Channel 1. Output logic is pulled to ground when the output is less than 90% of the desired output voltage. Tied to an external pull-up resistor. Input signal supply voltage pin. Feedback Pin. Used to set the output voltage of Channel 1 with a resistive divider from the output. Analog ground. Connect to GND1 and GND2. Compensation pin of Channel 1. This is the output of the error amplifier and inverting input of the PWM comparator. Soft-start/stop control input for Channel 1. An internal current source charges an external capacitor connected to this pin to set the soft-start time. Power ground for Channel 1. The exposed pad at the bottom of the package is the electrical ground connection of the NCP3120. This node must be tied to ground. http://onsemi.com 3 NCP3120 MAXIMUM RATINGS Characteristics Power Supply Voltage Input Signal Supply Voltage Input SW Pin Voltage EN Pin Voltage Input SEQ Pin Voltage Output PG Pin Voltage All Other Pins Thermal Resistance, Junction-to-Ambient (Note 1) Storage Temperature Range Junction Operating Temperature (Note 2) Symbol VVIN VAVIN VSW VEN VSEQ VPG RqJA TSTG TJ Min -0.3 -0.3 -0.7 -5V for < 50 ns -0.3 -0.3 -0.3 -0.3 50 -55 to +150 -40 to +150 Max 15 15 VVIN 8.0 8.0 5.5 5.5 V V C/W C C Unit V V V V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. RqJA on a 100 x 100 mm PCB with two solid 1 oz ground planes. 2. The maximum package power dissipation limit must not be exceeded PD + TJ (max) * T A R qJA http://onsemi.com 4 NCP3120 ELECTRICAL CHARACTERISTICS (-40C < TJ < 125C, TJ = 25C for typical values, VAVIN =12 V, VVIN =12 V, unless otherwise noted. RT = open kW) Characteristic RECOMMENDED OPERATING CONDITIONS Input Voltage Range SUPPLY CURRENT Quiescent Supply Current Shutdown Supply Current UNDERVOLTAGE LOCKOUT UVLO Threshold UVLO Hysteresis SWITCHING REGULATOR Minimum Duty Cycle Maximum Duty Cycle High Side MOSFET RDS(on) High Side Leakage Current High Side Switch Current Limit Set Point Current Loop Transient Response FB VFB Feedback Voltage TJ = 25C TJ = -40 to 125C, 4.5 V < VIN < 13.2V 0.788 0.784 0.8 0.812 0.816 V Comp = 0.6 V Comp = 2.6 V ISW = 0.5 A, TJ = 25C VEN = 0V, VSW = 0V (Note 3) (Note 4) 2.6 3.2 100 90 250 10 3.8 0 % % mW mA A nsec VIN Rising Edge VIN Falling Edge 3.9 0.15 4.3 4.1 0.20 4.5 0.25 V V VEN = H, VFB = 1.0 V No Switching, PG open VEN = 0 V, PG open 5.0 7.0 100 mA mA 4.5 13.2 V Conditions Min Typ Max Unit OSC Oscillator Frequency TJ = 25C, TJ = -40 to 125C TJ = 25C, TJ = -40 to 125C (RT = 52.3 kW) Standard Oscillator Frequency Range TRANSCONDUCTANCE ERROR AMPLIFIER (GM) Transconductance DC Gain Unity Gain Bandwidth Output Sink Current Output Source Current Input Bias Current Comp Pin Operating Voltage Range SOFT-START Soft-Start Period Soft-Start Voltage Range Soft-Start Current Source Charging, VSS = 1 V Discharging, VSS = 1 V VFB < 0.8 V, CS = 0.1 mF 0 6.5 6.5 8.75 8.75 10 VFB 11 11 ms V mA mA (Note 4) (Note 4) (Note 4) VFB = 1.0 V, Vcomp = 1.5 V VFB = 0.6 V, Vcomp = 1.5 V VFB = 0.8 V (Note 4) 0.6 80 80 0.9 50 1.0 55 4.0 100 100 100 500 2.6 1.1 60 ms dB MHz mA mA nA V TJ = 25C 180 170 635 200 200 200 750 220 230 865 750 kHz kHz kHz kHz http://onsemi.com 5 NCP3120 ELECTRICAL CHARACTERISTICS (-40C < TJ < 125C, TJ = 25C for typical values, VAVIN =12 V, VVIN =12 V, unless otherwise noted. RT = open kW) Characteristic TRACK Tracking Voltage Range Tracking Voltage Offset Track Bias Current POWER GOOD PG Threshold PG Shutdown Mode Feedback Voltage Rising, EN Tied to SEQ, VPG = 3.3 V Feedback Voltage Falling, EN Tied to SEQ, VEN,SEQ = 0V, VPG = 3.3V Rising Edge of Vout Falling Edge of Vout I(PG) = 1 mA 45 VPG = 5.5 V 1.0 90% VFB 10% VFB 15% VFB 20% VFB V V VTRACK = 0.6 V VTRACK = 0.6 V 100 0 VFB 15 500 V mV nA Conditions Min Typ Max Unit PG Delay PG Low Level Voltage PG Hysteresis PG Leakage Current ENABLE/POWER SEQUENCING Enable Internal Pullup Current Sequence Internal Pulldown Current Enable Threshold High Sequence Threshold Low THERMAL SHUTDOWN Overtemperature Trip Point Hysteresis 3. DC value. 4. Guaranteed by design. 50 10 0.3 ms ms V mV mA 4.0 16 EN Tied to SEQ EN Tied to SEQ 2.0 0.8 mA mA V V (Note 4) 160 15 C C http://onsemi.com 6 NCP3120 TYPICAL OPERATING CHARACTERISTICS 0.813 0.808 FREQUENCY (kHz) VOLTAGE (V) 0.803 0.798 0.793 0.788 0.783 -50 850 830 810 790 770 750 730 -50 RT = 47 kW -25 0 25 50 75 100 125 -25 0 25 50 75 100 125 TEMPERATURE (C) TEMPERATURE (C) Figure 3. Feedback Voltage vs. Temperature 216 211 FREQUENCY (kHz) 206 201 196 191 186 -50 CURRENT (mA) RT = open 6 5 4 Figure 4. High Switching Frequency vs. Temperature 1 Channel Disabled 3 2 1 0 -50 -25 0 25 50 75 100 125 -25 0 25 50 75 100 125 TEMPERATURE (C) TEMPERATURE (C) Figure 5. Low Switching Frequency vs. Temperature Figure 6. Quiescent Supply Current vs. Temperature http://onsemi.com 7 NCP3120 TYPICAL OPERATING CHARACTERISTICS 100 90 80 CURRENT (mA) 70 RDS(on) (W) 60 50 40 30 20 10 0 -50 0.20 0.15 -50 0.30 0.35 0.40 0.25 -25 0 25 50 75 100 125 -25 0 25 50 75 100 125 TEMPERATURE (C) TEMPERATURE (C) Figure 7. Shutdown Supply Current vs. Temperature 4.50 4.45 CURRENT (A) VOLTAGE (V) 4.40 4.35 4.30 4.25 4.20 -50 3.3 3.2 3.1 3.0 2.9 2.8 2.7 -50 Figure 8. RDS(on) vs. Temperature -25 0 25 50 75 100 125 -25 0 25 50 75 100 125 TEMPERATURE (C) TEMPERATURE (C) Figure 9. UVLO - Rising Threshold vs. Temperature 4.20 4.15 VOLTAGE (V) 4.10 4.05 4.00 3.95 3.90 -50 CURRENT (mA) 9.9 9.4 8.9 8.4 7.9 7.4 6.9 -50 Figure 10. Current Limit vs. Temperature -25 0 25 50 75 100 125 -25 0 25 50 75 100 125 TEMPERATURE (C) TEMPERATURE (C) Figure 11. UVLO - Falling Threshold vs. Temperature Figure 12. Soft-Start Charge Current vs. Temperature http://onsemi.com 8 NCP3120 TYPICAL OPERATING CHARACTERISTICS 9.9 9.4 CURRENT (mA) 8.9 8.4 7.9 7.4 6.9 -50 VOLTAGE (mV) -25 0 25 50 75 100 125 70 65 60 55 50 45 40 35 30 25 20 -50 -25 0 25 50 75 100 125 TEMPERATURE (C) TEMPERATURE (C) Figure 13. Soft-Start Discharge Current vs. Temperature 15 10 VOLTAGE (mV) 5 0 -5 -10 -15 -50 VTRACK = 0.6 V 65 60 55 50 45 40 35 -50 Figure 14. Power Good Hysteresis vs. Temperature -25 0 25 50 75 100 125 DELAY (ms) -25 0 25 50 75 100 125 TEMPERATURE (C) TEMPERATURE (C) Figure 15. Tracking Voltage Offset vs. Temperature 0.83 0.81 VOLTAGE (V) 0.79 0.77 0.75 0.73 0.71 -50 17 15 13 11 9 7 5 -50 Figure 16. Power Good Rising Delay vs. Temperature -25 0 25 50 75 100 125 DELAY (ms) -25 0 25 50 75 100 125 TEMPERATURE (C) TEMPERATURE (C) Figure 17. Power Good Feedback Threshold vs. Temperature Figure 18. Power Good Falling Delay vs. Temperature http://onsemi.com 9 NCP3120 TYPICAL OPERATING CHARACTERISTICS 0.45 0.40 0.35 VOLTAGE (V) 0.30 0.25 0.20 0.15 0.10 0.05 0 -50 -25 0 25 50 75 100 125 CURRENT (mA) 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 -50 -25 0 25 50 75 100 125 TEMPERATURE (C) TEMPERATURE (C) Figure 19. Power Good Saturation Voltage vs. Temperature 12 10 8 Ids (mA) 6 4 2 0 0 0.5 1.0 1.5 2.0 2.5 Vds (V) 3.0 3.5 4.0 4.5 5.0 CURRENT (mA) 20 19 18 17 16 15 14 13 12 11 10 -50 Figure 20. EN Internal Pull-up Current vs. Temperature -25 0 25 50 75 100 125 TEMPERATURE (C) Figure 21. Power Good Current vs. Drain-to-Source Voltage 3.40 3.38 3.36 3.34 Vout (V) Vout (V) 3.32 3.30 3.28 3.26 3.24 3.22 3.20 5 7 9 Vin (V) 11 13 15 3.300 Iout = 50 mA 3.306 3.309 3.312 Figure 22. SEQ Internal Pull-down Current vs. Temperature Vin = 12 V 3.303 Vin = 5 V 3.297 0 0.5 1.0 Iout (A) 1.5 2.0 Figure 23. NCP3120 Line Regulation Figure 24. NCP3120 Load Regulation http://onsemi.com 10 NCP3120 TYPICAL OPERATING CHARACTERISTICS 85 220 kHz 80 EFFICIENCY (%) 75 70 65 60 55 0 0.5 1.0 Iout (A) 1.5 2.0 EFFICIENCY (%) 750 kHz 530 kHz 5V 85 220 kHz 80 530 kHz 75 70 750 kHz 65 60 55 0 0.5 1.0 Iout (A) 1.5 2.0 90 12 V Figure 25. NCP3120 Efficiency, Vin = 5 V, Vout = 1.8 V, 255C 95 220 kHz 90 89 EFFICIENCY (%) EFFICIENCY (%) 530 kHz 85 80 75 70 77 65 0 0.5 1.0 Iout (A) 1.5 2.0 75 0 750 kHz 750 kHz 220 kHz 87 85 83 5V 93 91 Figure 26. NCP3120 Efficiency, Vin = 12 V, Vout = 3.3 V, 255C 12 V 500 kHz 81 79 0.5 1.0 Iout (A) 1.5 2.0 Figure 27. NCP3120 Efficiency, Vin = 5 V, Vout = 3.3 V, 255C 0.50 0.45 0.40 0.35 0.30 0.25 0.20 4 5 6 7 8 9 10 11 Figure 28. NCP3120 Efficiency, Vin = 12 V, Vout = 5 V, 255C RDS(on) (W) 12 13 14 Vin = AVin (V) Figure 29. RDS(on) vs. Input Voltage http://onsemi.com 11 NCP3120 DETAILED DESCRIPTION Introduction The NCP3120 is a dual channel non-synchronous PWM voltage mode buck regulator. Each channel is identical and has a 2.0 A internal P-FET, compensation, feedback, programmable soft-start, enable and Powergood pins. These circuits also share the same input voltage, reference voltage, thermal shutdown, undervoltage detect and master oscillator. A simple auto-tracking and sequencing capability can be implemented using the SEQ/TRACK/SS pins. The fixed-frequency programmable architecture, driven from a common oscillator, ensures a 180 phase differential between channels. This 180 phase shift between the two channels reduces the common input capacitor requirement and improves the noise immunity. The NCP3120 switching frequency is set by an external resistor and is adjustable between 200-750 kHz. This allows application optimization between efficiency and total solution size. The output voltage is fed back through an external resistor voltage divider to the FB input pin and compared with the reference voltage, then the voltage difference is amplified through the internal transconductance error amplifier. The output current of the transconductance error amplifier (OTA) is presented at the COMP node where an RC network compensates the regulation control system loop. The NCP3120 features a programmable soft-start function, which is implemented through the error amplifier and the external compensation capacitor. This feature prevents stress to the power components and limits output voltage overshoot during start-up. Undervoltage Lockout (UVLO) frequency of the NCP3120 is programmable from 200 kHz to 750 kHz using an external resistor connected from the RT pin to ground. The oscillator works on the double frequency internally. Therefore, both channels have a 180 phase shift of the SW pins. Out-of-Phase Operation In out-of-phase operation, the turn-on of the second channel is delayed by half the switching cycle. This delay is supervised by the oscillator, which supplies a clock signal to the second channel which is 180 out of phase with the clock signal of the first channel. The advantages of out-of-phase synchronization are many. Since the input current pulses are interleaved with one another, the overlap time is reduced. The effect of this overlap reduction is to attenuate the input filter requirement, allowing the use of smaller components. Additionally, since peak current occurs during a shorter time period, emitted EMI is also reduced, thereby reducing shielding requirements. Enable Input Undervoltage lockout (UVLO) is provided to ensure that unexpected behavior does not occur when Vin is too low to support the internal rails and power the converter. In case the input voltage is higher than the UVLO threshold (4.3 V standard value, rising voltage), the step down converter operation can be started. This circuit has a 0.25 V hysteresis (typical). If the falling trip is activated, switching ceases and eventually the circuit turns off. When the input circuit is in this state, the currrent consumption is equal 5 mA (typical). Fixed Frequency Operation Pull the EN enable input high to enable the operation. Logic low on SEQ forces the NCP3120 into shutdown mode. Connect SEQ to EN for normal operation of a standalone device. In shutdown mode, the NCP3120 is turned off and the supply current is reduced to less than 100 mA. In case the enable function will not be required, EN and SEQ pin have to be pulled high or connected directly to Vin (max 8 V). Note: For proper operation of the NCP3120 circuit, no voltage may be pulled high on the output pins. The output capacitors should be discharged. If this condition is not observed when NCP3120 is enabled, the regulator does not start switching. This helps to prevent improper operation of the NCP3120 circuit due to the implemented tracking and sequencing features. Soft-Start/Stop Control The NCP3120 uses a constant frequency architecture for generating a PWM signal. During normal operation, the oscillator generates an accurate pulse at the beginning of each switching cycle to turn on the main switch. The main switch will be turned off when the ramp signal intersects with the output of the error amplifier (COMP pin voltage). Therefore, the switch duty cycle can be modified to regulate the output voltage to the desired value as line and load conditions change. The major advantage of fixed frequency operation is that the component selections, especially the magnetic component design, become very easy. The oscillator This capacitor limits the maximum demand on the external power supply by controlling the inrush current peaks to charge the output capacitor and DC load and to attain smoothly increasing output voltage at start-up. A soft start circuit forces the error amplifier output to follow a prescribed voltage ramp when turning on and off. The output capacitor is discharged when Vin goes under the UVLO as thermal shutdown or overload detection occurs. The circuit input is presented as a voltage ramp generated by internal current sources tied to an external SS capacitor. The external capacitor on the soft-start node is charged/discharged by the 8.75 mA current from the constant current source, and the voltage on the SS node controls the OTA amplifier output voltage until the SS capacitor is charged/discharged to a voltage higher than 0.8 V. http://onsemi.com 12 NCP3120 Power Good The power good is an open drain and active high output that indicates when the output voltage has reached 90% (min) of the nominal output voltage. This output can be pulled up to the appropriate level with an external resistor. The power good comparator senses the voltage at the FB pin, which is a function of Vout. The power good output transistor behavior is shown in the "Typical Operating Characteristics" section. The PG pin is held low during a soft-start. Once a soft-start is completed, the PG goes high if there are no faults and no delays associated with it. Current Limit peak switch current in excess of 2.6 A (minimum). Current limiting is implemented by monitoring the high-side P-channel switch current during conduction with a current limit comparator. When the peak of the switching current reaches the current limit, the power switch turns off. Hiccup Overload Protection (OLM - Over Load Mode) The NCP3120 protects a power system if overcurrent occurs. The NCP3120 contains pulse-by-pulse current limiting to protect the power switch and external components. The current through each channel is continuously monitored. The current limit is set to allow Hiccup mode is a method of protecting the power supply from damage during overload conditions. Within normal operation, the external soft-start capacitor is pulled up by a current source that delivers 8.75 mA to the SS pin capacitor. The soft-start capacitor continues to charge until it reaches the saturation voltage of the current source, typically Vss = 4 V. When the overload condition is detected, the soft-start capacitor is discharged to 0.1 V and is again charged to 1 V. This is periodically repeated until the overload condition is detected. The transconductance error amplifier output is tied to ground when the soft-start capacitor is discharged. Figure 30. Hiccup Overload Protection Thermal Shutdown The NCP3120 has a thermal shutdown feature to protect the device from overheating when the die temperature exceeds 160C (typically). If the chip temperature exceeds the overtemperature shutdown trip point, the fault signal is activated. This will disable the step down converter operation, and the chip temperature will start to decrease. When the chip temperature drops 15C below the overtemperature shutdown trip point, the fault signal is deactivated and the step down converter operation starts again with soft-start. The thermal event sends the device immediately into the OFF state. The currrent consumption is equal 5 mA (typical) if the thermal condition is reached. http://onsemi.com 13 NCP3120 APPLICATION & DESIGN INFORMATION Inductor The output inductor may be the most critical component in the converter because it will directly affect the choice of other components and dictate both the steady state and transient performance of the converter. When choosing inductors, one might have to consider maximum load current, core and copper losses, component height, output ripple, EMI, saturation and cost. Lower inductor values are chosen to reduce the physical size of the inductor. A higher value cuts down the ripple current and core losses and allows more output current. In general, the output inductance value should be as low and the output inductor physically as small as possible to provide the best transient response and minimum cost. If a large inductance value is used, the converter will not respond quickly to rapid changes in the load current. On the other hand, an inductance value that is too low will result in very large ripple currents in the power components, resulting in increased dissipation and lower converter efficiency. A good standard for determining the inductance to use is to select the inductor peak-to-peak ripple current to be approximately 25% of the maximum switch current. Also, make sure that the inductor peak current is below the maximum switch current limit and the selected inductor type saturation current specification is higher than the peak current through the switch. Table 1. Calculated Inductor Values The maximum current in the inductor while operating in the continuous current mode is defined as the load current plus one half of the DIL currrent: I LP + I LOAD ) 1 DI L 2 The inductance value can be calculated by: L+ V OUT V IN * V OUT V IN @ DI L @ f OSC Therefore, the inductor peak current, ILP, can be calculated by: I LP + I LOAD ) V OUT V IN * V OUT 2 @ V IN @ L @ f OSC where; ILOAD is the output load current VOUT is the output voltage VIN is the input voltage DIL is the peak-to-peak inductor ripple current fOSC is the switching frequency of the oscillator The choice of the appropriate inductor type depends not only on the calculated inductance value, saturation current rating and parasitic serial resistance, but also on the required physical dimensions, EMI requirements (shielded or open inductor) and the price. Examples of suitable inductors from various manufacturers are shown in the table below. Calculated coils, I ripple peak-peak 20% f [kHz] Iout [A] 12 Vin to 7.5 Vout 1A 2A 12 Vin to 5 Vout 1A 2A 12 Vin to 3.3 Vout 1A 2A 5 Vin to 3.3 Vout 1A 2A 5 Vin to 2.5 Vout 1A 2A 5 Vin to 1.8 Vout 1A 2A 70 mH 36 mH 73 mH 36 mH 60 mH 30 mH 28 mH 14 mH 31 mH 16 mH 29 mH 15 mH 40 mH 20 mH 42 mH 20 mH 34 mH 17 mH 16 mH 8 mH 18 mH 9 mH 16.5 mH 8.2 mH 28 mH 14 mH 29 mH 15 mH 24 mH 12 mH 11.2 mH 5.6 mH 12.5 mH 6.3 mH 11.5 mH 5.8 mH 18.7 mH 10 mH 20 mH 10 mH 16 mH 8 mH 7.5 mH 3.7 mH 8.3 mH 4 mH 7.7 mH 3.8 mH 200 350 500 750 http://onsemi.com 14 NCP3120 Table 2. Inductor Examples L [mH] 33 DO3316P-333 MSS1038-333 PF0698.333NL PF0560.333NL 22 DO3340P-223 MSS1038-223 PG0015.223NL PF0560.223NL 15 DO3316P-153 MSS1246T-153 PG0015.153NL 10 DS3316P-103 DO3308P-103 P0762.103NL P1167.103NL 8.2 DS3316P-822 MSS6132-822 5.6 5.4 5.2 3.9 3.8 MSS6132-562 P1167.542NL PA0390.472NL DO3316T-392 PA0390.332NL Part Number Shielded/ Non-shielded N S N S N S N S N S N S N N S S S S S N N N Irms [A] 2.1 2.3 2.8 2.2 2.5 2.85 1.95 2.5 3.1 3.4 2.27 2 2.3 2 2 2.1 2.65 2.95 2.5 2.2 5.3 2.9 DCR max [mW} 100 93 65 93 66 73 100 73 46 56 80 101 85 110 50 85 70 60 33 54.4 15 42.8 Coilcraft Coilcraft PULSE PULSE Coilcraft Coilcraft PULSE PULSE Coilcraft Coilcraft PULSE Coilcraft Coilcraft PULSE PULSE Coilcraft Coilcraft Coilcraft PULSE PULSE Coilcraft PULSE www.coilcraft.com www.coilcraft.com www.pulseeng.com www.pulseeng.com www.coilcraft.com www.coilcraft.com www.pulseeng.com www.pulseeng.com www.coilcraft.com www.coilcraft.com www.pulseeng.com www.coilcraft.com www.coilcraft.com www.pulseeng.com www.pulseeng.com www.coilcraft.com www.coilcraft.com www.coilcraft.com www.pulseeng.com www.pulseeng.com www.coilcraft.com www.pulseeng.com Manufacturer Web Output Rectifier Diode When the high-side switch is on, energy is stored in the magnetic field in the inductor. During off time, the internal MOSFET switch is off. Since the current in the inductor has to discharge, the current flows through the rectifying diode to the output. A Schottky diode is recommended due to low diode forward voltage and very short recovery times, which positively impacts the step down voltage converter's overall efficiency. Another choice could be fast recovery or ultra-fast recovery diodes. It should be noted that some types of these diodes with an abrupt turn-off characteristic may cause instability or EMI troubles. Table 3. Schottky Diode Example Part Number Description VRRM min [V] MBRS2040LT3G MBRS230LT3G MBRS240LT3G SS24T3G MBRA340T3G MBRS330T3G 2 A, 40 V Low Vf Schottky Rectifier 2 A, 30 V Low Vf Schottky Rectifier 2 A, 40 V Low Vf Schottky Rectifier 2 A, 40 V Schottky Rectifier 3 A, 40 V Schottky Rectifier 3 A, 30 V Schottky Rectifier 40 30 40 40 40 30 The peak reverse voltage is equal to the maximum input voltage. The peak conducting current is clamped by the current limit of the NCP3120. Use of Schottky barrier diodes reduces diode reverse recovery input current spikes. For switching regulators operating at low duty cycles, it is beneficial to use rectifying diodes with somewhat higher RMS current ratings (thus lower forward voltages). This is because the diode conduction interval is much longer than that of the transistor. Converter efficiency will be improved if the voltage drop across the diode is lower. The average current can be calculated from: I D(AVG) + I LOAD V IN * V OUT V IN Package Web VF max [V] 0.43 0.49 0.43 0.5 0.45 0.5 IO(rec) max [A] 2 2 2 2 3 3 SMB SMB SMB SMB SMA SMC www.onsemi.com www.onsemi.com www.onsemi.com www.onsemi.com www.onsemi.com www.onsemi.com http://onsemi.com 15 NCP3120 The worst case of the diode average current occurs during maximum load current and maximum input voltage. The rectifying diodes should be placed close to the SW pin to avoid the possibility of ringing due to trace inductance. Input Capacitor The input current to the step down converter is discontinuous. The input capacitor has to maintain the DC input voltage and to sustain the ripple current produced by internal MOSFET switching. For stable operation of the switch mode converter, a low ESR capacitor is needed to prevent large voltage transients from appearing at the input. Therefore, ceramic capacitors are preferred, but the circuit works in a stable manner also with electrolytic capacitors. It must be located near the regulator and use short leads. Also, paralleling ceramic capacitors will increase the regulator stability. The RMS value of the input capacitor current ripple is: I RMS + I LOAD D(1 * D) supplies the current to the load in DCM or during load transient and filters the output voltage ripple. For low output ripple voltage and good stability, low ESR output capacitors are recommended. The inductor ripple current acting against the ESR of the output capacitor is the major contributor to the output ripple voltage. An output capacitor has two main functions: it filters the output and provides regulator loop stability. The ESR of the output capacitor and the peak-to-peak value of the inductor ripple current are the main factors contributing to the output ripple voltage value. The output voltage ripple is given by the following equation: DV OUT + V OUT V 1 @ 1 * OUT @ ESR ) V IN f SW @ L 8 @ f SW @ C OUT The duty cycle is: D+ V OUT ) V D V IN ) V D * V DSAT where: ESR is the equivalent series resistance of the output capacitor. The output capacitor value can by expressed by: C OUT + DI L 8 @ f SW @ DV OUT * DI L @ ESR where: VD is the voltage drop across the rectifying diode and VDSAT is the switch saturation voltage on the power MOSFET. The equation reaches its maximum value with duty cycle = 0.5, where: I RMS + I LOAD 2 These components must be selected and placed carefully to yield optimal results. Key specifications for output capacitors are their ESR (equivalent series resistance) and ESL (equivalent series inductance) values. For best transient response, a combination of low value/high frequency and bulk capacitors placed close to the load will be required. For most applications, a 22 mF ceramic capacitor should be sufficient. X5R or X7R dielectrics ceramic capacitors are recommended. Soft-Start Capacitor Selection Losses in the input capacitor can be calculated using the following equation: P CIN + I RMS2 @ ESR CIN where: ESRCIN is the effective series resistance of the input capacitance. The input capacitor voltage ripple depends on the CIN capacitor value. Therefore, the input capacitor can be estimated by: C IN + V V I LOAD @ OUT @ 1 * OUT V IN f SW @ DV IN V IN The soft-start time is programmed by an external capacitor connected from the SS pin to AGND, which can be calculated by: C SS [ t SS @ 8.75 mA 0.8 V where: - tSS is the soft-start/stop interval. Note: See the "Sequencing and Tracking" section on how to use this capacitor. Output Voltage Programming Output Capacitor The output capacitor filters output inductor ripple current and provides low impedance for load current changes. The principle consideration for the output capacitor is the ripple current induced by the switches through the inductor. It Table 4. Output Voltage Setting VOUT [V] R1 [kW] R2 [kW] 8 180 20 7.5 360 43 6 130 20 5 68 13 The controller will maintain 0.8 V at the feedback pin. Thus, if a resistor divider circuit is placed across the feedback pin to VOUT, the controller will regulate the output voltage in proportion to the resistor divider network in order to maintain 0.8 V at the FB pin. 4 300 75 3.3 47 15 2.5 51 24 1.8 20 16 1.2 10 20 http://onsemi.com 16 NCP3120 VOUT R1 VFB R2 Figure 31. Feedback divider The relationship between the resistor divider network and the output voltage is shown in the following equation: R2 + R1 V REF V OUT * V REF frequency operation because a higher frequency results in lower efficiency due to MOSFET gate charge losses. Additionally, the use of smaller inductors at higher frequencies results in higher ripple current, higher output voltage ripple, and lower efficiency at light load currents. The value of the oscillator resistor is designed to be linearly related to the switching period. There are two ways to determine the RT resistor value: by using the standard curve shown in Figure 32 or by using Table 5. The frequency on the RT pin will set the master oscillator. The actual operating frequency on each channel will be one-half the master oscillator. 600 500 400 300 200 100 0 200 250 300 350 400 450 500 550 600 650 700 750 freq [kHz] where: VREF is the circuit's internal voltage reference, which equals 0.8 V. Resistor R1 is selected based on a design trade-off between efficiency and output voltage accuracy. For high values of R1, there is less current consumption in the feedback network. However, the trade-off is output voltage accuracy due to the bias current in the error amplifier. Once R1 has been determined, R2 can be calculated. Selecting the Switching Frequency Selecting the switching frequency is a trade-off between component size and power losses. Operation at higher switching frequencies allows the use of smaller inductor and capacitor values. Nevertheless, it is common to select lower Table 5. Switching Frequency Selection Freq. [kHz] RT [kW] 200 open 250 649 300 316 350 205 400 154 450 121 RT [kOhm] Figure 32. Switching Frequency Selection 500 100 550 84.5 600 73.2 650 64.9 700 57.6 750 52.3 Sequencing of Output Voltages Some microprocessors and DSP chips need two power supplies with different voltage levels. These systems often require voltage sequencing between the core power supply and the I/O power supply. Without proper sequencing, latch-up failure or excessive current draw may occur that could result in damage to the processor's I/O ports or the I/O ports of a supporting system device such as memory, an FPGA or a data converter. To ensure that the I/O loads are not driven until the core voltage is properly biased, tracking of the core supply and the I/O supply voltage is necessary. Designing a system without proper power supply sequencing for signal processing devices like DSPs, FPGAs, and PLDs may create risks as to reliability or proper functionality. The risk comes when there are active and inactive power supply rails on the device for a long time. During this time, the ESD structures, internal circuits and components are stressed from interference between different voltages (from the two separate power supply rails). When these conditions persist on multi-supply devices for long time periods (this is a cumulative phenomenon), the life of the products (DSP, FPGA, and PLD devices) is drastically reduced. The failure is often a result of high currents flowing to the pins or the high voltage difference between pins. In that case, the signal processors require multiple power supplies generating different voltage levels for core and I/O peripherals over time. NCP3120 offers ratiometric sequencing, sequential sequencing and tracking sections to manage the output voltages behavior during start-up and power-down. Basically, the DSP, FPGA, and PLD manufacturers do not specify the method of power sequencing, but they do specify restrictions on the time or voltage differences during power-up and power-down. The power-up sequence for microprocessors should be finished approximately within a few seconds to prevent the risks mentioned above. For more information, see the microprocessor manufacturers' datasheets. http://onsemi.com 17 NCP3120 Ratiometric Sequencing In the ratiometric sequencing mode, multiple outputs start ramping at the same time and also reach the regulation level at the same time. When common EN is pulled down, the output voltages are going down at the same time. See Figure 33. This functionality is created by using the same capacitor values as the soft-start capacitors for all outputs and by AVIN C3 C13 R13 connecting all EN + SEQ pins together. To ensure this behavior, the soft start capacitors should have values greater than the time constant of the output inductor and output capacitor. For proper operation in this mode, using a common soft-start capacitor for both channels is not recommended. VIN C12 R_TRACK AVIN COMP1 AGND GND1 SS1 FB1 SW1 SW1 GND OUT1 SW1 VIN VIN VIN GND R12 C1 VIN VIN COMP2 AGND GND2 SW2 SW2 SW2 L21 D21 GND C22 R_T GND R23 VOUT 1 VOUT 2 PG1 Enable Disable EN1 PG2 EN1 SEQ1 EN2 SEQ2 TRACK1 TRACK2 FB2 RT L11 D11 R11 C11 NCP3120 GND GND OUT2 VIN C2 GND GND SS2 R21 C21 R22 GND GND GND C23 GND Figure 33. Ratiometric Sequencing Configuration http://onsemi.com 18 NCP3120 EN1/SEQ1 & EN2/SEQ2 SS1 & SS2 0.8V 4V 0.8V 90% VFB1 (min) VOUT1 & VOUT2 90% VFB2 (min) hyst + delay PG1 & PG2 Figure 34. Typical Behavior of Ratiometric Sequencing Mode Figure 35. Ratiometric Mode - Power-up Figure 36. Ratiometric Mode - Power-down Figure 37. Ratiometric Mode - Start of OLM Figure 38. Ratiometric Mode - End of OLM http://onsemi.com 19 NCP3120 Sequential Sequencing (First-Up/Last-Down Sequence Configuration) In sequential sequencing mode, the second output voltage starts ramping when the first output voltage is already settled and its power good signal is set. Figure 39 shows the NCP3120's configuration and standard waveforms. The rising slope of both voltages can be selected independently by the soft-start capacitors' values (C1, C2). When the AVIN C3 C13 R13 enable pin is deactivated, the second output voltage decreases first, followed by the first output voltage. The control logic is based on the internal power good signal; no delay is added. The signal has the same threshold values as the power good signal shown in the electrical table. The sequential sequencing mode is also called first-up/ last-down and is ideal for DSPs with separate power supplies for the core and the I/O ports. VIN C12 R_TRACK AVIN COMP1 AGND GND1 SS1 FB1 SW1 SW1 GND OUT1 SW1 VIN VIN VIN L11 R11 D11 GND C1 GND C2 GND OUT2 L21 D21 R12 GND C11 PG1 Enable Disable EN1 PG2 EN1 SEQ1 EN2 SEQ2 TRACK1 NCP3120 GND VIN VIN VIN COMP2 AGND GND2 SW2 SW2 TRACK2 FB2 RT SW2 R21 C21 SS2 C22 R_T GND R23 C23 GND C12 C22 C22 C12 GND GND R22 GND GND VOUT1 VOUT2 Figure 39. Sequential Configuration http://onsemi.com 20 NCP3120 Daisy Chain Operation The last-up/first-down power output has its SEQ pin tied to the EN of the first-up/last-down power output. Each output in the chain has its power-up delay set by the soft-start ramp-up of the supply. This feeds its EN and its power-down delay set by the soft-start ramp-down of the supply that feeds its SEQ pin. ENABLE DISABLE SEQ SS C1 SEQ SS C2 SEQ SS C3 SEQ SS C4 EN NCP3120 TRACK EN NCP3120 TRACK EN NCP3120 TRACK EN NCP3120 TRACK Vout1 Vout2 Vout3 Vout4 C1 C2 C3 C4 C4 C3 C2 C1 Figure 40. Simplified Drawing of Daisy-chained NCP3120's When the first voltage rail has reached a specific voltage level, the next voltage rail is enabled and its rise is monitored until it has reached the power good trip point. At this point, the next voltage rail is enabled. This continues until all voltage rails have been enabled (see Figure 41). Power-down sequencing is just the opposite of the power-up sequence. http://onsemi.com 21 NCP3120 EN1 & SEQ2 SS1 0.8V 4V 0.8V 90% VFB (min) VOUT1 10% VFB (min) Internal PG1 VOUT2 90% VFB (min) 10% VFB (min) Internal PG2 SEQ1 & EN2 SS2 0.8V 4V 0.8V VOUT1 & VOUT2 PG1 PG2 Figure 41. Typical Behavior of Sequential Mode http://onsemi.com 22 NCP3120 Figure 42. Sequential Mode - Power-up Figure 43. Sequential Mode - Power-down Figure 44. Sequential Mode - Power-down Figure 45. Daisy Chain of Four Outputs Figure 46. OLM of the 3rd Output in Daisy Chain http://onsemi.com 23 NCP3120 Tracking Voltage tracking is enabled by applying a ramp voltage to the TRACK pin. When the voltage on the TRACK pin is below 0.8 V, the feedback voltage will regulate to this tracking voltage. When the tracking voltage exceeds 0.8 V, tracking is disabled and the feedback voltage will regulate to the internal reference voltage. In this start-up sequence, the tracking pin is used to match the output voltage ramps exactly. Higher output voltage will continue to rise past the lower regulated point. This is AVIN C13 C3 R8 achieved by dividing the higher output voltage by the same ratio as the lower voltage feedback components and connecting the divided voltage into the TRACK pin of the lower voltage. Track pins must be tied high in the normal operation (except in the tracking mode). The output voltage during tracking can be calculated with the following equation: V OUT + V TRACK 1 ) R5 R6 V TRACK t 0.8 V VIN Cmaster R10 AVIN COMP1 AGND GND1 SS1 FB1 SW1 SW1 GND OUT1 SW1 VIN VIN VIN D1 GND C9 GND C10 GND OUT2 L2 D2 R11 R9 GND GND GND R4 GND R7 C4 GND GND R3 C8 L1 R1 C7 R2 GND GND GND R6 R5 PG1 Enable Disable PG2 EN1 SEQ1 EN2 SEQ2 TRACK1 NCP3120 VIN VIN VIN COMP2 AGND GND2 SW2 24 Cmaster VOUT1 VOUT2 Cmaster Figure 47. Tracking Configuration http://onsemi.com SW2 TRACK2 FB2 RT SW2 SS2 NCP3120 EN1/SEQ1 & EN2/SEQ2 SS1 90% V (min) FB1 0.8V 4V 0.8V VOUT1 & SS2 TRACK2 0.8V 90% V (min) FB1 0.8V VOUT1 & VOUT2 90% V FB2 (min) hyst+delay PG1 hyst+delay PG2 Figure 48. Typical Behavior of Tracking Configuration http://onsemi.com 25 NCP3120 Figure 49. Tracking Mode - Power-up Figure 50. Tracking Mode - Power-down Figure 51. Tracking Mode of Four Outputs Power-up Figure 52. Tracking Mode of Four Outputs Power-down VOUT1 When hiccup overload mode is detected on the slave channel only, the output voltage of the 2nd channel (slave) decreases. After the overload condition ends, the slave channel voltage remains low. If the slave channel should rise when the OLM disappears, the configuration of the enable and soft-start pins shown in Figure 53 must be used. EN2 pin 4k7 N-channel transistor SS2 pin CSS2 = 4n7 N-channel transistor Figure 53. Augmented OLM in Tracking Mode For proper operation of the modified tracking mode, use an SS1 capacitor with a value at least 10 times higher than that of the SS2 capacitor. http://onsemi.com 26 NCP3120 Figure 54. Master Voltage - Start of OLM Figure 55. Master Voltage - End of OLM Figure 56. Master Voltage - Start of Augmented OLM Figure 57. Master Voltage - End of Augmented OLM Note: If the overload conditions are detected on the master channel only or on both channels together (master + slave), both output voltages increase when the overload conditions are released. http://onsemi.com 27 NCP3120 Mixed Mode Sequencing The different modes can also be used together to achieve various combinations of power sequencing. Mixed mode A demonstrates the configuration of tracking and sequencing for four outputs. The schematic and typical output behavior is shown in Figure 58. Mixed mode B shows the combination of tracking, sequencing and normal mode. VIN C13 C3 R8 R10 AVIN FB1 AGND COMP1 C5 GND1 SS1 SW1 SW1 GND OUT1 VIN VIN VIN VIN VIN C9 C10 VIN L1 D1 GND R1 C7 R2 GND GND R6 GND OUT2 R3 R5 PG1 Enable Disable PG2 EN1 SW1 NCP3120 SEQ1 EN2 SEQ2 COMP2 AGND GND2 TRACK1 TRACK2 FB2 RT SW2 SW2 SS2 SW2 GND GND L2 D2 GND R4 GND GND C8 R9 GND R7 C4 GND GND R11 C16 C1 R17 R21 AVIN FB1 AGND COMP1 C6 GND1 SS1 SW1 SW1 GND OUT1 VIN VIN VIN VIN VIN C14 C15 VIN L3 D4 GND R12 C11 R13 GND GND R20 GND OUT2 R14 R19 PG1 PG2 EN1 VOUT1 VOUT2 VOUT3 VOUT4 SW1 SEQ1 EN2 SEQ2 TRACK1 TRACK2 FB2 RT NCP3120 COMP2 AGND GND2 SW2 SW2 SS2 SW2 GND GND L4 D3 GND R15 GND GND C12 R18 GND R16 C2 GND GND R22 Figure 58. Mixed Mode, Configuration A http://onsemi.com 28 NCP3120 Figure 59. Mixed Mode of Four Outputs Power-up Figure 60. Mixed Mode of Four Outputs Power-down http://onsemi.com 29 NCP3120 Mixed Mode B (Normal & Sequencing & Tracking) ENABLE DISABLE Out1 EN OUT SEQ Tied high NCP3120 TRACK Out2 EN OUT SEQ NCP3120 TRACK Out3 EN OUT SEQ NCP3120 TRACK Out4 EN OUT SEQ NCP3120 TRACK Out5 EN OUT SEQ NCP3120 TRACK Out6 EN OUT SEQ NCP3120 TRACK VOUT1 VOUT2 VOUT3 VOUT4 VOUT5 VOUT6 Figure 61. Mixed Mode, Configuration B Figure 62. Mixed Mode of Six Outputs Power-up Figure 63. Mixed Mode of Six Outputs Power-down http://onsemi.com 30 NCP3120 Normal Operation (No Tracking, No Sequencing) AVIN C3 C13 R13 VIN R24 R_TRACK R14 C12 GND AVIN COMP1 AGND GND1 SS1 FB1 SW1 SW1 OUT1 SW1 VIN VIN VIN GND R12 C1 GND C2 GND OUT2 L21 D21 GND C22 R22 GND GND R23 C23 GND GND GND GND L11 D11 R11 C11 PG1 Enable Disable Enable Disable EN2 PG2 EN1 PG1 PG2 EN1 SEQ1 EN2 SEQ2 TRACK1 NCP3120 VIN VIN VIN COMP2 AGND GND2 SW2 SW2 TRACK2 FB2 RT SW2 R21 C21 RT VOUT1 VOUT2 GND Figure 64. Normal Operation Configuration http://onsemi.com 31 SS2 NCP3120 EN1/SEQ1 EN2/SEQ2 SS1 0.8V 4V 0.8V SS2 0.8V 90%VFB (min) 4V 0.8V VOUT1 90%VFB (min) VOUT2 hyst + delay PG1 PG2 hyst + delay Figure 65. Typical Application Behavior http://onsemi.com 32 NCP3120 Parallel Operation OLM in Parallel Operation Parallel operation of NCP3120 circuit(s) has several advantages. One of the most important aspects is the capability to deliver a double output current. The major advantage is a reduced output voltage ripple in case of out-of-phase synchronization. The standard configuration is shown in Figure 60. AVIN C3 C13 R13 When OLM is detected (e.g., a jump from 4 A on the output to 6 A), the output voltage decreases. When OLM wears off, the output current must be decreased below 3 A. Then, the output voltage is released and current can be increased again - up to 4 A. VIN C12 R_TRACK AVIN COMP1 AGND GND1 SS1 FB1 SW1 SW1 GND OUT SW1 VIN VIN VIN GND R12 C1 GND C2 GND GND GND L11 D11 R11 C11 PG1 Enable Disable EN PG2 EN1 SEQ1 EN2 SEQ2 TRACK1 NCP3120 VIN VIN VIN COMP2 AGND GND2 SW2 SW2 TRACK2 FB2 RT SW2 L21 D21 GND RT GND R23 C23 GND SS2 C22 GND Figure 66. Parallel Operation Configuration. http://onsemi.com 33 NCP3120 Figure 67. Parallel Operation of Both Outputs http://onsemi.com 34 NCP3120 Loop Compensation A COMP pin of the transconductance error amplifier is used to compensate the regulation control system. Standard COMP pin values are shown in the BOM at the end of the datasheet. (See the COMPCALC program to determine customer preferred values.) To design the compensation components for conditions not described in Table 6 and/or for tuning the compensation Vin [V] 12 12 5 Vout [V] 3.3 5 1.8 Freq [kHz] 200 200 200 Iout [A] 2 2 2 L11 [mH] 22 33 15 for specific requirements, the COMPCALC design tool is available from ON Semiconductor at no charge. Visit http://www.onsemi.com/pub/Collateral/COMPCALC.ZIP to download the self-extracting program for NCP3120 loop compensation design assistance. There is an Excel design tool for component selection. This design tool is available at http://www.onsemi.com/. Table 6. Compensation Values Example for Typical Output Voltages C11 - ceramic [mF] 22 22 22 C13 [nF] 22 18 27 R13 [kW] 4.7 4.7 2.7 C14 [pF] 220 270 270 R14 [W] 100 100 100 C15 [nF] none none none Thermal Considerations The NCP3120 has thermal shutdown protection to safeguard the device from overheating when the die temperature exceeds 160_C. For the best thermal performance, wide copper traces and a generous amount of PCB printed circuit board copper should be used in the board layout. One exception to this is at the SW switching node, which should not have a large area in order to minimize the EMI radiation and other parasitic effects. Large areas of copper provide the best transfer of heat from the IC into the ambient air. PCB Layout Guidelines As in any switching regulator, the layout of the printed circuit board is very important. Rapidly switching currents associated with wiring inductance, stray capacitance and parasitic inductance of the printed circuit board traces can generate voltage transients that can generate electromagnetic interferences (EMI) and affect the desired operation. To minimize inductance and ground loops, the lengths of the leads indicated by heavy lines should be kept as short as possible. For best results, single-point grounding or ground plane construction should be used. On the other hand, the PCB area connected to the SW pin (drain of the internal switch) of the circuit should be kept to a minimum in order to minimize coupling to sensitive circuitry. Another sensitive part of the circuit is the feedback. It is important to keep the sensitive feedback wiring short. To ensure this, physically locate the programming resistors near the regulator. There should be a ground area on the top layer directly under the IC with an exposed area for connecting the IC exposed pad. Any internal ground planes should be connected by vias to this ground area. Additional vias must be used at the ground side of the input and output capacitors. The GND pin also should be tied to the PCB ground in the area under the IC. When laying out the buck regulator on a printed circuit board, the following checklist should be used to ensure proper operation of the circuit: 1. Rapid changes in voltage across parasitic capacitors and abrupt changes in current in parasitic inductors are major concerns for a good layout. 2. Keep high currents out of sensitive ground connections. 3. Avoid ground loops, as they pick up noise. Use star or single-point grounding. 4. For high power buck regulators on double-sided PCBs, a single ground plane (usually the bottom) is recommended. 5. Even though double-sided PCBs are usually sufficient for a good layout, four layer PCBs represent the optimum approach to reducing susceptibility to noise. Use the two internal layers as the power and GND planes, the top layer for power connections and component vias, and the bottom layer for noise sensitive traces. 6. Keep the inductor switching node small by placing the output inductor as close as possible to the chip. 7. Use fewer, but larger, output capacitors; keep the capacitors clustered; and use multiple layer traces with heavy copper to keep the parasitic resistance low. 8. Place the output capacitors as close to the output coil as possible. 9. Place the COMP capacitor as close as possible to the COMP pin. 10. Place the VIN bypass capacitors as close as possible to the IC. 11. Place the RT resistor as close as possible to the RT pin. 12. The exposed pad must be connected to a ground plane with a large copper surface area to dissipate heat. http://onsemi.com 35 NCP3120 Layout Diagram Figure 68. Typical Layout Diagram http://onsemi.com 36 NCP3120 Typical Application Circuit C3 100n C13 22n R13 4.7k VIN C15 NU RVIN 100 R1 75k R26 3.3k R16 5.1k AVIN COMP1 AGND FB1 C12 100n GND GND1 SS1 SW1 SW1 L11 SW1 VIN VIN VIN 22u D11 MBRS240 GND C1 22u C2 100n R14 100 R11 68k C14 220p R12 13k OUT1 2A @ 5V PG1 Enable Disable Enable Disable EN2 PG2 EN1 PG1 PG2 EN1 SEQ1 EN2 SEQ2 TRACK1 C11 22u NCP3120 VIN VIN VIN GND OUT2 2A @ 5V GND GND L21 22u D21 MBRS240 GND GND COMP2 AGND GND2 SW2 SW2 TRACK2 FB2 RT SW2 R24 100 C24 220p R21 47k R22 15k SS2 C22 100n GND C21 22u GND GND R23 4.7k C23 22n GND C25 NU Figure 69. Typical Circuit Diagram http://onsemi.com 37 NCP3120 Components: Table 7. Bill of Materials for the Typical Application Circuit (below) BOM of the NCP3120 - Evaluation Board v2.11 Qty Value Scale Ref. Designator Chip Vendor Part number 1 QFN32, 5x5 mm NCP3120 Resistors ON Semiconductor 3 1 1 1 2 1 1 1 1 100 75 68 13 4.7 47 15 5.1 3.3 W kW kW kW kW kW kW kW kW 1206 1206 1206 1206 1206 1206 1206 1206 1206 RVIN, R14, R24 R1 R11 R12 R13, R23 R21 R22 R16 R26 Capacitors Vishay Vishay Vishay Vishay Vishay Vishay Vishay Vishay Vishay RCA1206100R0FKEA RCA1206100KFKEA RCA120668K0FKEA RCA120613K0FKEA RCA12064K70FKEA RCA120647K0FKEA RCA120615K0FKEA RCA12065K10FKEA RCA12063K30FKEA 3 4 2 2 2 22 100 22 220 NU mF nF nF pF 1210 1206 1206 1206 C1, C11, C12 C2, C3, C12, C22 C13, C23 C14, C24 C15, C25 Inductors Kemet Epcos Epcos Epcos C1210C226K4PAC B37872A5104K060 B37872A5223K060 B37871K5221J060 2 22 mH L11, L21 Diodes Coilcraft DO3340P-223 2 MBRS240LT3 D11, D21 ON Semiconductor ORDERING INFORMATION Device NCP3120MNTXG Package QFN32 (Pb-Free) Shipping 4000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. http://onsemi.com 38 NCP3120 PACKAGE DIMENSIONS QFN32 5*5*1 0.5 P CASE 488AM-01 ISSUE O D A B 2X 2X 0.15 C 0.15 C 0.10 C 32 X 0.08 C L 32 X 9 8 1 32 32 X b 0.10 C A B 25 0.05 C BOTTOM VIEW 32 X ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative EE TOP VIEW SIDE VIEW D2 16 17 PIN ONE LOCATION E NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM TERMINAL 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MILLIMETERS MIN NOM MAX 0.800 0.900 1.000 0.000 0.025 0.050 0.200 REF 0.180 0.250 0.300 5.00 BSC 2.950 3.100 3.250 5.00 BSC 2.950 3.100 3.250 0.500 BSC 0.200 ----0.300 0.400 0.500 (A3) A A1 C EXPOSED PAD SEATING PLANE DIM A A1 A3 b D D2 E E2 e K L K 32 X SOLDERING FOOTPRINT* 5.30 3.20 32 X E2 0.63 24 e 3.20 5.30 0.28 28 X 0.50 PITCH *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 39 NCP3120/D |
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