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NLU3G14 Triple Schmitt-Trigger Inverter
The NLU3G14 MiniGatet is an advanced high-speed CMOS triple Schmitt-trigger inverter in ultra-small footprint. The NLU3G14 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. The NLU3G14 can be used to enhance noise immunity or to square up slowly changing waveforms.
Features http://onsemi.com MARKING DIAGRAMS
8 1 UDFN8 CASE 517AJ UXM G
* * * * * * *
High Speed: tPD = 4.0 ns (Typ) @ VCC = 5.0 V Low Power Dissipation: ICC = 1 mA (Max) at TA = 25C Power Down Protection Provided on inputs Balanced Propagation Delays Overvoltage Tolerant (OVT) Input and Output Pins Ultra-Small Packages These are Pb-Free Devices
1
ULLGA8 1.45 x 1.0 CASE 613AA
AM
1 IN A1 1 8 VCC
ULLGA8 1.6 x 1.0 CASE 613AB
LAM G
OUT Y3
2
7
OUT Y1
1
ULLGA8 1.95 x 1.0 CASE 613AC
LAM G
IN A2
3
6
IN A3
UX, A or LA = Specific Device Code M = Date Code G = Pb-Free Package
GND
4
5
OUT Y2
PIN ASSIGNMENT
1 IN A1 OUT Y3 IN A2 GND OUT Y2 IN A3 OUT Y1 VCC
Figure 1. Pinout (Top View)
1 1 1
2 3
IN A1 IN A2 IN A3
OUT Y2 OUT Y2
4 5 6
OUT Y3
7 8
Figure 2. Logic Symbol FUNCTION TABLE
A L H Y H L
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2008
1
March, 2008 - Rev. 2
Publication Order Number: NLU3G14/D
NLU3G14
MAXIMUM RATINGS
Symbol VCC VIN VOUT IIK IOK IO ICC IGND TSTG TL TJ MSL FR VESD DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Source/Sink Current DC Supply Current Per Supply Pin DC Ground Current per Ground Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature Under Bias Moisture Sensitivity Flammability Rating Oxygen ESD Withstand Voltage Index: 28 to 34 Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) VIN < GND VOUT < GND Parameter Value -0.5 to +7.0 -0.5 to +7.0 -0.5 to +7.0 -20 20 12.5 25 25 -65 to +150 260 150 Level 1 UL 94 V-0 @ 0.125 in > 2000 > 200 N/A 500 V Unit V V V mA mA mA mA mA C C C
ILATCHUP
Latchup Performance Above VCC and Below GND at 125C (Note 5)
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD22-A114-A. 3. Tested to EIA / JESD22-A115-A. 4. Tested to JESD22-C101-A. 5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VIN VOUT TA Dt/DV Positive DC Supply Voltage Digital Input Voltage Output Voltage Operating Free-Air Temperature Input Transition Rise or Fall Rate VCC = 3.3 V 0.3 V VCC = 5.0 V 0.5 V Parameter Min 1.65 0 0 -55 0 0 Max 5.5 5.5 5.5 +125 No Limit No Limit Unit V V V C ns/V
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2
NLU3G14
DC ELECTRICAL CHARACTERISTICS
TA = 25 5C Min 1.85 2.86 3.50 0.9 1.35 1.65 0.30 0.40 0.50 1.9 2.9 4.4 2.58 3.94 0 0 0 0.1 0.1 0.1 0.36 0.36 0.1 Typ 2.0 3.0 3.6 1.5 2.3 2.9 0.57 0.67 0.74 2.0 3.0 4.5 Max 2.2 3.15 3.85 1.65 2.46 3.05 1.20 1.40 1.60 0.9 1.35 1.65 0.30 0.40 0.50 1.9 2.9 4.4 2.48 3.80 0.1 0.1 0.1 0.44 0.44 1.0 1.20 1.40 1.60 TA = +855C Min Max 2.2 3.15 3.85 0.9 1.35 1.65 0.30 0.40 0.50 1.9 2.9 4.4 2.34 3.66 0.1 0.1 0.1 0.52 0.52 1.0 mA V 1.20 1.40 1.60 TA = -555C to +1255C Min Max 2.2 3.15 3.85 Unit V
Symbol VT+
Parameter Positive Threshold Voltage Negative Threshold Voltage Hysteresis Voltage Minimum High-Level Output Voltage
Conditions
VCC (V) 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5
VT-
V
VH
V
VOH
VIN v VT-MIN IOH = -50 mA VIN v VT-MIN IOH = -4 mA IOH = -8 mA VIN w VT+MAX IOL = 50 mA VIN w VT+MAX IOL = 4 mA IOL = 8 mA 0 v VIN v 5.5 V
2.0 3.0 4.5 3.0 4.5 2.0 3.0 4.5 3.0 4.5 0 to 5.5 5.5
V
VOL
Maximum Low-Level Output Voltage
IIN
Input Leakage Current Quiescent Supply Current
ICC
0 v VIN v VCC
1.0
10
40
mA
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
TA = 25 5C Min Typ 7.0 8.5 4.0 5.5 5.0 5.0 7.0 Max 12.8 16.3 8.6 10.6 10 TA = +855C Min 1.0 1.0 1.0 1.0 Max 15 18.5 10 12 10 TA = -555C to +1255C Min 1.0 1.0 1.0 1.0 Max 17 20.5 11.5 13.5 10 pF pF Unit ns
Symbol tPLH, tPHL
Parameter Propagation Delay, Input A to Output Y
VCC (V) 3.0 to 3.6 4.5 to 5.5
Test Condition CL = 15 pF CL = 50 pF CL = 15 pF CL = 50 pF
CIN CPD
Input Capacitance Power Dissipation Capacitance (Note 6)
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD * VCC * fin + ICC. CPD is used to determine the no-load dynamic power consumption: PD = CPD * VCC2 * fin + ICC * VCC.
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3
NLU3G14
VCC 50% GND tPLH Y 50% VCC *Includes all probe and jig capacitance. A 1-MHz square input wave is recommended for propagation delay tests. tPHL CL* INPUT OUTPUT
A or B
Figure 3. Switching Waveforms Figure 4. Test Circuit
VH VIN
VCC VT+ VTGND VOH VIN
VH
VCC VT+ VTGND VOH
VOUT VOL
Vout VOL (b) A Schmitt-Trigger Offers Maximum Noise Immunity
(a) A Schmitt-Trigger Squares Up Inputs With Slow Rise and Fall Times
Figure 5. Typical Schmitt-Trigger Applications
ORDERING INFORMATION
Device NLU3G14MUTAG NLU3G14AMX1TCG NLU3G14BMX1TCG NLU3G14CMX1TCG Package UDFN8 (Pb-Free) ULLGA8, 1.95 x 1.0, 0.5P (Pb-Free) ULLGA8, 1.6 x 1.0, 0.4P (Pb-Free) ULLGA8, 1.45 x 1.0, 0.35P (Pb-Free) Shipping 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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NLU3G14
PACKAGE DIMENSIONS
UDFN8 1.8x1.2, 0.4P CASE 517AJ-01 ISSUE O
D 0.10 C AB L1 E DETAIL A
NOTE 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH MAY NOT EXCEED 0.03 ONTO BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. DIM A A1 A3 b b2 D E e L L1 L2 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 0.30 REF 1.80 BSC 1.20 BSC 0.40 BSC 0.45 0.55 0.00 0.03 0.40 REF
0.10 C
0.05 C 0.05 C
e/2 e (b2)
1 4
(L2)
8 5 8X b
BOTTOM VIEW
EE EE
PIN ONE REFERENCE
TOP VIEW (A3) A A1 C
SEATING PLANE
SIDE VIEW
DETAIL A 8X
L
MOUNTING FOOTPRINT SOLDERMASK DEFINED
8X
0.10 0.05
M M
CAB C
NOTE 3
7X
0.66
0.22
1.50 1 0.32 0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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5
NLU3G14
PACKAGE DIMENSIONS
ULLGA8 1.45x1.0, 0.35P CASE 613AA-01 ISSUE A
D A B
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. DIM A A1 b D E e L L1 SEATING PLANE MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40
PIN ONE REFERENCE
0.10 C
0.10 C 0.05 C
8X
0.05 C
e/2 e
1 4 7X
L1 1.18
EEE EEE EEE
8
E
TOP VIEW
A SIDE VIEW A1 C
MOUNTING FOOTPRINT SOLDERMASK DEFINED*
7X NOTE 4
L
0.48
8X
0.22
5
8X
b 0.10 C A B 0.05 C
NOTE 3
0.53
1
PKG OUTLINE
0.35 PITCH
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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6
NLU3G14
PACKAGE DIMENSIONS
ULLGA8 1.6x1.0, 0.4P CASE 613AB-01 ISSUE A
D A B
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. DIM A A1 b D E e L L1 SEATING PLANE MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.60 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.30 0.40
PIN ONE REFERENCE
0.10 C 0.10 C 0.05 C
8X
0.05 C
e/2 e
1 4 7X
L1 1.24
EEE EEE EEE
8
E
TOP VIEW
A SIDE VIEW A1 C
MOUNTING FOOTPRINT SOLDERMASK DEFINED*
7X
0.49 L
NOTE 4
8X
0.26
5
8X
b 0.10 C A B 0.05 C
NOTE 3
0.53
1
PKG OUTLINE
0.40 PITCH
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
NLU3G14
PACKAGE DIMENSIONS
ULLGA8 1.95x1.0, 0.5P CASE 613AC-01 ISSUE A
D A B
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. DIM A A1 b D E e L L1 MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40
PIN ONE REFERENCE
0.10 C
0.10 C 0.05 C
8X
0.05 C
L1 1.24
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ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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EEEE EEEE EEEE
e/2
1 8
E
TOP VIEW
A SIDE VIEW A1 C
SEATING PLANE
MOUNTING FOOTPRINT SOLDERMASK DEFINED*
7X NOTE 4
e
4
7X
L
0.49
8X
0.30
5
8X
b 0.10 C A B 0.05 C
NOTE 3
0.53
1
PKG OUTLINE
0.50 PITCH
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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8
NLU3G14/D

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