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TR0636E-20170
IT3D(M)-300S-BGA (37) Lead-Free CROSS SECTION TEST REPORT
- Post 6000 cycles Report -
APPRO VED CHECKED CHARG ED
T Y. ARAI T M. MAT SUO T S. KI KUCHI
Nov . 18, 2009 Nov . 18, 2009 Nov . 17, 2009
HIROSE ELECTRIC
[1] Objective
To evaluate SnCu intermetallic at BGA joints by cross sectioning initial state and post 6000 thermal cycle in accordance with IPC-9701.
[2] Specimens
No. 1 2 3 4 5 6 7 8 Virgin Solder Ball on Connector Sn-3.0Ag-0.5Cu IT3M-300S-BGA (37) Lead Free No clean Post 6000 cycle Water Soluble Initial Water Soluble Product Name State Solder paste No clean Assembly Virgin Assembly Reworked Virgin Assembly Reworked Virgin Assembly Reworked Virgin Assembly Reworked Reworked Sn-3.0Ag-0.5Cu
Remarks
*Specimens are assembled as Fig.1. *The test board design is based on IPC-9701 specification. *Thickness of the PCB: 3.3mm
328
294
Spacer Position
[3] Test Period
From July 16, 2008 to January 20, 2009
Cross Sectioning
1. Requirements
SnCu intermetallic is observed at `the solder to connector pin interface' and `the solder to pad interface'.
2.
Conditions
2-1 Test condition
(+10 / 0 C ) 0 ( 0 / -10 C )
0
Number of cycles : 6000 For details, please refer to IPC-9701 and JESD22-A-104-B.
2-2 Cross Sectioning Locations 1st Column of Solder Joints
Pin 1 Side
1st Row of Solder Joints
3.
Results
Typical SnCu intermetallic was observed in all specimens.
Initial
Representative Cross Section
A B
(Cross Section) 3-1: No clean, Virgin Assembly
A
B
3-2: No clean, Reworked
3-3: Water Soluble, Virgin Assembly
3-4: Water Soluble, Reworked
Post 6000 cycles
Representative Cross Section
A
B
(Cross Section) 3-1: No clean, Virgin Assembly
A
B
3-2: No clean, Reworked
3-3: Water Soluble, Virgin Assembly
3-4: Water Soluble, Reworked

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