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APTGF25H120T1G Full - Bridge NPT IGBT Power Module 3 Q1 5 6 Q2 7 1 Q4 9 4 Q3 CR1 CR3 2 VCES = 1200V IC = 25A @ Tc = 80C Application * Welding converters * Switched Mode Power Supplies * Uninterruptible Power Supplies * Motor control Features * Non Punch Through (NPT) Fast IGBT - Low voltage drop - Low tail current - Switching frequency up to 50 kHz - Soft recovery parallel diodes - Low diode VF - Low leakage current - RBSOA and SCSOA rated * Very low stray inductance - Symmetrical design * Internal thermistor for temperature monitoring * High level of integration Benefits * Outstanding performance at high frequency operation * Direct mounting to heatsink (isolated package) * Low junction to case thermal resistance * Solderable terminals both for power and signal for easy PCB mounting * Low profile * Each leg can be easily paralleled to achieve a phase leg of twice the current capability * RoHS Compliant CR2 CR4 8 11 NTC 10 12 Pins 3/4 must be shorted together Absolute maximum ratings Symbol VCES IC ICM VGE PD RBSOA Parameter Collector - Emitter Breakdown Voltage Continuous Collector Current Pulsed Collector Current Gate - Emitter Voltage Maximum Power Dissipation Reverse Bias Safe Operating Area TC = 25C TC = 80C TC = 25C TC = 25C Tj = 125C Max ratings 1200 40 25 100 20 208 50A@1150V Unit V March , 2009 1-6 APTGF25H120T1G - Rev 1 A V W These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com APTGF25H120T1G All ratings @ Tj = 25C unless otherwise specified Electrical Characteristics Symbol Characteristic ICES VCE(sat) VGE(th) IGES Zero Gate Voltage Collector Current Collector Emitter saturation Voltage Gate Threshold Voltage Gate - Emitter Leakage Current Test Conditions VGE = 0V VCE = 1200V Tj = 25C Tj = 125C Tj = 25C VGE =15V IC = 25A Tj = 125C VGE = VCE , IC = 1mA VGE = 20V, VCE = 0V Min Typ Max 250 500 3.7 6 400 Unit A V V nA 2.5 4 3.2 4.0 Dynamic Characteristics Symbol Cies Coes Cres Qg Qge Qgc Td(on) Tr Td(off) Tf Td(on) Tr Td(off) Tf Eon Eoff Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Total gate Charge Gate - Emitter Charge Gate - Collector Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy Test Conditions VGE = 0V VCE = 25V f = 1MHz VGE = 15V VBus = 600V IC =25A Inductive Switching (25C) VGE = 15V VBus = 600V IC = 25A RG = 22 Inductive Switching (125C) VGE = 15V VBus = 600V IC = 25A RG = 22 VGE = 15V Tj = 125C VBus = 600V IC = 25A Tj = 125C RG = 22 Min Typ 1650 250 110 160 10 70 60 50 305 30 60 50 346 40 3.5 mJ 1.5 Max Unit pF nC ns ns Reverse diode ratings and characteristics Symbol Characteristic VRRM IRM IF VF Maximum Peak Repetitive Reverse Voltage Test Conditions Tj = 25C Tj = 125C Tc = 80C IF = 30A IF = 60A IF = 30A Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Min 1200 Typ Max 100 500 Unit V A A Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage VR=1200V V 1.8 300 380 360 1700 ns nC trr Qrr Reverse Recovery Time Reverse Recovery Charge www.microsemi.com 2-6 APTGF25H120T1G - Rev 1 IF = 30A VR = 800V di/dt =200A/s March , 2009 30 2.6 3.2 3.1 APTGF25H120T1G Thermal and package characteristics Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt Junction to Case Thermal Resistance Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight IGBT Diode 2500 -40 -40 -40 2.5 Min Typ Max 0.6 1.2 150 125 100 4.7 80 Unit C/W RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz V C N.m g To heatsink M4 Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information). Symbol Characteristic Resistance @ 25C R25 B 25/85 T25 = 298.15 K RT = R25 1 1 RT: Thermistor value at T exp B25 / 85 T - T 25 T: Thermistor temperature Min Typ 50 3952 Max Unit k K SP1 Package outline (dimensions in mm) See application note 1904 - Mounting Instructions for SP1 Power Modules on www.microsemi.com www.microsemi.com 3-6 APTGF25H120T1G - Rev 1 March , 2009 APTGF25H120T1G Typical Performance Curve 60 Ic, Collector Current (A) 50 40 TJ=25C Output characteristics (VGE=15V) Ic, Collector Current (A) 250s Pulse Test < 0.5% Duty cycle 16 Output Characteristics (VGE=10V) 250s Pulse Test < 0.5% Duty cycle 12 TJ=25C 30 TJ=125C 8 TJ=125C 20 10 0 0 2 3 4 5 6 7 VCE, Collector to Emitter Voltage (V) Transfer Characteristics 1 8 4 0 0 0.5 1 1.5 2 2.5 3 3.5 VCE, Collector to Emitter Voltage (V) Gate Charge IC = 25A TJ = 25C VCE=240V VCE=600V Ic, Collector Current (A) 250s Pulse Test < 0.5% Duty cycle VGE, Gate to Emitter Voltage (V) 80 18 16 14 12 10 8 6 4 2 0 0 60 40 TJ=125C VCE=960V 20 TJ=25C 0 0 2.5 5 7.5 10 12.5 VGE, Gate to Emitter Voltage (V) On state Voltage vs Gate to Emitter Volt. TJ = 125C 250s Pulse Test < 0.5% Duty cycle 15 30 60 90 120 150 180 Gate Charge (nC) On state Voltage vs Junction Temperature Ic=50A Ic=25A VCE, Collector to Emitter Voltage (V) VCE, Collector to Emitter Voltage (V) 9 8 7 6 5 4 3 2 1 0 9 6 5 4 3 Ic=50A Ic=25A Ic=12.5A 2 1 0 25 50 75 100 TJ, Junction Temperature (C) 125 250s Pulse Test < 0.5% Duty cycle VGE = 15V Ic=12.5A 10 11 12 13 14 15 16 VGE, Gate to Emitter Voltage (V) Breakdown Voltage vs Junction Temp. Collector to Emitter Breakdown Voltage (Normalized) 1.10 Ic, DC Collector Current (A) 40 DC Collector Current vs Case Temperature 1.05 30 1.00 20 0.95 10 0.90 25 50 75 100 125 TJ, Junction Temperature (C) 0 25 50 75 100 125 TC, Case Temperature (C) 150 www.microsemi.com 4-6 APTGF25H120T1G - Rev 1 March , 2009 APTGF25H120T1G Turn-On Delay Time vs Collector Current VCE = 600V RG = 22 Turn-Off Delay Time vs Collector Current td(off), Turn-Off Delay Time (ns) td(on), Turn-On Delay Time (ns) 75 70 65 60 55 50 5 15 25 35 45 55 ICE, Collector to Emitter Current (A) Current Rise Time vs Collector Current 160 VCE = 600V RG = 22 400 VGE=15V, TJ=125C 350 VGE = 15V 300 VGE=15V, TJ=25C 250 VCE = 600V RG = 22 200 5 15 25 35 45 55 ICE, Collector to Emitter Current (A) Current Fall Time vs Collector Current 50 45 TJ = 125C tr, Rise Time (ns) tf, Fall Time (ns) 120 40 35 30 25 TJ = 25C 80 VGE=15V 40 VCE = 600V, VGE = 15V, RG = 22 0 5 15 25 35 45 55 ICE, Collector to Emitter Current (A) Turn-On Energy Loss vs Collector Current VCE = 600V RG = 22 20 5 15 25 35 45 ICE, Collector to Emitter Current (A) 55 Turn-Off Energy Loss vs Collector Current Eoff, Turn-off Energy Loss (mJ) 4 VCE = 600V VGE = 15V RG = 22 TJ = 125C Eon, Turn-On Energy Loss (mJ) 10 8 6 4 2 0 5 TJ=125C, VGE=15V 3 TJ=25C, VGE=15V 2 TJ = 25C 1 0 15 25 35 45 ICE, Collector to Emitter Current (A) 55 5 15 25 35 45 ICE, Collector to Emitter Current (A) Reverse Bias Safe Operating Area 55 Switching Energy Losses (mJ) 5 4 3 2 1 0 Switching Energy Losses vs Gate Resistance VCE = 600V VGE = 15V TJ= 125C 60 IC, Collector Current (A) Eon, 25A 50 40 30 20 10 0 Eoff, 25A 0 10 20 30 40 50 60 0 400 800 1200 Gate Resistance (Ohms) VCE, Collector to Emitter Voltage (V) www.microsemi.com 5-6 APTGF25H120T1G - Rev 1 March , 2009 APTGF25H120T1G Fmax, Operating Frequency (kHz) Capacitance vs Collector to Emitter Voltage 10000 Cies Operating Frequency vs Collector Current 120 100 80 ZVS VCE = 600V D = 50% RG = 22 TJ = 125C TC= 75C C, Capacitance (pF) 1000 Coes 60 40 20 0 0 10 20 30 IC, Collector Current (A) 40 Hard switching ZCS 100 Cres 10 0 10 20 30 40 VCE, Collector to Emitter Voltage (V) 50 0.7 Thermal Impedance (C/W) 0.6 0.5 0.4 0.3 0.2 0.1 0.5 0.3 0.1 0.05 0.9 0.7 Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration Single Pulse 0 0.00001 0.0001 0.001 0.01 0.1 1 10 Rectangular Pulse Duration (Seconds) Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved. www.microsemi.com 6-6 APTGF25H120T1G - Rev 1 Microsemi reserves the right to change, without notice, the specifications and information contained herein March , 2009 |
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