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TYPICAL PERFORMANCE CURVES APT30GT60BRDL(G) 600V APT30GT60BRDL(G) *G Denotes RoHS Compliant, Pb Free Terminal Finish. Resonant Mode Combi IGBT(R) The Thunderbolt IGBT(R) used in this Resonant Mode Combi is a new generation of high voltage power IGBTs. Using Non- Punch Through Technology, the Thunderblot IGBT(R) offers superior ruggedness and ultrafast switching speed. Features * Low Conduction Loss * Low Gate Charge * Ultrafast Tail Current shutoff * Low forward Diode Voltage (VF) * Ultrasoft Recovery Diode * SSOA Rated * RoHS Compliant Typical Applications * Induction Heating * Welding * Medical * High Power Telecom * Resonant Mode Phase Shifted Bridge G E G TO -24 7 C E C MAXIMUM RATINGS Symbol VCES VGE I C1 I C2 I CM SSOA PD TJ,TSTG TL Parameter Collector-Emitter Voltage Gate-Emitter Voltage Continuous Collector Current @ TC = 25C Continuous Collector Current @ TC = 110C Pulsed Collector Current 1 All Ratings: TC = 25C unless otherwise specified. APT30GT60BRDL(G) UNIT Volts 600 30 64 30 110 110A @ 600V 250 -55 to 150 300 C Watts Amps Switching Safe Operating Area @ TJ = 150C Total Power Dissipation Operating and Storage Junction Temperature Range Max. Lead Temp. for Soldering: 0.063" from Case for 10 Sec. STATIC ELECTRICAL CHARACTERISTICS Symbol V(BR)CES VGE(TH) VCE(ON) Characteristic / Test Conditions Collector-Emitter Breakdown Voltage (VGE = 0V, I C = 250A) Gate Threshold Voltage (VCE = VGE, I C = 700A, Tj = 25C) MIN TYP MAX Units 600 3 1.6 4 2.0 2.8 50 2 5 2.5 Volts Collector-Emitter On Voltage (VGE = 15V, I C = 30A, Tj = 25C) Collector-Emitter On Voltage (VGE = 15V, I C = 30A, Tj = 125C) I CES I GES Collector Cut-off Current (VCE = 600V, VGE = 0V, Tj = 25C) 2 A nA 11-2008 052-6360 Rev B Collector Cut-off Current (VCE = 600V, VGE = 0V, Tj = 125C) Gate-Emitter Leakage Current (VGE = 20V) 1250 100 CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. Microsemi Website - http://www.microsemi.com DYNAMIC CHARACTERISTICS Symbol Cies Coes Cres VGEP Qg Qge Qgc SSOA td(on) tr td(off) tf Eon1 Eon2 Eoff td(on) tr td(off) tf Eon1 Eon2 Eoff Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate-to-Emitter Plateau Voltage Total Gate Charge 3 APT30GT60BRDL(G) Test Conditions Capacitance VGE = 0V, VCE = 25V f = 1 MHz Gate Charge VGE = 15V VCE = 300V I C = 30A TJ = 150C, R G = 10, VGE = 15V, L = 100H,VCE = 600V Inductive Switching (25C) VCC = 400V VGE = 15V I C = 30A 4 5 MIN TYP MAX UNIT 1600 155 90 7.5 145 10 60 110 12 20 225 80 525 605 600 12 20 245 100 570 965 830 J ns ns A nC V pF Gate-Emitter Charge Gate-Collector ("Miller ") Charge Switching Safe Operating Area Turn-on Delay Time Current Rise Time Turn-off Delay Time Current Fall Time Turn-on Switching Energy RG = 10 TJ = +25C Turn-on Switching Energy (Diode) Turn-off Switching Energy Turn-on Delay Time Current Rise Time Turn-off Delay Time Current Fall Time Turn-on Switching Energy 44 6 J Inductive Switching (125C) VCC = 400V VGE = 15V I C = 30A RG = 10 55 Turn-on Switching Energy (Diode) Turn-off Switching Energy 6 TJ = +125C THERMAL AND MECHANICAL CHARACTERISTICS Symbol RJC RJC WT Characteristic Junction to Case (IGBT) Junction to Case (DIODE) Package Weight MIN TYP MAX UNIT C/W gm .50 1.0 5.9 1 Repetitive Rating: Pulse width limited by maximum junction temperature. 2 For Combi devices, Ices includes both IGBT and FRED leakages 3 See MIL-STD-750 Method 3471. 4 Eon1 is the clamped inductive turn-on energy of the IGBT only, without the effect of a commutating diode reverse recovery current adding to the IGBT turn-on loss. Tested in inductive switching test circuit shown in figure 21, but with a Silicon Carbide diode. 11-2008 Rev B 5 Eon2 is the clamped inductive turn-on energy that includes a commutating diode reverse recovery current in the IGBT turn-on switching loss. (See Figures 21, 22.) 6 Eoff is the clamped inductive turn-off energy measured in accordance with JEDEC standard JESD24-1. (See Figures 21, 23.) Microsemi Reserves the right to change, without notice, the specifications and information contained herein. 052-6360 TYPICAL PERFORMANCE CURVES 100 V GE APT30GT60BRDL(G) 140 15 &13V IC, COLLECTOR CURRENT (A) 120 11V 100 10V 80 60 40 20 0 9V 8V 7V 6V 0 5 10 15 20 VCE, COLLECTER-TO-EMITTER VOLTAGE (V) = 15V 90 IC, COLLECTOR CURRENT (A) 80 70 60 50 40 30 20 10 0 TJ = -55C TJ = 25C TJ = 125C 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 VCE, COLLECTER-TO-EMITTER VOLTAGE (V) 250s PULSE TEST<0.5 % DUTY CYCLE FIGURE 1, Output Characteristics(TJ = 25C) 100 90 IC, COLLECTOR CURRENT (A) 80 70 60 50 40 30 20 10 0 0 TJ = 125C TJ = 25C VGE, GATE-TO-EMITTER VOLTAGE (V) FIGURE 2, Output Characteristics (TJ = 125C) 16 I = 30A C T = 25C J TJ = -55C 14 12 10 8 6 4 2 0 0 VCE = 120V VCE = 300V VCE = 480V 2 4 6 8 10 12 VGE, GATE-TO-EMITTER VOLTAGE (V) FIGURE 3, Transfer Characteristics VCE, COLLECTOR-TO-EMITTER VOLTAGE (V) 20 40 60 80 100 120 140 160 GATE CHARGE (nC) FIGURE 4, Gate Charge 3.5 3.0 2.5 IC = 30A 2.0 1.5 1.0 0.5 0 VGE = 15V. 250s PULSE TEST <0.5 % DUTY CYCLE VCE, COLLECTOR-TO-EMITTER VOLTAGE (V) 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 8 10 12 14 16 VGE, GATE-TO-EMITTER VOLTAGE (V) FIGURE 5, On State Voltage vs Gate-to- Emitter Voltage 1.15 0 6 IC = 15A IC = 30A IC = 60A TJ = 25C. 250s PULSE TEST <0.5 % DUTY CYCLE IC = 60A IC = 15A 25 50 75 100 125 150 TJ, Junction Temperature (C) FIGURE 6, On State Voltage vs Junction Temperature 90 0 1.05 1.00 0.95 0.90 0.85 0.80 0.75 0.70 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (C) FIGURE 7, Threshold Voltage vs. Junction Temperature IC, DC COLLECTOR CURRENT(A) 1.10 VGS(TH), THRESHOLD VOLTAGE (NORMALIZED) 80 70 60 50 40 30 20 10 -25 0 25 50 75 100 125 150 TC, CASE TEMPERATURE (C) FIGURE 8, DC Collector Current vs Case Temperature 0 -50 11-2008 052-6360 Rev B APT30GT60BRDL(G) 16 td(ON), TURN-ON DELAY TIME (ns) 14 12 10 8 6 4 VCE = 400V T = 25C, or 125C L = 100H 300 td (OFF), TURN-OFF DELAY TIME (ns) VGE = 15V 250 VGE =15V,TJ=125C VGE =15V,TJ=25C 200 150 100 2 RJ = 10 G 0 0 50 VCE = 400V RG = 10 L = 100H 10 20 30 40 50 60 70 ICE, COLLECTOR TO EMITTER CURRENT (A) FIGURE 9, Turn-On Delay Time vs Collector Current 60 50 tr, RISE TIME (ns) 40 30 20 10 0 TJ = 25 or 125C,VGE = 15V RG = 10, L = 100H, VCE = 400V 10 20 30 40 50 60 70 ICE, COLLECTOR TO EMITTER CURRENT (A) FIGURE 10, Turn-Off Delay Time vs Collector Current 160 140 TJ = 125C, VGE = 15V RG = 10, L = 100H, VCE = 400V 0 0 120 tf, FALL TIME (ns) 100 80 60 40 TJ = 25C, VGE = 15V 20 0 10 20 30 40 50 60 70 ICE, COLLECTOR TO EMITTER CURRENT (A) FIGURE 11, Current Rise Time vs Collector Current 3000 EON2, TURN ON ENERGY LOSS (J) V = 400V CE V = +15V GE R = 10 G 0 10 20 30 40 50 60 70 ICE, COLLECTOR TO EMITTER CURRENT (A) FIGURE 12, Current Fall Time vs Collector Current 2000 EOFF, TURN OFF ENERGY LOSS (J) V = 400V CE V = +15V GE R = 10 G 0 2500 TJ = 125C 1500 TJ = 125C 2000 1500 1000 1000 500 TJ = 25C 500 TJ = 25C 0 10 20 30 40 50 60 70 ICE, COLLECTOR TO EMITTER CURRENT (A) FIGURE 13, Turn-On Energy Loss vs Collector Current 4500 SWITCHING ENERGY LOSSES (J) 4000 3500 3000 1500 1000 500 0 0 Eoff,60A Eon2,30A V = 400V CE V = +15V GE T = 125C J 0 0 10 20 30 40 50 60 70 ICE, COLLECTOR TO EMITTER CURRENT (A) FIGURE 14, Turn Off Energy Loss vs Collector Current 3000 SWITCHING ENERGY LOSSES (J) V = 400V CE V = +15V GE R = 10 G 0 Eon2,60A Eon2,60A 2500 2000 1500 Eoff,60A Eon2,30A Eoff,30A Eoff,15A Eon2,15A 11-2008 1000 Eoff,30A Eoff,15A Eon2,15A 500 0 Rev B 052-6360 10 20 30 40 50 RG, GATE RESISTANCE (OHMS) FIGURE 15, Switching Energy Losses vs. Gate Resistance 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (C) FIGURE 16, Switching Energy Losses vs Junction Temperature 0 TYPICAL PERFORMANCE CURVES 3,000 Cies 1,000 C, CAPACITANCE ( F) P APT30GT60BRDL(G) 120 IC, COLLECTOR CURRENT (A) 100 80 60 40 20 500 Coes 100 50 Cres 0 10 20 30 40 50 VCE, COLLECTOR-TO-EMITTER VOLTAGE (VOLTS) Figure 17, Capacitance vs Collector-To-Emitter Voltage 10 100 200 300 400 500 600 700 VCE, COLLECTOR TO EMITTER VOLTAGE Figure 18,Minimim Switching Safe Operating Area 0 0 0.60 ZJC, THERMAL IMPEDANCE (C/W) 0.50 D = 0.9 0.40 0.7 0.30 0.5 0.20 0.3 Note: PDM t1 t2 0.10 0 10-5 0.1 0.05 10-4 SINGLE PULSE Duty Factor D = 1/t2 Peak TJ = PDM x ZJC + TC t 10-3 10-2 10-1 RECTANGULAR PULSE DURATION (SECONDS) Figure 19a, Maximum Effective Transient Thermal Impedance, Junction-To-Case vs Pulse Duration 1.0 140 FMAX, OPERATING FREQUENCY (kHz) Junction temp. (C) RC MODEL 50 0.0838 0.00245 10 5 T = 125C J T = 75C C D = 50 % = 400V V CE R = 10 G Power (watts) 0.207 0.00548 F max = min (f max, f max2) 0.05 f max1 = t d(on) + tr + td(off) + tf f max2 = Pdiss = Pdiss - P cond E on2 + E off TJ - T C R JC 0.209 Case temperature. (C) 0.165 FIGURE 19b, TRANSIENT THERMAL IMPEDANCE MODEL 15 25 35 45 55 65 IC, COLLECTOR CURRENT (A) Figure 20, Operating Frequency vs Collector Current 1 5 052-6360 Rev B 11-2008 APT30GT60BRDL(G) Gate Voltage APT30DL60 10% TJ = 125C td(on) Collector Current V CC IC V CE tr 5% 10% 90% 5% Collector Voltage A Switching Energy D.U.T. Figure 21, Inductive Switching Test Circuit Figure 22, Turn-on Switching Waveforms and Definitions 90% td(off) tf 90% TJ = 125C Gate Voltage Collector Voltage 10% 0 Collector Current Switching Energy Figure 23, Turn-off Switching Waveforms and Definitions 052-6360 Rev B 11-2008 TYPICAL PERFORMANCE CURVES APT30GT60BRDL(G) ULTRAFAST SOFT RECOVERY ANTI-PARALLEL DIODE MAXIMUM RATINGS Symbol IF (AV) IF (RMS) IFSM Characteristic / Test Conditions Maximum Average Forward Current (TC = 100C, Duty Cycle = 0.5) RMS Forward Current (Square wave, 50% duty) Non-Repetitive Forward Surge Current (TJ = 45C, 8.3ms) All Ratings: TC = 25C unless otherwise specified. APT30GT60BRDL(G) UNIT 30 51 320 Amps STATIC ELECTRICAL CHARACTERISTICS Symbol Characteristic / Test Conditions IF = 30A VF Forward Voltage IF = 60A IF = 30A, TJ = 125C MIN TYP MAX UNIT 1.25 2.0 1.25 MIN TYP 1.6 Volts DYNAMIC CHARACTERISTICS Symbol trr trr Qrr IRRM trr Qrr IRRM trr Qrr IRRM Characteristic Test Conditions MAX UNIT ns Reverse Recovery Time I = 1A, di /dt = -100A/s, V = 30V, T = 25C F F R J Reverse Recovery Time Reverse Recovery Charge Maximum Reverse Recovery Current Reverse Recovery Time Reverse Recovery Charge Maximum Reverse Recovery Current Reverse Recovery Time Reverse Recovery Charge Maximum Reverse Recovery Current 1.2 ZJC, THERMAL IMPEDANCE (C/W) 1 0.8 0.6 Note: 64 317 962 7 561 2244 9 264 3191 26 - IF = 30A, diF/dt = -200A/s VR = 400V, TC = 25C - nC Amps ns nC Amps ns nC Amps IF = 30A, diF/dt = -200A/s VR = 400V, TC = 125C - IF = 30A, diF/dt = -1000A/s VR = 400V, TC = 125C - PDM 0.4 0.2 0 t1 t2 Duty Factor D = 1/t2 Peak TJ = PDM x ZJC + TC t 1.0 10-3 10-2 10-1 RECTANGULAR PULSE DURATION (seconds) FIGURE 1a. MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs. PULSE DURATION 11-2008 052-6360 Rev B TJ (C) TC (C) 10-5 10-4 Dissipated Power (Watts) .0005 .0016 0.263 ZEXT are the external thermal impedances: Case to sink, sink to ambient, etc. Set to zero when modeling only the case to junction. FIGURE 1b, TRANSIENT THERMAL IMPEDANCE MODEL ZEXT .112 .437 .450 TYPICAL PERFORMANCE CURVES 100 90 80 IF, FORWARD CURRENT (A) 70 60 50 40 30 20 10 0 0 800 TJ= 125C trr, COLLECTOR CURRENT (A) TJ= 150C TJ= 55C 700 600 500 400 300 200 100 0 15A 60A 30A APT30GT60BRDL(G) T = 125C J V = 400V R TJ= 25C Qrr, REVERSE RECOVERY CHARGE (nC) IRRM, REVERSE RECOVERY CURRENT (A) 0.5 1.0 1.5 2.0 2.5 3.0 VF, ANODE-TO-CATHODE VOLTAGE (V) FIGURE 2, Forward Current vs. Forward Voltage 4500 T = 125C 60A J V = 400V R 4000 3500 3000 2500 2000 1500 1000 500 15A 30A 0 200 400 600 800 1000 -diF/dt, CURRENT RATE OF CHANGE (A/s) FIGURE 3, Reverse Recovery Time vs. Current Rate of Change 32 28 24 20 16 12 8 4 0 T = 125C J V = 400V R 60A 30A 15A 0 200 400 600 800 1000 -diF/dt, CURRENT RATE OF CHANGE (A/s) FIGURE 4, Reverse Recovery Charge vs. Current Rate of Change 1.2 1 0.8 0.6 0.4 0.2 0 IRRM 0 0 200 400 600 800 1000 -diF/dt, CURRENT RATE OF CHANGE (A/s) FIGURE 5, Reverse Recovery Current vs. Current Rate of Change 60 50 40 IF(AV) (A) 30 20 10 Duty cycle = 0.5 TJ = 126C Kf, DYNAMIC PARAMETERS (Normalized to 1000A/s) tRR QRR 0 25 50 75 100 125 150 0 25 50 75 100 125 150 175 TJ, JUNCTION TEMPERATURE (C) FIGURE 6, Dynamic Parameters vs Junction Temperature 300 CJ, JUNCTION CAPACITANCE (pF) 250 200 150 100 50 0 Case Temperature (C) FIGURE 7, Maximum Average Forward Current vs. Case Temperature 052-6360 Rev B 11-2008 10 100 400 VR, REVERSE VOLTAGE (V) FIGURE 8, Junction Capacitance vs. Reverse Voltage 1 TYPICAL PERFORMANCE CURVES +18V 0V diF /dt Adjust Vr APT30GT60BRDL(G) D.U.T. trr/Qrr Waveform CURRENT TRANSFORMER Figure 9. Diode Test Circuit 1 2 3 4 IF - Forward Conduction Current diF /dt - Rate of Diode Current Change Through Zero Crossing. IRRM - Maximum Reverse Recovery Current. Zero 1 4 6 5 3 2 0.25 IRRM Slope = diM/dt trr - Reverse Recovery Time, measured from zero crossing where diode current goes from positive to negative, to the point at which the straight line through IRRM and 0.25 IRRM passes through zero. Qrr - Area Under the Curve Defined by IRRM and trr. diM/dt - Maximum Rate of Current Increase During the Trailing Portion of trr. 5 6 Figure 10, Diode Reverse Recovery Waveform and Definitions TO-247 (B) Package Outline 4.69 (.185) 5.31 (.209) 1.49 (.059) 2.49 (.098) 6.15 (.242) BSC 15.49 (.610) 16.26 (.640) 5.38 (.212) 6.20 (.244) Collector (Cathode) 20.80 (.819) 21.46 (.845) 3.50 (.138) 3.81 (.150) 4.50 (.177) Max. 0.40 (.016) 0.79 (.031) 2.87 (.113) 3.12 (.123) 1.65 (.065) 2.13 (.084) 19.81 (.780) 20.32 (.800) 1.01 (.040) 1.40 (.055) Gate Collector (Cathode) Emitter (Anode) 5.45 (.215) BSC 2-Plcs. Dimensions in Millimeters and (Inches) Microsemi's products are covered by one or more of U.S. patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743, 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262 and foreign patents. US and Foreign patents pending. All Rights Reserved. 052-6360 Rev B 11-2008 2.21 (.087) 2.59 (.102) |
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