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| CYStech Electronics Corp. N-Channel Enhancement Mode Power MOSFET Spec. No. : C434J3 Issued Date : 2008.12.24 Revised Date :2009.02.04 Page No. : 1/7 MTN2572J3 Features * Low Gate Charge * Simple Drive Requirement * Repetitive Avalanche Rated * Fast Switching Characteristic * RoHS compliant package BVDSS ID RDS(ON) 150V 36A 50m Symbol MTN2572J3 Outline TO-252 GGate DDrain SSource GDS Absolute Maximum Ratings (TC=25C, unless otherwise noted) Parameter Symbol Limits Unit Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @VGS=10V, TC=25C Continuous Drain Current @VGS=10V, TC=100C Pulsed Drain Current (Note 1) Avalanche Current Avalanche Energy @ L=0.1mH, ID=18A, RG=25 Repetitive Avalanche Energy@ L=0.05mH (Note 2) Total Power Dissipation (TC=25) Linear Derating Factor Operating Junction and Storage Temperature Note : 1. Pulse width limited by maximum junction temperature 2. Duty cycle 1% MTN2572J3 VDS VGS ID ID IDM IAS EAS EAR Pd Tj, Tstg 150 30 36 22 120 18 16.2 8.1 50 0.32 -55~+175 V A mJ W W/C C CYStek Product Specification CYStech Electronics Corp. Thermal Data Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max Symbol Rth,j-c Rth,j-a Spec. No. : C434J3 Issued Date : 2008.12.24 Revised Date :2009.02.04 Page No. : 2/7 Value 3 75 Unit C/W C/W Characteristics (TC=25C, unless otherwise specified) Symbol Static BVDSS BVDSS/Tj VGS(th) GFS IGSS IDSS *RDS(ON) *ID(ON) Dynamic *Qg *Qgs *Qgd *td(ON) *tr *td(OFF) *tf Ciss Coss Crss Rg Min. 150 1.5 48 Typ. 0.05 2.5 40 40 43 15 25 25 200 100 120 10460 157 113 2 120 380 Max. 4.0 100 1 25 50 48 140 1.3 Unit V V/C V S nA A A m A nC Test Conditions VGS=0V, ID=250A Reference to 25C, ID=1mA VDS = VGS, ID=250A VDS =5V, ID=20A VGS=30 VDS =120V, VGS =0V VDS =100V, VGS =0V, Tj=125C VGS =10V, ID=20A VDS =10V, VGS =10V ID=20A, VDS=80V, VGS=10V VDS=75V, ID=1A, VGS=10V, RG=6 ns pF A V ns nC VGS=0V, VDS=25V, f=1MHz VGS=15mV, VDS=0V, f=1MHz Source-Drain Diode *IS *ISM *VSD *trr *Qrr - IF=IS, VGS=0V IF=25A, VGS=0, dIF/dt=100A/s *Pulse Test : Pulse Width 300s, Duty Cycle2% Ordering Information Device MTN2572J3 Package TO-252 (RoHS compliant) Shipping 2500 pcs / Tape & Reel Marking 2572 MTN2572J3 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Spec. No. : C434J3 Issued Date : 2008.12.24 Revised Date :2009.02.04 Page No. : 3/7 MTN2572J3 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves(Cont.) Spec. No. : C434J3 Issued Date : 2008.12.24 Revised Date :2009.02.04 Page No. : 4/7 MTN2572J3 CYStek Product Specification CYStech Electronics Corp. Reel Dimension Spec. No. : C434J3 Issued Date : 2008.12.24 Revised Date :2009.02.04 Page No. : 5/7 Carrier Tape Dimension MTN2572J3 CYStek Product Specification CYStech Electronics Corp. Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 C Spec. No. : C434J3 Issued Date : 2008.12.24 Revised Date :2009.02.04 Page No. : 6/7 Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Average ramp-up rate 3C/second max. (Tsmax to Tp) Preheat 100C -Temperature Min(TS min) -Temperature Max(TS max) 150C -Time(ts min to ts max) 60-120 seconds Time maintained above: -Temperature (TL) 183C - Time (tL) 60-150 seconds Peak Temperature(TP) 240 +0/-5 C Time within 5C of actual peak 10-30 seconds temperature(tp) Ramp down rate 6C/second max. 6 minutes max. Time 25 C to peak temperature MTN2572J3 Pb-free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds 260 +0/-5 C 20-40 seconds 6C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. CYStek Product Specification CYStech Electronics Corp. TO-252 Dimension A C Spec. No. : C434J3 Issued Date : 2008.12.24 Revised Date :2009.02.04 Page No. : 7/7 Marking: B L F G D Device Name Date code 2572 3 H E K 2 I 1 J Style: Pin 1.Gate 2.Drain 3.Source 3-Lead TO-252 Plastic Surface Mount Package CYStek Package Code: J3 *: Typical DIM A B C D E F Inches Min. Max. 0.0177 0.0217 0.0650 0.0768 0.0354 0.0591 0.0177 0.0236 0.2441 0.2677 0.2125 0.2283 Millimeters Min. Max. 0.45 0.55 1.65 1.95 0.90 1.50 0.45 0.60 6.20 6.80 5.40 5.80 DIM G H I J K L Inches Min. Max. 0.0866 0.1102 *0.0906 0.0449 0.0346 0.2047 0.2165 0.0551 0.0630 Millimeters Min. Max. 2.20 2.80 *2.30 1.14 0.88 5.20 5.50 1.40 1.60 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: * Lead : KFC; pure tin plated * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTN2572J3 CYStek Product Specification |
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