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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
LED ARRAY
Pb
Lead-Free Parts
LA208B/SRG-1-PF
DATA SHEET
DOC. NO : REV. DATE : :
QW0905-L A208B/SRG-1-PF A 25 - Apr. - 2005
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA208B/SRG-1-PF Page 1/6
Package Dimensions
7.5 2.5O 0.5 14.0
10.3 6.55
3.0
3.5O 0.5
1.85
2.54TYP
2.54TYP
11.25O 0.5
1
2 G
3 SR 1.CATHODE GREEN 2.COMMON ANODE 3.CATHODE RED
123
LSRG3392/R6-PF
5.0 5.9
7.6
8.6 10.5O 0.5
G
SR
1.5MAX 0.5 TYP
1
2
3
18.0MIN
2.0MIN 2.0MIN 2.54TYP 2.54TYP
1.CATHODE GREEN 2.COMMON ANODE 3.CATHODE RED
1
2
3
Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA208B/SRG-1-PF Page 2/6
Absolute Maximum Ratings at Ta=25 J
Ratings Parameter Symbol SR Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir Topr Tstg Tsol 30 100 100 10 -40 ~ +85 -40 ~ +100 Max 260J for 5 sec Max (2mm from body) G 15 80 50 mA mA mW UNIT
g A J J
Typical Electrical & Optical Characteristics (Ta=25 J )
PART NO
MATERIAL Emitted GaAlAs Red
COLOR
Forward Peak Spectral voltage wave halfwidth @ 20mA(V) length f nm f Pnm
Luminous intensity
@10mA(mcd)
Viewing angle 2c 1/2 (deg)
Lens Red Diffused 660 565 20 20
Min. Max. Min. 1.5 1.7 2.4 2.1 20 12
Typ. 45 30 70 70
LA208B/SRG-1-PF
GaP
Green Green Diffused
Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA208B/SRG-1-PF Page 3/6
Typical Electro-Optical Characteristics Current
SR CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
3.0
1000
Forward Current(mA)
100
Relative Intensity Normalize @20mA
1.0 2.0 3.0 4.0 5.0
2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
10 1.0
0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1 1.0
0.9 0.8 -40 -20 0 20 40 60 80 100
Relative Intensity@20mA Normalize @25J
Forward Voltage@20mA Normalize @25J
1.2
Ambient Temperature(J )
Ambient Temperature(J )
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 600 650 700 750
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA208B/SRG-1-PF Page 4/6
Typical Electro-Optical Characteristics Curve
G CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
3.5
1000
Forward Current(mA)
100
Relative Intensity Normalize @20mA
1.0 2.0 3.0 4.0 5.0
3.0 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
10 1.0
0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
Forward Voltage@20mA Normalize @25J
1.1 1.0
0.9 0.8 -40 -20 0 20 40 60 80 100
Relative Intensity@20mA Normalize @25J
1.2
Ambient Temperature(J )
Ambient Temperature(J )
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
Relative Intensity@20mA
1.0
0.5
0.0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA208B/SRG-1-PF Recommended Soldering Conditions 1. Wave Solder Soldering Soldering Iron:30W Max Temperature 300C Max Soldering Time:3 Seconds Max Distance:2mm Min(From solder joint to case) Page5/6
Temp(C) 245C 5sec Max 245
120
Preheat
2/sec max
2/sec max
2/sec max Time(sec)
120 Seconds Max
Dip Soldering Preheat: 120 C Max Preheat time: 120 seconds Max Ramp-up:2C/sec(max) Ramp-Down:2C/sec(max) Solder Bath:245C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case)
2. PB-Free Wave Solder
Temp(C) 265C 5sec Max 265
Soldering Soldering Iron:30W Max Temperature:350 CMax Soldering Time:3seconds Max Distance:2mm Min(From solder joint to case)
120
Preheat
2/sec max
2/sec max
2/sec max Time(sec) 120 Seconds Max
Dip Soldering Preheat: 120 C Max Preheat time: 120seconds Max Ramp-up:2C/sec(max) Ramp-Down:2C/sec(max) Solder Bath:265C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA208B/SRG-1 LA208B/SRG-1-PF Page 6/6
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65JO 5J 2.RH=90 %~95 % 3.t=240hrs O 2hrs
The purpose of this test is the resistance of the device under tropical for hous.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 JO 5J &-40JO (10min) (10min) 2.total 10 cycles
5J
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 JO 5J 2.Dwell time= 10 O 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 JO 5J 2.Dwell time=5 O 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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