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 May 2007 rev 0.3
PCS3P622S04J
Low Frequency Timing-SafeTM Peak EMI reduction IC
General Features
* * * * Low Frequency Clock Distribution with TimingSafeTM and Peak EMI Reduction Input frequency range: 4MHz - 20MHz Zero input - output propagation delay Low-skew outputs * * * * * * * Output-output skew less than 250pS Device-device skew less than 700pS
with Peak EMI Reduction. PCS3P622S04J accepts one reference input and drives out four low-skew clocks. PCS3P622S04J has an on-chip PLL that locks to an input clock on the XIN/CLKIN pin. The PLL feedback is on-chip and is obtained from the CLKOUT pad, internal to the device. PCS3P622S04J has a crystal oscillator interface. An inexpensive crystal will provide the clock source for distribution. It is available in 8 pin TSSOP. All outputs have less than 200pS of Cycle-to-cycle jitter. The input and output propagation delay is guaranteed to be less than 350pS, and the output-to-output skew is guaranteed to be less than 250pS. Refer "Spread Spectrum Control and Input-Output Skew Table" for values of deviation and Input-Output Skew
Less than 200pS Cycle-to-cycle jitter 3.3V Operation Commercial temperature range Available in 8pin TSSOP(4.4MM-Body) First True Drop-in solution
Product Description
PCS3P622S04J is a versatile, 3.3V Zero-delay buffer designed to distribute low frequency Timing-SafeTM clocks
Block Diagram
VDD
CLKIN / XIN XOUT
CLK1
Crystal Oscillator
PLL
CLK2 CLK3 CLKOUT
GND
PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200, Campbell, CA 95008 * Tel: 408-879-9077 * Fax: 408-879-9018 www.pulsecoresemi.com
Notice: The information in this document is subject to change without notice.
May 2007 rev 0.3
Spread Spectrum Frequency Generation
The clocks in digital systems are typically square waves with a 50% duty cycle and as frequencies increase the edge rates also get faster. Analysis shows that a square wave is composed of fundamental frequency and harmonics. The fundamental frequency and harmonics generate the energy peaks that become the source of EMI. Regulatory agencies test electronic equipment by measuring the amount of peak energy radiated from the equipment. In fact, the peak level allowed decreases as the frequency increases. The standard methods of reducing EMI are to use shielding, filtering, multi-layer
PCS3P622S04J
PCBs etc. These methods are expensive. Spread spectrum clocking reduces the peak energy by reducing the Q factor of the clock. This is done by slowly modulating the clock frequency. PCS3P622S04J uses the center modulation spread spectrum technique in which the modulated output frequency varies above and below the reference frequency with a specified modulation rate. With center modulation, the average frequency is the same as the unmodulated frequency and there is no performance degradation
Timing-SafeTM technology
Timing-SafeTM technology is the ability to modulate a clock source with Spread Spectrum technology and maintain synchronization with any associated data path.
Pin Configuration
CLKIN / XIN XOUT
1 2
8 7 6 5
CLKOUT VDD CLK3 CLK2
PCS3P622S04J CLK1 3 GND 4
Low Frequency Timing-SageTM Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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May 2007 rev 0.3
Pin Description Pin #
1 2 3 4 5 6 7 8
PCS3P622S04J
Pin Name
XIN/CLKIN XOUT CLK1 GND CLK2 CLK3 VDD CLKOUT
Description
Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. Crystal connection. If using an external reference, this pin must be left unconnected. Buffered clock output Ground Buffered clock output Buffered clock output 3.3V supply Buffered clock output, internal feedback on this pin
Notes: 1. Weak pull-down on all outputs 2. Weak pull-up on the Inputs 3. Buffered clock outputs are Timing-SafeTM
Spread Spectrum Control and Input-Output Skew Table Device
PCS3P622S04J
Note: TSKEW is measured in units of the Clock Period
Input Frequency
16MHz
Deviation
0.35%
Input-Output Skew(TSKEW)
0.375
Absolute Maximum Ratings Symbol
VDD, VIN TSTG Ts TJ TDV Storage temperature Max. Soldering Temperature (10 sec) Junction Temperature Static Discharge Voltage (As per JEDEC STD22- A114-B)
Parameter
Voltage on any pin with respect to Ground
Rating
-0.5 to +4.6 -65 to +125 260 150 2
Unit
V C C C KV
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability.
Operating Conditions for PCS3P622S04J Parameter
VDD TA CL CIN Supply Voltage Operating Temperature (Ambient Temperature) Load Capacitance Input Capacitance
Description
Min
3.0 0
Max
3.6 +70 30 7
Unit
V C pF pF
Low Frequency Timing-SafeTM Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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May 2007 rev 0.3
Electrical Characteristics Parameter
VIL VIH IIL IIH VOL VOH IDD Zo
PCS3P622S04J
Description
Input LOW Voltage Input LOW Current Input HIGH Current Output LOW Voltage Supply Current Output Impedance
2 2 1 1
Test Conditions
Min
2.0
Typ
Max
0.8
Unit
V V A A V V mA
Input HIGH Voltage
VIN = 0V VIN = VDD IOL = 8mA IOH = -8mA Unloaded outputs 2.4 14 23
50 100 0.4
Output HIGH Voltage
Note: 1. REF input has a threshold voltage of VDD/2 2. Parameter is guaranteed by design and characterization. Not 100% tested in production
Switching Characteristics Parameter
1/t1 t3 t4 t5 t6 t7 tJ tLOCK
Description
Output Frequency Duty Cycle = (t2 / t1) * 100 Output Rise Time Output Fall Time
1,2 1,2 2 2
Test Conditions
30pF load Measured at VDD/2 Measured between 0.8V and 2.0V Measured between 2.0V and 0.8V All outputs equally loaded Measured at VDD /2 Measured at VDD/2 on the CLKOUT pins of the device Loaded outputs Stable power supply, valid clock presented on REF pin
Min
4 40
Typ
50
Max
20 60 2.5 2.5 250 350 700 200 1.0
Unit
MHz % nS nS pS pS pS pS mS
Output-to-output skew CLKOUT Rising Edge
Delay, REF Rising Edge to
2
Device-to-Device Skew 2 Cycle-to-cycle jitter PLL Lock Time 2
2
Note: 1. All parameters specified with loaded outputs. 2. Parameter is guaranteed by design and characterization. Not 100% tested in production
Low Frequency Timing-SafeTM Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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May 2007 rev 0.3
Switching Waveforms Duty Cycle Timing
t1 t2 1.4 V 1.4 V 1.4 V
PCS3P622S04J
All Outputs Rise/Fall Time
2.0 V 0.8 V t3 t4 2.0 V 0.8 V 3.3 V 0V
OUTPUT
Output - Output Skew
1.4 V OUTPUT1 1.4 V OUTPUT2 t
5
Input - Output Propagation Delay
VDD /2 INPUT VDD /2 OUTPUT t6
Device - Device Skew
VDD /2 CLKOUT, Device 1 CLKOUT, Device 2 t
7
VDD /2
Low Frequency Timing-SafeTM Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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May 2007 rev 0.3
Input-Output Skew
Timing-SafeTM Output +3.3V
PCS3P622S04J
Test Circuit
Input
CLKOUT OUTPUT VDD 0.1uF CLOAD
TSKEW -
TSKEW+
One clock cycle N=1
when spread spectrum is ON For example, TSKEW = 0.375 for an Input clock16MHz, translates in to (1/16MHz) * 0.375=23.43nS
GND
TSKEW represents input-output skew
A Typical example of Timing-SafeTM waveform
Input Input
CLKOUT with SSOFF
Timing-SafeTM CLKOUT
Low Frequency Timing-SafeTM Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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May 2007 rev 0.3
Typical Crystal Oscillator Circuit
PCS3P622S04J
Crystal
R1 = 510
C1 = 27 pF
C2 = 27 pF
Typical Crystal Specifications Fundamental AT cut parallel resonant crystal
Nominal frequency Frequency tolerance Operating temperature range Storage temperature Load capacitance Shunt capacitance ESR 16 MHz 50 ppm or better at 25C -25C to +85C -40C to +85C 18pF 7pF maximum 25
Low Frequency Timing-SafeTM Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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May 2007 rev 0.3
Package Information
PCS3P622S04J
8-lead Thin Shrunk Small Outline Package (4.40-MM Body)
H
E D A2 A e B A1 L C
Dimensions Symbol Min
A A1 A2 B c D E e H L 0.020 0 0.002 0.033 0.008 0.004 0.114 0.169 0.026 BSC 0.252 BSC 0.028 8 0.50 0
Inches Max
0.043 0.006 0.037 0.012 0.008 0.122 0.177 0.05 0.85 0.19 0.09 2.90 4.30
Millimeters Min Max
1.10 0.15 0.95 0.30 0.20 3.10 4.50 0.65 BSC 6.40 BSC 0.70 8
Low Frequency Timing-SafeTM Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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May 2007 rev 0.3
Ordering Codes Ordering Code
PCS3P622S04JG-08-TT PCS3P622S04JG-08-TR
PCS3P622S04J
Marking
3P622S04JG 3P622S04JG
Package Type
8-pin 4.4-mm TSSOP - TUBE, Green 8-pin 4.4-mm TSSOP - TAPE & REEL, Green
Temperature
Commercial Commercial
Device Ordering Information
PCS3P622S04JG-08-TR
R = Tape & reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN DEVICE PIN COUNT U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70
G = GREEN PACKAGE, LEAD FREE, and RoHS
PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved
PulseCore Semiconductor Mixed Signal Product
Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.
Low Frequency Timing-SafeTM Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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May 2007 rev 0.3
PCS3P622S04J
PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com
Copyright (c) PulseCore Semiconductor All Rights Reserved Part Number: PCS3P622S04J Document Version: 0.3
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 Timing-SafeTM US patent pending
(c) Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore's best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore's Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore's Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use.
Low Frequency Timing-SafeTM Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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