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SA58637
2 x 2.2 W BTL audio amplifier
Rev. 01 -- 25 February 2008 Product data sheet
1. General description
The SA58637 is a two-channel audio amplifier in an HVQFN20 package. It provides power output of 2.2 W per channel with an 8 load at 9 V supply. The internal circuit is comprised of two Bridge-Tied Load (BTL) amplifiers with a complementary PNP-NPN output stage and standby/mute logic. The SA58637 is housed in a 20-pin HVQFN package, which has an exposed die attach paddle enabling reduced thermal resistance and increased power dissipation.
2. Features
I I I I I I I I I Low junction-to-ambient thermal resistance using exposed die attach paddle Gain can be fixed with external resistors from 6 dB to 30 dB Standby mode controlled by CMOS-compatible levels Low standby current < 10 A No switch-on/switch-off plops High power supply ripple rejection: 50 dB minimum ElectroStatic Discharge (ESD) protection Output short circuit to ground protection Thermal shutdown protection
3. Applications
I Professional and amateur mobile radio I Portable consumer products: toys and games I Personal computer remote speakers
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
4. Quick reference data
Table 1. Quick reference data VCC = 6 V; Tamb = 25 C; RL = 8 ; VMODE = 0 V; measured in test circuit Figure 3; unless otherwise specified. Symbol VCC Iq Istb Po Parameter supply voltage quiescent current standby current output power Conditions operating RL = VMODE = VCC THD+N = 10 % THD+N = 0.5 % THD+N = 10 %; VCC = 9 V; application demo board THD+N PSRR total harmonic distortion-plus-noise power supply rejection ratio Po = 0.5 W 1 kHz 100 Hz to 20 kHz
[2] [3] [1]
Min 2.2 1.2 0.9 -
Typ 9 15 1.5 1.1 2.2
Max 18 22 10 -
Unit V mA A W W W
50 40
0.15 -
0.3 -
% dB dB
[1] [2]
With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the DC output offset voltage divided by RL. Power supply rejection ratio is measured at the output with a source impedance of RS = 0 at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail. Power supply rejection ratio is measured at the output, with a source impedance of RS = 0 at the input. The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail.
[3]
5. Ordering information
Table 2. Ordering information Name SA58637BS HVQFN20 Description plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 6 x 5 x 0.85 mm Version SOT910-1 Type number Package
SA58637_1
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Product data sheet
Rev. 01 -- 25 February 2008
2 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
6. Block diagram
VCCL VCCR
SA58637
INL- INL+ 15 14
R
17
10 16
OUTL-
VCCL
R
20 k
1
OUTL+
20 k
STANDBY/MUTE LOGIC
INR- INR+
12 13
R
11
OUTR-
VCCR
R
20 k
6
OUTR+
SVR
3
20 k
MODE SELECT
2 4
STANDBY/MUTE LOGIC
5 n.c.
8
9
19
18
20
7
GND GND GND GND LGND RGND
002aad577
Fig 1.
Block diagram of SA58637
SA58637_1
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Product data sheet
Rev. 01 -- 25 February 2008
3 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
7. Pinning information
7.1 Pinning
20 LGND 17 VCCL 16 OUTL- 15 INL- 14 INL+ 13 INR+ 12 INR- 11 OUTR- VCCR 10 7 8 GND 9 GND
002aad578
19 GND
terminal 1 index area OUTL+ MODE SVR SELECT n.c. OUTR+ 1 2 3 4 5 6
SA58637BS
Transparent top view
Fig 2.
Pin configuration for HVQFN20
7.2 Pin description
Table 3. Symbol OUTL+ MODE SVR SELECT n.c. OUTR+ RGND GND VCCR OUTR- INR- INR+ INL+ INL- OUTL- VCCL LGND
[1]
Pin description Pin 1 2 3 4 5 6 7 8, 9, 18, 19 10 11 12 13 14 15 16 17 20 Description positive loudspeaker terminal, left channel operating mode select (standby, mute, operating) half supply voltage, decoupling ripple rejection BTL loudspeaker channel select (left, right, both channels) not connected positive loudspeaker terminal, right channel ground, right channel ground[1] supply voltage; right channel negative loudspeaker terminal, right channel negative input, right channel positive input, right channel positive input, left channel negative input, left channel negative output terminal, left channel supply voltage, left channel ground, left channel
Pins 8, 9, 18 and 19 are connected to the lead frame and also to the substrate. They may be kept floating. When connected to the ground plane, the PCB can be used as heatsink.
SA58637_1
RGND
18 GND
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Product data sheet
Rev. 01 -- 25 February 2008
4 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
8. Functional description
The SA58637 is a two-channel BTL audio amplifier capable of delivering 2 x 1.5 W output power to an 8 load at THD+N = 10 % using a 6 V power supply. It is also capable of delivering 2 x 2.2 W output power to an 8 load at THD+N = 10 % using a 9 V power supply. Using the MODE pin, the device can be switched to standby and mute condition. The device is protected by an internal thermal shutdown protection mechanism. The gain can be set within a range of 6 dB to 30 dB by external feedback resistors.
8.1 Power amplifier
The power amplifier is a Bridge-Tied Load (BTL) amplifier with a complementary PNP-NPN output stage. The voltage loss on the positive supply line is the saturation voltage of a PNP power transistor and on the negative side the saturation voltage of an NPN power transistor. The total voltage loss is < 1 V.
8.2 Mode select pin (MODE)
The device is in Standby mode (with a very low current consumption) if the voltage at the MODE pin is greater than VCC - 0.5 V, or if this pin is floating. At a MODE voltage in the range between 1.5 V and VCC - 1.5 V the amplifier is in a mute condition. The mute condition is useful to suppress plop noise at the output, caused by charging of the input capacitor. The device is in Active mode if the MODE pin is grounded or less than 0.5 V (see Figure 6).
8.3 SELECT output configuration
The outputs differentially drives the speakers, so there is no need for coupling capacitors (see Figure 3). If the voltage at the SELECT pin is in the range between 1.5 V and VCC - 1.5 V, or if it is kept floating, then both channels are operational. If the SELECT pin is set to a logic LOW or grounded, then only the right channel is operational and the left channel is in Standby mode. If the SELECT pin is set to logic HIGH or connected to VCC, then only the left channel is operational and right channel is in Standby mode. Setting the SELECT pin to logic LOW or a logic HIGH voltage results in a reduction of quiescent current consumption by a factor of approximately 2. Switching the SELECT pin during operation is not plop-free, because the input capacitor of the channel which is coming out of standby needs to be charged first. For plop-free channel selecting the device has first to be set in mute condition with the MODE pin (between 1.5 V and VCC - 1.5 V). The SELECT pin is then set to the new level and after a delay the MODE pin is set to a LOW level. The delay needed depends on the values of the input capacitors and the feedback resistors. Time needed is approximately 10 x C1 x (R1 + R2), so approximately 0.6 seconds for the values shown in Figure 3.
Table 4. Control pins MODE and SELECT versus status of output channels Voltage levels at control pins at VCC = 5 V; for other voltage levels see Figure 6 and Figure 7. Control pin MODE HIGH[1]/n.c.[2] HVCC[4] LOW[5] SELECT X[3] HVCC[4]/n.c.[2] HVCC[4]/n.c.[2] Status of output channel Left channel standby mute on Right channel standby mute on 0 15 15 Typical Iq (mA)
SA58637_1
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Product data sheet
Rev. 01 -- 25 February 2008
5 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
Table 4. Control pins MODE and SELECT versus status of output channels ...continued Voltage levels at control pins at VCC = 5 V; for other voltage levels see Figure 6 and Figure 7. Control pin MODE HVCC[4]/LOW[5] HVCC[4]/LOW[5] HVCC[4]/LOW[5]
[1] [2] [3] [4] [5]
Status of output channel SELECT HIGH[1] HVCC[4]/n.c.[2] LOW[5] Left channel mute/on mute/on standby Right channel standby mute/on mute/on
Typical Iq (mA) 8 15 8
HIGH = VSELECT > VCC - 0.5 V. n.c. = not connected or floating. X = don't care. HVCC = 1.5 V < VSELECT < VCC - 1.5 V. LOW = VSELECT < 0.5 V.
9. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC VI IORM Tstg Tamb VCC(sc) Ptot Parameter supply voltage input voltage repetitive peak output current storage temperature ambient temperature supply voltage (short circuit) total power dissipation non-operating operating Conditions operating Min -0.3 -0.3 -55 -40 Max +18 VCC + 0.3 1 +150 +85 10 2.2 Unit V V A C C V W
10. Thermal characteristics
Table 6. Symbol Rth(j-a) Rth(j-sp)
[1]
Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to solder point Conditions in free air with heat spreader
[1]
Typ 80 22 3
Unit K/W K/W K/W
Thermal resistance is 22 K/W with DAP soldered to 64.5 mm2 (10 in2), 28.3 g (1 oz) copper heat spreader.
11. Static characteristics
Table 7. Static characteristics VCC = 6 V; Tamb = 25 C; RL = 8 ; VMODE = 0 V; measured in test circuit Figure 3; unless otherwise specified. Symbol VCC Iq Istb
SA58637_1
Parameter supply voltage quiescent current standby current
Conditions operating RL = VMODE = VCC
[1]
Min 2.2 -
Typ 9 15 -
Max 18 22 10
Unit V mA A
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2008
6 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
Table 7. Static characteristics ...continued VCC = 6 V; Tamb = 25 C; RL = 8 ; VMODE = 0 V; measured in test circuit Figure 3; unless otherwise specified. Symbol VO VO(offset) IIB VMODE Parameter output voltage differential output voltage offset input bias current voltage on pin MODE pins INL+, INR+ pins INL-, INR- operating mute standby IMODE VSELECT current on pin MODE voltage on pin SELECT 0 V < VMODE < VCC both channels on left channel on right channel on II(SELECT)
[1] [2]
Conditions
[2]
Min 0 1.5 VCC - 0.5 1.5 VCC - 0.5 GND -
Typ 2.2 -
Max 50 500 500 0.5 VCC - 1.5 VCC 20 VCC - 1.5 VCC 0.5 100
Unit V mV nA nA V V V A V V V A
input current on pin SELECT
VSELECT = 0 V
With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the DC output offset voltage divided by RL. The DC output voltage with respect to ground is approximately 0.5 x VCC.
12. Dynamic characteristics
Table 8. Dynamic characteristics VCC = 6 V; Tamb = 25 C; RL = 8 ; f = 1 kHz; VMODE = 0 V; measured in test circuit Figure 3; unless otherwise specified. Symbol Po Parameter output power Conditions THD+N = 10 % THD+N = 0.5 % THD+N = 10 %; VCC = 9 V; application demo board THD+N Gv(cl) Zi Vn(o) PSRR VO(mute) cs
[1] [2] [3] [4] [5]
Min 1.2 0.9 [1]
Typ 1.5 1.1 2.2 0.15 100 -
Max 0.3 30 100 200 -
Unit W W W % dB k V dB dB V dB
total harmonic distortion-plus-noise closed-loop voltage gain differential input impedance output noise voltage power supply rejection ratio mute output voltage channel separation
Po = 0.5 W
6 -50 -40 -40
[2]
1 kHz 100 Hz to 20 kHz mute condition
[3] [4] [5]
Gain of the amplifier is 2 x (R2 / R1) in test circuit of Figure 3. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance of RS = 0 at the input. Power supply rejection ratio is measured at the output with a source impedance of RS = 0 at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail. Power supply rejection ratio is measured at the output, with a source impedance of RS = 0 at the input. The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail. Output voltage in mute position is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, which includes noise.
(c) NXP B.V. 2008. All rights reserved.
SA58637_1
Product data sheet
Rev. 01 -- 25 February 2008
7 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
13. Application information
13.1 BTL application
Tamb = 25 C, VCC = 9 V, f = 1 kHz, RL = 8 , Gv = 20 dB, audio band-pass 22 Hz to 22 kHz. The single-ended input and BTL differential output diagram is shown in Figure 3.
1 F
R2 50 k R1 10 k
VCC INL- INL+ 15 14 17 10 16 OUTL-
RL 100 nF 100 F
VI C3 47 F
1
OUTL+
1 F
R3 10 k R4 50 k
SA58637
INR- INR+ SVR MODE SELECT 12 13 3 2 4 20 7 GND 6 OUTR+ 11 OUTR-
RL
VI
001aah746
R2 Gain left = 2 x -----R1 R4 Gain right = 2 x -----R3
Pins 8, 9, 18 and 19 connected to ground.
Fig 3.
Application diagram of SA58637 single-ended input and BTL differential output configuration
SA58637_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2008
8 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
14. Test information
14.1 Static characterization
The quiescent current has been measured without any load impedance (Figure 4). Figure 6 shows three areas: operating, mute and standby. It shows that the DC switching levels of the mute and standby respectively depends on the supply voltage level.
30 Iq (mA) 20
002aac081
10 VO (V) 1 10-1 10-2 10-3
(1) (2) (3)
002aac089
10
10-4 10-5
0 0 4 8 12 16 20 VCC (V)
10-6 10-1
1
10 VMODE (V)
102
RL =
Band-pass = 22 Hz to 22 kHz. (1) VCC = 3 V. (2) VCC = 5 V. (3) VCC = 12 V.
Fig 4.
Quiescent current as a function of supply voltage
16 VMODE (V) 12
Fig 5.
Output voltage as a function of voltage on pin MODE
002aac090
standby
8 mute 4
0 0 4 8
operating 12 VCC (V) 16
Fig 6.
Voltage on pin MODE as a function of supply voltage
SA58637_1
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Product data sheet
Rev. 01 -- 25 February 2008
9 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
20 VSELECT (V) 16
002aad579
12
(4)
(5)
8
VCC
(3) (1)
4
(2)
0 0 4 8 12 16 VCC (V) 20
(1) Left channel on (2) Left channel standby (3) Right channel on (4) Right channel standby (5) Left channel + right channel on
Fig 7.
Voltage on pin SELECT as a function of supply voltage
SA58637_1
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Product data sheet
Rev. 01 -- 25 February 2008
10 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
14.2 BTL dynamic characterization
The total harmonic distortion-plus-noise (THD+N) as a function of frequency (Figure 8) was measured with a low-pass filter of 80 kHz. The value of capacitor C3 influences the behavior of PSRR at low frequencies; increasing the value of C3 increases the performance of PSRR.
10 THD+N (%) 1
(1)
002aac083
-60 cs (dB) -70
(1) (2)
002aac084
-80
(3)
10-1
(2)
-90
10-2 10
102
103
104 f (Hz)
105
-100 10
102
103
104 f (Hz)
105
Po = 0.5 W; Gv = 20 dB. (1) VCC = 6 V; RL = 8 . (2) VCC = 7.5 V; RL = 16 .
VCC = 6 V; VO = 2 V; RL = 8 . (1) Gv = 30 dB. (2) Gv = 20 dB. (3) Gv = 6 dB.
Fig 8.
Total harmonic distortion-plus-noise as a function of frequency
-20 PSRR (dB) -40
Fig 9.
Channel separation as a function of frequency
002aac085
(1) (2)
-60
(3)
-80 10
102
103
104 f (Hz)
105
VCC = 6 V; RS = 0 ; Vripple = 100 mV. (1) Gv = 30 dB. (2) Gv = 20 dB. (3) Gv = 6 dB.
Fig 10. Power supply rejection ratio as a function of frequency
SA58637_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2008
11 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
14.3 Thermal behavior
The measured thermal performance of the HVQFN20 package is highly dependent on the configuration and size of the heat spreader on the application demo board. Data may not be comparable between different semiconductor manufacturers because the application demo boards and test methods are not standardized. The thermal performance of a package for a specific application may also differ from those presented here because the configuration of the application boards copper heat spreader may be significantly different. NXP Semiconductors uses FR-4 type application boards with 28.3 g (1 oz) copper traces with solder coating. The demo board (see Figure 16) has a 28.3 g (1 oz) copper heat spreader that runs under the IC and provides a mounting pad to solder to the die attach paddle of the HVQFN20 package. The heat spreader is symmetrical and provides a heat spreader on both top and bottom of the PCB. The heat spreader on top and bottom side of the demo board is connected through 2 mm diameter plated through holes. Directly under the DAP (Die Attach Paddle), the top and bottom side of the PCB are connected by four vias. The total top and bottom heat spreader area is 64.5 mm2 (10 in2). The junction to ambient thermal resistance, Rth(j-a) = 22 K/W for the HVQFN20 package when the exposed die attach paddle is soldered to a 32.3 mm2 (5 in2) area of 28.3 g (1 oz) copper heat spreader on the demo PCB. The maximum sine wave power dissipation for Tamb = 25 C is: 150 - 25 -------------------- = 5.7 W 22 Thus, for Tamb = 60 C the maximum total power dissipation is: 150 - 60 -------------------- = 4.1 W 22 The power dissipation as a function of ambient temperature curve (Figure 11) shows the power derating profiles with ambient temperature for three sizes of heat spreaders. For a more modest heat spreader using a 32.3 mm2 (5 in2) area on the top or bottom side of the PCB, the Rth(j-a) is 31 K/W. When the package is not soldered to a heat spreader, the Rth(j-a) increases to 60 K/W.
SA58637_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2008
12 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
6 P (W) 4
(1)
002aac283
(2)
2
(3)
0 0 40 80 120 160 Tamb (C)
(1) 64.5 mm2 (10 in2) heat spreader top and bottom, 28.3 g (1 oz copper). (2) 32.3 mm2 (5 in2) heat spreader top or bottom, 28.3 g (1 oz copper). (3) No heat spreader.
Fig 11. Power dissipation as a function of ambient temperature
The characteristics curves (Figure 12a and Figure 12b, Figure 13, Figure 14, and Figure 15a and Figure 15b) show the room temperature performance for SA58637 using the demo PCB shown in Figure 16. For example, Figure 12 "Power dissipation as a function of output power" (a and b) show the performance as a function of load resistance and supply voltage. Worst case power dissipation is shown in Figure 13. Figure 15a shows that the part delivers typically 2.8 W per channel for THD+N = 10 % using 8 load at 9 V supply, while Figure 15b shows that the part delivers 3.3 W per channel at 12 V supply and 16 load, THD+N = 10 %.
3 P (W) 2
(3) (2)
002aac288
3
(4)
002aac289
P (W) 2
(3) (2)
1
(1)
1
(1)
0 0 1 2 Po (W) 3
0 0 1 2 3 Po (W) 4
(1) VCC = 6 V. (2) VCC = 7.5 V. (3) VCC = 9 V.
(1) VCC = 6 V. (2) VCC = 7.5 V. (3) VCC = 9 V. (4) VCC = 12 V.
a. RL = 8 ; f = 1 kHz; Gv = 20 dB Fig 12. Power dissipation as a function of output power
b. RL = 16 ; f = 1 kHz; Gv = 20 dB
SA58637_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2008
13 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
4 P (W) 3
001aah747
4 Po (W) 3
(2)
002aac286
(3)
2
(1)
(2)
(3)
2
1
1
(1)
0 0 4 8 VCC (V) 12
0 0 4 8 VCC (V) 12
(1) RL = 4 . (2) RL = 8 . (3) RL = 16 .
THD+N = 10 %; f = 1 kHz; Gv = 20 dB. (1) RL = 4 . (2) RL = 8 . (3) RL = 16 .
Fig 13. Worst case power dissipation as a function of supply voltage
Fig 14. Output power as a function of supply voltage
102 THD+N (%) 10
(1) (2) (3)
002aac284
102 THD+N (%) 10
002aac285
(1) (2) (3) (4)
1
1
10-2
10-2
10-3 10-2
1 Po (W)
10
10-3 10-3
10-2
1 Po (W)
10
(1) VCC = 6 V. (2) VCC = 7.5 V. (3) VCC = 9 V.
(1) VCC = 6 V. (2) VCC = 7.5 V. (3) VCC = 9 V. (4) VCC = 12 V.
a. RL = 8 ; f = 1 kHz; Gv = 20 dB
b. RL = 16 ; f = 1 kHz; Gv = 20 dB
Fig 15. Total harmonic distortion-plus-noise as a function of output power
SA58637_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2008
14 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
14.4 General remarks
The frequency characteristics can be adapted by connecting a small capacitor across the feedback resistor. To improve the immunity of HF radiation in radio circuit applications, a small capacitor can be connected in parallel with the feedback resistor (56 k); this creates a low-pass filter.
14.5 SA58637BS PCB demo
The application demo board may be used for evaluation single-ended input, BTL differential output configuration as shown in the schematic in Figure 3. The demo PCB (Figure 16) is laid out for a 64.5 mm2 (10 in2) heat spreader (total of top and bottom heat spreader area).
SA58637_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2008
15 of 22
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Product data sheet Rev. 01 -- 25 February 2008
(c) NXP B.V. 2008. All rights reserved. SA58637_1
NXP Semiconductors
top layer
bottom layer
SA58637BS Rev5 Audio Amplifier
VCC GND OUTL+ OUTL-
100 F
10 k
10 k
INL- GND VCC/2 VCC
56 k 1 F 1 F
MODE GND SEL VCC SELECT
11 k 11 k
GND
1 F
47 F
56 k
INR-
1 F
OUTR+
OUTR-
2 x 2.2 W BTL audio amplifier
001aah667
SA58637
16 of 22
Fig 16. SA58637BS PCB demo
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
15. Package outline
HVQFN20: plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 6 x 5 x 0.85 mm
SOT910-1
D
B
A
terminal 1 index area
E
A A1 c
detail X
e1 1/2 e e
7
b
10
v w
M M
CAB C
C y1 C y
L
6 11
e
Eh 1/2 e
e2
1
16
terminal 1 index area
20
17
Dh 0 2.5 scale DIMENSIONS (mm are the original dimensions) UNIT mm A max 1 A1 0.05 0.00 b 0.4 0.3 c 0.2 D 5.1 4.9 Dh 3.15 2.85 E 6.1 5.9 Eh 4.15 3.85 e 0.8 e1 2.4 e2 4 L 0.65 0.40 v 0.1 w 0.05 5 mm
X
y 0.05
y1 0.1
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included OUTLINE VERSION SOT910-1 REFERENCES IEC --JEDEC MO-220 JEITA --EUROPEAN PROJECTION ISSUE DATE 05-10-11
Fig 17. Package outline SOT910-1 (HVQFN20)
SA58637_1 (c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2008
17 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description".
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
* Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
* * * * * *
Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
* Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are exposed to the wave
* Solder bath specifications, including temperature and impurities
SA58637_1 (c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2008
18 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
16.4 Reflow soldering
Key characteristics in reflow soldering are:
* Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 18) than a SnPb process, thus reducing the process window
* Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
* Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 9 and 10
Table 9. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5 Table 10. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 350 220 220
Package thickness (mm)
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 18.
SA58637_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2008
19 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 18. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description".
17. Abbreviations
Table 11. Acronym BTL CMOS DAP ESD HF NPN PCB PNP RMS SE THD Abbreviations Description Bridge-Tied Load Complementary Metal Oxide Semiconductor Die Attach Paddle ElectroStatic Discharge High-Frequency Negative-Positive-Negative Printed-Circuit Board Positive-Negative-Positive Root Mean Squared Single-Ended Total Harmonic Distortion
18. Revision history
Table 12. Revision history Release date 20080225 Data sheet status Product data sheet Change notice Supersedes Document ID SA58637_1
SA58637_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2008
20 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
19. Legal information
19.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
19.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
Suitability for use -- NXP Semiconductors products are not
designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
20. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
SA58637_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2008
21 of 22
NXP Semiconductors
SA58637
2 x 2.2 W BTL audio amplifier
21. Contents
1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 9 10 11 12 13 13.1 14 14.1 14.2 14.3 14.4 14.5 15 16 16.1 16.2 16.3 16.4 17 18 19 19.1 19.2 19.3 19.4 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 5 Mode select pin (MODE) . . . . . . . . . . . . . . . . . 5 SELECT output configuration . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . . 8 BTL application . . . . . . . . . . . . . . . . . . . . . . . . . 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Static characterization . . . . . . . . . . . . . . . . . . . 9 BTL dynamic characterization . . . . . . . . . . . . 11 Thermal behavior . . . . . . . . . . . . . . . . . . . . . . 12 General remarks . . . . . . . . . . . . . . . . . . . . . . . 15 SA58637BS PCB demo . . . . . . . . . . . . . . . . . 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17 Soldering of SMD packages . . . . . . . . . . . . . . 18 Introduction to soldering . . . . . . . . . . . . . . . . . 18 Wave and reflow soldering . . . . . . . . . . . . . . . 18 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 18 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 19 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20 Legal information. . . . . . . . . . . . . . . . . . . . . . . 21 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Contact information. . . . . . . . . . . . . . . . . . . . . 21 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 February 2008 Document identifier: SA58637_1

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