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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Features
* High luminous intensity output. * Low power consumption. * High efficiency. * Versatile mounting on PCB or panel. * I.C. Compatible / low current requirements. * Popular T-1 3/4 diameter.
Package Dimensions
Part No.
LTL2H3TCKS7
Lens
Water Clear
Source Color
InGaN Bluish-Green
Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is O 0.25mm(.010") unless otherwise noted. 3. Lead spacing is measured where the leads emerge from the package. 4. Specifications are subject to change without notice.
Part No. : LTL2H3TCKS7 BNS-OD-C131/A4
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Absolute Maximum Ratings at TA=25J
Parameter Power Dissipation Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) DC Forward Current Reverse Voltage Operating Temperature Range Storage Temperature Range Lead Soldering Temperature [1.6mm(.063") From Body] Maximum Rating 130 100 30 5 -40J to + 80J -55 to + 100 J J Unit mW mA mA V
260J for 5 Seconds
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Electrical / Optical Characteristics at TA=25J
Parameter Luminous Intensity Viewing Angle Peak Emission Wavelength Dominant Wavelength Spectral Line Half-Width Forward Voltage Reverse Current Capacitance Symbol IV 21/2 P d VF IR C 40 Min. 4200 Typ. 9300 15 505 503 35 3.4 4.3 100 Max. Unit mcd deg nm nm nm V A pF IF = 20mA VR = 5V VF = 0 , f = 1MHz Test Condition IF = 20mA Note 1,5 Note 2 (Fig.5) Measurement @Peak (Fig.1) Note 4
NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength, d is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. Iv classification code is marked on each packing bag. 5. The Iv guarantee should be added 15M tolerance. 6. Precautions in handling: E When soldering, leave 2mm of minimum clearance from the resin to the soldering point. E Dipping the resin to solder must be avoided. E Correcting the soldered position after soldering must be avoided. E In soldering, do not apply any stress to the lead frame particularly when heated. E When forming a lead, make sure not to apply any stress inside the resin. E Lead forming must be done before soldering. E It is necessary to cut the lead frame at normal temperature. 7. Caution in ESD: Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. Part No. : LTL2H3TCKS7 BNS-OD-C131/A4 Page : 3 of 10
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Typical Electrical / Optical Characteristics Curves
(25J Ambient Temperature Unless Otherwise Noted)
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Packing Spec
250 or 500 pcs per packing bag
10 packing bags per inner carton total 5000 pcs per inner carton
8 Inner cartons per outer carton total 40000 pcs per outer carton In every shipping lot, only the last pack will be non-full packing
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Bin Code List For Reference
Luminous Intensity Iv(mcd) Bin Code V W X Y Z 5A Min. 4200 5500 7200 9300 12000 16000 IF@20mA Max. 5500 7200 9300 12000 16000 21000
Note: Tolerance of each bin limit is 15%
Forward Voltage Vf (Volts) Bin Code 4 5 6 7 8 Min. 3.00 3.25 3.50 3.75 4.00
IF@20mA Max. 3.25 3.50 3.75 4.00 4.25
Dominant Wavelength d(nm) Bin Code A B Min. 498 503
IF@20mA Max. 503 508
Note: Tolerance of each bin limit is 1nm
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon's Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30C temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. Dipping the lens into the solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering conditions : Soldering iron Temperature Soldering time 300C Max. 3 sec. Max. (one time only) Wave soldering Pre-heat Pre-heat time Solder wave Soldering time 100C Max. 60 sec. Max. 260C Max. 10 sec. Max.
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of the LED. IR reflow is not suitable process for through hole type LED lamp product.
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
6. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs
7. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage: Use a conductive wrist band or anti- electrostatic glove when handling these LEDs All devices, equipment, and machinery must be properly grounded Work tables, storage racks, etc. should be properly grounded Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of friction between LEDs during storage and handing
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Suggested checking list :
Training and Certification 1. Everyone working in a static-safe area is ESD-certified? 2. Training records kept and re-certification dates monitored? Static-Safe Workstation & Work Areas 1. Static-safe workstation or work-areas have ESD signs? 2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V? 3. All ionizer activated, positioned towards the units? 4. Each work surface mats grounding is good? Personnel Grounding 1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 2. If conductive footwear used, conductive flooring also present where operator stand or walk? 3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*? 4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs? 5. All wrist strap or heel strap checkers calibration up to date? Note: *50V for Blue LED. Device Handling 1. Every ESDS items identified by EIA-471 labels on item or packaging? 2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation? 3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items? 4. All flexible conductive and dissipative package materials inspected before reuse or recycle? Others 1. Audit result reported to entity ESD control coordinator? 2. Corrective action from previous audits completed? 3. Are audit records complete and on file?
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
8. Reliability Test
Classification Test Item Test Condition
Ta= Under Room Temperature As Per Data Sheet Maximum Rating *Test Time= 1000HRS (-24HRS,+72HRS) Ta= 655J RH= 90 a 95% Test Time= 240HRS2HRS Ta= 655J RH= 90 a 95% VR=5V Test Time = 500HRS (-24HRS, +48HRS) Ta= 1055J *Test Time= 1000HRS (-24HRS,+72HRS)
Reference Standard
MIL-STD-750D:1026 (1995) MIL-STD-883D:1005 (1991) JIS C 7021:B-1 (1982) MIL-STD-202F: 103B(1980) JIS C 7021 : B-11(1982)
Operation Life
High Temperature High Humidity Storage
Endurance Test
High Temperature High Humidity Reverse BIAS High Temperature Storage
JIS C 7021 : B-11(1982)
MIL-STD-883D:1008 (1991) JIS C 7021:B-10 (1982)
Low Temperature Storage
Ta= -555J *Test Time=1000HRS (-24HRS,+72HRS) 105 J a 25 J a 30mins 5mins 10 Cycles 105 5 J a 10mins 10 Cycles -55 J a 25J 30mins 5mins
JIS C 7021:B-12 (1982) MIL-STD-202F:107D (1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1010 (1991) JIS C 7021: A-4(1982) MIL-STD-202F:107D(1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1011 (1991) MIL-STD-202F:210A(1980) MIL-STD-750D:2031(1995) JIS C 7021: A-1(1982) MIL-STD-202F:208D(1980) MIL-STD-750D:2026(1995) MIL-STD-883D:2003(1991) JIS C 7021: A-2(1982)
Temperature Cycling
Environmental Test
Thermal Shock
-55 5 J 10mins
J
Solder Resistance
T.sol = 260 5J Dwell Time= 10 1secs
Solderability
T. sol = 230 5J Dwell Time= 5 1secs
9. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.
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