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| IC554 Series Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Pin Count: Dual Inline Memory Module (DIMM, 72 pins) Part Number (Details) 1,000M W min. at 500V DC 700V AC for 1 minute 30m W max. at 10mA/20mV max. -55C to +170C 10,000 insertions min. 72 contact pins IC-554 - 1 - MF Series No. 1 = 72 Pins MF = Flanged Unmarked = Not Flanged Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features i Card thickness 1.00mm Outline Socket Dimensions Recommended PC Board Layout Top View from Socket 89.00 0.2 R 1.50 AE3.20 + 0.1 0 89.00 0.1 1.27x35=44.45 0.1 1.27x35=44.45 0.2 1.27x17=21.59 Ref 1.27x18=22.86 Ref 1.27 0.1 AE3.20 0 Thru hole + 0.1 (1.27x17=21.59) 1.27 0.05 0.635 0.05 (1.27x18=22.86) 72-AE0.80 + 0.1 0 17.00 13.00 8.040.05 4.840.05 1.270.05 1.27x35=44.45 0.05 1.27 0.1 0.67 + 0.1 0 1.27x 35=44.45 0.2 80.00 0.4 98.00 0.4 80.00 Ref 0.1 59.89 + 0 55.90 Ref Matching Module Dimensions 59.69 15.48 0.1 11.00 34.10 Ref Front 20.00 25.35 Front 4.00 3.70 0.5 w0.40 x t0.30 17.78 6.35 1.02 0.3 1.27 0.3 7.62 0.2 54.00 + 0 1.00 - 0.07 + 0.09 44.45 0.05 51.66 (2.00) Back 1.27x35=44.45 0.05 (1.27x17=21.59) 2.00 (1.27x18=22.86) 17.78 1.80 Back AE1.800.05 SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Test & Burn-In |
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