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DATA SHEET
MeshConnectTM Module Series
Module and Extended Range Module
Development Kits available: ZICM2410P0-KIT2-1, ZICM2410P2-KIT1-1
DESCRIPTION
CEL's MeshConnectTM Module Series provides high performance and low cost 2.4 GHz IEEE 802.15.4 / ZigBee modules for a broad range of wireless networks. The MeshConnect certified and qualified modules, enable customer to accelerate time to market by greatly reducing design and certification phases of development. CEL's MeshConnectTM radio modules leverage the advanced features of the MeshConnectTM Integrated Circuit (IC). The IC is a true single-chip solution, compliant with ZigBee specifications and IEEE 802.15.4, a complete wireless solution for all ZigBee applications. The IC consists of an RF transceiver with baseband modem, a hardwired MAC and an embedded 8051 microcontroller with internal Flash memory. The device provides numerous general-purpose I/O pins, peripheral functions such as timers and UARTs and is one of the first devices to provide an embedded Voice CODEC. This device is also ideal for low power applications. The original MeshConnect module delivers excellent performance at a surprisingly low cost. The module's +6dBm output power means better range, more reliable transmission and fewer nodes in your network. It also makes these modules ideal for applications where cost and power constraints do not allow for external power amplifiers or peripheral range extension components. The MeshConnect Extended Range module adds a power amplifier (PA) and low noise amplifier (LNA) to increase range to over two miles - plus more reliable transmission and fewer nodes in your network. It is especially useful for open outdoor applications where the nodes are physically far apart, or for indoor use where the nodes have to operate in a noisy RF environment. The Extended Range Module's outstanding +123 dBm budget link ensures high quality connections even in such harsh environments.
Integrated Transceiver Modules for ZigBee / IEEE 802.15.4
MeshConnectTM Module Series
* * * * * * * * 96 kB FLASH Memory 8 kB SRAM 8051 MCU core up to 22 GPIO Pins SPI (Master/Slave) + UARTs I2S/PCM Interface with two 128-byte FIFOs -law/a-law/ADPCM Voice Codec 4-channel 8-bit ADC
FEATURES
* High RF performance: - Up to 123.5 dB RF Link Budget - RX Sensitivity: -97 dBm and -103.5 dBm - RF TX Power:+6 dBm and +20 dBm * Scalable Data Rate: 250 kbps, 500 kbps and 1Mbps * Miniature footprint: 1" x 1.350" (25.4 mm x 34.3 mm) * Voice Codec Support: -law/a-law/ADPCM * 4 Level Power Management Scheme w/ Deep Sleep Mode (0.3 A) * Integrated PCB trace antenna * 16 RF channels * Up to 12,000 feet of range * AES 128-bit encryption * FCC, CE and IC certifications * ROHS compliant
APPLICATIONS
* Food processing controls * Traffic Management * Sensor Networks * Asset Management * Barcode reader * Patient Monitoring * Glucose monitor
Industrial Controls
* Security * HVAC control * Lighting control * Thermostats
Home & Building Automation
ORDERING INFORMATION
Part Number Order Number ZICM2410P0-1 MeshConnectTM Module ZICM2410P0-1-SN ZICM2410P0-1C ZICM2410P0-1C-SN ZICM2410P0-KIT2-1 ZICM2410P2-1 MeshConnectTM Extended Range Module ZICM2410P2-1-SN ZICM2410P2-1C ZICM2410P2-1C-SN ZICM2410P2-KIT1-1
Document No: 0007-00-07-00-000 (Issue C) Date Published: April 7, 2010
Description +6 dBm Output power, PCB Trace antenna +6 dBm Output power, PCB Trace antenna, SNAP software +6 dBm Output power, with u.FL Connector for external antenna +6 dBm Output power, with u.FL Connector for external antenna, SNAP software +6 dBm Engineering Development Kit +20 dBm Output power, PCB Trace antenna +20 dBm Output power, PCB Trace antenna, SNAP software +20 dBm Output power, with u.FL Connector for external antenna +20 dBm Output power, with u.FL Connector for external antenna, SNAP software Evaluation board for +20 dBm module
Page 1
The information in this document is subject to change without notice, please confirm data is current
MeshConnectTM Module Series
MODULE BLOCK DIAGRAM
Module
PWR Reg 16 MHz XTAL
Extended Range Module
PWR Reg
ANT
16 MHz XTAL
ANT Castellation Edge Connector
Castellation Edge Connector
MeshConnectTM IC
Micro processor Radio
MeshConnectTM IC
Micro processor Radio
PA
LNA
DEVELOPMENT KIT
CEL's MeshConnect Development Kit assist users in both evaluation and development. As a stand-alone radio system, the kit allows users to place the modules in to the target environment and evaluate performance on-site. The MeshConnect Development Kit also serves as an invaluable aid in application development. Through the many interface headers on the board, the user has access to all the MeshConnect module pins enabling easy connection to target systems for application development. The key components of the MeshConnect Development Kits are the CEL's MeshConnect radio module and the interface board. The MeshConnect module contains the CEL transceiver IC, Crystals, Power Regulator and an integrated PCB antenna with a connector for an external antenna (optional). The interface board features a serial communication interface, a power management module, and peripherals such as potentiometers, LEDs, and GPIO headers. For more detail information regarding MeshConnect Development Kits, refer to the respective development kit user guides documents. (Available at CEL's website http://www.cel.com)
Order Number ZICM2410P0-KIT2-1 ZICM2410P2-KIT1-1 Description +6 dBm Engineering Development Kit Evaluation board for +20 dBm module
MeshConnectTM Module Development Kit
* Evaluation Boards w/Module (3) * Network Analyzer (1) * Antennas (1) * USB Cables (2) * Jumpers (10)
Kit Contents:
* AA Batteries (4) * Universal AC/DC Power Supply (2)
* Software & Technical Information CD (2)
MeshConnectTM Extended Range Module Development Kit
* Evaluation Boards w/Module (1) * USB Cables (1)
Kit Contents:
* Jumpers (2)
* Software & Technical Information CD (2)
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MeshConnectTM Module Series TABLE OF CONTENTS
Introduction and Overview
Description.............................................................................................................................................................................................. Features.................................................................................................................................................................................................. Applications............................................................................................................................................................................................ Ordering Information............................................................................................................................................................................. Module Block Diagram........................................................................................................................................................................... Development Kit..................................................................................................................................................................................... 1 1 1 1 2 2
System Level Function
Transceiver IC......................................................................................................................................................................................... Modes of Operation (TX, RX, Sleep)...................................................................................................................................................... Power Amplifier....................................................................................................................................................................................... Interface.................................................................................................................................................................................................. Software Tools........................................................................................................................................................................................ 4 5 6 6 6
Electrical Specification
Absolute Maximum Ratings................................................................................................................................................................... Recommended (Operating Condition).................................................................................................................................................. DC Characteristics.................................................................................................................................................................................. RF Characteristics.................................................................................................................................................................................. 8 8 8 8
Pin Signal & Interfaces
Pin Signals I/O Configuration................................................................................................................................................................ I/O Pin Assignment................................................................................................................................................................................. Module Dimensions................................................................................................................................................................................ 9 9 11 13 14 15 16
Processing Agency Certifications Shipment, Storage & Handling References & Revision History
Page 3
MeshConnectTM Module Series
TRANSCEIVER IC
A true monolithic solution, the MeshConnect IC incorporates the RF transceiver with baseband modem, a hardwired MAC, and an embedded 8051 microcontroller, offering an excellent low cost high performance solution for all IEEE 802.15.4 / ZigBee applications.
PS/2 UART/2
ADPCM
Voice FIFFO
MAC MODEM
RF TX RF RX
SPI WDT GPIO/24 Timer/4 PWM/2 Quad Key Scan Digital Regulator
a-law -law
DMA
AES Engine
PLL Temp. Sensor
MCU (8051)
DATA 8KB FLASH 96KB ROM Bat Monitor ADC (4CH) Analog Regulator
RC Oscillator
Clock PLL
POR
3V Ciruitry
With an industry best +8 dBm output power, the MeshConnect IC will support a wide a variety of applications without the need for external amplification. Combined with a highly sensitive -98 dBm receiver the MeshConnect IC leads the industry with 106 dB link budget. In addition to excellent RF performance at ZigBee (250 kbps) data rates, the IC adds high speed modes, Turbo (500 kbps) and Premium (1 Mbps), for networks looking for increased throughput. The device provides numerous general-purpose I/O pins, peripheral functions such as timers and UARTs and is one of the first devices to provide an embedded Voice CODEC. CEL provides its customers with the CEL ZigBee Stack as part of the software library. Also available are the hardware & software tools required to develop custom applications. The combination of industry leading link budget, high speed RF, and integrate voice CODEC make the IC a truly distinct single chip solution. The Extended Range module adds both an PA and LNA to maximize RF performance. The NEC uPG2250 PA enable the Extended Range module to output up to +20 dBm transmit power. In the receive path the addition of the UPC8233 LNA boosts the already sensitive receiver up to -103.5 dBm. The Extended Range link budget boasts a very robust 123.5 dBm enabling a line of sight range over 2 miles.
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MeshConnectTM Module Series
ANTENNA
CEL's MeshConnect modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional u.FL connector can be specified, providing connection to a 50-ohm external antenna of the user's choice. See Ordering Information on page 1. The PCB antenna employs an F-Antenna topology that is compact and supports an omni-directional radiation pattern. To maximize antenna efficiency, an adequate ground plane must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB will contribute significantly to the antenna performance (it should not be directly under the F-Antenna). The position of the module on the host board and overall design of the product enclosure contribute to antenna performance. Poor design affects radiation patterns and can result in reflection, diffraction, and/or scattering of the transmitted signal. Here are some design guidelines to help ensure antenna performance: * Never place the ground plane or route copper traces directly underneath the antenna portion of the module. * Never place the antenna close to metallic objects. * In the overall design, ensure that wiring and other components are not placed near the antenna. * Do not place the antenna in a metallic or metalized plastic enclosure. * Keep plastic enclosures 1cm or more from the antenna in any direction. For optimum antenna performance, the MeshConnect modules should be mounted with the PCB trace antenna overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the host board under the module, up to the antenna. The installation of an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout.
MODES OF OPERATION
There are three power down modes in the IC. Each mode can be set using the PDMODE [1:0] bits in the PDCON register and power down modes can be started by setting the PDSTART bit to 1. Each mode has a different current consumption and wake-up sources, please refer to the IC datasheet for further information on the available power down modes. Table 8 describes the three power down modes. Table 8 - Power Down Modes
PDMODE [1:0] 0 1 Description Active (Normal Operation) PM1 mode Wake-Up Source Hardware Reset, Sleep Timer interrupt, External interrupt Hardware Reset, Sleep Timer interrupt, External interrupt Hardware Reset, External interrupt Regulator for Digital block ON OFF (After wake-up, register configuration is required) OFF (After wake-up, register configuration is required)
2
PM2 mode
3
PM3 mode
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MeshConnectTM Module Series
POWER AMPLIFIER
The orginal MeshConnect module does not incorporate an external Power Amplifier and therefore the RF output port is connected directly (through matching components) to the RF antenna. As CEL's IC IEEE 802.15.4 / ZigBee transceiver already offers the industry's best link budget at 106 dB, even without an external PA the MeshConnect can maintain wireless connection over long distance (3,000 ft line-of-sight). The Extended Range module adds both an PA and LNA to optimize RF performance. The NEC uPG2250 PA enable the Extended Range module to output up to +20 dBm transmit power. In the receive path the addition of the UPC8233 LNA boosts the already sensitive receiver up to -103.5 dBm. The Extended Range link budget boasts a very robust 123.5 dBm enabling a line of sight range over 2 miles.
INTERFACE
The MeshConnect has all major communication interfaces routed from the IC to the module edge connectors: * UART1 & UART 2 * I2S * SPI
VOICE CODEC
The MeshConnect IC includes three voice codec algorithms: -law, a-law and ADPCM. The -law algorithm is a companding algorithm primarily used in the digital telecommunication systems of North America and Japan. As with other companding algorithms, its purpose is to reduce the dynamic range of an audio signal. In the analog domain this can increase the signal-to-noise ratio (SNR) achieved during transmission and in the digital domain, it can reduce the quantization error (hence increasing signal to quantization noise ratio). These SNR improvements can be traded for reduced bandwidth and equivalent SNR instead. The a-law algorithm is a standard companding algorithm used in European digital communications systems to optimize/modify the dynamic range of an analog signal for digitizing. The a-law algorithm provides a slightly larger dynamic range than the -law at the cost of worse proportional distortion for small signals. Adaptive DPCM (ADPCM) is a variant of DPCM [Differential (or Delta) pulse-code modulation] that varies the size of the quantization step, allowing further reduction of the required bandwidth for a given signal-to-noise ratio. DPCM encodes the PCM values as differences between the current and the previous value. For audio applications this type of encoding reduces the number of bits required per sample by about 25% compared to PCM.
SOFTWARE TOOLS
CEL offers complete SW tools for MeshConnect that customers need to create their ZigBee application. PROFILE BUILDER * Profile Builder allows for easy creation of custom ZigBee profiles for use in end-user applications. * Uses the input requirements to modify a set of `C' source files which include the necessary ZigBee functions. * Output files will contain the ZigBee Device Object (ZDO) descriptors and the ZigBee Device Profile (ZDP) descriptors. * The ZDO and ZDP define the ZigBee node and functionality. The output files can be seamlessly integrated with the CEL ZigBee stack libraries.
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MeshConnectTM Module Series
SOFTWARE TOOLS (Continued)
DEVICE PROGRAMMER * Device Programmer is used to program the application firmware to the on-chip Flash program memory of the IC device. * Device Programmer supports: * ISP Mode: Download the firmware from the host PC via serial communication through the IC's UART1 interface. * The evaluation boards utilize a USB -> Serial converter. * OTA Mode: Download the firmware from the host PC using wireless communication (Over-The-Air). * This requires two nodes, the host (connected to a PC) and the target device to be programmed. Device Programmer can read / write hardware information (i.e. IEEE Address, Channel #, etc) directly via the aforementioned communication modes. PROFILE SIMULATOR * Profile Simulator is used to simulate and test a ZigBee network consisting of a coordinator, router and / or end devices. * Profile Simulator includes: * Device Manager: Setting parameters of a ZigBee node. * Bind Manager: Managing "bindings" in a ZigBee network. * ZStack manager: Setting parameters of a ZigBee network. * ZigBee Device Wizard: Selects network configuration during ZigBee network formation. Can be used to generate ZigBee standard primitive functions for MAC, NWK and APS layers and the ZDO and APP. PACKET ANALYZER AND WIRELESS NETWORK ANALYZER * Packet Analyzer monitors traffic over a wireless network channel by capturing RF packet data in real-time. * Packet Analyzer requires the Wireless Network Analyzer to "sniff" the RF packets. * Packet Analyzer also includes diagnostic tools: * Energy Scan: Evaluates the received signal power within the bandwidth of an IEEE 802.15.4 channel yielding available channels. * Active Scan: Scanning for active Coordinators and Routers broadcasting a Beacon frame. * Packet Analyzer is capable of displaying network configuration (i.e. tree vs. star), network nodes, packet details, etc. * Can be used in conjunction with any IEEE 802.15.4 or ZigBee network. KEIL 8051 DEVELOPMENT TOOLS (Evaluation version provided in development kit). * Supports all 8051 derivatives and variants. * Easy-to-Use Vision Integrated Development Environment (IDE) supports the complete development cycle. * Supports memory banking for CODE and variables beyond the 64 kbyte threshold. Numerous optimization levels yield the ability to place more features into less memory providing the utmost code density.
Page 7
MeshConnectTM Module Series
ABSOLUTE MAXIMUM RATINGS
Description Power Supply Voltage (Vcc) Voltage on any digital pin Input RF Level Storage Temperature Reflow Soldering Temperature -55 MeshConnectTM Module Min -0.3 -0.3 Max 3.3 3.3 10 125 250 -55 MeshConnectTM Extended Range Module Min -0.3 -0.3 Max 3.3 3.3 -6 125 250 Unit VDC VDC dBm C C
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDED (OPERATING CONDITIONS)
Description Operating ambient temperature range, TA Operating Supply Voltage Input Frequency MeshConnectTM Module MeshConnectTM Extended Range Module Min -40 2.1 2.405 Typ 25 Max 85 3.0 2.48 Unit C VDC GHz
DC CHARACTERISTICS (@ 25C, VCC = 3.0V unless otherwise noted)
Description Vcc Supply (Vcc) Rx mode Current (Vcc = 3.0V) Tx mode Current (Vcc = 3.0V, Pout Max) Tx mode Current (Vcc = 2.1V, Pout Max) Tx mode Current (Vcc = 3.0V, 0 dBm) Sleep Mode (Deep) Current MeshConnectTM Module Min 2.1 35 44 44 31 1 Typ Max 3.3 38 48 48 MeshConnectTM Extended Range Module Min 2.1 38 175 120 75 4 Typ Max 3.3 42 Unit VDC mA mA mA mA A
RF CHARACTERISTICS (@ 25C, VCC = 3.0V unless otherwise noted)
Description Frequency Band (16 - 5MHz wide channels) Rx Sensitivity for 1% PER Saturation (maximum input level) Tx Output Power (VCC = 3.0V) TX Output Power (VCC = 2.1V) Error Vector Magnitude Adjacent Channel Rejection +/- 5 MHz +/- 10 MHz Frequency Error Tolerance Output Power Control Range Over the Air Data Rate Harmonics (2nd & 3rd) 35 35 -96.2 55 250 1000 -41.2 4.5 4.5 MeshConnectTM Module Min 2.405 -97 5 6.0 6.0 17 47 51 96.2 35 35 35 -96.2 55 250 1000 -41.2 Typ Max 2.480 -85 MeshConnectTM Extended Range Module Min 2.405 -103.5 -11 20 15.5 15 47 51 96.2 35 Typ Max 2.480 -85 Unit GHz dBm dBm dBm dBm % dB kHz dB kbps dBm/MHz
Page 8
MeshConnectTM Module Series
PIN SIGNALS I/O PORT CONFIGURATION
MeshConnect module has 56 edge I/O interfaces for connection to the user's host board. The MeshConnect Module Dimensions shows the layout of the 56 edge castellations.
MeshConnect I/O PIN ASSIGNMENTS
Pin # 1 2 MeshConnectTM Module GND GND MeshConnectTM Extended Range Module GND GND Type GND-RF GND-RF static control line GND-RF GND NC GND-Logic GND-Logic GND-Logic GND-Logic GND-Logic Analog Input Analog Input Analog Input Analog Input digital I/O digital I/O digital I/O digital I/O GND-Logic GND-Logic GND-Logic digital I/O Power digital I/O digital I/O digital I/O Ground Ground Mode Select, Bit #1. Active Low Internal Voltage Regulator Enable: 0: Internal Voltage Regulator Enabled 1: Internal Voltage Regulator Disabled, Supply Analog and Digital Supply Voltages Externally Ground GND no connect Ground Ground Ground Ground Ground 1.5V Level Analog ADC0 Input 1.5V Level Analog ADC1 Input 1.5V Level Analog ADC2 Input 1.5V Level Analog ADC3 Input Port P1.7 Port P1.6 Port P1.4 / QUADZB / Sleep Timer OSC Buffer Input Port P1.3 / QUADZA / Sleep Timer OSC Buffer Output / RTCLKOUT Ground Ground Ground Port P1.1 / TXD1 3.0V Power supply for Analog Internal Voltage Regulator Port P1.0 / RXD1 Port P3.7 / 12mA Drive capability / PWM3 / CTS1 / SPICSN Port P3.6 / 12mA Drive capability /PWM2 / RTS1 / SPICLK Description Functionality Ground Ground IC Pin # N/A N/A
3
MS1
NC
No connect
14
4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 Note:
GND GND NC GND GND GND GND GND ACH0 ACH1 ACH2 ACH3 P1_7
(1)
GND NC NC GND GND GND GND GND ACH0 ACH1 ACH2 ACH3 NC NC P1_4 P1_3 GND GND GND P1_1 VCC_3V P1_0 P3_7 P3_6
Ground Ground No connect Ground Ground Ground Ground Ground ADC input ADC input ADC input ADC input Digital I/O Digital I/O digital I/O or dedicated function port digital I/O or dedicated function port Ground Ground digital I/O or dedicated function port Power Input digital I/O or dedicated function port digital I/O with high current capability digital I/O with high current capability Ground
N/A 13 N/A 49 49 49 49 49 8 9 10 11 20 21 22 23 49 49 49 24 7 26 27 28
P1_6(1) P1_4 P1_3 GND GND GND P1_1 VCC_3V P1_0 P3_7 P3_6
1. Pin used on extended range module to control on board power amplifier.
2. Digital 1.5V regulator output. Sources little current. If it is used by the host board, care must be taken to ensure noise is not introduced as it could degrade RF performance. Page 9
MeshConnectTM Module Series
MeshConnect I/O PIN ASSIGNMENTS (Continued)
Pin # 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 MeshConnectTM Module P3_5 P3_4 GND P3_3 P3_2 GND P3_1 P3_0 GND P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 P0_0 MeshConnectTM Extended Range Module P3_5 P3_4 GND P3_3 P3_2 GND P3_1 P3_0 GND P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 P0_0 Type digital I/O digital I/O GND-Logic digital I/O digital I/O GND-Logic digital I/O digital I/O GND-Logic digital I/O digital I/O digital I/O digital I/O digital I/O digital I/O digital I/O digital I/O Description Port P3.5 / T1 / CTS0 / QUADYB / SPIDO Port P3.4 / T0 / RTS0 / QUADYA / SPIDI Ground Port P3.3 / INT1 (active low) Port P3.2 / INT0 (active low) Ground Port P3.1 / TXD0 / QUADXB Port P3.0 / RXD0 / QUADXA Ground GPIO 8051 Port P0.7 / I2STX_MCLK GPIO 8051 Port P0.6 / I2STX_BCLK GPIO 8051 Port P0.5 / I2STX_LRCLK GPIO 8051 Port P0.4 / I2STX_DO GPIO 8051 Port P0.3 / I2SRX_MCLK GPIO 8051 Port P0.2 / I2SRX_BCLK GPIO 8051 Port P0.1 / I2SRX_LRCK GPIO 8051 Port P0.0 / I2SRX_DI Output of Digital Internal Voltage Regulator (1.5V) / 1.5V Power supply for Digital Core(input mode @ No REG) Mode Select, Bit #2. Active High In-System Programming (ISP) Input: 0: Normal Mode 1: ISP Mode Reset (Active Low) Output of Analog Internal Voltage Regulator (1.5V) / 1.5V Power supply for Mixer, VGA, and LPF (input mode @ No REG) Ground Ground Ground Ground Ground No Connect Ground Ground Functionality digital I/O or dedicated function port digital I/O or dedicated function port digital I/O or dedicated function port digital I/O or dedicated function port digital I/O or dedicated function port digital I/O or dedicated function port Ground digital I/O digital I/O digital I/O digital I/O digital I/O digital I/O digital I/O digital I/O Selected as Internal Regulator output or Regulated Voltage supply Input Ground Ground IC Pin # 29 30 49 31 32 49 33 35 49 36 37 38 39 40 41 42 43
45
DVDD_1_5(2)
NC
Power
19
46 47 48 49 50 51 52 53 54 55 56 Note:
ISP RESET AVDD_1_5(2) GND GND GND GND GND NC GND GND
ISP RESET NC GND GND GND GND GND NC GND GND
Digital Input Control Power GND-Logic GND-Logic GND-Logic GND-Logic GND-Logic NC GND-RF GND-RF
Programming Hardware Reset
15 17 6 49 49 49 49 49 N/A N/A N/A
Selected as Internal Regulator output or Regulated Voltage supply Input Ground Ground Ground Ground Ground No connect Ground Ground
1. Pin used on extended range module to control on board power amplifier.
2. Digital 1.5V regulator output. Sources little current. If it is used by the host board, care must be taken to ensure noise is not introduced as it could degrade RF performance.
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MeshConnectTM Module Series
MODULE DIMENSIONS
MeshConnectTM Module / MeshConnectTM Extended Range Module
w/U.FL Connector for external antenna
0.120"
0007 00 00 00 001
ZICM2410P0
J2 0R C25
RF Shield Pin 56
Pin 1
C7 C21 C7B C11 L3 C13 L4 R7 U1 C9 R2 C14 L2
R10 C24 C5B C20
R11 C23 C22 R8
L5
R1
0.895"
C6
C2
C4A C17
R5
R4 C16
C10
R6
R9
XTAL1 C15
Pin 19
Pin 38 0.062"
1.000"
0.195"
MeshConnectTM Module / MeshConnectTM Extended Range Module
w/PCB Trace Antenna
0007 00 00 00 001
ZICM2410P0
J2 0R C25
RF Shield Pin 56
Pin 1
C7 C21 C7B C11 L3 C13 L4 R7 U1 C9 R2 C14 L2
R10 C24 C5B C20
R11 C23 C22 R8
R1
0.895"
C6
C2
C4A C17
R5
R4 C16
C10
R6
R9
XTAL1 C15
Pin 19
Pin 38 0.062"
1.000"
0.195"
For layout recommendation for optimum antenna performance, refer to Antenna section in this document.
Page 11
1.413"
C6A C1 L6 C6B
1.413"
C6A C1 L6 C6B
ZIC2410 QN48 ZIC2410 QN48
L5
MeshConnectTM Module Series MODULE LAND FOOTPRINT
Note: Unless otherwise specified. Dimensions are in Inches [mm].
1.100 [27.94] 1.000 [25.41] 0.050 [1.27]
COPPER KEEPOUT
0.361 [9.17]
O0.147
KEEPOUT
0.940 [23.88]
0.050 [1.27] Pitch
1.055 [26.80]
0.9277 [23.56]
56 x 0.040 [1.02]
0.105 [2.67] 0.890 [22.61]
56 x 0.100 [2.54]
0.7489 [19.02]
Page 12
MeshConnectTM Module Series PROCESSING
Recommended Reflow Profile
Parameters Values Ramp up rate (from Tsoakmax to Tpeak) Minimum Soak Temperature Maximum Soak Temperature Soak Time TLiquidus Time above TL Tpeak Time within 5 of Tpeak Time from 25 to Tpeak Ramp down rate 3/sec max 150C 200C 60-120 sec 217C 60-150 sec 260 + 0C 20-30 sec 8 min max 6C/sec max
Achieve the brightest possible solder fillets with a good shape and low contact angle.
Pb-Free Soldering Paste
Use of "No Clean" soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations (`half vias') where they contact the host board should meet the appropriate IPC Specification. See IPC-A-610-D "Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations."
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. * Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. * Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. * Ultrasonic cleaning could damage the module permanently. The best approach is to consider using a "no clean" soldering paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the Module to the host board, consider optical inspection to check the following: * Proper alignment and centering of the module over the pads. * Proper solder joints on all pads. * Excessive solder or contacts to neighboring pads, or vias.
Repeating Reflow Soldering Wave Soldering
Only a single reflow soldering process is encouraged for host boards.
If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged.
Page 13
MeshConnectTM Module Series PROCESSING (Continued)
Hand Soldering
Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350C, follow IPC recommendations/ reference document IPC-7711.
Rework
The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool and hot plate for pre-heating from underneath is recommended. Avoid overheating.
Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will
terminate warranty coverage.
Additional Grounding
Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is done at the customer's own risk. The numerous ground pins at the module perimeter should be sufficient for optimum immunity to external RF interference.
AGENCY CERTIFICATIONS FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation.
Warning (Part 15.21)
Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment.
20 cm Separation Distance
To comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.
OEM Responsibility to the FCC Rules and Regulations
The MeshConnect Module has been certified per FCC Part 15 rules for integration into products without further testing or certification. To fulfill the FCC certification requirements, the OEM of the MeshConnect Module must ensure that the information provided on the MeshConnect Label is placed on the outside of the final product. The MeshConnect Module is labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: "Contains Transmitter Module FCC ID: W7Z-ICP0" or "Contains FCC ID: W7Z-ICP0" The OEM of the MeshConnect Module must only use the approved antenna, (PCB Trace Antenna) that has been certified with this module. The OEM of the MeshConnect Module must test their final product configuration to comply with Unintentional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules.
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MeshConnectTM Module Series AGENCY CERTIFICATIONS (Continued) IC Certification -- Industry Canada Statement
The term "IC" before the certification / registration number only signifies that the Industry Canada technical specifications were met.
Section 14 of RSS-210
The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php
CE Certification -- Europe
The MeshConnect RF module has been tested and certified for use in the European Union.
OEM Responsibility to the European Union Compliance Rules
If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the final product to the European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining European Union Compliance. If any of the specifications are exceeded in the final product, the OEM is required to make a submission to the notified body for compliance testing.
OEM Labeling Requirements
The CE' mark must be placed on the OEM product in a visible location. The CE mark shall consist of the initials "CE" with the following form: * If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to. * The CE mark must be a minimum of 5mm in height * The CE marking must be affixed visibly, legibly, and indelibly. Since the 2400 - 2483.5 MHz band is not harmonized by a few countries throughout Europe, the Restriction sign must be placed to the right of the "CE" marking as shown in the picture
SHIPMENT, HANDLING, AND STORAGE
Shipment Handling
The MeshConnect Modules are delivered in trays of 28. The MeshConnect Modules are designed and packaged to be processed in an automated assembly line.
Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD
protection may destroy or damage the module permanently.
Warning According to JEDEC ISP, the MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in Section 2.1. Read carefully to prevent permanent damage due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage/shelf life in sealed bags is 12 months at <40C and <90% relative humidity.
Page 15
MeshConnectTM Module Series REFERENCES & REVISION HISTORY
Previous Versions
0007-00-07-00-000 (Issue A) February 05, 2009 0007-00-07-00-000 (Issue B) June 11, 2009 0007-00-07-00-000 (Issue C) October 6, 2009 0007-00-07-00-000 (Issue C) January 29, 2010 0007-00-07-00-000 (Issue C) April 7, 2010
Changes to Current Version Initial preliminary datasheet. Updated Development Kit and Agency Certification Added New MeshConnect Extended Range Module Removed "Prelimary" from datasheet and "Pending" from Agency Certification Added SNAP enabled modules to Ordering Information , updated module land footprint
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Disclaimer
* The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. * CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features.
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