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| PEMD14; PUMD14 NPN/PNP resistor-equipped transistors; R1 = 47 k, R2 = open Rev. 02 -- 2 September 2009 Product data sheet 1. Product profile 1.1 General description NPN/PNP resistor-equipped transistors Table 1. Product overview Package NXP PEMD14 PUMD14 SOT666 SOT363 JEITA SC-88 PEMB14 PUMB14 PEMH14 PUMH14 PNP/PNP complement NPN/NPN complement Type number 1.2 Features I I I I Built-in bias resistors Simplifies circuit design Reduces component count Reduces pick and place cost 1.3 Applications I Low current peripheral driver I Control of IC inputs I Replacement of general-purpose transistors in digital applications 1.4 Quick reference data Table 2. Symbol VCEO IO R1 Quick reference data Parameter collector-emitter voltage output current (DC) bias resistor 1 (input) Conditions open base Min 33 Typ 47 Max 50 100 61 Unit V mA k NXP Semiconductors PEMD14; PUMD14 NPN/PNP resistor-equipped transistors; R1 = 47 k, R2 = open 2. Pinning information Table 3. Pin 1 2 3 4 5 6 Pinning Description GND (emitter) TR1 input (base) TR1 output (collector) TR2 GND (emitter) TR2 input (base) TR2 output (collector) TR1 TR1 Simplified outline 6 5 4 Symbol 6 5 4 R1 TR2 1 2 3 001aab555 R1 1 2 3 006aaa269 3. Ordering information Table 4. Ordering information Package Name PEMD14 PUMD14 SC-88 Description plastic surface mounted package; 6 leads plastic surface mounted package; 6 leads Version SOT666 SOT363 Type number 4. Marking Table 5. PEMD14 PUMD14 [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China Marking codes Marking code[1] 5B T2* Type number PEMD14_PUMD14_2 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 -- 2 September 2009 2 of 11 NXP Semiconductors PEMD14; PUMD14 NPN/PNP resistor-equipped transistors; R1 = 47 k, R2 = open 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IO ICM Ptot Parameter collector-base voltage collector-emitter voltage emitter-base voltage output current (DC) peak collector current total power dissipation SOT363 SOT666 Tstg Tj Tamb Per device Ptot total power dissipation SOT363 SOT666 [1] [2] Conditions open emitter open base open collector Min - Max 50 50 5 100 100 200 200 +150 150 +150 Unit V V V mA mA mW mW C C C Per transistor; for the PNP transistor with negative polarity Tamb 25 C [1] [1] [2] -65 -65 storage temperature junction temperature ambient temperature Tamb 25 C [1] [1] [2] - 300 300 mW mW Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. Reflow soldering is the only recommended soldering method. 6. Thermal characteristics Table 7. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient SOT363 SOT666 Per device Rth(j-a) thermal resistance from junction to ambient SOT363 SOT666 [1] [2] Conditions Tamb 25 C [1] [1] [2] Min Typ Max Unit Per transistor - - 625 625 K/W K/W Tamb 25 C [1] [1] [2] - - 416 416 K/W K/W Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. Reflow soldering is the only recommended soldering method. PEMD14_PUMD14_2 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 -- 2 September 2009 3 of 11 NXP Semiconductors PEMD14; PUMD14 NPN/PNP resistor-equipped transistors; R1 = 47 k, R2 = open 7. Characteristics Table 8. Characteristics Tamb = 25 C unless otherwise specified Symbol ICBO ICEO Parameter collector-base cut-off current collector-emitter cut-off current emitter-base cut-off current DC current gain collector-emitter saturation voltage bias resistor 1 (input) collector capacitance TR1 (NPN) TR2 (PNP) VCB = -10 V; IE = ie = 0 A; f = 1 MHz 2.5 3 pF pF Conditions VCB = 50 V; IE = 0 A VCE = 30 V; IB = 0 A VCE = 30 V; IB = 0 A; Tj = 150 C VEB = 5 V; IC = 0 A VCE = 5 V; IC = 1 mA IC = 10 mA; IB = 0.5 mA Min 100 33 Typ 47 Max 100 1 50 100 150 61 mV k Unit nA A A nA Per transistor; for the PNP transistor with negative polarity IEBO hFE VCEsat R1 Cc PEMD14_PUMD14_2 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 -- 2 September 2009 4 of 11 NXP Semiconductors PEMD14; PUMD14 NPN/PNP resistor-equipped transistors; R1 = 47 k, R2 = open 103 006aaa182 103 006aaa183 hFE (1) VCEsat (mV) (2) 102 (3) (2) (1) (3) 102 10-1 1 10 I C (mA) 102 10 1 10 I C (mA) 102 VCE = 5 V (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -40 C IC/IB = 20 (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -40 C Fig 1. TR1 (NPN): DC current gain as a function of collector current; typical values Fig 2. TR1 (NPN): Collector-emitter saturation voltage as a function of collector current; typical values 1000 006aaa206 -1 006aaa207 hFE (1) (2) (3) VCEsat (V) 100 -10-1 (1) (2) (3) 10 -10-1 -1 -10 IC (mA) -102 -10-2 -10-1 -1 -10 IC (mA) -102 VCE = -5 V (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -40 C IC/IB = 20 (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -40 C Fig 3. TR2 (PNP): DC current gain as a function of collector current; typical values Fig 4. TR2 (PNP): Collector-emitter saturation voltage as a function of collector current; typical values PEMD14_PUMD14_2 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 -- 2 September 2009 5 of 11 NXP Semiconductors PEMD14; PUMD14 NPN/PNP resistor-equipped transistors; R1 = 47 k, R2 = open 8. Package outline Plastic surface-mounted package; 6 leads SOT363 D B E A X y HE vMA 6 5 4 Q pin 1 index A A1 1 e1 e 2 bp 3 wM B detail X Lp c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT363 REFERENCES IEC JEDEC JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Fig 5. Package outline SOT363 (SC-88) (c) NXP B.V. 2009. All rights reserved. PEMD14_PUMD14_2 Product data sheet Rev. 02 -- 2 September 2009 6 of 11 NXP Semiconductors PEMD14; PUMD14 NPN/PNP resistor-equipped transistors; R1 = 47 k, R2 = open Plastic surface-mounted package; 6 leads SOT666 D A E X S YS HE 6 5 4 pin 1 index A 1 e1 e 2 bp 3 wMA Lp detail X c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 0.6 0.5 bp 0.27 0.17 c 0.18 0.08 D 1.7 1.5 E 1.3 1.1 e 1.0 e1 0.5 HE 1.7 1.5 Lp 0.3 0.1 w 0.1 y 0.1 OUTLINE VERSION SOT666 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Fig 6. Package outline SOT666 (c) NXP B.V. 2009. All rights reserved. PEMD14_PUMD14_2 Product data sheet Rev. 02 -- 2 September 2009 7 of 11 NXP Semiconductors PEMD14; PUMD14 NPN/PNP resistor-equipped transistors; R1 = 47 k, R2 = open 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. [1] Type number PEMD14 PUMD14 PUMD14 [1] [2] [3] Package SOT666 SOT363 SOT363 Description 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel; T1 4 mm pitch, 8 mm tape and reel; T2 [2] [3] Packing quantity 3000 -115 -125 4000 -115 10000 -135 -165 For further information and the availability of packing methods, see Section 12. T1: normal taping T2: reverse taping PEMD14_PUMD14_2 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 -- 2 September 2009 8 of 11 NXP Semiconductors PEMD14; PUMD14 NPN/PNP resistor-equipped transistors; R1 = 47 k, R2 = open 10. Revision history Table 10. Revision history Release date 20090902 Data sheet status Product data sheet Change notice Supersedes PEMD14_PUMD14_1 Document ID PEMD14_PUMD14_2 Modifications: * * * This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. Figure 5 "Package outline SOT363 (SC-88)": updated Figure 6 "Package outline SOT666": updated Product data sheet - PEMD14_PUMD14_1 20050114 PEMD14_PUMD14_2 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 -- 2 September 2009 9 of 11 NXP Semiconductors PEMD14; PUMD14 NPN/PNP resistor-equipped transistors; R1 = 47 k, R2 = open 11. Legal information 11.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 11.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PEMD14_PUMD14_2 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 -- 2 September 2009 10 of 11 NXP Semiconductors PEMD14; PUMD14 NPN/PNP resistor-equipped transistors; R1 = 47 k, R2 = open 13. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 2 September 2009 Document identifier: PEMD14_PUMD14_2 |
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