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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
TAPE AND BOX TYPE LED LAMPS
Pb
Lead-Free Parts
LSIR3331/TBS-X-PF
DATA SHEET
DOC. NO : REV. DATE : :
QW0905- LSIR3331/TBS-X-PF A 19 - Nov. - 2004
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSIR3331/TBS-X-PF Page 1/9
Package Dimensions
P2
H
H2 H1 L W0 W1 W3 W2
D
P1 F P
T
LSIR3331-PF
5.0
5.9
7.6
8.6
1.5MAX 25.0MIN
0.5 TYP
2.54TYP
1.0MIN
+Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO.LSIR3331/TBS-X-PF Page 2/9
Features:
1. High radiant intensity. 2. Suitable for pulsed applications. 3. Low average degradation.
Descriptions:
The LSIR3331/TBS-X-PF series are super-high efficiency Gallium Aluminum Arsenide infrared emitting diodes encapsulated in blue transparent plastic T-1 3/4 package individually.
Device Selection Guide:
PART NO LSIR3331/TBS-X-PF
MATERIAL AlGaAs/GaAs
LENS COLOR Blue Transparent
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSIR3331/TBS-X-PF Page 3/9
Absolute Maximum Ratings at Ta=25
Ratings Parameter Symbol SIR Power Dissipation Peak Forward Current (300PPS,10s Pulse) Forward Current Reverse Voltage Electrostatic Discharge Operating Temperature Storage Temperature PD IFP IF Vr ESD Topr Tstg
100 1 50 5
UNIT
mW A mA V
2000 -40 ~ +85 -40 ~ +85
V
Electrical Optical Characteristics (Aa=25)
PARAMETER Radiant Intensity Aperture Radiant Incidence Peak Emission Wavelength Spectral Line Half Width Forward Voltage Reverse Current Viewing Angle SYMBOL Le Ee
Min. 8.0 1.0
Typ. 12 1.7 880 50 1.4
Max.
UNIT mW/sr mW/cm nm nm
2
TEST CONDITION IF=20mA IF=20mA IF=20mA IF=20mA IF=20mA VR=5V
peak
VF IR 21/2
1.7 100
V
A
deg
20
Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The radiant intensity data did not including 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO.LSIR3331/TBS-X-PF Page 4/9
*Dimension Symbol Information
SPECIFICATIONS SYMBOL ITEMS OPTION SYMBOL CODE
-------------------
Minimum mm inch
0.15 0.09
-------
Maximum mm
4.2 3.0 2.0 18.5 22.5 26.5 23.5 20.9 25.0 25.5 20.0 19.4 36 11 13 5.8 7.7 1.42 9.75 15.5 4.0 19
inch
0.17 0.12 0.08 0.73 0.89 1.04 0.93 0.82 0.98 1.0 0.79 0.76 1.42 0.43 0.51 0.23 0.3 0.06 0.38 0.61 0.16 0.75
Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection
D F
H
3.8 2.3
-------
TBS-1 TBS-2 TBS-3 TBS-5 Feed Hole To Bottom Of Component TBS-6 TBS-7 TBS-8 TBS-9 TBS-10 Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width
-------------------------------------------------------------
17.5 21.5 25.5 22.5 19.9 H1 24.0 24.5 19.0 18.4 H2 L P P1 P2 T W0 W1 W2 W3 12.4 4.4 5.1
-------------
0.69 0.85 1.0 0.89 0.78 0.94 0.96 0.75 0.72
-------
W0 0.49 0.17 0.2
-------
8.5 14.5 0 17.5
0.33 0.57 0 0.69
*REMARK:TBS = Tape And Box Straight Leads
*Dimensions Symbol Information
Specification Symbol mm Overall Length Overall Width Overall Thickness L W H 330 265 50 inch 13.0 10.4 1.97 mm 340 275 60 inch 13.4 10.8 2.4
*Package Dimensions
W
L
H
Part No.
LSIR3331/TBS-X-PF
Quantity/Box 2000PCS
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO.LSIR3331/TBS-X-PF Page 5/9
Typical Electro-Optical Characteristics Curve
SIR CHIP
Fig.1 Forward Current vs. Rorward Voltage
1000
Fig.2 Relative Radiant Intensity vs. Wavelength
1.0
100 10 1 0.1 0.5
Relative Radiant Intensity Normalize @20mA
Forward Current(mA)
0.5
1.0
1.5
2.0
2.5
0.0 750
800
850
900
950
1000
1050
Forward Voltage(V)
Wavelength(nm)
Fig.3 Relative Radiant Power vs. Forward DC Current
10.0
Fig.4 Relative Radiant Power vs. Forward Peak Current
10.0
Relative Radiant Power Normalize @20mA
Relative Radiant Power Normalize @100 mA
10 100
1.0
1.0
0.1 1
0.1 10
100
1000
IFDC(mA)
IFPK(mA)
Fig.5 Forward DC Voltage vs. Temperature Forward DC Voltage @20 mA Normalize @ 25
1.2
Fig.6 Relative Radiant Power vs. Temperature
3.0
Relative Radiant Power Normalize @ 20mA,25
-20 0 20 40 60 80 100
2.5 2.0 1.5 1.0 0.5 0.0 -40
1.1 1.0
0.9 0.8 -40
-20
0
20
40
60
80
100
Ambient Temperature[]
Ambient Temperature[]
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSIR3331/TBS-X-PF Page 6/9
Storage time:
1.The operation of Temperatures and RH are : 5 ~35,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ~ 35,RH<60%, they should be treated at 605 fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, require some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value.
Circuit model A LED
Circuit model B LED
(A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSIR3331/TBS-X-PF Page 7/9
Mounting:
1. If the leads are subjected to stress during soldering a printed circuit board, illumination failure may result immediately or later during use. For this reason, make sure that the intervals between the installation holes in the board are equal to the intervals between the leads (after forming if done) so that no stress is applied to the lead.
(O)
(O)
(X)
2. The LED lamps are designed for high-density mounting and have a structure which can alleviate mechanical stress due to clinching . Nevertheless , take care to avoid the occurrence of residual mechanical stress due to clinching .
15
45
Anode side(cathode side on GaAlAs chips)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO.LSIR3331/TBS-X-PF Page 8/9
Soldering Condition(Pb-Free) 1.Iron:
Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)
Temp( C) 260 C3sec Max
260
5 /sec max
120
2 /sec max Preheat 60 Seconds Max
25 0 0
50
100
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO.LSIR3331/TBS-X-PF Page 9/9
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=85 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 5 2.RH=90 %~95% 3.t=240hrs 2hrs
The purpose of this test is the resistance of the device under tropical for hous.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 5 2.Dwell time= 10 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 5 2.Dwell time=5 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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