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UBA2028
600 V dimmable power IC for compact fluorescent lamps
Rev. 01 -- 9 October 2009 Product data sheet
1. General description
The UBA2028 is a high voltage power IC that drives and controls electronically ballasted Compact Fluorescent Lamps (CFLs). The IC includes a Metal-Oxide-Semiconductor Transistor (MOST) half bridge power circuit, a dimming function, a high voltage level shift circuit, an oscillator function, a lamp voltage monitor, a current control function, a timer function and protections.
2. Features
I I I I I I I I I I I I Two internal 600 V, 3 max MOST half bridge powers. For steady state currents up to 280 mA. For ignition currents up to 1.5 A. Adjustable preheat time. Adjustable preheat current. Current controlled operating. Single ignition attempt. Adaptive non-overlap time control. Integrated high voltage level shift function. Power-down function. Protection against lamp failures or lamp removal. Capacitive mode protection.
3. Applications
I 5 W to 25 W dimmable CFLs, provided that the maximum junction temperature is not exceeded.
NXP Semiconductors
UBA2028
600 V dimmable power IC for compact fluorescent lamps
4. Quick reference data
Table 1. Quick reference data VDD = 13 V; VFS - VSH = 13 V; Tamb = 25 C; all voltages are referenced to GND; unless otherwise specified. Symbol Start-up state VDD(startup) VDD(stop) IDD Vhs Vref fmax fmin Ron ID start-up supply voltage stop supply voltage supply current high-side supply voltage reference voltage maximum frequency minimum frequency on-state resistance drain current for oscillator for oscillator oscillator start-up; VDD < VDD(startup) IHV < 30 A; t < 1 s Ileak = 10 A for bridge; CCF = 100 pF for bridge; CCF = 100 pF half bridge power pulsed; tp limited by Tj(max); T < Tj(max) 12.4 8.6 2.86 90 38.9 13.0 9.1 170 2.95 100 40.5 13.6 9.6 200 600 3.04 110 42.1 3 1.5 V V A V V kHz kHz A Parameter Conditions Min Typ Max Unit
High-voltage supply Reference voltage Voltage controlled oscillator
Half bridge power transistors
Preheat current sensor Vph Vlamp(fail) Vlamp(max) Voffset gm Preheat timer tph VOL VOH preheat time LOW-level output voltage HIGH-level output voltage CCT = 330 nF; RIREF = 33 k 1.6 1.8 1.4 3.6 2.0 s V V preheat voltage lamp fail voltage maximum lamp voltage offset voltage transconductance VCS = 0 V to 2.5 V f = 1 kHz 0.57 0.77 1.44 -2 1900 0.60 0.81 1.49 0 3800 0.63 0.85 1.54 +2 5700 V V V mV A/mV Lamp voltage sensor
Average current sensor
5. Ordering information
Table 2. Ordering information Package Name UBA2028T SO20L Description Version plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 Type number
UBA2028_1
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Product data sheet
Rev. 01 -- 9 October 2009
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Product data sheet Rev. 01 -- 9 October 2009
(c) NXP B.V. 2009. All rights reserved. UBA2028_1
6. Block diagram
NXP Semiconductors
VDD
VREF
16
3V
7 2, 3 1
Vpd BOOTSTRAP LEVEL SHIFTER HS DRIVER
FS HV
TR1
SUPPLY
reference voltages supply (5 V)
19
LS DRIVER
SH
digital analog
TR2 20 18
UBA2028
VDD(L) GND
SL GLI GL
4
DRIVER LOGIC reset
15 5
PREHEAT TIMER
STATE LOGIC
ANT/CMD
ACM
LOGIC COUNTER
LOGIC
* reset state * start-up state * preheat state * ignition state * burn state * hold state * power-down state
600 V dimmable power IC for compact fluorescent lamps
PCS
17
PCS
CT
10
VOLTAGE CONTROLLED OSCILLATOR
LOGIC LAMP VOLTAGE SENSOR
AVERAGE CURRENT SENSOR
8 9
CSP CSN
REFERENCE CURRENT
I V Vlamp(fail) Vlamp(max) FREQUENCY CONTROL
13
IREF
12
CF
6
LVS
11
014aaa906
UBA2028
CSW
Fig 1.
Block diagram
3 of 21
NXP Semiconductors
UBA2028
600 V dimmable power IC for compact fluorescent lamps
7. Pinning information
7.1 Pinning
HV FS FS GND ACM LVS VREF CSP CSN
1 2 3 4 5 6 7 8 9
20 SL 19 SH 18 GLI 17 PCS 16 VDD 15 GL 14 GND 13 IREF 12 CF 11 CSW
014aaa904
UBA2028
CT 10
Fig 2.
Pin diagram
7.2 Pin description
Table 3. Symbol HV FS FS GND ACM LVS VREF CSP CSN CT CSW CF IREF GND GL VDD PCS GLI SH SL Pin description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Description high voltage input floating supply voltage; supply for high-side switch floating supply voltage; supply for high-side switch ground capacitive mode input lamp voltage sensor input reference voltage output positive input for the average current sensor negative input for the average current sensor preheat timer output input of voltage controlled oscillator voltage controlled oscillator output internal reference current input ground gate output for the low-side switch, must be wired to pin 18 low-voltage supply preheat current sensor input gate input for the low-side switch, must be wired to pin 15. source for the high-side switch source low side switch, connected to PGND via a resistor[7]
UBA2028_1
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Product data sheet
Rev. 01 -- 9 October 2009
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NXP Semiconductors
UBA2028
600 V dimmable power IC for compact fluorescent lamps
8. Functional description
8.1 Start-up state
Initial start-up can be achieved by charging the low-voltage supply capacitor at pin 16 (see Figure 8 Figure 9) via an external start-up resistor. Start-up of the circuit is achieved under the condition that both half-bridge transistors TR1 and TR2 are non-conductive. The circuit will be reset in the start-up state. If the low-voltage supply (VDD) reaches the value of VDD(startup) the circuit will start oscillating. A DC reset circuit is incorporated in the High-Side (HS) driver. Below the lockout voltage at the FS pin the output voltage (TR1 gate voltage - VSH) is zero. The voltages at pins CF and CT are zero during the start-up state.
8.2 Oscillation
The internal oscillator is a Voltage Controlled Oscillator (VCO) circuit which generates a sawtooth waveform between the Vo(osc)max level and 0 V. The frequency of the sawtooth is determined by capacitor CCF, resistor RIREF, and the voltage at pin CSW. The minimum and maximum switching frequencies are determined by RIREF and CCF; their ratio is internally fixed. The sawtooth frequency is twice the half-bridge frequency. The UBA2028 brings the transistors TR1 and TR2 into conduction alternately with a duty cycle of approximately 50 %. An overview of the oscillator signal and driver signals is illustrated in Figure 7. The oscillator starts oscillating at fmax. During the first switching cycle the Low-Side (LS) transistor (TR2) is switched on. The first conducting time is made extra long to enable the bootstrap capacitor to charge.
8.3 Adaptive non-overlap
The non-overlap time is realized with an adaptive non-overlap timing circuit (ANT). By using an adaptive non-overlap circuit, the application can determine the duration of the non-overlap time and make it optimum for each frequency; see Figure 7. The non-overlap time is determined by the slope of the half-bridge voltage, and is detected by the signal across resistor R15 see Figure 8 (R6 in Figure 9) which is connected directly to pin ACM. The minimum non-overlap time is internally fixed. The maximum non-overlap time is internally fixed at approximately 25 % of the bridge period time. An internal filter of 30 ns is included at the ACM pin to increase the noise immunity.
8.4 Timing circuit
A timing circuit is included to determine the preheat time and the ignition time. The circuit consists of a clock generator and a counter. The preheat time is defined by CCT and RIREF connected to pins 10 and 13, and consists of 7 pulses at CCT; the maximum ignition time is 1 pulse at CCT. The timing circuit starts operating after the start-up state, as soon as the low supply voltage (VDD) has reached VDD(startup) or when a critical value of the lamp voltage (Vlamp(fail)) is exceeded. When the timer is not operating CCT is discharged to 0 V at 1 mA.
UBA2028_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 9 October 2009
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NXP Semiconductors
UBA2028
600 V dimmable power IC for compact fluorescent lamps
8.5 Preheat state
After starting at fmax, the frequency decreases until the momentary value of the voltage across sense resistor R21 (see Figure 8) or R5 (Figure 9) reaches the internally fixed preheat voltage level (pin PCS). Detection of the pre-heat voltage occurs during the end of the `on-time' of the low side switch TR2 when the internal pre-heat fixed voltage reference level is exceeded. Once detection has occurred the output current of the Preheat Current Sensor (PCS) circuit discharges the capacitor CCSW, thus raising the frequency. The internal pre-heat control is reset during each "on-time' of the high side switch TR1, thus CCSW is charged, and the frequency decreases. It remains in this condition when no detection occurs. The preheat time begins at the moment that the circuit starts oscillating. During the preheat time the Average Current Sensor (ACS) circuit is disabled. An internal filter of 30 ns is included at pin PCS to increase the noise immunity.
8.6 Ignition state
After the preheat time the ignition state is entered and the frequency will sweep down due to charging of the capacitor at pin CSW with an internally fixed current; see Figure 4. During this continuous decrease in frequency, the circuit approaches the resonant frequency of the load. This will cause a high voltage across the load, which normally ignites the lamp. The ignition voltage of a lamp is designed above the Vlamp(fail) level. If the lamp voltage exceeds the Vlamp(fail) level the ignition timer is started.
8.7 Burn state
If the lamp voltage does not exceed the Vlamp(max) level the voltage at pin CSW will continue to increase until the clamp level at pin CSW is reached; see Figure 4. As a consequence the frequency will decrease until the minimum frequency is reached. When the frequency reaches its minimum level it is assumed that the lamp has ignited and the circuit will enter the burn state. The Average Current Sensor (ACS) circuit will be enabled. As soon as the averaged voltage across sense resistor R21 (see Figure 8) or R5 (Figure 9), measured at pin CSN, reaches the reference level at pin CSP, the average current sensor circuit will take over the control of the lamp current. The average current through R21 or R5 is transferred to a voltage at the voltage controlled oscillator and regulates the frequency and, as a result, the lamp current.
8.8 Lamp failure mode
8.8.1 During ignition state
If the lamp does not ignite, the voltage level increases. When the lamp voltage exceeds the Vlamp(max) level, the voltage will be regulated at the Vlamp(max) level; see Figure 5. When the Vlamp(fail) level is crossed the ignition timer has already started. If the voltage at pin LVS is above the Vlamp(fail) level at the end of the ignition time the circuit stops oscillating and is forced into the Power-down mode. The circuit will be reset only when the supply voltage is powered down.
8.8.2 During burn state
If the lamp fails during normal operation, the voltage across the lamp will increase and the lamp voltage will exceed the Vlamp(fail) level; see Figure 6. At that moment the ignition timer is started. If the lamp voltage increases further it will reach the Vlamp(max) level. This forces the circuit to re-enter the ignition state and results in an attempt to re-ignite the lamp. If
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Product data sheet
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NXP Semiconductors
UBA2028
600 V dimmable power IC for compact fluorescent lamps
during restart the lamp still fails, the voltage remains high until the end of the ignition time. At the end of the ignition time the circuit stops oscillating and the circuit will enter the Power-down mode.
8.9 Power-down mode
The Power-down mode will be entered if, at the end of the ignition time, the voltage at pin LVS is above Vlamp(fail). In the Power-down mode the oscillator will be stopped and both TR1 and TR2 will be non-conductive. The VDD supply is internally clamped. The circuit is released from the Power-down mode by lowering the low-voltage supply below VDD(rst).
8.10 Capacitive mode protection
The signal across R15 see Figure 8 (R6 in Figure 9) also gives information about the switching behavior of the half bridge. If, after the preheat state, the voltage across the ACM resistor (R15 or R6) does not exceed the Vdet(capm) level during the non-overlap time, the Capacitive Mode Detection circuit (CMD) assumes that the circuit is in the capacitive mode of operation. As a consequence the frequency will directly be increased to fmax. The frequency behavior is de coupled from the voltage at pin CSW until CCSW has been discharged to zero.
8.11 Charge coupling
Due to parasitic capacitive coupling to the high voltage circuitry all pins are burdened with a repetitive charge injection. Given the typical application the pins IREF and CF are sensitive to this charge injection. For charge coupling of approximately 8 pC, a safe functional operation of the IC is guaranteed, independent of the current level. Charge coupling at current levels below 50 A will not interfere with the accuracy of the VCS, Vi(PCS) and Vi(ACM) levels. Charge coupling at current levels below 20 A will not interfere with the accuracy of any parameter.
8.12 Design equations
The following design equations are used to calculate the desired preheat time, the maximum ignition time, and the minimum and the maximum switching frequency. C CT R IREF t ph = 1.8 x ------------------------- x -------------------9 3 330 x 10 33 x 10 C CT R IREF t ign = 0.26 x ------------------------- x -------------------9 3 330 x 10 33 x 10 33 x 10 3 100 x 10 f min = 40.5 x 10 x --------------------------- x ------------------C CF R IREF f max = 2.5 x f min
- 12 3
(1)
(2)
(3) (4)
Start of ignition is defined as the moment at which the measured lamp voltage crosses the Vlamp(fail) level; see Section 8.8.
UBA2028_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 9 October 2009
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NXP Semiconductors
UBA2028
600 V dimmable power IC for compact fluorescent lamps
mgw582
VCF 0
V(GH-SH) 0
VGL 0
Vhalfbridge 0 VACM 0
time
Fig 3.
Oscillator and drive signals
Vlamp Vlamp(max) Vlamp(fail)
preheat state
ignition state
burn state
f min detection
Timer on off time
mgw583
Fig 4.
Normal ignition behavior
UBA2028_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 9 October 2009
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NXP Semiconductors
UBA2028
600 V dimmable power IC for compact fluorescent lamps
Vlamp Vlamp(max) Vlamp(fail)
preheat state
ignition state
power-down state
Timer on off time
timer ended
mgw584
Fig 5.
Failure mode during ignition
Vlamp Vlamp(max) Vlamp(fail)
burn state
ignition state
power-down state
Timer on off
timer started
timer ended time
mgw585
Fig 6.
Failure mode during burn
UBA2028_1
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Product data sheet
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NXP Semiconductors
UBA2028
600 V dimmable power IC for compact fluorescent lamps
8.13 Layout considerations
The connection of PGND and GND is shown in Figure 7
VDD GND
HV SH
GND PGND IREF CT CF CSW VREF CSP CSN PGND ACM
UBA2028
SL PCS
014aaa938
Fig 7.
PGND and GND connection
UBA2028_1
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Product data sheet
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UBA2028
600 V dimmable power IC for compact fluorescent lamps
9. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages referenced to GND. Symbol VHV ID Parameter voltage on pin HV drain current Conditions operating; during 1 s operating TR1 pulsed; tp limited by Tj(max); T < Tj(max) TR2 pulsed; tp limited by Tj(max); T < Tj(max) VVDD VFS Vi(ACM) Vi(PCS) Vi(LVS) Vi(CSP) Vi(CSN) Vi(CSW) SR Tamb Tj Tstg VESD voltage on pin VDD voltage on pin FS input voltage on pin ACM input voltage on pin PCS input voltage on pin LVS input voltage on pin CSP input voltage on pin CSN input voltage on pin CSW slew rate ambient temperature junction temperature storage temperature electrostatic discharge voltage pin HV pins FS, SH pin GL pin GL
[1] [2]
[1] [1] [1] [2]
Min -
Max 600 510 1.5 1.5 14 14 +5 +5 5 5 +5 5 +4 +80 +150 +150 1500 1000 < 500 150
Unit V V A A V V V V V V V V V/ns C C C V V V V
with respect to SH
0 -5 -5 0 0 -0.3 0
pin SH; repetitive
-4 -25 -25 -55 -
In accordance with the human body model, i.e. equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. In accordance with the machine model, i.e. equivalent to discharging a 200 pF capacitor through a 0.75 H coil and a 10 resistor.
10. Thermal characteristics
Table 5. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions SO20L; in free air Typ 75 Unit K/W
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Product data sheet
Rev. 01 -- 9 October 2009
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UBA2028
600 V dimmable power IC for compact fluorescent lamps
11. Characteristics
Table 6. Characteristics VDD = 13 V; VFS - VSH = 13 V; Tamb = 25 C; all voltages referenced to GND; see application circuits of [8] [9] unless otherwise specified. Symbol VDD VDD(rst) VDD(startup) VDD(stop) VDD(hys) Vclamp(VDD) IDD IDD(pd) Vhs Ileak Vref Vref/Vref Isource Isink Zo VI II Parameter supply voltage reset supply voltage start-up supply voltage stop supply voltage hysteresis of supply voltage clamp voltage on pin VDD supply current power-down supply current high-side supply voltage leakage current reference voltage relative reference voltage variation source current sink current output impedance input voltage input current reference range Ileak = 1 mA source Conditions for defined driver output; TR1 = off; TR2 = off TR1 = off; TR2 = off for oscillator for oscillator for start-stop Power-down mode oscillator start-up; VDD < VDD(startup) VDD = 9 V IHV < 30 A; t < 1 s 600 V at high-voltage pins Ileak = 10 A Ileak = 10 A; Tamb = 25 C to 150 C Min 4.5 12.4 8.6 3.5 10 2.86 1 1 65 Typ 5.5 13.0 9.1 3.9 11 170 170 2.95 -0.64 3.0 2.5 Max 6 7.0 13.6 9.6 4.4 12 200 200 600 30 3.04 95 Unit V V V V V V A A V A V % mA mA V A Start-up state: pin VDD
High voltage supply: pins HV, SH and FS
Reference voltage: pin VREF
Current supply: pin IREF
Voltage controlled oscillator Output: pin CSW VO Vclamp fmax fmin f/f tstart tno(min) tno(max) VO(osc)max output voltage clamp voltage maximum frequency minimum frequency relative frequency variation start time minimum non-overlap time maximum non-overlap time maximum oscillator output voltage for control burn state for bridge; CCF = 100 pF for bridge; CCF = 100 pF Tamb = -20 C to +80 C first output oscillator stroke TR1 to TR2 gate voltages TR2 to TR1 gate voltages fbridge = 40 kHz f = fmin
[1]
2.7 2.8 90 38.9 0.68 0.75 -
3.0 3.1 100 40.5 1.3 50 0.90 1.00 7.5 2.5
3.3 3.4 110 42.1 1.13 1.25 -
V V kHz kHz % s s s s V
Voltage controlled oscillator output: pin CF
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Product data sheet
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UBA2028
600 V dimmable power IC for compact fluorescent lamps
Table 6. Characteristics ...continued VDD = 13 V; VFS - VSH = 13 V; Tamb = 25 C; all voltages referenced to GND; see application circuits of [8] [9] unless otherwise specified. Symbol Io(startup) Iosc Output driver Low-side driver output: pin GL VOH VOL IO(source) Isink(o) Ron Roff Output stage Power transistors Ron on-state resistance TR1 high side power TR2 low side power Ron(150)/Ron(25) on-state resistance ratio (150 C to 25 C) Floating supply voltage: pin FS VFS IFS Bootstrap diode VFd(bs) Input: pin PCS II Vph Isource(o) Isink(o) II Vdet(capm) Input: pin LVS II Vlamp(fail) Vlamp(fail)hys Vlamp(max) Isink(o)
UBA2028_1
Parameter start-up output current oscillator current
Conditions for oscillator; VCF = 1.5 V VCF = 1.5 V
Min 3.8 21
Typ 4.5 -
Max 5.2 54
Unit A A
HIGH-level output voltage LOW-level output voltage output source current output sink current on-state resistance off-state resistance
Io = 10 mA Io = 10 mA VGL = 0 V VGL = 13 V Io = 10 mA Io = 10 mA
12.5 135 265 32 16
180 330 39 21
0.5 235 415 45 26
V V mA mA
-
2.7
3 3 -
-
voltage on pin FS current on pin FS
for lockout DC level at TR1 gate voltage - VSH = 13 V I = 5 mA
2.8 -
3.5 35
4.2 -
V A
bootstrap diode forward voltage
1.3
1.7
2.1
V
Preheat current sensor input current preheat voltage output source current output sink current input current capacitive mode detection voltage Vi(CSW) = 2.0 V Vi(CSW) = 2.0 V Vi(ACM) = 0.6 V positive negative Vi(LVS) = 0.81 V Vi(PCS) = 0.6 V 0.57 9.0 80 -68 0.77 119 1.44 Vi(CSW) = 2.0 V 27 0.60 10 10 100 -85 0.81 144 1.49 30 1 0.63 11 1 120 -102 1 0.85 169 1.54 33 A V A A A mV mV A V mV V A
Output: pin CSW
Adaptive non-overlap and capacitive mode detection; pin ACM
input current lamp fail voltage lamp fail voltage hysteresis maximum lamp voltage output sink current
Output: pin CSW
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Product data sheet
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UBA2028
600 V dimmable power IC for compact fluorescent lamps
Table 6. Characteristics ...continued VDD = 13 V; VFS - VSH = 13 V; Tamb = 25 C; all voltages referenced to GND; see application circuits of [8] [9] unless otherwise specified. Symbol Isource(o) Parameter output source current Conditions Vi(CSW) = 2.0 V Min 9.0 Typ 10 Max 11 Unit A
Average current sensor Input: pins CSP and CSN II Voffset gm Io input current offset voltage transconductance output current VCS = 0 V Vi(CSP) = Vi(CSN) = 0 V to 2.5 V f = 1 kHz source and sink; Vi(CSW) = 2 V CCT = 330 nF; RIREF = 33 k CCT = 330 nF; RIREF = 33 k Vo(CT) = 2.5 V -2 1900 85 0 3800 95 1 +2 5700 105 A mV A/mV A
Output: pin CSW
Preheat timer; pin CT tph tign Io VOL VOH Vhys
[1]
preheat time ignition time output current LOW-level output voltage HIGH-level output voltage hysteresis voltage
1.6 5.5 -
1.8 0.32 5.9 1.4 3.6 2.20
2.0 6.3 2.35
s s A V V V
for output
2.05
The maximum non-overlap time is determined by the level of the CF signal. If this signal exceeds a level of 1.25 V, the non-overlap will end, resulting in a maximum non-overlap time of 7.5 s at a bridge frequency of 40 kHz.
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Product data sheet
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UBA2028
600 V dimmable power IC for compact fluorescent lamps
12. Application information
D1D1 HER107 C2 22 F 200V R1 L FUSISTOR 2.2 1 W C5 100 nF 400 V C8 22 nF 250 V R9 47 k D1C1 HER107
120 V AC 60 Hz C11 3.9 nF 1000 V
R19 1 k N.M.
D8 1N4148 C6 22 nF 250 V
R14 150 k
D3 75V
R12 0
D12 5.1 V
R26 22 k C22 470 nF 50V C27 4.7 F 50V
C4 3.3 nF 250 V N.M. D1B1 HER107 D1A1 HER107
N L2 6.8 mH
R13 120 k
C10 1nF 700V
C16 470nF 50V
R11 68 k
R2 33 k
C1 22 F 200V
R8 220 k
R10 110 k 12 V R6 27 k C12 100 nF D5 1N4148 L1A1 1.8 H C31 82 nF 250 V L1B1 1.8 H C30 82 nF 250 V
HV
R23 6.8 M
VDD 16 3
FS
FS 2 SH 19 GLI
R12 22 k N.M.
C13 100 nF L1 2.5 mH
VREF CSP IREF CF
1 7 8
C17 68 nF C15 1 nF 1000 V
CFL 18 W 150 V RMS
18 13 12 10 9 11 6 4 GND 14 GND 20 SL 17 5
UBA2028
15
GL CSN
C14 1 nF 400 V
R7 33 k C25 100 pF C9 220 nF C20 220 nF
CT CSW LVS
ACM
C26 5.6 nF
D23 12 V
PCS
R21 1
R15 2.4 1W
C23 10 nF N.M.
R16 5.1 k
R17 1 k R18 33 1W
D5 1N4935 C21 470 nF D7 1N4935
014aaa916
Fig 8.
Application circuit 120 V
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Product data sheet
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UBA2028
600 V dimmable power IC for compact fluorescent lamps
Cin 1800 pF 1000 V R3 220 k R12 330 k R7 62 k C5 100 nF D4 BAS16H D2 RS1PJ D16 RS1PJ C6 100 nF R20 220 k 0.5 W C1 10 F 400 V L3 2.5 mH C19 47 nF 400 V C20 3.9 nF 1000 V D3 12 V
HV FS FS
1 2 3
20 19 18 17
SL SH GLI PCS VDD GL GND IREF CF CSW
C3 220 nF R5 12W
C8 1 nF 1000 V
GND
R9 220 k 0.5 W
C7 5.6 nF
4 5 6 7 8 9 10
ACM LVS
R28
UBA2028
16 15 14 13 12 11
R6 2.4
L3A 1.8 H C22 220 nF
L3B 1.8 H C23 220 nF
VREF
3 M
D11 5.1 V C28 4.7 F R21 22 k
D8 BAS16H R22 22 k
R 19 22 k R13 22 k
CSP CSN
EF20-CFL
C29 4.7 F
CT
R4 33 k
D1 V+ AC 2 1
DFS10S V- 4 AC 3
C2 220 nF R10 1 k C9 10 nF C4 100 pF
C12 47 nF 400 V L1 8.2 mH C11 47 nF 400 V R1 4.7 1W C30 470 pF R8 33 k D7 RS1PD R14 15 1W C27 470 nF D5 RS1PD
R15 30 2W
D6 RS1PD
L
230 V AC
N
014aaa917
Fig 9.
Application circuit 230 V
13. Test information
13.1 Quality information
13.1.1 Safety: Electric, Magnetic and ElectroMagnetic Fields (EMF)
* NXP Semiconductors manufactures and sells many products, which, like any
electronic apparatus, in general may have the ability to emit and receive electromagnetic signals.
* One of NXP Semiconductors' leading business principles is to take health and safety
measures for our products, to comply with all applicable legal requirements and to stay well within the EMF standards applicable at the time of printing this document for each individual product.
* NXP Semiconductors aims, at all times, to supply safe products and services.
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Product data sheet
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UBA2028
600 V dimmable power IC for compact fluorescent lamps
* The consensus of scientific opinion is that EMF exposure below the limits prescribed
by safety standards and recommendations, applicable at the time of printing this document, poses no risk to human health.
* NXP Semiconductors plays an active role in the development of international EMF
and safety standards, enabling NXP Semiconductors to anticipate further developments in standardization for early integration in its products.
* Additional information can be obtained from:
- Institute of Electrical and Electronic Engineers (www.ieee.org) - Office of Communications (www.ofcom.org.uk) - EU pages on EMF and Public Health (ec.europa.eu/health/index_en.htm).
UBA2028_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 9 October 2009
17 of 21
NXP Semiconductors
UBA2028
600 V dimmable power IC for compact fluorescent lamps
14. Package outline
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)
0.9 0.4
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
0.035 0.004 0.016
8 o 0
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 10. Package outline SOT163-1 (SO20)
UBA2028_1 (c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 9 October 2009
18 of 21
NXP Semiconductors
UBA2028
600 V dimmable power IC for compact fluorescent lamps
15. Revision history
Table 7. Revision history Release date 20091009 Data sheet status Product data sheet Change notice Supersedes Document ID UBA2028_1
UBA2028_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 9 October 2009
19 of 21
NXP Semiconductors
UBA2028
600 V dimmable power IC for compact fluorescent lamps
16. Legal information
16.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
16.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
UBA2028_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 9 October 2009
20 of 21
NXP Semiconductors
UBA2028
600 V dimmable power IC for compact fluorescent lamps
18. Contents
1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.8.1 8.8.2 8.9 8.10 8.11 8.12 8.13 9 10 11 12 13 13.1 13.1.1 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Oscillation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Adaptive non-overlap . . . . . . . . . . . . . . . . . . . . 5 Timing circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Preheat state . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Ignition state . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Burn state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Lamp failure mode . . . . . . . . . . . . . . . . . . . . . . 6 During ignition state . . . . . . . . . . . . . . . . . . . . . 6 During burn state . . . . . . . . . . . . . . . . . . . . . . . 6 Power-down mode . . . . . . . . . . . . . . . . . . . . . . 7 Capacitive mode protection . . . . . . . . . . . . . . . 7 Charge coupling . . . . . . . . . . . . . . . . . . . . . . . . 7 Design equations . . . . . . . . . . . . . . . . . . . . . . . 7 Layout considerations . . . . . . . . . . . . . . . . . . . 10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11 Thermal characteristics. . . . . . . . . . . . . . . . . . 11 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12 Application information. . . . . . . . . . . . . . . . . . 15 Test information . . . . . . . . . . . . . . . . . . . . . . . . 16 Quality information . . . . . . . . . . . . . . . . . . . . . 16 Safety: Electric, Magnetic and ElectroMagnetic Fields (EMF) . . . . . . . . . . . . 16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Contact information. . . . . . . . . . . . . . . . . . . . . 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 9 October 2009 Document identifier: UBA2028_1

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