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Connector for microSDTM Card (Push-push Type)
SCHA Series
Compact low-profile type most suitable for mobile phones.
For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM For Memory StickTM Combine Type For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module Structure Mounting style Media ejection structure Operating temperature range Voltage proof Insulation resistance Initial Contact resistance Initial Connector contacts Detection switch
Standard mount/Reverse mount Push-push type 20 to 70
Features
Improved operability from a clear click feel. Good operational feel.
Applications
For mobile phones, personal digital assistants, digital still cameras, compact audio equipment.
Typical Specifications
Items Applicable media Mounting type Specifications
microSDTM Card Surface mounting type
500V AC 1minute 1,000M 100m 500m 5,000cycles min.
Performance
Insertion and removal cycle
Product Line
Media ejection structure Mounting system Features
Without switch Standard mount Push-push type With switch Reverse mount SCHA2B0300 3 0 Taping SCHA1B0100 2
Stand-off mm
Packing system
Product No.
SCHA1A0101
Drawing No.
1
16
Connector for microSDTM Card (Push-push Type) SCHA Series
Dimensions
Standard mount
No. Without switch
14 1.3 1.9
9.4 6.85 6.1 5.7 1.8 1.8 14
Unit:mm
Style PC board mounting hole dimensions Viewed from the mounting face side For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM For Memory StickTM Combine Type
12.9 Card center No parts area Land area 1.4
0.3
0.7 2.6
16.7 /Card insertion
1 /Over travel
14.2
14.8 15.2
12.6 9.85 7.4 7.2
2.9 13.6 0.8 1.5 1.9 P=1.1 7.7
1
7.7 3 /Eject travel
1.9
Card center
1.45 0.3 1.24
Card center
Connector center
0.3
P=1.1
0.3
1.4
1.15
For Compact FlashTM For PC cards supporting CardBus For Express CardTM
0.8
No pattern area
With switch
14 Card detect switch 1.3 1.9
0.15 1.20 14 13.85 12.55 1.3
0.3
1.4
0.7
4.6
9.2 9.4
17.8 Card insertion
1 Over travel
15.50
16
6.1 0.3 1.5
0.8 0.3 P=1.1
2
0.3
2.9
1.3 1.24
7.7 (5.7) 7
0.2 max.
13
1.3
2.8 Eject travel
0.3 Card center Connector center
Card center
Connector center
Land area No pattern area No parts area
1.5
11.25 12.75 14.2 16
1.5
0.3
9.4
1.4
Common switch
For CMOS Camera Module
17
Connector for microSDTM Card (Push-push Type) SCHA Series
Dimensions
Reverse mount
No. For SD Memory Card For microSDTM Card For SIM Card 8pins
13 12.2
Unit:mm
Style PC board mounting hole dimensions Viewed from the mounting face side
With switch
0.85 14 3.81 0.85 Card detect switch 1.9
9.16 7.96 7.46 5.06 3.26 7.24 6.04 5.54 5.34 1.8
0.95 Common
0.4
2.4 1.6 0.8
For W-SIM For Memory Stick MicroTM For Memory StickTM Combine Type For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module
3
1.9 2 4-1.2 10-0.3
3.2 2.4
1.6 0.8
10-0.6 Connector center Card center Land area No parts area 1.8 0.96
3.2
13 12.2
1 Over travel Eject travel 2.85
Connector center
Card center 0.35
18
1.8
0.96
1.9
2.55
13.55
Pin1 Dummy Pin2 Pin3 Pin4
Pin8 Dummy Pin7 Pin6 Pin5
1.8
16.1
1
Small Memory Card Connectors
Soldering Conditions
Example of Reflow Soldering Condition Reference
1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2 CA K or CC T . 3. Temperature profile Surface of products
For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM For Memory StickTM Combine Type
240 (max.) Temperature (C ) 230 (min.) 200 180 150 100 Time (s) Pre-heating 90 30 sec. 10 sec.(max.)
Room temperature
Heating time
For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module
sec.
Cautions for using this product
1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.
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