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| DATA SHEET GaAs INTEGRATED CIRCUIT PG2053K GaAs MMIC DBS 4 x 2 IF SWITCH MATRIX FEATURES * HIGH ISOLATION * CONTROL VOLTAGE : ISL = 38 dB TYP. @ f = 0.95 to 2.15 GHz, VCONT = +5.0 V/0 V : VCONT (H) = +4.5 to +5.5 V (+5.0 V TYP.) : VCONT (L) = -0.5 to +0.5 V (0 V TYP.) * LOW INSERTION LOSS : LINS = 6.0 dB TYP. @ f = 0.95 to 2.15 GHz, VCONT = +5.0 V/0 V, ZO = 50 * 20-PIN 4 x 4 mm SQUARE MICRO LEAD PACKAGE (20-pin plastic QFN (0.5 mm pitch)) APPLICATIONS * Direct Broadcast Satellite (DBS) * Switch Box * 4 x 2 switch matrix to L, S band applications ORDERING INFORMATION Part Number Package 20-pin plastic QFN (0.5 mm pitch) Marking G2053 Supplying Form * Embossed tape 12 mm wide * Pin 1 to 5 face the perforation side of the tape * Qty 3 kpcs/reel PG2053K-E3 Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PG2053K Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PG10503EJ01V0DS (1st edition) Date Published June 2004 CP(K) Printed in Japan NEC Compound Semiconductor Devices, Ltd. 2004 PG2053K ABSOLUTE MAXIMUM RATINGS (TA = +25C, unless otherwise specified) Parameter Supply Voltage Control Voltage Total Power Dissipation Input Power Operating Ambient Temperature Storage Temperature Symbol VDD VCONT1 to 4 Ptot Pin TA Tstg Ratings -1.0 to +6.0 -1.0 to +6.0 2 Note Unit V V W dBm C C +10 -40 to +85 -65 to +150 Note Mounted on double-sided copper-clad 50 x 50 x 1.6 mm epoxy glass PWB, TA = +85C RECOMMENDED OPERATING CONDITIONS (TA = +25C) Parameter Supply Voltage Control Voltage (H) Control Voltage (L) Symbol VDD VCONT (H) VCONT (L) MIN. +4.5 +4.5 -0.5 TYP. +5.0 +5.0 0 MAX. +5.5 +5.5 +0.5 Unit V V V ELECTRICAL CHARACTERISTICS (TA = +25C, VDD = +5.0 V, VCONT = +5.0 V/0 V, Pin = 0 dBm, ZO = 50 , each port, unless otherwise specified) Parameter Insertion Loss Insertion Loss Flatness Isolation D/U-ratio Note 1 Symbol LINS Test Conditions f = 0.95 to 2.15 GHz LINS (0.95 GHz) - LINS (2.15 GHz) f = 0.95 to 2.15 GHz f = 0.95 to 2.15 GHz VCONT = +5.0 V/0 V, non-RF VCONT = +5.0 V/0 V, non-RF MIN. - - 35 10 - - TYP. 6.0 0.5 38 15 - - MAX. 8.0 1.5 - - 0.5 2.0 Unit dB dB dB dB mA mA LINS ISL RLout ICONT IDD Output Return Loss Control Current Supply Current Note 2 Notes 1. Isolation D/U-ratio = (Signal leakage (off-state)) - (Insertion loss (on-state)) 2. Per 1 control pin 2 Data Sheet PG10503EJ01V0DS PG2053K PIN CONNECTIONS Pin No. Pin Name VCONT1 N.C. GND IN-A VCONT2 IN-B GND VDD GND IN-D Pin No. 11 12 13 14 15 16 17 18 19 20 Pin Name VCONT4 IN-C GND N.C. VCONT3 OUT2 GND N.C. GND OUT1 (Top View) (GND) 6 7 8 9 10 (GND) 11 12 13 14 15 54321 (GND) (GND) 20 19 18 17 16 (GND) 20 19 18 17 16 (GND) (Bottom View) 12345 (GND) 6 7 8 9 10 (GND) 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 GND Remark N.C. : Non Connection Data Sheet PG10503EJ01V0DS 3 PG2053K TRUTH TABLE State ON CHANNEL OUT1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 IN-D IN-C IN-B IN-A OUT2 IN-A IN-B IN-C IN-D IN-A IN-B IN-C IN-D IN-A IN-B IN-C IN-D IN-A IN-B IN-C IN-D VCONT1 Low Low Low Low Low Low Low Low High High High High High High High High CONTROL PINS VCONT2 Low Low Low Low High High High High Low Low Low Low High High High High VCONT3 Low Low High High Low Low High High Low Low High High Low Low High High VCONT4 Low High Low High Low High Low High Low High Low High Low High Low High Remark High : +5 Vdc, Low : 0 Vdc. FUNCTIONAL DIAGRAM VCONT2 IN-A GND VCONT1 N.C. GND GND IN-B GND VDD GND IN-D 4 : 16 DECODER OUT1 GND N.C. GND OUT2 GND GND VCONT4 VCONT3 IN-C N.C. GND 4 Data Sheet PG10503EJ01V0DS PG2053K EVALUATION CIRCUIT (VDD = +5.0 V, VCONT = +5.0 V/0 V, ZO = 50 ) VCONT2 VCONT1 IN-A 56 1 000 pF DC Blocking Capacitor C = 56 pF GND N.C. 56 1 000 pF IN-B 56 pF GND GND 1 000 pF 56 VDD GND IN-D 56 pF GND GND N.C. OUT1 GND GND N.C. GND OUT2 DC Blocking Capacitor GND C = 56 pF 56 pF 1 000 pF 56 IN-C VCONT4 56 pF 1 000 pF 56 VCONT3 Back Side : GND The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Data Sheet PG10503EJ01V0DS 5 PG2053K TYPICAL CHARACTERISTICS (TA = +25C, VDD = +5.0 V, VCONT = +5.0 V/0 V, Pin = 0 dBm, ZO = 50 , unless otherwise specified) INSERTION LOSS vs. FREQUENCY 0 -1 0 -10 SIGNAL LEAKAGE vs. FREQUENCY -3 -4 -5 -6 -7 -8 -9 -10 0 0.5 SIGNAL LEAKAGE (dB) 3.0 Insertion Loss LINS (dB) -2 Other mode -20 -30 -40 -50 -60 -70 -80 -90 -100 0 On channel mode : AA, BB, CC,DD 1.0 1.5 2.0 2.5 0.5 1.0 1.5 2.0 2.5 3.0 Frequency f (GHz) Frequency f (GHz) INPUT RETURN LOSS vs. FREQUENCY 0 -5 OUTPUT RETURN LOSS vs. FREQUENCY 0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 0 0.5 1.0 1.5 2.0 2.5 3.0 Input Return Loss RLin (dB) -10 -15 -20 -25 -30 -35 -40 -45 -50 0 0.5 Input selected Input deselected 1.0 1.5 2.0 2.5 3.0 Frequency f (GHz) Output Return Loss RLout (dB) Frequency f (GHz) Remark The graphs indicate nominal characteristics. 6 Data Sheet PG10503EJ01V0DS PG2053K INSERTION LOSS vs. ON CHANNEL MODE -3.0 f = 0.95 GHz Insertion Loss LINS (dB) Insertion Loss LINS (dB) INSERTION LOSS vs. ON CHANNEL MODE -3.0 f = 1.5 GHz -4.0 -4.0 -5.0 -5.0 -6.0 -6.0 -7.0 -8.0 AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD ON CHANNEL MODE -7.0 -8.0 AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD ON CHANNEL MODE INSERTION LOSS vs. ON CHANNEL MODE -3.0 f = 2.15 GHz Isolation D/U-Ratio ISL (dB) Insertion Loss LINS (dB) ISOLATION D/U-RATIO vs. ON CHANNEL MODE -30 f = 0.95 GHz -35 -40 -45 -50 -55 -60 -4.0 -5.0 -6.0 -7.0 -8.0 AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD ON CHANNEL MODE AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD ON CHANNEL MODE ISOLATION D/U-RATIO vs. ON CHANNEL MODE -30 f = 1.5 GHz Isolation D/U-Ratio ISL (dB) ISOLATION D/U-RATIO vs. ON CHANNEL MODE -30 f = 2.15 GHz Isolation D/U-Ratio ISL (dB) -35 -40 -45 -50 -55 -60 AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD ON CHANNEL MODE -35 -40 -45 -50 -55 -60 AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD ON CHANNEL MODE Remark The graphs indicate nominal characteristics. Data Sheet PG10503EJ01V0DS 7 PG2053K ISOLATION D/U-RATIO vs. OPERATING AMBIENT TEMPERATURE -30 f = 0.95 GHz ISOLATION D/U-RATIO vs. OPERATING AMBIENT TEMPERATURE -30 f = 1.5 GHz Isolation D/U-Ratio ISL (dB) -35 -40 -45 -50 -55 -60 -40 -30 -20 -10 0 Isolation D/U-Ratio ISL (dB) 10 20 30 40 50 60 70 80 90 -35 -40 -45 -50 -55 -60 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Operating Ambient Temperature TA (C) Operating Ambient Temperature TA (C) Output Power Pout (dBm) 3rd Order Intermoduration Distortion IM3 (dBc) ISOLATION D/U-RATIO vs. OPERATING AMBIENT TEMPERATURE -30 f = 2.15 GHz OUTPUT POWER, IM3 vs. INPUT POWER 40 20 0 Pout -20 -40 IM3 -60 -80 freq1 = 2.150 GHz freq2 = 2.151 GHz 0 10 20 30 40 50 OIP3 = +30 dBm Isolation D/U-Ratio ISL (dB) -35 -40 -45 -50 -55 -60 -40 -30 -20 -10 0 -100 -120 -10 10 20 30 40 50 60 70 80 90 Operating Ambient Temperature TA (C) Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. 8 Data Sheet PG10503EJ01V0DS PG2053K PACKAGE DIMENSIONS 20-PIN 4 x 4 mm SQUARE MICRO LEAD PACKAGE (20-PIN QFN (0.5 mm pitch)) (UNIT: mm) (Top View) 4.150.15 3.800.1 Pin 1 Identifier (Side View) 0.90.1 0.01+0.04 -0.01 Pin 1 4.150.15 3.800.1 (Bottom View) 0.6 MAX. 0.23+0.07 -0.05 Pin 1 Identifier 0.6 MAX. Pin 1 1.9 1.9 0. 45 0.45+0.2 -0.1 0.50 0. 20 Data Sheet PG10503EJ01V0DS 9 PG2053K RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 Condition Symbol IR260 For soldering Caution Do not use different soldering methods together (except for partial heating). 10 Data Sheet PG10503EJ01V0DS PG2053K * The information in this document is current as of June, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 Data Sheet PG10503EJ01V0DS 11 PG2053K Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth. For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0406 |
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