View PE9309_4493518.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Preliminary Specification
PE9309
Product Description
The PE9309 is a high-performance dynamic UltraCMOSTM prescaler with a fixed divide ratio of 4. Its operating frequency range is 3.0 GHz to 13.5 GHz. The PE9309 operates on a single supply with a frequency-selecting bias resistor and draws only 16 mA. It is packaged in a small 8-lead Flat Pack and is also available in Die form for Hybrid application. The PE9309 is manufactured on Peregrine's UltraCMOSTM process, a patented variation of silicon-on-insulator (SOI) technology on a sapphire substrate, offering the performance of GaAs with the economy and integration of conventional CMOS. Typical Industries
* * * * * * *
3.0 - 13.5 GHz Low Power UltraCMOSTM Divide-by-4 Prescaler Features * High-frequency operation: up to 13.5 GHz
* Fixed divide ratio of 4 * Low-power operation:16 mA typical @
2.6V
* Small package: 8-lead Formed Flat pack * Available as Die
Figure 2. Package Type
8-lead CSOIC
Medical Automotive Telecom Infrastructure Test Instrumentation Down-hole oil/gas Military Screening available for commercial space applications
Figure 1. Functional Schematic Diagram
D
ESD
SET
Q Q
D
SET
Q Q
ESD
CLR
CLR
Output Buffer Chip Boundary
Table 1. Electrical Specifications (ZS = ZL = 50 ) -40 C TA 85 C, unless otherwise specified
Parameter
Frequency Output Power (Pout) Input Power (Pin) 0.75 GHz Fout 3.375 GHz 3.0 GHz Fin < 13.5 GHz
Conditions
Minimum
3.0 0 0
Typical
Maximum
13.5
Units
GHz dBm
7
dBm
Document No. 70-0241-04 www.psemi.com
(c)2007-2009 Peregrine Semiconductor Corp. All rights reserved. Page 1 of 6
PE9309
Preliminary Specification
Figure 3. Pin Configuration (Top View)
VBYPS VBYPS RF IN GND 1 2 8 7 RBIAS VDD RF OUT NC
Table 4. Absolute Maximum Ratings
Symbol
VDD TST TOP VESD PINMAX
Parameter/Conditions
DC Supply voltage Storage temperature range Operating temperature range ESD voltage (Human Body Model) Maximum input power
Min
Max
3.0
Units
V C C V dBm
-65 -40
150 85 250 14
9309
3 6
Top View
4 5
Side View
GND
Table 2. Pin Descriptions
Pin No. Pin Name
1 2 3 4 5 6 7 8 GND VBYPS VBYPS IN GND NC OUT VDD RBIAS GND
Exceeding absolute maximum ratings may cause permanent damage. Operation should be restricted to the limits in the Operating Ranges table. Operation between operating range maximum and absolute maximum for extended periods may reduce reliability.
Description
Prescaler Supply Bypass Prescaler Supply Bypass RF Input Ground Not Connected RF Output. Supply Voltage Frequency-Selecting Bias Resistor Bottom of the package is Ground. Connecting the bottom of the package to ground is required
Device Functional Considerations
The PE9309 divides a 3.0 GHz to 13.5 GHz input signal by four, producing a 750 MHz to 3.375 GHz output signal. In order for the prescaler to work properly, several conditions need to be adhered to. It is crucial that pins 1, 2 and 7 be supplied with bypass capacitors to ground. In addition, the output signal (pins 6) needs to be ac coupled via an external capacitor as shown in the test circuit in Figure 5. The input frequency range is selected by the value of RBIAS according to Figure 4. The ground pattern on the board should be made as wide as possible to minimize ground impedance.
Table 3. Operating Ranges
Parameter
Supply Voltage (VDD) Supply Current (IDD)
Min
2.45 6
Typ
2.6
Max
2.75 23
Units
V mA
The bottom of the package is the primary ground connection and it needs to be soldered to the PCB ground.
Figure 4. Frequency versus RBIAS
15 14 13 12 Frequency (GHz) 11 10 9 8 7 6 5 4 3 2 0 5 10 15 20 25 30 35 40 45 50 55 60 RBIAS (KOhm) Lower Freq Lim Optimal Freq Lim Upper Freq Lim
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOSTM device, observe the same precautions that you would use with other ESD-sensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the specified rating.
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOSTM devices are immune to latch-up.
(c)2007-2009 Peregrine Semiconductor Corp. All rights reserved. Page 2 of 6
Document No. 70-0241-04 UltraCMOSTM RFIC Solutions
PE9309
Preliminary Specification
Figure 5. Test Circuit Block Diagram
1 2 0.01F 10 pF 3
VBYPS VBYPS
RBIAS VDD
8 7
RBIAS
10 pF
9309
IN GND OUT NC 6 10 pF 4 5 0.01F
VDD
50
T Line*
Spectrum Analyzer 6.8 pF RF Source T Line* Side View *T Line = Transmission Line
GND
50
Figure 6. High Frequency System Application The wideband frequency of operation of the PE9309 makes it an ideal part for use in a DBS down converter system.
INPUT DBS 1
st
BPF
SAW
AGC
IF
FM DEMOD
BASEBAND OUTPUT
DIVIDE BY 4
PE97632
9309
LOW NOISE PLL SYNTH
LPF
Document No. 70-0241-04 www.psemi.com
(c)2007-2009 Peregrine Semiconductor Corp. All rights reserved. Page 3 of 6
PE9309
Preliminary Specification
Evaluation Kit
The Ceramic SOIC Prescaler Evaluation Board was designed to help customers evaluate the PE9309 divide-by-4 prescaler. On this board, the device input (pin 3) is connected to the SMA connector J5 through a 50 transmission line. The device output (pin 6) is connected to SMA connector J6 through a 50 transmission line. J4 provides DC power to the device via pin 7. J2 powers U2. Multiple decoupling capacitors (C4,6,13,16=10pF, C3,5,14,15=0.01uF) are used. One out of eight different resistors for RBIAS is selected by toggling SW1, SW2 and SW3 according to the table shown in Figure 8. Jumper on J3 should be on to lower setting (1 and 2). It is the responsibility of the customer to determine proper supply decoupling for their design application. The board is constructed using 4 layers. The top and bottom layers are comprised of Rogers low loss 4350 material having a core thickness of 0.010"; while the internal layers are comprised of FR-4. The overall board thickness is 0.062".
Figure 7. Evaluation Board Layouts
Peregrine Specification 101-0392
Applications Support
If you have a problem with your evaluation kit or if you have applications questions call (858) 731-9400 and ask for applications support. You may also contact us by fax or e-mail: Fax: (858) 731-9499 E-Mail: help@psemi.com
Figure 8. Evaluation Board Schematic
Peregrine Specification 102-0468
VDD 1 J2 VDD2 J4 HEADER 2 J3
VDD1 1 2 3
R8 R9 R10 5.6K 8.2K 12.0K 18.0K
U2 ADG708_16LEAD_TSSOP A0 A0 EN VSS S1 S2 S3 S4 D A1 A2 GND VDD S5 S6 S7 S8 16 15 14 13 12 11 10 9
R12 R13 R14 R15 27.0K 39.0K 56.0K 82.0K C5 0.01uF C6 10pF R16 0 OHM
SW3 0 0 0 0 1 1 1 1 X
SW2 0 0 1 1 0 0 1 1 X
SW1 0 1 0 1 0 1 0 1 X
Rbias 5.6K 8.2K 12.0K 18.0K 27.0K 39.0K 56.0K 82.0K Hi Z
HEADER 2
1
1
A1 A2
VDD1
1 2
+ C11 10F
+ C8 10F
1 2
1 2 3
2
2
4 5 6 7 8
VDD1
R1 1
220
220
220
C13 VDD1
10pF
VDD1
VDD2
R32
R33
R34
4
6
4
6
4
VDD1
6
R22
R21
SW1
SW2
SW3
DNI
DNI
R 19
DNI
C14
0.01uF
J1
CA1
R18
DNI
R20
5
5
4 3 2 1
1
DNI
DNI
5
0 OHM
2 3 4 5
10 9 8 7
R24 R25 R26
DNI DNI DNI
A2 A1 A0
J5
C3 0.01uF
C4 10pF U1 Prescaler
C15 0.01uF
C16 10pF
6
1
R2 DNI
1 2 3 4
R4 DNI
VBYPS RBIAS VDD VBYPS IN OUT GND NC
8 7 6 5
R5 DNI
J6 C7
1
2
6.8pF R3 DNI R6 DNI
R 27
R 28
DNI
DNI
D NI
2
R 29
VDD2
2
2
C9
C10 0.01uF
D2
D3
10K
10K
1
D4
10K
10pF
1
1
PCB MOUNTING HOLES
MT1 MT2 MT3 MT4
J7
50 OHM
1 1
J8
1
1
1
NOTES:
1. USE 101-0392-01 PCB 2. CAUTION: CONTAINS PARTS AND ASSEMBLIES SUSCEPTIBLE TO DAMAGE BY ELECTROSTATIC DISCHARGE (ESD) 3. ALL TRANSMISION LINES ARE: 35MIL WIDTH, 14MIL GAPS, 20MIL CORE DIELECTRIC 3.48 Er AND 2.8MIL Cu THICKNESS.
1
2
2
(c)2007-2009 Peregrine Semiconductor Corp. All rights reserved. Page 4 of 6
Document No. 70-0241-04 UltraCMOSTM RFIC Solutions
2
PE9309
Preliminary Specification
Figure 9. Package Drawing
8-lead CSOIC
.380 / .410
.210 / .250 Pin 1 .180 SQ MAX
.050 TYP
TOP VIEW
.150 TYP
.015 TYP
SIDE VIEW
.005 Typ .070 Max
ALL DIMENSIONS ARE IN INCHES DRAWINGS ARE NOT TO SCALE
Table 5. Ordering Information
Order Code
9309-01 9309-11 9309-99 9309-00
Part Marking
9309 9309 PE9309A PE9309-EK
Description
PE9309-08CFPJ-B Engineering Samples PE9309-08CFPJ-B, Production Units DIE, Production Units PE9309 Evaluation Kit
Package
8-lead FLAT PACK 8-lead FLAT PACK DIE Evaluation Board
Screening Specification
Shipping Method
50 / Tray
01-0015
1
50 / Tray 100 / Waffle Pack 1 / Box
01-00322
Notes: 1. Document 01-0015: Quality Requirements for Space Applications 2. Document 01-0032: Quality Requirements for the Evaluation of Semiconductor Dice for Space Applications
Document No. 70-0241-04 www.psemi.com
(c)2007-2009 Peregrine Semiconductor Corp. All rights reserved. Page 5 of 6
PE9309
Preliminary Specification
Sales Offices
The Americas Peregrine Semiconductor Corporation
9380 Carroll Park Drive San Diego, CA 92121 Tel: 858-731-9400 Fax: 858-731-9499
Peregrine Semiconductor, Asia Pacific (APAC)
Shanghai, 200040, P.R. China Tel: +86-21-5836-8276 Fax: +86-21-5836-7652
Peregrine Semiconductor, Korea
#B-2607, Kolon Tripolis, 210 Geumgok-dong, Bundang-gu, Seongnam-si Gyeonggi-do, 463-943 South Korea Tel: +82-31-728-3939 Fax: +82-31-728-3940
Europe Peregrine Semiconductor Europe
Batiment Maine 13-15 rue des Quatre Vents F-92380 Garches, France Tel: +33-1-4741-9173 Fax : +33-1-4741-9173
Peregrine Semiconductor K.K., Japan
Teikoku Hotel Tower 10B-6 1-1-1 Uchisaiwai-cho, Chiyoda-ku Tokyo 100-0011 Japan Tel: +81-3-3502-5211 Fax: +81-3-3502-5213
Hi-Rel and Defense Products
Americas: Tel: 858-731-9453 Europe, Asia Pacific: 180 Rue Jean de Guiramand 13852 Aix-En-Provence Cedex 3, France Tel: +33-4-4239-3361 Fax: +33-4-4239-7227
For a list of representatives in your area, please refer to our Web site at: www.psemi.com
Data Sheet Identification
Advance Information
The product is in a formative or design stage. The data sheet contains design target specifications for product development. Specifications and features may change in any manner without notice. The information in this data sheet is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user's own risk. No patent rights or licenses to any circuits described in this data sheet are implied or granted to any third party. Peregrine's products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. The Peregrine name, logo, and UTSi are registered trademarks and UltraCMOS, HaRP, MultiSwitch and DuNE are trademarks of Peregrine Semiconductor Corp.
Preliminary Specification
The data sheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product.
Product Specification
The data sheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a DCN (Document Change Notice).
(c)2007-2009 Peregrine Semiconductor Corp. All rights reserved. Page 6 of 6
Document No. 70-0241-04 UltraCMOSTM RFIC Solutions

▲Up To Search▲

Price & Availability of PE9309

	To Download PE9309 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .