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VLMY3191
Vishay Semiconductors
Standard SMD LED PLCC2
94 8553
FEATURES * Lead (Pb)-free product - RoHS compliant * SMD LED with exceptional brightness * Luminous intensity categorized e3 * Compatible with automatic placement equipment * EIA and ICE standard package * Compatible with infrared, vapor phase and wave solder processes according to CECC * Available in 8 mm tape * Low profile package * Non-diffused lens: excellent for coupling to light pipes and backlighting * Low power consumption * Luminous intensity ratio in one packaging unit IVmax/IVmin 1.6 * Lead (Pb)-free device * Preconditioning: acc. to JEDEC level 2 a APPLICATIONS * Automotive: backlighting in dashboards and switches * Telecommunication: indicator and backlighting in telephone and fax * Indicator and backlight for audio and video equipment * Indicator and backlight in office equipment * Flat backlight for LCDs, switches and symbols * General use
DESCRIPTION This device has been designed for applications requiring narrow brightness and color selection. The package of this device is the PLCC-2. It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy. PRODUCT GROUP AND PACKAGE DATA * Product series: LED * Package: SMD PLCC-2 * Product group: standard * Angle of half intensity: 60
PARTS TABLE
PART VLMY3191-GS08 VLMY3191-GS18 COLOR, LUMINOUS INTENSITY Yellow, IV = (7.1 to 18) mcd Yellow, IV = (7.1 to 18) mcd TECHNOLOGY GaAsP on GaP GaAsP on GaP
Document Number 84760 Rev. 1.4, 24-Sep-07
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VLMY3191
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS1) VLMY3191
PARAMETER Reverse voltage
2)
TEST CONDITION Tamb 60 C tp 10 s Tamb 60 C
SYMBOL VR IF IFSM PV Tj Tamb Tstg
VALUE 6 30 0.5 100 100 - 40 to + 100 - 55 to + 100 260 400
UNIT V mA A mW C C C C K/W
DC Forward current Surge forward current Power dissipation Junction temperature Operating temperature range Storage temperature range Soldering temperature Thermal resistance junction/ ambient
t5s mounted on PC board (pad size > 16 mm2)
Tsd RthJA
Note: 1) Tamb = 25 C, unless otherwise specified 2) Driving the LED in reverse direction is suitable for short term application
OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMY3191, YELLOW
PARAMETER Luminous intensity Dominant wavelength Peak wavelength Angle of half intensity Forward voltage Reverse voltage Junction capacitance TEST CONDITION IF = 10 mA IF = 10 mA IF = 10 mA IF = 10 mA IF = 20 mA IR = 10 A VR = 0, f = 1 MHz PART VLMY 3191 SYMBOL IV d p VF VR Cj 6 MIN 7.1 583 588 590 60 2.4 15 15 3.0 TYP. MAX 18 592 UNIT mcd nm nm deg V V pF
Note: 1) Tamb = 25 C, unless otherwise specified
LUMINOUS INTENSITY CLASSIFICATION
GROUP K1 K2 L1 L2 Note: Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of 11 %. The above Type Numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable. In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. In order to ensure availability, singe wavelength groups will not be orderable. LUMINOUS INTENSITY (MCD) MIN. 7.10 9.00 11.20 14.00 MAX. 9.00 11.20 14.00 18.00
COLOR CLASSIFICATION
GROUP DOMINANT WAVELENGTH (NM) YELLOW MIN. 1 2 3 4 5 6 581 583 585 587 589 591 MAX. 584 586 588 590 592 594
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Document Number 84760 Rev. 1.4, 24-Sep-07
VLMY3191
Vishay Semiconductors
TYPICAL CHARACTERISTICS Tamb = 25 C, unless otherwise specified
0 10 20 30
100
IV rel - Relative Luminous Intensity
125
P - Power Dissipation (mW) V
40 1.0 0.9 0.8 0.7 50 60 70 80 0.6 0.4 0.2 0 0.2 0.4 0.6
75
50
25
0 0
95 10904
20
40
60
80
100
95 10319
Tamb - Ambient Temperature (C)
Figure 1. Power Dissipation vs. Ambient Temperature
Figure 4. Rel. Luminous Intensity vs. Angular Displacement
60
100 yellow
IF - Forward Current (mA)
40 30 20 10 0
0 20 40 60 80 100
- Forward Current (mA) I
F
50
10
1
0.1 0
95 9987
1
2
3
4
5
95 10905
Tamb - Ambient Temperature (C)
V F - Forward Voltage (V)
Figure 2. Forward Current vs. Ambient Temperature
Figure 5. Forward Current vs. Forward Voltage
10000
t p /T = 0.005 Tamb < 60 C 0.01 0.02 0.05
2.0
I v rel - Relative Luminous Intensity
yellow 1.6
I F - Forward Current (mA)
1000
1.2
100
0.2 0.5 DC
0.8
10
0.1
0.4
1 0.01
95 9985
0
0.1
1
10
100
95 9992
0
20
40
60
80
100
t p - Pulse Length (ms)
T amb - Ambient Temperature (C)
Figure 3. Forward Current vs. Pulse Length
Figure 6. Rel. Luminous Intensity vs. Ambient Temperature
Document Number 84760 Rev. 1.4, 24-Sep-07
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VLMY3191
Vishay Semiconductors
2.4 I v rel - Relative Luminous Intensity IV rel - Relative Luminous Intensity yellow 2.0 1.6 1.2 0.8 0.4 0
95 10260
1.2 yellow 1.0 0.8 0.6 0.4 0.2 0 550
95 10039
10 1
20 0.5
50 0.2
100 0.1
200 0.05
500 I F (mA) 0.02 tp /T
570
590
610
630
650
- Wavelength (nm)
Figure 7. Rel. Lumin. Intensity vs. Forw. Current/Duty Cycle
Figure 9. Relative Luminous Intensity vs. Wavelength
10
I v rel - Relative Luminous Intensity
yellow
1
0.1
0.01 1
95 9999
10 I F - Forward Current (mA)
100
Figure 8. Relative Luminous Intensity vs. Forward Current
PACKAGE DIMENSIONS in millimeters
3.5 0.2
1.75 0.10
technical drawings according to DIN specifications
0.9
Mounting Pad Layout Pin identification 1.2 area covered with solder resist
2.6 (2.8)
+ 0.15
2.2
C
A
2.8
4 1.6 (1.9)
?
2.4
3
+ 0.15
Drawing-No.: 6.541-5025.01-4 Issue: 8; 22.11.05
95 11314-1
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4
Document Number 84760 Rev. 1.4, 24-Sep-07
VLMY3191
Vishay Semiconductors
METHOD OF TAPING/POLARITY AND TAPE AND REEL SMD LED (VLM.3 - SERIES) Vishay's LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertation. The blister tape is a plastic strip with impressed component cavaties, covered by a top tape. REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS18 (=8000 PCS.) PREFERRED
120 10.4 8.4
4.5 3.5 2.5 1.5
13.00 12.75 62.5 60.0
Identification Label: Vishay Type Group Tape Code Production Code Quantity
Adhesive Tape
321 329
14.4 max.
18857
Figure 12. Reel Dimensions - GS18
Blister Tape
SOLDERING PROFILE
IR Reflow Soldering Profile for lead (Pb)-free soldering
Preconditioning acc. to JEDEC Level 2a
300
Component Cavity
94 8670
250 Temperature (C)
255 C 255C 240 C 217 C
max. 260 C 245 C
TAPING OF VLM.3...
3.5 3.1 2.2 2.0
200
max. 30 s
150
max. 120 sec max. 100 sec
100
max. Ramp Up 3 C/sec max. Ramp Down 6 C/sec
5.75 5.25 3.6 3.4
1.85 1.65
50
4.0 3.6 8.3 7.7
0 0
19470-2
50
100
150 Time (s)
200
250
300
max. 2 cycles allowed
1.6 1.4
4.1 3.9
2.05 1.95
4.1 3.9
0.25
Figure 13. Vishay Lead (Pb) -free Reflow Soldering Profile (acc. to J-STD-020B)
TTW Soldering
(acc. to CECC00802) 948626-1
94 8668
Figure 10. Tape Dimensions in mm for PLCC-2
300 250
5s 235 C...260 C first wave ca. 200 K/s 100 C...130 C second wave ca. 2 K/s
Lead Temperature full line: typical dotted line: process limits
REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS08 (=1500 PCS.)
120 10.0 9.0
Temperature (C)
200 150 100 50 0
2 K/s forced cooling
ca. 5 K/s
4.5 3.5 2.5 1.5
13.00 12.75 63.5 60.5
0
50
100 Time (s)
150
200
250
Identification Label: Vishay Type Group Tape Code Production Code Quantity
Figure 14. Double Wave Soldering of Opto Devices (all packages)
180 178
14.4 max.
94 8665
Figure 11. Reel Dimensions - GS08
Document Number 84760 Rev. 1.4, 24-Sep-07
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VLMY3191
Vishay Semiconductors
BAR CODE PRODUCT LABEL
106 A H VISHAY 37
BC
19799
D
E
F
G
A) Type of componenent B) Manufacturing plant C) SEL - selection code (bin): e.g.: K2 = code for luminous intensity group 3 = code for color group D) Date code year/week E) Day code (e.g. 3: Wednesday) F) Batch no. G) Total quantity H) Company code DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage.
RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: * Storage temperature 10 C to 30 C * Storage humidity 60 % RH max. After more than 672 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 C + 5 C/ - 0 C and < 5 % RH (dry air/ nitrogen) or 96 h at 60 C + 5 C and < 5 % RH for all device containers or 24 h at 100 C + 5 C not suitable for reel or tubes. An EIA JEDEC standard JESD22-A112 level 2a label is included on all dry bags.
LEVEL This bag contains MOISTURE -SENSITIVE DEVICES
CAUTION
2a
1. Shelf life in sealed bag 12 months at <40C and < 90% relative humidity (RH) 2. After this bag is opened devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. 260C) must be: a) Mounted within 672 hours at factory condition of < 30C/60%RH or b) Stored at <10% RH. 3. Devices require baking before mounting if: a) Humidity Indicator Card is >10% when read at 23C + 5C or b) 2a or 2b is not met.
Aluminum bag
Label
4. If baking is required, devices may be baked for: 192 hours at 40C + 5C/-0C and <5%RH (dry air/nitrogen) or o or 96 hours at 605 Cand <5%RH For all device containers 24 hours at 1005C Not suitable for reels or tubes Bag Seal Date: ______________________________ (If blank, see bar code label) Note: LEVEL defined by EIA JEDEC Standard JESD22-A113
19786
Reel
15973
Example of JESD22-A112 level 2a label ESD PRECAUTION Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electro-static sensitive devices warning labels are on the packaging. VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELS The Vishay Semiconductors standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data.
FINAL PACKING The sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes.
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Document Number 84760 Rev. 1.4, 24-Sep-07
VLMY3191
Vishay Semiconductors
OZONE DEPLETING SUBSTANCES POLICY STATEMENT It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 84760 Rev. 1.4, 24-Sep-07
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Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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