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Pressure
Freescale Semiconductor
+
MPX12 Rev 8, 09/2008
10 kPa Uncompensated Silicon Pressure Sensors
The MPX12 series silicon piezoresistive pressure sensors provide a very accurate and linear voltage output, directly proportional to the applied pressure. This standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of the predictability of Freescale's single element strain gauge design.
MPX12 Series
0 to 10 kPa (0 to 1.45 psi) 55 mV Full Scale Span (Typical)
Application Examples
* * * * * * * * Air Movement Control Environmental Control Systems Level Indicators Leak Detection Medical Instrumentation Industrial Controls Pneumatic Control Systems Robotics
Features
* * * * * * Low Cost Patented Silicon Shear Stress Strain Gauge Design Ratiometric to Supply Voltage Easy to Use Chip Carrier Package Options Gauge Options Durable Epoxy Package
ORDERING INFORMATION
Device Name MPX12D MPX12DP MPX12GP MPXV12GW6U MPXV12GW7U Package Options Tray Tray Tray Rail Rail Case No. 344 344C 344B 1735 1560 None * # of Ports Single Dual * * * * * * * Gauge Pressure Type Differential * * Absolute
SMALL OUTLINE PACKAGE
MPXV12GW6U CASE 1735-01
MPXV12GW7U CASE 1560-02
UNIBODY PACKAGES
MPX12D CASE 344-15
MPX12GP CASE 344B-01
MPX12DP CASE 344C-01
(c) Freescale Semiconductor, Inc., 2007-2008. All rights reserved.
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25C unless otherwise noted, P1 > P2)
Characteristic Differential Pressure Supply Voltage Supply Current Full Scale Offset
(4) (2)
Symbol POP VS Io VFSS Voff V/P --
Min 0 -- -- 45 0 -- -0.5 -- -- -0.22 -- 0.21 400 750 -- -- --
Typ -- 3.0 6.0 55 20 5.5 -- 0.1 0.5 -- 15 -- -- -- 1.0 20 0.5
Max 10 6.0 -- 70 35 -- 5.0 -- -- -0.16 -- 0.27 550 1250 -- -- --
Unit kPa Vdc mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS/C V/C %Zin/C ms ms %VFSS
Range(1)
Span(3)
Sensitivity Linearity Pressure Hysteresis
(6)
(0 to 10 kPa)
-- -- TCVFSS TCVoff TCR Zin Zout tR -- --
Temperature Hysteresis (-40C to +125C) Temperature Coefficient of Full Scale Span Temperature Coefficient of Offset Temperature Coefficient of Resistance Input Impedance Output Impedance Response Time Warm-Up
(5)
(10% to 90%)
Time(6)
(7)
Offset Stability
1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum related pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX12 2 Sensors Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Burst Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol PMAX PBURST TSTG TA Value 75 100 -40 to +125 -40 to +125 Unit kPa kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
3
+VS 2 Sensing Element 4 +VOUT
-VOUT
1 GND
Figure 1. Uncompensated Pressure Sensor Schematic
Voltage Output versus Applied Differential Pressure
The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1).
MPX12 Sensors Freescale Semiconductor 3
Pressure
Temperature Compensation
Figure 2 shows the typical output characteristics of the MPX12 series over temperature. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components, or by designing your system using the MPX2010D series sensor. Several approaches to external temperature compensation over both -40 to +125C and 0 to +80C ranges are presented in Applications Note AN840.
80 70 60 Output (mVdc) 50 40 30 20 10 0 PSI 0 kPa 0.3 2.0 0.6 4.0 0.9 6.0 1.2 8.0 10 1.5 Offset (Typ) +125C VS = 3 VDC P1 > P2 +25C -40C Span Range (Typ)
LINEARITY Linearity refers to how well a transducer's output follows the equation: VOUT = VOFF + sensitivity x P over the operating pressure range (Figure 3). There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure.
Pressure Differential
Figure 2. Output vs. Pressure Differential
80 70 60 50 Output (mVdc) 40 30 20 10 0 0 Offset (VOFF) Pressure (kPa) Max POP Theoretical Actual Span (VFSS) Linearity
Figure 3. Linearity Specification Comparison
MPX12 4 Sensors Freescale Semiconductor
Pressure
Gel Die Coat P1 Wire Bond Thermoplastic Case Die Stainless Steel Cap
Lead Frame
P2 Differential Sensing Element
Die Bond
Figure 4. Cross-Sectional Diagram (not to scale) Figure 4 illustrates the differential/gauge die. A gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. Operating characteristics, internal reliability and qualification tests are based on use of dry clean air as the pressure media. Media other than dry clean air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application.
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing gel which isolates the die from the environment. The Freescale MPVZ12 series is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table
Pressure (P1) Side Identifier Side with Port Side with Port Stainless Steel Cap Side with Part Marking Side with Port Attached
Part Number MPXV12GW6U MPXV12GW7U MPX12D MPX12DP MPX12GP
Case Type 1735 1560 344 344C 344B
MPX12 Sensors Freescale Semiconductor 5
Pressure
PACKAGE DIMENSIONS
CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE
MPX12 6 Sensors Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE
MPX12 Sensors Freescale Semiconductor 7
Pressure
PACKAGE DIMENSIONS
CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE
MPX12 8 Sensors Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE
MPX12 Sensors Freescale Semiconductor 9
Pressure
PACKAGE DIMENSIONS
CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE
MPX12 10 Sensors Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE
MPX12 Sensors Freescale Semiconductor 11
Pressure
PACKAGE DIMENSIONS
C R M
1
B
-AN
PIN 1
1234
2
3
4
Z
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
DIM A B C D F G J L M N R Y Z INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30 NOM 30 NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00
L
-TJ
SEATING PLANE
G F
M
F Y
D 4 PL 0.136 (0.005)
TA
M
DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
STYLE 2: PIN 1. 2. 3. 4.
VCC - SUPPLY + SUPPLY GROUND
STYLE 3: PIN 1. 2. 3. 4.
GND -VOUT VS +VOUT
CASE 344-15 ISSUE AA UNIBODY PACKAGE
SEATING PLANE
-TR H N
PORT #1 POSITIVE PRESSURE (P1)
-AU L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D F G H J K L N P Q R S U INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC
-Q-
B
12 34
PIN 1
K
S
-P0.25 (0.010) J C
M
TQ
S
F G D 4 PL 0.13 (0.005)
M
TS
S
Q
S
STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT
CASE 344B-01 ISSUE B UNIBODY PACKAGE
MPX12 12 Sensors Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
V R
PORT #2 PORT #1
-AU W H N
PORT #2 VACUUM (P2)
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38
PORT #1 POSITIVE PRESSURE (P1)
-QSEATING PLANE
B
SEATING PLANE
PIN 1
1234
-P-TJ C -T0.25 (0.010)
M
K S
TQ
S
F G D 4 PL
0.13 (0.005)
M
TS
S
Q
S
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
CASE 344C-01 ISSUE B UNIBODY PACKAGE
MPX12 Sensors Freescale Semiconductor 13
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MPX12 Rev. 8 09/2008

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