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19-0782; Rev 0; 4/07
LED Light Management IC in 2.5mm x 2.5mm UCSP
General Description
The MAX8830 light management IC integrates a 280mA PWM DC-DC step-up converter, a 200mA white LED camera flash current sink, and four programmable LED current sinks. The internal 1MHz step-up converter features an internal switching MOSFET and synchronous rectifier to improve efficiency and minimize external component count. The camera flash output current and maximum timer is programmable through I2C. Each LED current is individually regulated to a programmable level (from off to 10mA in 32 steps) and is completely independent of each other. An I2C interface controls individual on/off of all outputs, step-up output voltage setting, movie/flash current, flash timer duration settings, and individual LED current sink settings. The MAX8830 is available in a 16-bump UCSPTM package (2.5mm x 2.5mm).
Features
Step-Up DC-DC Converter 280mA Guaranteed Output Current Over 90% Efficiency On-Chip FET and Synchronous Rectifier Fixed 1MHz PWM Switching Small 2.2H to 10H Inductor I2C-Programmable VOUT (3.8V to 5.2V and Off in 16 Steps) Flash LED Current Sink I2C-Programmable Flash Output Current (Off to 200mA in 16 Steps) I2C-Programmable Flash Maximum Timer (0.5s, 1.0s, 1.5s, or 2.0s) I2C-Programmable Movie Output Current (Off to 200mA in 16 Steps) Movie Enabled by I2C or Logic Input Flash Enabled by Logic Input Low Dropout (75mV typ) Four LED Current Sinks Individually I2C-Programmable Output Current Off to 10mA in 32 Steps Low LED Sink Current Dropout Voltage (30mV typ) I2C Interface Write Address (0x94), Read Address (0x95) Individual On/Off and LED Current Settings Simple Register Mapping < 1A Shutdown Current Open/Short LED Detection Thermal-Shutdown Protection 16-Bump, 2.5mm x 2.5mm UCSP Package
MAX8830
Applications
Cell Phones and Smartphones PDAs and MP3 Players
Typical Operating Circuit
2.2H TO 10H PROGRAMMABLE OUTPUT 3.8V TO 5.2V UP TO 280mA OUT COUT
INPUT 2.7V TO 5.5V IN CIN GND PGND
LX
MAX8830
COMP FLED MOVIE ON FLASH ON MVON 200mA FLASH
Ordering Information
PART TEMP RANGE -40C to +85C PIN-PACKAGE 16-bump 2.5mm x 2.5mm UCSP PKG CODE W162A2-1
FLEN SCL
LED1 LED2 LED3
MAX8830EWE+T
IC SDA VLOGIC VDD
+Denotes a lead-free package.
LED4
Pin Configuration appears at the end of data sheet. UCSP is a trademark of Maxim Integrated Products, Inc.
________________________________________________________________ Maxim Integrated Products
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For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
LED Light Management IC in 2.5mm x 2.5mm UCSP MAX8830
ABSOLUTE MAXIMUM RATINGS
IN, OUT to GND.............................................-0.3V to +6.0V IN, OUT to GND (maximum of 1s) ....................................+7.0V VDD to GND ...........................................................-0.3V to +4.0V SCL, SDA, MVON, FLEN to GND..................-0.3V to VDD + 0.3V COMP, FLED, LED_ to GND .......................-0.3V to VOUT + 0.3V PGND to GND .......................................................-0.3V to +0.3V Continuous ILX Current...............................................600mARMS Continuous Power Dissipation (TA = +70C) 16-Bump 2.5mm x 2.5mm UCSP (derate 105.7mW/C above +70C) .............................750mW Operating Temperature Range ...........................-40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Bump Temperature* (soldering) ......................................+235C
*This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Preheating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN = 3.6V, VGND = VPGND = 0V, VDD = 3.0V, TA = -40C to +85C, unless otherwise noted. Typical values are at TA = +25C.) (Note 1)
PARAMETER IN Operating Voltage VDD Operating Range VDD Undervoltage Lockout (UVLO) Threshold VDD UVLO Hysteresis IN UVLO Threshold IN UVLO Hysteresis VDD Standby Supply Current IN Standby Supply Current IN Shutdown Supply Current Thermal-Shutdown Hysteresis Thermal-Shutdown LOGIC AND I2C INTERFACE MVON, FLEN Logic Input-High Voltage VDD = 1.7V to 3.6V SCL, SDA MVON, FLEN Logic Input-Low Voltage VDD = 1.7V to 3.6V SCL, SDA TA = +25C TA = +85C -1 0.01 0.1 0.03 1.3 0.6 1.3 0.1 0.2 0.4 400 tBUF tHD_STA tLOW 1.6 0.7 x VDD 0.4 0.3 x VDD +1 V V SCL = SDA = VDD, I2C ready SCL = SDA = VDD, I2C ready All outputs off, VDD = 0 TA = +25C TA = +85C TA = +25C TA = +85C TA = +25C TA = +85C VIN rising 2.25 VDD falling DESCRIPTION MIN 2.7 1.7 1.35 1.5 50 2.45 50 3 4 5 5 0.1 1 20 +160 5 15 10 2.65 TYP MAX 5.5 3.6 1.65 UNITS V V V mV V mV A A A C C
Logic Input Current SDA Output Low Voltage I2C Clock Frequency Bus-Free Time Between START and STOP Hold Time Repeated START Condition SCL Low Period
VIL = 0V or VIH = 3.6V ISDA = 3mA
A V kHz s s s
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LED Light Management IC in 2.5mm x 2.5mm UCSP
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 3.6V, VGND = VPGND = 0V, VDD = 3.0V, TA = -40C to +85C, unless otherwise noted. Typical values are at TA = +25C.) (Note 1)
PARAMETER SCL High Period Setup Time Repeated START Condition SDA Hold Time SDA Setup Time Setup Time for STOP Condition STEP-UP DC-DC CONVERTER IN Supply Current OUT Voltage Range OUT Voltage Accuracy Line Regulation Load Regulation Maximum OUT Current nFET Current Limit LX nFET On-Resistance LX pFET On-Resistance LX Leakage Operating Frequency Maximum Duty Cycle Minimum Duty Cycle COMP Transconductance COMP Discharge Resistance OUT Discharge Resistance FLED CURRENT SINK DRIVER IN Supply Current Maximum Current Setting Step-up off, FLED on Flash (enabled by FLEN) Movie (enabled by MVON or I2C) 50mA setting, Movie 50mA setting (Note 2) TA = +25C TA = +85C In 500ms steps (Note 3) FLED enabled FLED enabled 0.5 100 VOUT 1V TA = +25C TA = -40C to +85C -3.0 -5 75 0.01 0.1 2.0 5 0.35 100 50 0.5 +3.0 +5 0.6 mA mA VCOMP = 1.5V During shutdown or UVLO, from COMP to GND During shutdown or UVLO, from OUT to IN LX to PGND, ILX = 100mA LX to OUT, ILX = 100mA VLX = 5.5V TA = -40C to +85C TA = +25C TA = +85C 0.75 65 1MHz switching, VOUT = 5V 100mV steps IOUT = 100mA VIN = 2.7V to 4.2V IOUT = 0 to 280mA VIN 3.2V, VOUT = 5.0V 280 TA = +25C TA = +85C 3.8 -1.5 -3 0.1 0.5 500 2.2 0.1 0.15 0.1 1 1.00 75 4 60 180 10 8 1.25 5 0.3 4 7.5 5.2 +1.5 +3 mA V % %/V %/A mA A A MHz % % S k tHIGH tSU_STA tHD_DAT tSU_DAT tSU_STO DESCRIPTION MIN 0.6 0.6 0 100 0.6 TYP 0.2 0.1 -0.01 50 0.1 MAX UNITS s s s ns s
MAX8830
Current Accuracy Current-Regulator Dropout FLED Leakage in Shutdown Flash Duration Timer Range Open-LED Detection Threshold Shorted-LED Detection Threshold
% mV A s mV V
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LED Light Management IC in 2.5mm x 2.5mm UCSP MAX8830
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 3.6V, VGND = VPGND = 0V, VDD = 3.0V, TA = -40C to +85C, unless otherwise noted. Typical values are at TA = +25C.) (Note 1)
PARAMETER LED1-LED4 CURRENT SINK DRIVER IN Supply Current Maximum Current Setting LED1-LED4 = 10mA setting, VOUT = VIN 3/32 setting, TA = +25C Current Regulator Dropout Leakage in Shutdown Open-LED Detection Threshold Shorted-LED Detection Threshold 10mA setting (Note 2) TA = +25C TA = +85C LED_ enabled LED_ enabled TA = +25C TA = 0C to +85C TA = -40C to +85C -2 -5 -8 7 30 0.01 0.1 100 VOUT 1V 125 5 mV A mV V Step-up off, all current sinks on 0.2 10 0.3 +2 +5 +8 % 0.5 mA mA DESCRIPTION MIN TYP MAX UNITS
Current Accuracy
Note 1: All devices are 100% production tested at TA = +25C. Limits over the operating temperature range are guaranteed by design. Note 2: LED current sink dropout voltage is defined as the voltage at which current drops 10% from the current level measured at 0.6V. Note 3: Flash duration is from rising edge of FLEN until IFLED turns off (or returns to the movie current setting if MVON is high).
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LED Light Management IC in 2.5mm x 2.5mm UCSP
Typical Operating Characteristics
(VIN = 3.6V, VOUT = 3.8V, VDD = 3.0V, circuit of Figure 1, TA = +25C, unless otherwise noted.)
STEP-UP CONVERTER EFFICIENCY vs. INPUT VOLTAGE
MAX8830 toc01
MAX8830
STEP-UP CONVERTER EFFICIENCY vs. OUTPUT CURRENT
MAX8830 toc02
INPUT STANDBY SUPPLY CURRENT vs. INPUT VOLTAGE
VOUT = VIN ALL LEDs OFF I2C READY
MAX8830 toc03
100 98 96 EFFICIENCY (%) VOUT = 3.8V IOUT = 200mA
100 90 80 EFFICIENCY (%) 70 60 50
25
20 INPUT CURRENT (A)
94 92 90 88 86 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 INPUT VOLTAGE (V) L1 = 10H TOKO 1098AS-100M DE2812C SERIES VOUT = 5V
15
10
5 40 30 1 10 100 1000 OUTPUT CURRENT (mA) 0 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 INPUT VOLTAGE (V)
INPUT STANDBY SUPPLY CURRENT vs. TEMPERATURE
VOUT = VIN ALL LEDs OFF I2C READY
MAX8830 toc04
SWITCHING WAVEFORMS (VOUT = 3.8V, IOUT = 280mA)
MAX8830 toc05
30 25 INPUT CURRENT (A) 20 15 10 5 0 -40 -15 10 35 60
ILX
200mA/div
VLX
2V/div
85
400ns/div
TEMPERATURE (C)
SWITCHING WAVEFORMS (VOUT = 5V, IOUT = 280mA)
MAX8830 toc06
OSCILLATOR FREQUENCY vs. TEMPERATURE
MAX8830 toc07
1.20 OSCILLATOR FREQUENCY (MHz) 1.15 1.10 1.05 1.00 0.95 0.90
ILX
200mA/div
VLX
2V/div
400ns/div
-40
-15
10
35
60
85
TEMPERATURE (C)
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LED Light Management IC in 2.5mm x 2.5mm UCSP MAX8830
Typical Operating Characteristics (continued)
(VIN = 3.6V, VOUT = 3.8V, VDD = 3.0V, circuit of Figure 1, TA = +25C, unless otherwise noted.)
OSCILLATOR FREQUENCY vs. INPUT VOLTAGE
MAX8830 toc08
OUTPUT VOLTAGE vs. TEMPERATURE
3.82 3.81 3.80 OUTPUT VOLTAGE (V) 3.79 3.78 3.77 3.76 3.75 3.74 3.73 VOUT = 5V VOUT = 3.8V
MAX8830 toc09
LED CURRENT ACCURACY AND MATCHING vs. INPUT VOLTAGE (ILED_ = 10mA)
5.06 LED CURRENT ACCURACY (%) 5.05 5.04 5.03 5.02 5.01 5.00 4.99 4.98 4.97 -2.5 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 INPUT VOLTAGE (V) 0 -0.5 ILED4 -1.0 -1.5 ILED2 -2.0 ILED3 ILED1
MAX8830 toc10 MAX8830 toc13
1.20 OSCILLATOR FREQUENCY (MHz) 1.15 1.10 1.05 1.00 0.95 0.90 2.7 3.1 3.5 3.9 4.3 4.7 5.1
5.07
0.5
3.72 5.5 -40 -25 -15 0 10 25 35 50 60 70 85 INPUT VOLTAGE (V) TEMPERATURE (C)
LED CURRENT ACCURACY vs. TEMPERATURE
MAX8830 toc11
FLED CURRENT-REGULATOR DROPOUT VOLTAGE vs. FLED CURRENT
180 160 DROPOUT VOLTAGE (mV) 140 120 100 80 60 40 20 0
MAX8830 toc12
LED_ CURRENT-REGULATOR DROPOUT VOLTAGE vs. LED_ CURRENT
50 45 40 DROPOUT VOLTAGE (mV) 35 30 25 20 15 10 5 0
1.0 0.8 LED CURRENT ACCURACY (%) 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1.0 -40 -15 10 35
ILED = 10mA
200
60
85
0
50
100 FLED CURRENT (mA)
150
200
0
2
4
6
8
10
TEMPERATURE (C)
LED_ CURRENT (mA)
STARTUP WAVEFORMS
MAX8830 toc14
SOFT-START
MAX8830 toc15
5V/div VIN 5V/div VOUT
VIN VOUT = 5V
2V/div 500mV/div
2V/div VLX 20.0s/div
VOUT = 3V VCOMP 100ms/div
500mV/div
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LED Light Management IC in 2.5mm x 2.5mm UCSP
Pin Description
UCSP BUMP A1 NAME FUNCTION Flash LED Current-Sink Regulator. Current flowing into FLED is based on the internal I2C registers. Connect FLED to the cathode of an external flash LED or LED module. FLED is high impedance during shutdown. If unused, FLED may be shorted to ground or left unconnected. Power Ground. Connect PGND to GND and to the input capacitor ground. Connect PGND to the PCB ground plane. Inductor Connection. Connect LX to the switched side of the inductor. LX is internally connected to the drains of the internal MOSFETs. LX is high impedance in shutdown. Regulator Output. Connect OUT to the anodes of the external LEDs. OUT can also be used to supply other circuits, such as audio amplifiers. Bypass OUT to PGND with a 10F or larger ceramic capacitor. During shutdown, VOUT is one diode drop below the VIN. LED Current-Sink Regulators. Current flowing into LED_ is based on the internal I2C registers. Connect LED_ to the cathodes of external LEDs. LED_ is high impedance during shutdown. If unused, LED_ can be shorted to ground or left unconnected. Movie On Logic Input. Connect to VDD or drive with logic 1 to enable the movie mode. The FLED movie current is set in the I2C registers. Connect to GND or drive with logic 0 to turn off the movie mode. The movie mode is also enabled through the I2C interface. Analog Supply Voltage Input. The input voltage range is 2.7V to 5.5V. Bypass IN to GND and PGND with a 10F ceramic capacitor as close as possible to the IC. IN is high impedance during shutdown. Flash Enable Logic Input. A transition from logic 0 to logic 1 on FLEN initiates the flash mode. The flash duration and FLED flash current are set in I2C registers. The flash mode terminates when either FLEN transitions back to logic 0 or after the flash-duration timer expires. I2C Clock Input. Data is read on the rising edge of SCL. Compensation Input. See the COMP Network Selection section for details. Analog Ground. Connect GND to PGND and to the input capacitor ground. Connect GND to the PCB ground plane. I2C Data Input. Data is read on the rising edge of SCL. Logic Input Supply Voltage. Connect VDD to the logic supply driving SCL, SDA, MVON, and FLEN. Bypass VDD to GND with a 0.1F ceramic capacitor. Setting VDD = 0 places the part in shutdown.
MAX8830
FLED
A2 A3
PGND LX
A4
OUT
C1 B1 B2 D1
LED1 LED2 LED3 LED4
B3
MVON
B4
IN
C2 C3 C4 D2 D3 D4
FLEN SCL COMP GND SDA VDD
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LED Light Management IC in 2.5mm x 2.5mm UCSP MAX8830
L1* 10H VIN 2.7V TO 5.5V CIN 10F MAX8830 LX IN GND CHIP POWER AND REFERENCE nFET PWM BOOST CONVERTER pFET OUT COUT 10F + VREF IOUT 280mA
PGND RCOMP CCOMP COMP 1MHz 4 4 MOVIE ON /OFF MVON 5 FLASH ON /OFF FLEN FLASH MAX TIMER (0.5/1.0/1.5/2.0s) 2 5 SCL SERIAL INTERFACE SDA I2C PORT REGISTERS AND LOGIC 8 5
FLED
200mA FLASH LED
LED1
LED2
LED3 5
VLOGIC CVDD 0.1F
VDD LED4
*L1 = TOKO 1098AS-100M
Figure 1. Block Diagram and Typical Application Circuit
Detailed Description
The MAX8830 light management IC integrates a 280mA PWM step-up DC-DC converter, a 200mA white LED camera flash current sink, and four programmable LED current sinks. An I2C interface controls individual on/off of all outputs, step-up output voltage setting, movie/ flash current and flash timer-duration settings, and individual current sink settings. Figure 1 shows the block diagram and typical application circuit.
Step-Up Converter (LX, OUT, COMP, PGND)
The MAX8830 includes a fixed-frequency, PWM step-up converter that supplies power to the LEDs and additional loads, such as audio amplifiers. The output voltage is programmable from 3.8V to 5.2V (in 100mV steps) through the I2C port. If the output voltage is not programmed, the step-up converter remains off; however, if any of the current regulators are programmed, the boost converter p-channel synchronous rectifier is turned on. The step-up converter switches an internal power MOSFET and synchronous rectifier at a constant 1MHz frequency with varying duty cycle up to 75% to maintain constant output voltage as VIN and load vary. Internal circuitry prevents any unwanted subharmonic switching by forcing a minimum 4% duty cycle.
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LED Light Management IC in 2.5mm x 2.5mm UCSP
Flash Current-Sink Regulator (FLED, MVON, FLEN)
A low-dropout linear current regulator from FLED to PGND sinks current from an external flash LED cathode terminal. The FLED current is regulated to I2C-programmable levels for movie mode (up to 200mA) and flash mode (up to 200mA). The movie mode provides continuous lighting when enabled through I2C (see Table 1). The flash mode is enabled only when FLEN goes high. A flash maximum timer, programmable from 0.5s to 2.0s through I2C, limits the duration of the flash mode in case FLEN remains high. The flash mode has priority over the movie mode. CCOMP is discharged whenever the step-up converter is turned off, allowing the device to reinitiate soft-start when it is enabled. The internal MOSFET and synchronous rectifier are also high impedance when the step-up converter is off; however, OUT is one diode drop below the input. FLED and LED_ are high impedance in shutdown, so the external LEDs are all off, but any external circuitry on OUT (such as an audio amplifier) is not disconnected, and therefore, should include its own shutdown capability.
MAX8830
Parallel Connection of Current-Sink Regulators
The LED current-sink regulators (FLED and LED_) can be connected in parallel in any combination to allow the use of higher current LEDs or any other desired effects. Unused current regulators may be left unconnected or shorted to ground. The LED regulators must be disabled through I2C to avoid a fault detection from an open or short.
Current-Sink Regulators (LED1-LED4)
Four low-dropout linear current regulators from LED_ to GND sink current from external LED cathode terminals. The LED_ currents are individually regulated to an I2Cprogrammable level from off to 10mA in 32 steps, independently set for each LED_.
Open/Short LED Detection
The MAX8830 includes 10 comparators to detect open or shorted LEDs on the FLED and LED1-LED4 pins. One comparator on each pin detects when the voltage falls below 100mV, indicating an open LED fault. Another comparator on each pin detects when the voltage rises above VOUT - 1V, indicating a shorted LED fault. The fault-detection comparators are enabled only when the corresponding current sink is enabled (and not set to zero current). Once a fault is detected the two comparators provide a single bit output (1 = fault, 0 = no fault) corresponding to the appropriate pin. When a read command (address 0x95) is issued to the MAX8830, the status of each pin is latched into the status register (see Table 6) and subsequently written to the I2C bus by the MAX8830.
Undervoltage Lockout
The IC contains undervoltage lockout (UVLO) circuitry that disables the device until VIN is greater than 2.45V (typ). Once VIN rises above 2.45V (typ), the UVLO circuitry does not disable the IC until VIN falls below the UVLO threshold hysteresis.
Soft-Start
The MAX8830 soft-starts by charging CCOMP with a 100A current source. During this time, the internal MOSFET is switching at the minimum duty cycle. Once VCOMP rises above 1V, the duty cycle increases until the output voltage reaches the desired regulation level. COMP is pulled to GND with a 80 internal resistor during UVLO or shutdown. See the Typical Operating Characteristics for an example of soft-start operation.
Shutdown and Standby
The MAX8830 is in shutdown when VDD = 0. In shutdown, supply current is reduced to 0.1A (typ). The MAX8830 is in standby when the step-up converter and all LED outputs are turned off through I 2C (and by keeping MVON and FLEN at logic 0). During this time, the I2C port remains in standby (ready) state as long as logic-high voltage is supplied to VDD.
Thermal Shutdown
Thermal shutdown limits total power dissipation in the MAX8830. When the junction temperature exceeds +160C, the device turns off, allowing the IC to cool. The IC turns on and begins soft-start after the junction temperature cools by 20C. This results in a pulsed output during continuous thermal-overload conditions.
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LED Light Management IC in 2.5mm x 2.5mm UCSP MAX8830
I2C Serial Interface
The step-up converter OUT voltage, FLED flash current and duration, FLED movie current, and LED_ individual currents are set using the I2C serial interface. Each current level is individually programmable (including off) with a single command (see Tables 1, 2, and 3). While the flash current is set through I2C, current does not flow until the FLEN input is logic 1, as described in the Flash Current-Sink Regulator (FLED, MVON, FLEN) section. By default, the movie current is turned on when a nonzero setting is programmed through I 2 C. Alternately, by setting a bit in the "other" register, the movie mode current may also be gated by logic 1 at the MVON input. The I2C serial interface consists of a serial-data line (SDA) and a serial-clock line (SCL). Standard I2C writebyte commands are used. Figure 2 shows a timing diagram for the I2C protocol. The MAX8830 is a slave-only device, relying upon a master to generate a clock signal. The master (typically a microprocessor) initiates data transfer on the bus and generates SCL to permit data transfer. A master device communicates to the MAX8830 by transmitting the proper 8-bit address (0x94) followed by the 8-bit control byte. Each 8-bit control byte consists of a command code (usually 3-bits) with the remaining bits (usually 5 bits) as data (see Table 1). Each transmit sequence is framed by a START (A) condition and a STOP (L) condition. Each word transmitted over the bus is 8 bits long and is always followed by an acknowledge clock pulse.
A
tLOW
B
tHIGH
C
D
E
F
G
H
I
J
K
L
M
SCL
SDA
tSU_STA
tHD_STA
tSU_DAT
tHD_DAT F = ACKNOWLEDGE BIT CLOCKED INTO MASTER G = MSB OF DATA CLOCKED INTO SLAVE (OP/SUS BIT) H = LSB OF DATA CLOCKED INTO SLAVE I = SLAVE PULLS SMBDATA LINE LOW
tSU_STO J = ACKNOWLEDGE CLOCKED INTO MASTER K = ACKNOWLEDGE CLOCK PULSE L = STOP CONDITION, DATA EXECUTED BY SLAVE M = NEW START CONDITION
tBUF
A = START CONDITION B = MSB OF ADDRESS CLOCKED INTO SLAVE C = LSB OF ADDRESS CLOCKED INTO SLAVE D = R/W BIT CLOCKED INTO SLAVE E = SLAVE PULLS SMBDATA LINE LOW
Figure 2. I2C Timing Diagram
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LED Light Management IC in 2.5mm x 2.5mm UCSP
Table 1. Control Data Byte
SDA CONTROL BYTE FUNCTION C2 Step-Up OUT Voltage Unused LED1 Current LED2 Current LED3 Current LED4 Current Unused Flash Current Movie Current Other 0 0 0 0 0 1 1 1 1 1 COMMAND C1 0 0 0 1 1 0 0 1 1 1 C0 0 0 1 0 1 0 1 0 1 1 D4 0 0 0 0 0 0 0 0 0 1 D3 DATA D2 D1 D0 3.8V to 5.2V and off in 16 steps Reserved for future use Off to 10mA in 32 steps Off to 10mA in 32 steps Off to 10mA in 32 steps Off to 10mA in 32 steps Off to 10mA in 32 steps Off to 200mA in 16 steps Off to 200mA in 16 steps 0 MVON enable Flash duration
MAX8830
Note: C2 is MSB and D0 is LSB.
Table 2. Control Register Data Default Settings
SDA CONTROL BYTE FUNCTION C2 Step-Up OUT Voltage Unused LED1 Current LED2 Current LED3 Current LED4 Current Unused Flash Current Movie Current Other 0 0 0 0 0 1 1 1 1 1 COMMAND C1 0 0 0 1 1 0 0 1 1 1 C0 0 0 1 0 1 0 1 0 1 1 D4 0 0 0 0 0 0 0 0 0 1 D3 Off (0000) Reserved for future use Off (00000) Off (00000) Off (00000) Off (00000) Reserved for future use Off (00000) Off (0000) 0 MV by I2C (0) 0.5s (00) DATA D2 D1 D0
Note: C2 is MSB and D0 is LSB.
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LED Light Management IC in 2.5mm x 2.5mm UCSP MAX8830
Table 3. Step-Up Voltage and LED Current Settings
OUT VOLTAGE (V) OR LED CURRENT (mA) OUT OFF 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 LED1 OFF 0.63 0.94 1.25 1.56 1.88 2.19 2.50 2.81 3.13 3.44 3.75 4.06 4.38 4.69 5.00 5.31 5.63 5.94 6.25 6.56 6.88 7.19 7.50 7.81 8.13 8.44 8.75 9.06 9.38 9.69 10.00 LED2 OFF 0.63 0.94 1.25 1.56 1.88 2.19 2.50 2.81 3.13 3.44 3.75 4.06 4.38 4.69 5.00 5.31 5.63 5.94 6.25 6.56 6.88 7.19 7.50 7.81 8.13 8.44 8.75 9.06 9.38 9.69 10.00 LED3 OFF 0.63 0.94 1.25 1.56 1.88 2.19 2.50 2.81 3.13 3.44 3.75 4.06 4.38 4.69 5.00 5.31 5.63 5.94 6.25 6.56 6.88 7.19 7.50 7.81 8.13 8.44 8.75 9.06 9.38 9.69 10.00 LED4 OFF 0.63 0.94 1.25 1.56 1.88 2.19 2.50 2.81 3.13 3.44 3.75 4.06 4.38 4.69 5.00 5.31 5.63 5.94 6.25 6.56 6.88 7.19 7.50 7.81 8.13 8.44 8.75 9.06 9.38 9.69 10.00 FLASH OFF 25.0 37.5 50.0 62.5 75.0 87.5 100.0 112.5 125.0 137.5 150.0 162.5 175.0 188.0 200.0 MOVIE OFF 25.0 37.5 50.0 62.5 75.0 87.5 100.0 112.5 125.0 137.5 150.0 162.5 175.0 188.0 200.0 D4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 D3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 DATA D2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 D1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 D0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1
Note: Defaults in bold italics.
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LED Light Management IC in 2.5mm x 2.5mm UCSP
Table 4 lists the MVON control settings; Table 5 lists flash duration settings. Table 6 shows the read (0x95) status register.
UCSP Applications Information
For the latest application details on UCSP construction, dimensions, tape carrier information, PCB techniques, bump-pad layout, and recommended reflow temperature profile, as well as the latest information on reliability testing results, go to the Maxim website at www.maxim-ic.com/ucsp for the Application Note: UCSP-A Wafer-Level Chip-Scale Package.
MAX8830
Table 4. MVON Control Setting
SDA CONTROL BYTE FUNCTION C2 Movie Enabled Through I 2C Movie Enabled Through MVON Pin 1 1 COMMAND C1 1 1 C0 1 1 D4 1 1 D3 X X DATA D2 0 1 D1 X X D0 X X
Note: Defaults in bold italics.
Table 5. Flash Duration Settings
SDA CONTROL BYTE FUNCTION C2 0.5s Flash 1.0s Flash 1.5s Flash 2.0s Flash 1 1 1 1 COMMAND C1 1 1 1 1 C0 1 1 1 1 D4 1 1 1 1 D3 X X X X DATA D2 X X X X D1 0 0 1 1 D0 0 1 0 1
Note: Defaults in bold italics.
Table 6. Read (0x95) Status Register
SDA READ BYTE FUNCTION D7 Fault Status X D6 X D5 X D4 FLED DATA D3 LED4 D2 LED3 D1 LED2 D0 LED1
Note: 1 = fault, 0 = no fault
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LED Light Management IC in 2.5mm x 2.5mm UCSP MAX8830
Table 7. Suggested Inductors
MANUFACTURER Cooper (Coiltronics) FDK TDK TOKO SERIES SD3114 MIPF2520 MIPW3226 VLF3012AT DE2812C INDUCTANCE (H) 2.2 2.2 2.2 2.2 10 2.7 10 DCR (m) 110 80 100 88 360 75 325 ISAT (A) 1.74 1.3A 1.1 1.0 0.49 1.8 0.78 DIMENSIONS (LTYP x WTYP x HMAX = VOLUME) 3.0 x 3.0 x 1.45 = 13mm3 2.5 x 2.0 x 1.0 = 5mm3 3.2 x 2.6 x 1.0 = 8mm3 2.8 x 2.6 x 1.2 = 9mm3 3.0 x 3.2 x 1.2 = 12mm3 3.0 x 3.2 x 1.2 = 12mm3
Inductor Selection
The MAX8830 is designed to use a 2.2H to 10H inductor. To prevent core saturation, ensure that the inductor-saturation current rating exceeds the peak inductor current for the application. Calculate the worstcase peak inductor current with the following formula: IPEAK = VOUT x IOUT(MAX) VIN(MIN) x 0.5s + 0.9 x VIN(MIN) 2 xL
PCB Layout
Due to fast switching waveforms and high-current paths, careful PCB layout is required. Connect GND and PGND directly to the ground plane. The IN bypass capacitor should be placed as close as possible to the IC. RCOMP and CCOMP should be connected between COMP and GND as close as possible to the IC. Minimize trace lengths between the IC and the inductor, the input capacitor, and the output capacitor; keep these traces short, direct, and wide. The ground connections of CIN and COUT should be as close together as possible and connected to PGND. The traces from the input to the inductor and from the output capacitor to the LEDs may be longer. A sample layout is available in the MAX8830 evaluation kit.
Table 7 provides a list of suggested inductors.
Capacitor Selection
Bypass the input to GND and PGND using a ceramic capacitor. A ceramic capacitor with X5R and X7R dielectrics are recommended for their low ESR and tighter tolerances over a wide temperature range. Place the capacitor as close as possible to the IC. The recommended minimum value for the input capacitor is 10F; however, larger value capacitors can be used to reduce input ripple at the expense of size and higher cost. The output capacitance required depends on the maximum output current. A 10F ceramic capacitor works well in most situations, but a 4.7F capacitor is acceptable for lower load currents.
Pin Configuration
MAX8830
1 + A FLED B LED2 C LED1 D FLEN SCL COMP LED3 MVON IN PGND LX OUT 2 3 4
COMP Network Selection
The step-up converter is compensated for stability through an external compensation network from COMP to GND. See Table 8 for recommended compensation components.
Table 8. Suggested Compensation Networks
RCOMP (k) 2.2H Inductor (Dynamic Loads) 4.7H Inductor (Dynamic Loads) 10H Inductor (Dynamic Loads) Only LED Loads (2.2H to 10H) 4.3 3 3 0 (short) CCOMP (pF) 2200 4700 6800 22000
LED4
GND
SDA
VDD
UCSP (2.5mm x 2.5mm)
Chip Information
PROCESS: BiCMOS
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LED Light Management IC in 2.5mm x 2.5mm UCSP
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
16L WAFER LEVEL.EPS
MAX8830
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 15
(c) 2007 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc.

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