 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| ClampTM 1-Line ESD Protection PROTECTION PRODUCTS - MicroClampTM Description The Clamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and PDAs. It features large cross-sectional area junctions for conducting high transient currents. It offers superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The ClampTM1201H is in a 2-pin, RoHS compliant, SOD-523 package. The leads are finished with leadfree matte tin. Each device will protect one line operating at 12 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. TM UCLAMP1201H Features Transient protection for data lines to IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small SOD-523 package (1.7 x 0.9 x 0.7mm) Protects one I/O or power line Low clamping voltage Working voltage: 12V Low leakage current Solid-state silicon-avalanche technology Mechanical Characteristics EIAJ SOD-523 package Molding compound flammability rating: UL 94V-0 Marking: Marking code, cathode band Packaging: Tape and Reel per EIA 481 Lead Finish: Matte tin RoHS Compliant Applications Cellular Handsets & Accessories Personal Digital Assistants (PDAs) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Dimensions 1.70 1.30 0.9 Schematic & PIN Configuration 0.35 0.70 Maximum Dimensions (mm) Revision 03/08/2005 1 SOD-523 (Top View) www.semtech.com UCLAMP1201H PROTECTION PRODUCTS Absolute Maximum Rating R ating Peak Pulse Power (tp = 8/20s) Maximum Peak Pulse Current (tp = 8/20s) ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Lead Soldering Temperature Operating Temperature Storage Temperature Symbol Pp k Ip p V PP TL TJ TSTG Value 200 8 +/- 20 +/- 15 260 (10 sec.) -55 to +125 -55 to +150 Units Watts Amps kV C C C Electrical Characteristics (T=25oC) Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Forward Voltage Clamp ing Voltage Clamp ing Voltage Junction Cap acitance Symbol VRWM V BR IR VF VC VC Cj It = 1mA VRWM = 12V, T=25C IF = 10mA IPP = 1A, tp = 8/20s IPP = 8A, tp = 8/20s VR = 0V, f = 1MHz 0.8 19 25 60 13.3 1 Conditions Minimum Typical Maximum 12 Units V V A V V V pF 2005 Semtech Corp. 2 www.semtech.com UCLAMP1201H PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 10 Power Derating Curve 110 100 90 % of Rated Power or IPP 80 70 60 50 40 30 20 10 0 Peak Pulse Power - P PP (kW) 1 0.1 0.01 0.1 1 10 Pulse Duration - tp (us) 100 1000 0 25 50 75 100 o 125 150 Ambient Temperature - TA ( C) Clamping Voltage vs. Peak Pulse Current 25 3.5 3 Forward Voltage - VF (V) 2.5 2 1.5 1 0.5 0 0 1 2 3 4 5 6 7 Peak Pulse Current - IPP (A) 8 9 10 0 Forward Voltage vs. Forward Current Clamping Voltage - VC (V) 20 15 10 Waveform Parameters: tr = 8s td = 20s 5 Waveform Parameters: tr = 8s td = 20s 0 1 2 3 4 5 Forward Current - IF (A) 6 7 8 Junction Capacitance vs. Reverse Voltage 1.1 1 0.9 Normalized Capacitance 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 1 2 3 Reverse Voltage - VR (V) 4 5 f = 1 MHz ESD Clamping (8kV Contact per IEC 61000-4-2) 2005 Semtech Corp. 3 www.semtech.com UCLAMP1201H PROTECTION PRODUCTS Applications Information Device Connection Options These TVS diodes are designed to protect one data, I/O, or power supply line. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Circuit Diagram 2005 Semtech Corp. 4 www.semtech.com UCLAMP1201H PROTECTION PRODUCTS Applications Information - Spice Model 0.5 nH Figure 1 - UCLAMP1201H Spice Model Table 1 - UCLAMP1201H Spice Parameters Parameter IS BV VJ RS IB V CJO TT M N EG Unit Amp Volt Volt Ohm Amp Farad sec --eV D1 (T VS) 1.48E-14 15.33 0.723 0.772 1.0E-3 52E-12 2.541E-9 0.268 1.1 1.11 2005 Semtech Corp. 5 www.semtech.com UCLAMP1201H PROTECTION PRODUCTS Outline Drawing - SOD-523 E E1 B DIM A b c D E E1 L L1 aaa DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .019 .009 .003 .027 .059 .043 .003 .003 .023 .031 .063 .047 .008 .005 .008 .027 .013 .008 .035 .067 .051 .011 .008 0.50 0.25 0.10 0.70 1.50 1.10 0.10 0.10 0.60 0.70 0.35 0.20 0.80 0.90 1.60 1.70 1.20 1.30 0.20 0.30 0.15 0.20 0.20 D 2X b aaa CAB A A SEATING PLANE C L c NOTES: L1 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern - SOD-523 Y X G C Z DIM C G X Y Z DIMENSIONS INCHES MILLIMETERS (.057) .024 .018 .033 .090 (1.45) 0.60 0.45 0.85 2.30 NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2005 Semtech Corp. 6 www.semtech.com UCLAMP1201H PROTECTION PRODUCTS Marking Code Ordering Information Part Number uClamp 1201H.TCT Working Voltage 12V Device Qty per Marking Reel 2H 3,000 Reel Size 7 Inch 2H Tape and Reel Specification Note: Devices are lead-free MicroClamp, uClamp and Clamp are marks of Semtech Corporation Tape Specifications Device Orientation in Tape Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 www.semtech.com 2005 Semtech Corp. 7 |
Price & Availability of UCLAMP1201H
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |