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BCP69
20 V, 1 A PNP medium power transistor
Rev. 06 -- 2 December 2008 Product data sheet
1. Product profile
1.1 General description
PNP medium power transistor in a Surface-Mounted Device (SMD) plastic package.
Table 1. Product overview Package NXP BCP69 BCP69-16 BCP69-16/DG BCP69-16/IN BCP69-25
[1] /DG: halogen-free
Type number[1]
JEITA SC-73
Package configuration medium power
SOT223
1.2 Features
I I I I High current Three current gain selections 1.4 W total power dissipation Medium power SMD plastic package
1.3 Applications
I I I I I Linear voltage regulators High-side switches Supply line switches MOSFET drivers Audio preamplifier
1.4 Quick reference data
Table 2. Symbol VCEO IC ICM Quick reference data Parameter collector-emitter voltage collector current peak collector current single pulse; tp 1 ms Conditions open base Min Typ Max -20 -1 -2 Unit V A A
NXP Semiconductors
BCP69
20 V, 1 A PNP medium power transistor
Quick reference data ...continued Parameter DC current gain BCP69 BCP69-16 BCP69-16/DG BCP69-16/IN BCP69-25 Conditions VCE = -1 V; IC = -500 mA 85 100 140 160 375 250 230 375 Min Typ Max Unit
Table 2. Symbol hFE
2. Pinning information
Table 3. Pin 1 2 3 4 Pinning Description base collector emitter collector
1 2 3 3
sym028
Simplified outline
4
Graphic symbol
2, 4 1
3. Ordering information
Table 4. Ordering information Package Name BCP69 BCP69-16 BCP69-16/DG BCP69-16/IN BCP69-25
[1] /DG: halogen-free
Type number[1]
Description plastic surface-mounted package with increased heatsink; 4 leads
Version SOT223
SC-73
BCP69_6
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 -- 2 December 2008
2 of 13
NXP Semiconductors
BCP69
20 V, 1 A PNP medium power transistor
4. Marking
Table 5. BCP69 BCP69-16 BCP69-16/DG BCP69-16/IN BCP69-25
[1] /DG: halogen-free
Marking codes Marking code BCP69 BCP69/16 BCP69-16D 69-16N BCP69/25
Type number[1]
5. Limiting values
Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IC ICM IBM Ptot Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current peak collector current peak base current total power dissipation single pulse; tp 1 ms single pulse; tp 1 ms Tamb 25 C
[1] [2] [3]
Conditions open emitter open base open collector
Min -65 -65
Max -32 -20 -5 -1 -2 -200 0.625 1 1.4 150 +150 +150
Unit V V V A A mA W W W C C C
Tj Tamb Tstg
[1] [2] [3]
junction temperature ambient temperature storage temperature
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
BCP69_6
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 -- 2 December 2008
3 of 13
NXP Semiconductors
BCP69
20 V, 1 A PNP medium power transistor
1.6 Ptot (W) 1.2
(2) (1)
mle311
0.8
(3)
0.4
0 -65
-5
55
115
175 Tamb (C)
(1) FR4 PCB, mounting pad for collector 6 cm2 (2) FR4 PCB, mounting pad for collector 1 cm2 (3) FR4 PCB, standard footprint
Fig 1.
Power derating curves
6. Thermal characteristics
Table 7. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air
[1] [2] [3]
Min -
Typ -
Max 200 125 89 15
Unit K/W K/W K/W K/W
Rth(j-sp)
[1] [2] [3]
thermal resistance from junction to solder point
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
BCP69_6
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 -- 2 December 2008
4 of 13
NXP Semiconductors
BCP69
20 V, 1 A PNP medium power transistor
102 Rth(j-a) (K/W) 10
006aab402
duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.01 0.02 =
t1 t2
P
1
0
t1 t2
t
10-1 10-5
10-4
10-3
10-2
10-1
1
10
102 tp (s)
103
FR4 PCB, mounting pad for collector 6 cm2
Fig 2.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
BCP69_6
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 -- 2 December 2008
5 of 13
NXP Semiconductors
BCP69
20 V, 1 A PNP medium power transistor
7. Characteristics
Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol ICBO Parameter collector-base cut-off current emitter-base cut-off current DC current gain BCP69 VCE = -10 V; IC = -5 mA VCE = -1 V; IC = -500 mA VCE = -1 V; IC = -1 A BCP69-16 BCP69-16/DG BCP69-16/IN BCP69-25 VCEsat VBE collector-emitter saturation voltage base-emitter voltage VCE = -1 V; IC = -500 mA VCE = -1 V; IC = -500 mA VCE = -1 V; IC = -500 mA IC = -1 A; IB = -100 mA VCE = -10 V; IC = -5 mA VCE = -1 V; IC = -1 A Cc collector capacitance VCB = -10 V; IE = ie = 0 A; f = 1 MHz VCE = -5 V; IC = -50 mA; f = 100 MHz 50 85 60 100 140 160 28 375 250 230 375 -500 -700 -1 mV mV V pF Conditions VCB = -25 V; IE = 0 A VCB = -25 V; IE = 0 A; Tj = 150 C VEB = -5 V; IC = 0 A Min Typ Max -100 -10 -100 Unit nA A nA
IEBO hFE
fT
transition frequency
40
140
-
MHz
BCP69_6
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 -- 2 December 2008
6 of 13
NXP Semiconductors
BCP69
20 V, 1 A PNP medium power transistor
103
mle305
hFE
-2.4 IC (A) -2.0
006aab403
IB (mA) = -18.0 -14.4 -10.8
-16.2 -12.6 -9.0
-1.6 -1.2
-7.2 -0.8 -3.6 -0.4 -1.8 -5.4
102 -10-1
-1
-10
-102
-103 -104 IC (mA)
0 0
-1
-2
-3
-4 VCE (V)
-5
VCE = -1 V
Tamb = 25 C
Fig 3.
BCP69-16: DC current gain as a function of collector current; typical values
mle304
Fig 4.
BCP69-16: Collector current as a function of collector-emitter voltage; typical values
mle306
-1000 VBE (mV) -800
-103 VCEsat (mV) -102
-600
-400 -10 -200
0 -10-1
-1
-10
-102
-103 -104 IC (mA)
-1 -10-1
-1
-10
-102
-103 -104 IC (mA)
VCE = -1 V
IC/IB = 10
Fig 5.
BCP69-16: Base-emitter voltage as a function of collector current; typical values
Fig 6.
BCP69-16: Collector-emitter saturation voltage as a function of collector current; typical values
BCP69_6
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 -- 2 December 2008
7 of 13
NXP Semiconductors
BCP69
20 V, 1 A PNP medium power transistor
103
mle309
-2.4 IC (A) -2.0 IB (mA) = -12.0
006aab404
hFE
-10.8 -9.6 -7.2 -8.4 -6.0 -3.6 -2.4
-1.6 -1.2
-4.8 -0.8 -0.4
-1.2
102 -10-1
-1
-10
-102
-103 -104 IC (mA)
0 0
-1
-2
-3
-4 VCE (V)
-5
VCE = -1 V
Tamb = 25 C
Fig 7.
BCP69-25: DC current gain as a function of collector current; typical values
mle304
Fig 8.
BCP69-25: Collector current as a function of collector-emitter voltage; typical values
mle310
-1000 VBE (mV) -800
-103 VCEsat (mV) -102
-600
-400 -10 -200
0 -10-1
-1
-10
-102
-103 -104 IC (mA)
-1 -10-1
-1
-10
-102
-103 -104 IC (mA)
VCE = -1 V
IC/IB = 10
Fig 9.
BCP69-25: Base-emitter voltage as a function of collector current; typical values
Fig 10. BCP69-25: Collector-emitter saturation voltage as a function of collector current; typical values
BCP69_6
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 -- 2 December 2008
8 of 13
NXP Semiconductors
BCP69
20 V, 1 A PNP medium power transistor
8. Package outline
6.7 6.3 3.1 2.9 4 1.1 0.7 7.3 6.7 3.7 3.3
1.8 1.5
1 2.3 4.6 Dimensions in mm
2
3 0.8 0.6 0.32 0.22 04-11-10
Fig 11. Package outline SOT223 (SC-73)
9. Packing information
Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number[2] BCP69 BCP69-16 BCP69-16/DG BCP69-16/IN BCP69-25
[1] [2] For further information and the availability of packing methods, see Section 13. /DG: halogen-free
Package SOT223
Description 8 mm pitch, 12 mm tape and reel
Packing quantity 1000 -115 4000 -135
BCP69_6
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 -- 2 December 2008
9 of 13
NXP Semiconductors
BCP69
20 V, 1 A PNP medium power transistor
10. Soldering
7 3.85 3.6 3.5 0.3 1.3 1.2 (4x) (4x)
4
solder lands solder resist 3.9 6.1 7.65 solder paste occupied area
1
2
3
Dimensions in mm
2.3 1.2 (3x) 1.3 (3x) 6.15
2.3
sot223_fr
Fig 12. Reflow soldering footprint SOT223 (SC-73)
8.9 6.7
1.9 solder lands solder resist 6.2 8.7 occupied area Dimensions in mm
1 2 3
4
1.9 (3x)
preferred transport direction during soldering
2.7 1.1
2.7 1.9 (2x)
sot223_fw
Fig 13. Wave soldering footprint SOT223 (SC-73)
BCP69_6 (c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 -- 2 December 2008
10 of 13
NXP Semiconductors
BCP69
20 V, 1 A PNP medium power transistor
11. Revision history
Table 10. BCP69_6 Modifications: Revision history Release date 20081202 Data sheet status Product data sheet Change notice Supersedes BCP69_5 Document ID
* * * * * * * * *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Table 1 "Product overview": enhanced Table 4 "Ordering information": enhanced Figure 2, 4 and 8: updated Figure 11: superseded by minimized package outline drawing Section 9 "Packing information": added Section 10 "Soldering": enhanced Section 12 "Legal information": updated Product specification Product specification Product specification BCP69_4 BCP69_3 BCP69_CNV_2
BCP69_5 BCP69_4 BCP69_3
20031125 20021115 19990408
BCP69_6
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 -- 2 December 2008
11 of 13
NXP Semiconductors
BCP69
20 V, 1 A PNP medium power transistor
12. Legal information
12.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
12.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
BCP69_6
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 -- 2 December 2008
12 of 13
NXP Semiconductors
BCP69
20 V, 1 A PNP medium power transistor
14. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Packing information. . . . . . . . . . . . . . . . . . . . . . 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 2 December 2008 Document identifier: BCP69_6

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