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350 MA CONSTANT-CURRENT LED DRIVER
FSP3300
FEATURES
No external component required 350mA constant sink current Output short circuit protection Low dropout voltage Low quiescent current Build-in thermal protection Supply voltage range 2.7V~7V 2KV HBM ESD protection Advanced CMOS process SOT89 and TO252 package
GENERAL DESCRIPTION
The FSP3300 is a low dropout current regulator rated for 350mA constant sink current. The low quiescent current and low dropout voltage is achieved by advanced CMOS process
APPLICATIONS
Power LED driver
PIN CONFIGURATION
(1) SOT89 (Top View) (2) TO252 (Top View)
3 2 GND
VDD
1
OUT
2
GND
3
VDD
1
OUT
Symbol 1 2 3
Name OUT GND VDD
Descriptions Output pin, connect to load Ground Power supply
BLOCK DIAGRAM
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FSP3300
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Rating Unit VDD Input Voltage 2.7 to 7 V VLEDn Output Voltage 2.7 to 7 V TJ Maximum Junction Temperature 150 Tstg Storage Temperature Range -40~+150 Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of the specified terminal.
ELECTRICAL CHARACTERISTICS (VDD=3.7V, TA=25, UNLESS OTHERWISE NOTED)
Symbol ISINK Parameter Test Conditions Min. 305 Typ. 350 120 200 Max. 390 5 5 Unit mA mA/V mA/V mV A Apply Pin OUT VDD
Output Sink Current VOUT=0.2V Load Regulation VOUT=0.2V to 3V Line Regulation VDD=3V to 6V , VOUT=0.2V VOUTL Output Dropout Voltage IDD Supply Current Consumption Note: Output dropout voltage: 90% xIOUT@ VOUT=200mV
Recommended Operating Conditions
Symbol VDD IOUT Ta Parameter Supply Voltage Output Sink Current Operating free-air temperature range Min. 2.7 -40 Typ. Max. 6 400 +85 Unit V mA
Power Dissipation Table
JA Derating factor (mW/) Power rating (mW) Power rating (mW) Power rating (mW) TA25 (/W) TA=70 TA=85 TA25 PK 71 14.1 1763 1128 916 Note: Junction Temperature Calculation: TJ=TA+(PDxJA). PD: Power Dissipation, TA: Ambient temperature, JA: Thermal Resistance-Junction to Ambient. The JA numbers are guidelines for the thermal performance of the device/PC-board system. All of the above assume no ambient airflow. Package
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FSP3300
TYPICAL APPLICATIONS CIRCUIT
(1) Typical Application Circuit
Supply Voltage 2.7V to 7.0V
1 3 VDD
OUT 2 GND
Note: 1. The supply voltage should be larger than the forward voltage of the LED by 0.15V. VDDVLEDF+0.15 In the application of VDD= VLEDF+0.15, the chip works in the max efficiency and min power dissipation
(2) Typical Application Circuit for Larger Current
Supply Voltage 4*Battery 6V
1 3 VDD
OUT 2 GND 1 3 VDD
OUT 2 GND
Note: The FSP3300 can be parallel connected to get larger driver current (about 700mA) for 3W LED. At this application, the supply voltage should be 6V at least for 3W LED. To minimize the chip power dissipation, there should be a diode connected between supply to VDD of the chip. The forward voltage of the diode should be less than 3.3V.
APPLICATION INFORMATION
The maximum power dissipation on regulator: PD(MAX)=VOUT(MAX)xIOUT(NOM)+VIN(MAX) xIQ VOUT(MAX =the maximum voltage on output pin IOUT(NOM)=the nominal output current IQ =the quiescent current the regulator consumes at VIN(MAX =the maximum input voltage Thermal consideration: The FSP3300 have internal power and thermal limiting circuitry designed to protect the device under overload conditions. However maximum junction temperature ratings should not be exceeded under continuous normal load conditions. The thermal protection circuit of FSP3300 prevents the device from damage due to excessive power dissipation. When the device temperature rises to approximately 120, the regulator will be turned off. When power consumption is over about 700mW (SOT89-3L package at TA=70), additional heat sink is required to control the junction temperature below 120. The junction temperature is: TJ=PD(JT+CS +SA)+TA PD: Dissipation power JT: Thermal resistance from the junction to the mounting tab of the package CS: Thermal resistance through the interface between the IC and the surface on which it is mounted. (typically, CS1.0/W)
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SA: Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink) If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of copper foil required. For multi-layered PCB, these layers can also be used as a heat sink, They can be connected with several through hole vias. PCB SA (/W) PCB heat sink size (mm2) 59 500 45 1000 38 1500 33 2000 27 3000 24 4000 21 5000
TYPICAL PERFORMANCE CHARACTERISTICS
0.17 0.16 0.15 0.14 0.13 0.12 0.11 0.10 Quiescent Current vs Supply Voltage
0.22 0.20 0.18 0.16 0.14 0.12 0.10 20 Quiescent Current vs Temperature
IQ(mA)
IQ(mA)
2
2.5
3 VIN(V)
3.5
4
30
40
50 60 70 80 Temperature()
90 100
Output Current vs Out-dropout Voltage 140 120 100 80 60 40 20 0 0.01 0.1 1 10 OUT-DROPOUT(V)
OUT(mA)
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FSP3300
ORDERING INFORMATION
FSP3300X X X Package: Y: SOT89 D: TO252 Packing: Blank: Tube or Bulk A: Tape & Reel
Temperature Grade: D: -40~85
MARKING INFORMATION
(1) SOT89 (2) TO252
Logo
Logo
LAYMX
Internal Code Date Code: Y: Year (1=2001) M: Month (1~9, O,N, D) Part Number: FSP3300
FSP3300
YYWWXX
Part Number
Internal Code Date Code: YY: Year (01=2001) WW: Nth week (01~52)
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FSP3300
PACKAGE INFORMATION
(1) SOT89
D1
1.7
E
HE
0.4 1.9
L
2.7
e1
0.9
1.5
e
Land Patten Recommendation (Unit :mm)
8(2) D
5(2)
A
b
b1
b
Symbol A b b1 C D D1 e e1 E HE L
Min. 1.40 0.36 0.41 0.35 4.40 1.40 2.90 1.45 2.35 3.94 0.80
Dimensions In Millimeters Nom. 1.50 0.42 0.47 0.39 4.50 1.60 3.00 1.50 2.48
C
Max. 1.60 0.48 0.53 0.43 4.60 1.75 3.10 1.55 2.60 4.25 1.20
Min. 0.055 0.014 0.016 0.014 0.173 0.055 0.114 0.057 0.093 0.155 0.031
Dimensions In Inches Nom. 0.059 0.016 0.043 0.015 0.177 0.062 0.118 0.059 0.098
1.3
Max. 0.063 0.018 0.051 0.017 0.181 0.069 0.122 0.061 0.102 0.167 0.047
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FSP3300
(2) TO252
5.6
E b2 L2
11.0
5.6
2.25
L1
2.0
1.2
b e1 e
Land Pattern Recommendation (Unit : mm)
H C1 L
7.2
D
C A1
SEATING PLANE
SEE NOTE2
Notes: 1. JEDEC Outline:TO-252 AB 2. Mils suggested for positive contact at mounting
Symbol A A1 b b2 C C1 D E e e1 H L L1 L2 Dimensions In Millimeters Nom. Max. 2.29 2.39 1.15 1.27 0.61TYP. 5.35 5.50 0.52 0.58 0.52 0.58 5.57 5.80 6.58 6.80 2.25BSC. 4.50BSC. 9.70 10.40 0.83 1.78 1.02 2.03 Dimensions In Inches Nom. 0.090 0.045 0.024TYP. 0.211 0.020 0.020 0.219 0.259 0.089BSC. 0.177BSC. 0.382 0.033 0.070
Min. 2.18 1.02 5.20 0.46 0.46 5.33 6.35 9.00 0.51 0.64 1.52
Min. 0.086 0.040 0.205 0.018 0.018 0.210 0.250 0.354 0.020 0.025 0.060
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A
Max. 0.094 0.050 0.217 0.023 0.023 0.228 0.268 0.409 0.040 0.080

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