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| CHR2297 RoHS COMPLIANT 36-44GHz Multifunction (MFC) Down-Converter GaAs Monolithic Microwave IC Description The CHR2297 is a multifunction chip (MFC) which integrates a LO buffer amplifier, an IF amplifier and a single cold FET mixer. It is usable for down-conversion. It is designed for a wide range of applications, from military to commercial communication systems. The backside of the chip is both RF and DC grounds. This helps to simplify the assembly process. The circuit is manufactured with a p-HEMT process, 0.25m gate length, via holes through the substrate, air bridges and electron beam gate lithography. It is available in chip form. Down converter LO IF RF Conversion Gain 10 9 Main Features Conversion Gain (dB) 8 7 6 5 4 3 2 1 0 34 35 36 37 38 39 40 41 42 43 44 45 46 RF Frequency (GHz) F_IF= 2GHz F_IF= 6GHz Broadband performance : 36-44GHz RF 2.5dB conversion gain 0dBm LO input power +4dBm input power (1dB gain comp.) DC power consumption, 65mA @ 4V Chip size : 1.33 x 1.68 x 0.10 mm Main Characteristics Tamb. = 25C Parameter FRF FLO FIF Gc RF frequency range LO frequency range IF frequency range Conversion Gain Min 36 30 2 Typ Max 44 39 6 Unit GHz GHz GHz dB 2.5 ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions ! Ref. : DSCHR22977187 - 06 Jul 07 1/6 Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Route Departementale 128 - B.P.46 - 91401 Orsay Cedex France Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 CHR2297 Electrical Characteristics Tamb = +25C Symbol FRF FLO FIF Gc PLO LO_IF Lk 36-44GHz MFC Down-Converter Parameter RF frequency range LO frequency range IF frequency range Conversion Gain LO Input power LO Leakage on IF (for PLO=0dBm) RF Leakage on IF (for PRF=-5dBm) Input power at 1dB gain compression LO Matching (1) RF Matching (1) IF Matching Drain bias voltage (pads Vd1, Vd2) Gate bias voltage (pad Vg) Drain bias current Min 36 30 2 Typ Max 44 39 6 Unit GHz GHz GHz dB dBm dBm dBm dBm dBm 2.5 0 -28 -22 -50 +4 2.0:1 2.0:1 2.0:1 4 -1 65 LO_RF Lk LO Leakage on RF (for PLO=0dBm) RF_IF Lk P1dB LO Match RF Match IF Match Vd Vg Id V V mA (1) A wire bond of typically 0.1 to 0.15 nH will improve the input and output matching. Absolute Maximum Ratings (1) Tamb = +25C Symbol Vd Id PLO Ta Tstg Drain bias voltage Drain bias current Maximum LO input power Operating temperature range Storage temperature range Parameter Values 4.5 100 5 -40 to +85 -55 to +125 Unit V mA dBm C C (1) Operation of device above anyone of these parameters may cause permanent damage. Ref. : DSCHR22977187 - 06 Jul 07 2/6 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 36-44GHz MFC Down-Converter Typical on wafer measurement Tamb: 25C, Vd=4V, Vg= -1V, PLO= 0dBm Conversion gain versus RF frequency 10 9 8 7 CHR2297 Conversion Gain (dB) 6 5 4 3 2 1 0 34 35 36 37 38 39 40 41 42 43 44 45 46 RF Frequency (GHz) F_IF= 2GHz F_IF= 6GHz Conversion gain versus RF input power 10 9 8 7 RF=36GHz, IF=2GHz RF=40GHz, IF=2GHz RF=36GHz, IF=6GHz RF=40GHz, IF=6GHz RF=44GHz, IF=6GHz Conversion Gain (dB) 6 5 4 3 2 1 0 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10 RF input power (dBm) Ref. : DSCHR22977187 - 06 Jul 07 3/6 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 CHR2297 0 36-44GHz MFC Down-Converter LO Leakage on RF port -5 F_IF= 2GHz F_IF= 6GHz LO Leakage on RF port (dBm) -10 -15 -20 -25 -30 -35 -40 34 35 36 37 38 39 40 41 42 43 44 45 46 RF Frequency (GHz) LO Leakage on IF port 0 -5 F_IF= 2GHz F_IF= 6GHz LO Leakage on IF port (dBm) -10 -15 -20 -25 -30 -35 -40 34 35 36 37 38 39 40 41 42 43 44 45 46 RF Frequency (GHz) Ref. : DSCHR22977187 - 06 Jul 07 4/6 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 36-44GHz MFC Down-Converter Recommanded assembly plan CHR2297 25m wedge bonding is recommended Ref. : DSCHR22977187 - 06 Jul 07 5/6 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 CHR2297 Mechanical data 36-44GHz MFC Down-Converter Tol: 35m Chip thickness: 100m. All dimensions are in micrometers Ordering Information Chip form : CHR2297-98F/00 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHR22977187 - 06 Jul 07 6/6 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 |
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