Part Number Hot Search : 
DFREE 224SH P6KE47 TIES27 SP8043 AD654JN 2SK1394 WT6803
Product Description
Full Text Search
 

To Download RFP-100200A25Z50 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 Model RFP-100200A25Z50
Surface Mount Termination 10 Watts, 50
Description
The RFP-100200A25Z50 is high performance Alumina surface mount termination intended as a lower cost alternative to Aluminum Nitride (AlN) and Beryllium Oxide (BeO). The termination is well suited to all cellular frequency bands such as; AMPS, GSM, DCS, PCS, PHS and UMTS. The high power handling makes the part ideal for terminating 90 degree hybrid, directional couplers, and for use in isolators.
General Specifications Features:
* 10 Watts * Lowest Cost * True Surface Mount * Alumina Ceramic * Non-Nichrome Resistive Element * Low VSWR
* 100% Tested Resistive Element Substrate Terminal Finish Operating Temperature Thick film Alumina Ceramic Thick film Silver -55 to +125C (see chart)
Tolerance is 0.010", unless otherwise specified. Designed to meet of exceed applicable portions of MIL-E-5400. All dimensions in inches.
Electrical Specifications
Resistance Value: Power: Frequency Range: V.S.W.R.: 50 ohms, 2% 10 Watts DC - 3.0 GHz <1.25:1
Specification based on unit properly installed using suggested mounting instructions and a 50 ohm nominal impedance. Specifications subject to change without notice
Outline Drawing
100200A25Z50 (097) Rev C
Available on Tape and Reel For Pick and Place Manufacturing.
USA/Canada: Toll Free: Europe:
(315) 432-8909 (800) 544-2414 +44 2392-232392
Model RFP-100200A25Z50
Typical Performance:
Power De-rating:
Tape & Reel:
RF PAD LOCATION .060 DIA. .160 .470 .010
.215
.070
.120 .160
.220
DESPOOLING DIRECTION SCALE: NONE
SOLDER PASTE
.070
PCB Solder interface Temperature - C
Mounting Footprint and Procedure:
50 ohm line 0.092 [2.34] 0.025 [0.63]
SCREW (2 PLS.)
0.035 [0.89]
O0.101 [O2.57] 2x 4-40 Screw Hole O0.031 [O0.79] 0.060 [1.52]
PC BOARD HEATSINK
SOLDER FILLED VIA
MOUNTING PROCEDURE
1. Drill thermal vias through PCB and fill with solder. 2. Solder part in place using appropriate solder with a controlled temperature iron. 3. To ensure good thermal connectivity to heat sink, which is critical for proper operation, drill and tap heatsink and mount PCB board to heatsink using screws.
0.250 [6.35]
Dimension given in inches [millimeters] For best thermal performance the PCB should be soldered to the heat sink.
100200A25Z50 (097) Rev C
USA/Canada: Toll Free: Europe:
(315) 432-8909 (800) 544-2414 +44 2392-232392
Available on Tape and Reel For Pick and Place Manufacturing.


▲Up To Search▲   

 
Price & Availability of RFP-100200A25Z50

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X