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| ASMT-MX20 3W Power LED Light Source Data Sheet Description 3W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard. The low profile package design is suitable for a wide variety of applications especially where height is a constraint. The package is compatible with reflow soldering process. This will give more freedom and flexibility to the light source designer. Features * * * * * * * * * * Available in white color Energy efficient Exposed pad for excellent heat transfer Suitable for reflow soldering process High current operation up to 700 mA Long operation life Wide viewing angle Silicone encapsulation ESD of 2 kV MSL 2A Specifications * InGaN technology * 4.0 V, 700 mA (max.) * 110 viewing angle Applications * * * * * * * Portable (flash light, bicycle headlight) Reading light Architectural lighting Garden lighting Decorative lighting Backlighting General lighting Package Dimensions 10.00 1 2 3 ANODE CATHODE ANODE 3.30 8.50 METAL SLUG 3 1.27 5.26 10.60 8.50 8.00 1.30 5.25 1 2 2.00 0.81 5.08 LED + - NOTES: 1. ALL DIMENSIONS IN MILLIMETERS. 2. TOLERANCE IS 0.1 mm UNLESS OTHERWISE SPECIFIED. Device Selection Guide at Junction Temperature Tj = 25C Color White Part Number ASMT-MW20 Luminous Flux, v[1][2] (lm) Min. Typ. 95 140 Test Current (mA) 700 Dice Technology InGaN Notes: 1. V is the total luminous flux output as measured with an integrating sphere at 25 ms mono pulse condition. 2. Flux tolerance is 10%. 2 Part Numbering System A S M T- M x 2 0 - N x 1 x 2 x 3 0 Color Bin Selection Max. Flux Bin Selection Min. Flux Bin Selection Color W - White Absolute Maximum Ratings at TA = 25C Parameter DC Forward Current Peak Pulsing Current [1] ASMT-MX20 700 1000 120 -30 to +85 -40 to +120 Refer to Figure 5 Units mA mA C C C LED Junction Temperature Operating Ambient Temperature Range Storage Temperature Range Soldering Temperature Note: 1. Pulse condition duty factor = 10%, Frequency = 1 kHz. Optical Characteristics (TA = 25 C) Part Number ASMT-MW20 Color White Typical Chromaticity Coordinates x y 0.33 0.33 Viewing Angle 21/2[1] (Degrees) Typ. 110 Luminous Efficiency (lm/W) Typ. 57 Notes: 1. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristic (TA = 25C) Dice Type InGaN Forward Voltage VF (Volts) Min. 3.03 Max. 4.00 Reverse Voltage VR[1] Not recommended Thermal Resistance Rj-ms (C/W)[2] Typ. 8 Notes: 1. Not designed for reverse bias operation. 2. Rj-ms is Thermal Resistance from LED junction to metal slug. 3 1.0 0.9 0.8 RELATIVE INTENSITY 700 WHITE 600 FORWARD CURRENT - mA 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 430 480 530 580 630 WAVELENGTH - nm 680 730 780 500 400 300 200 100 0 0 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 FORWARD VOLTAGE - V Figure 1. Relative intensity vs. wavelength Figure 2. Forward current vs. forward voltage 1.0 1.0 0.9 0.8 RELATIVE INTENSITY RELATIVE LUMINOUS FLUX (v) - lm 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 100 200 300 400 500 600 700 WHITE 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -70 -50 -30 -10 10 30 50 70 90 MONO PULSE CURRENT - mA OFF-AXIS ANGLE () Figure 3. Relative luminous flux vs. mono pulse current Figure 4. Radiation pattern 10.70 0.10 10 - 30 SEC. 255 - 260 C TEMPERATURE 8.40 0.10 217 C 200 C 150 C 3 C/SEC. MAX. -6 C/SEC. MAX. 17.00 0.20 3 C/SEC. MAX. 60 - 120 SEC. 100 SEC. MAX. 1.00 0.10 3.1 0.10 TIME (Acc. to J-STD-020C) 5.08 0.10 Figure 5. Recommended reflow soldering Figure 6. Recommended soldering land pattern 4 100 90 RELATIVE INTENSITY (%) 80 70 60 50 40 30 20 10 0 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 JUNCTION TEMPERATURE (C) Figure 7. Relative LOP vs. junction temperature COOL WHITE Flux Bin Limit (for Reference Only) [X1 X2] Bin A B C D E F G H J K L M N Flux (lm) at 700 mA Min. 5.5 7.0 9.0 11.5 15.0 19.5 25.5 33.0 43.0 56.0 73.0 95.0 124.0 Max. 7.0 9.0 11.5 15.0 19.5 25.5 33.0 43.0 56.0 73.0 95.0 124.0 161.0 Color Bin Selections [ X3 ] 0 A B C D E F Z Y W V U T S Q P N M L K J 1 2 3 4 5 6 Individual reel will contain parts from one full bin only. Full Distribution A only B only C only D only E only F only A and B only B and C only C and D only D and E only E and F only F and G only G and H only A, B and C only B, C and D only C, D and E only D, E and F only E, F and G only F, G and H only Special Color Bin A, B, C and D only E, F, G and H only B, C, D and E only C, D, E and F only A, B, C, D and E only B, C, D, E, and F only Tolerance for each bin limits is 10% White Bin A Bin B Bin C Bin D Bin E Bin F Bin G Bin H Tolerances 0.01 Color Limits (Chromaticity Coordinates) X 0.367 0.362 Y 0.400 0.372 X 0.362 0.356 Y 0.372 0.330 X 0.329 0.329 Y 0.369 0.345 X 0.329 0.329 Y 0.345 0.302 X 0.303 0.307 Y 0.333 0.311 X 0.307 0.311 Y 0.311 0.285 X 0.388 0.379 Y 0.417 0.383 X 0.379 0.369 Y 0.383 0.343 0.329 0.345 0.329 0.302 0.305 0.322 0.311 0.285 0.283 0.284 0.290 0.265 0.362 0.372 0.356 0.330 0.329 0.369 0.329 0.345 0.301 0.342 0.305 0.322 0.274 0.301 0.283 0.284 0.367 0.400 0.362 0.372 0.44 0.42 0.40 0.38 G A 4.0 k 4.5 k 0.36 Y - COORDINATE 0.34 0.32 0.30 0.28 0.26 0.24 0.24 10 k C 5.6 k B D H BLACK BODY CURVE E F 7k 0.26 0.28 0.30 0.32 0.34 X-COORDINATE 0.36 0.38 0.40 0.42 0.44 6 Package Tube Dimensions 535 10.5 6.6 10.5 36.5 Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body (white epoxy). This product is classified as moisture sensitive level 2A When the bag is opened, parts required to mount within 672 hours of factory conditions 30C/60%, and stored at <10% RH. Devices required bake, before mounting if: a) The humidity indicator card is >10% when read at 23 5C b) The pack has been opened for more than 672 hours. Baking recommended condition: 60 5C for 20 hours. DISCLAIMER AVAGO'S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2007 Avago Technologies Limited. All rights reserved. AV02-0153EN - August 3, 2007 |
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