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HLMP-CYxx
Precision Optical Performance 5mm Round Warm White LED Lamps
Data Sheet
Description
These high intensity white LED lamps are based on InGaN material technology. A blue LED die is coated by phosphortoproducewhite. The typical resulting color is described by the coordinates x= 0.41, y = 0.39 using the CIE 1931 Chromaticity Diagram. These T-13/4 lamps are untinted, non-diffused, and incorporate precise optics which produce welldefined spatial radiation patterns at specific viewing coneangle.
Features
* Welldefinedspatialradiationpattern * Highluminouswhiteemission * Viewingangle:15,23,30and50 * Standoffornon-standoffleads
Package Dimensions
Package Dimension A
5.00 0.20 (0.197 0.008) 8.71 0.20 (0.343 0.008) 1.14 0.20 (0.045 0.008)
Package Dimension B
5.00 0.20 (0.197 0.008) 8.71 0.20 (0.343 0.008)
DIMENSION H
2.35 (0.093) MAX.
0.70 (0.028) MAX. 31.60 MIN. (1.244)
1.14 0.20 (0.045 0.008) 1.50 0.15 (0.059 0.006) 0.70 (0.028) MAX.
31.60 MIN. (1.244)
CATHODE LEAD
DIMENSION H: 15: 12.24 0.25mm (0.482 0.01 inches) 23: 12.50 0.25mm (0.492 0.01 inches) 30: 12.00 0.25mm (0.472 0.01 inches)
CATHODE LEAD
0.50 0.10 SQ. TYP. (0.020 0.004)
1.00 MIN. (0.039)
1.00 MIN. (0.039)
CATHODE FLAT 5.80 0.20 (0.228 0.008) 2.54 0.38 (0.100 0.015)
0.50 0.10 (0.020 0.004)
SQ. TYP.
CATHODE FLAT
5.80 0.20 (0.228 0.008) 2.54 0.38 (0.100 0.015)
Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate during handling and processing. Refer to Application Note AN-1142 for additional details.
HLMP-CY46/47 Package drawing
Package Dimension C
5.00 0.20 (0.197 0.008) 8.71 0.20 (0.343 0.008) 1.14 0.20 (0.045 0.008)
Package Dimension D
5.00 0.20 (0.197 0.008) 8.71 0.20 (0.343 0.008)
DIMENSION H
0.70 (0.028) MAX. 31.60 MIN. (1.244)
2.35 (0.093) MAX.
1.14 0.20 (0.045 0.008) 1.50 0.15 (0.059 0.006) 0.70 (0.028) MAX.
31.60 MIN. (1.244)
DIMENSION H: 50: 11.98 0.25mm (0.4715 0.01 inches)
CATHODE LEAD
CATHODE LEAD
1.00 MIN. (0.039)
0.50 0.10 SQ. TYP. (0.020 0.004)
1.00 MIN. (0.039)
0.50 0.10 (0.020 0.004)
SQ. TYP.
CATHODE FLAT
5.80 0.20 (0.228 0.008) 2.54 0.38 (0.100 0.015)
CATHODE FLAT
5.80 0.20 (0.228 0.008) 2.54 0.38 (0.100 0.015)
Note: 1. Alldimensionsareinmillimeters/inches. 2. Epoxymeniscusmayextendabout1mm(0.040")downtheleads. 3. Ifheatsinkingapplicationisrequired,theterminalforheatsinkisanode.
Device Selection Guide
Part Number HLMP-CY-WZ0DD HLMP-CY-WZ0DD HLMP-CY6-VY0DD HLMP-CY7-VY0DD HLMP-CY36-UX0DD HLMP-CY37-UX0DD HLMP-CY46-TW0DD HLMP-CY47-TW0DD Typical Viewing Angle () 5 5 3 3 30 30 50 50 Luminous Intensity (mcd) at 20mA Min. 5500 5500 400 400 300 300 500 500 Max. 6000 6000 000 000 9300 9300 5500 5500 Standoff No Yes No Yes No Yes No Yes Package Dimension A B A B A B C D
Toleranceforeachintensitylimitis15%.
Part Numbering System
HLMP - C Y xx - x x x xx Packaging Option DD: Ammopacks Color Bin Selection 0: Open distribution Maximum Intensity Bin 0: No maximum intensity limit Minimum Intensity Bin Refer to Device Selection Guide Viewing Angle 11/12: 15 package 26/27: 23 package 36/37: 30 package 46/47: 50 package Color: Y: Warm White Package C: 5mm round Lamps
Absolute Maximum Rating TA = 25C
Parameter DC Forward Current Peak Forward Current Power Dissipation Reverse Voltage LED Junction Temperature Operating Temperature Range Storage Temperature Range
Notes: 1. DeratelinearlyasshowninFigure2 2. DutyFactor10%,frequency1kHz.
White 30 00[] 6 5 (IR = 0 A) 0 -40 to +85 -40 to +00
Unit mA mA mW V C C C
Optical/ Electrical Performance at 25C
Parameter Forward Voltage Reverse Voltage Thermal Resistance Chromaticity Coordinate Symbol VF VR RJ-PIN X y Min .8 5.0 40 0.4 0.39 Typ 3. Max 3.8 Units V V C/W Test Condition IF = 0 mA IR = 0 A LED junction to anode lead IF = 0 mA
Notes: 1.ThereversevoltageoftheproductisequivalenttotheforwardvoltageoftheprotectivechipatIR=10A 2.ThechromaticitycoordinatesarederivedfromtheCIE1931ChromaticityDiagramandrepresenttheperceivedcolorofthedevice.
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1.0 0.8 0.6 0.4 0.2 0.0 IF max. - MAXIMUM FORWARD CURRENT - mA 380 480 580 WAVELENGTH - nm 680 780
35 30 25 20 15 10 5 0 0 20 40 60 80 100
RELATIVE INTENSITY
T A - AMBIENT TEMPERATURE - C
Figure 1. Relative Intensity vs. Wavelength
Figure 2. Forward current vs Ambient Temperature
1.6 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.4 1.2 Y-COORDINATE 1 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 DC FORWARD CURRENT - mA 35
0.003 0.002 0.001 0 -0.001 10mA -0.002 -0.003 -0.004 20mA 0 0.002 0.004 30mA
-0.006
-0.004
-0.002
5mA
X-COORDINATE
Figure 3. Relative Intensity vs Forward Current
Figure 4. Chromaticity shift vs forward current
35 30 FORWARD CURRENT - mA 25 20 15 10 5 0 0 1 2 FORWARD VOLTAGE - V 3 4
Figure 5. Forward current vs forward voltage
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Radiation Pattern
1 NORMALIZED INTENSITY NORMALIZED INTENSITY -90 -60 -30 0 30 60 90 0.8 0.6 0.4 0.2 0 1 0.8 0.6 0.4 0.2 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90
ANGULAR DISPLACEMENT - DEGREES
Figure 6. Radiation pattern for HLMP-CY11/12
1 NORMALIZED INTENSITY
Figure 7. Radiation pattern for HLMP-CY26/27
1 NORMALIZED INTENSITY 0.8 0.6 0.4 0.2 0 0 30 60 90 120 150 180
0.8 0.6 0.4 0.2 0 0 30 60 90 120 150 180
ANGULAR DISPLACEMENT - DEGREES
ANGULAR DISPLACEMENT - DEGREES
Figure 8. Radiation pattern for HLMP-CY36/37
Figure 9. Radiation pattern for HLMP-CY46/47
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Intensity Bin Limit Table at 20mA
Intensity (mcd) at 20 mA Bin T U V W X Y Z Min 500 300 400 5500 700 9300 000 Max 300 400 5500 700 9300 000 6000
Color bin limits
Rank 3 Chromaticity Coordinates Limits X Y X Y X Y 0.360 0.3850 0.3988 0.46 0.4390 0.430 0.3988 0.46 0.4390 0.430 0.4970 0.4466 0.38 0.3580 0.49 0.375 0.4588 0.3838 0.3545 0.3408 0.38 0.3580 0.49 0.375 0.360 0.3850 0.3988 0.46 0.4390 0.430
Toleranceforeachbinlimitis0.01
Toleranceforeachbinlimitis15%
Avago Warm white binning on CIE 1931 Chromaticity Diagram
0.500
0.450 Bin 3 0.400 Bin 1 Bin 2 y
0.350
Black Body 0.300 0.300 0.350 0.400 x 0.450 0.500 0.550
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Precautions:
Lead Forming:
* TheleadsofanLEDlampmaybeperformedorcutto lengthpriortoinsertionandsolderingonPCboard. * Ifleadformingisrequiredbeforesoldering,caremust betakentoavoidanyexcessivemechanicalstressthat induced into the LED package. Otherwise, cut the leads to applicable length after soldering process at roomtemperature.Thesolderjointformedwillabsorb the mechanical stress, due to the lead cutting, from travelingtotheLEDchipdieattachandwirebond. * For better control, it is recommended to use proper tooltopreciselyformandcuttheleadstoapplicable lengthratherthandoingitmanually.
Avago Technologies LED configuration
Anode
InGaN Device
Note:ElectricalconnectionbetweenbottomsurfaceofLEDdieand theleadframematerialthroughconductivepasteofsolder.
Soldering condition:
* Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. * Theclosestmanualsolderingdistanceofthesoldering heat source (soldering iron's tip) to the body is 1.59mm.SolderingtheLEDcloserthan1.59mmmight damagetheLED.
1.59mm
* If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during solderingprocess. * Atelevatedtemperature,theLEDismoresusceptible to mechanical stress.Therefore, PCB must allowed to cool down to room temperature prior to handling, whichincludesremovalofjigs,fixturesorpallet. * Special attention must be given to board fabrication, solder masking, surface platting and lead holes size andcomponentorientationtoassurethesolderability.
* Recommendedsolderingcondition: Wave Soldering Pre-heat temperature Preheat time Peak temperature 05 C Max. 30 sec Max 50 C Max. Manual Solder Dipping 60 C Max.
* RecommendedPCboardplatedthroughholessizefor LEDcomponentleads. LED component lead size 0.457 x 0.457 mm (0.08 x 0.08 inch) 0.508 x 0.508 mm (0.00 x 0.00 inch) Diagonal 0.646 mm (0.05 inch) 0.78 mm (0.08 inch) Plated through hole diameter 0.976 to .078 mm (0.038 to 0.04 inch) .049 to .50 mm (0.04 to 0.045 inch)
Dwell time 3 sec Max. 5 sec Max * Wave soldering parameter must be set and maintain according to the recommended temperature and dwelltime.Customerisadvisedtodailycheckonthe soldering profile to ensure that the soldering profile is always conforming to recommended soldering condition.
Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a changeintemperatureexperiencedbytheboardifsamewave soldering setting is used. So, it is recommended to re-calibrate thesolderingprofileagainbeforeloadinganewtypeofPCB. 2. Avago Technologies' high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature is not exceeding 250C. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination.
* Under sizing of plated through hole can lead to twisting or improper LED placement during auto insertion.Oversizingplatedthroughholecanleadto mechanicalstressontheepoxylensduringclinching.
Note: Refer to application note AN1027 for more information on solderingLEDcomponents.
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Recommended Wave Soldering Profile
TURBULENTWAVE 250 LAMINARWAVE HOTAIRKNIFE
200
TEMPERATURE-C
TOPSIDE OFPCBOARD BOTTOMSIDE OFPCBOARD
150 FLUXING 100 CONVEYORSPEED=1.83M/MIN(6FT/MIN) PREHEATSETTING=150C(100CPCB) SOLDERWAVETEMPERATURE=245C5C AIRKNIFEAIRTEMPERATURE=390C AIRKNIFEDISTANCE=1.91mm(0.25IN.) AIRKNIFEANGLE=40 SOLDER:SN63;FLUX:RMA LEADFREESOLDER 96.5%Sn;3.0%Ag;0.5%Cu NOTE:ALLOWFORBOARDSTOBE SUFFICIENTLYCOOLEDBEFORE EXERTINGMECHANICALFORCE. 40 50 TIME-SECONDS 60 70 80 90 100
50 30 PREHEAT 10 20 30
0
Ammo Packs Drawing
6.351.30 0.250.0512 12.701.00 0.500.0394
CATHODE
20.501.00 0.8070.039 9.1250.625 0.35930.0246
18.000.50 0.70870.0197
o\C7;4.000.20TYP. 12.700.30 0.500.0118 0.700.20 0.02760.0079 A VIEW A-A A 0.15750.008
Note:Theammo-packsdrawingisapplicableforpackagingoption-DD&-ZZandregardlessstandoffornon-standoff
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Packaging Box for Ammo Packs
Note:ForInGaNdevice,theammopackpackagingboxcontainESDlogo
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 007 Avago Technologies Limited. All rights reserved. AV0-0EN - March 9, 007

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