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HLMP-AD85, HLMP-AD87, HLMP-AM86, HLMP-AM87, HLMP-AB86, HLMP-AB87
Precision Optical Performance e reen an le 5mm Mini Oval s
Data Sheet
Description
These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger informationsigns.Theovalshapedradiationpatternand highluminousintensityensurethesedevicesareexcellent forwidefieldofviewoutdoorapplicationswhereawide viewing angle and readability in sunlight are essential. These lamps have very smooth, matched radiation patternsensuringconsistentcolormixinginfullcolorapplications, message uniformity across the viewing angle ofthesign.HighefficiencyLEDmaterialisusedinthese lamps:AluminiumIndiumGalliumPhosphide(AlInGaP)for redandIndiumGalliumitride(InGa)forblueandgreen. Eachlampismadewithanadvanceopticalgradeepoxy offering superior high temperature and high moisture resistanceinoutdoorapplications. ThepackageepoxycontainsbothUV-AandUV-inhibitorstoreducetheeffectsoflongtermexposuretodirect sunlight.
Features
* * * * * Welldefinedspatialradiationpattern Highbrightnessmaterial Availableinred,greenandbluecolor -RedAlInGaP630nm -Green InGa nm GreenInGanm -lue InGa 0nm lueInGa0nm Superiorresistancetomoisture Tintedanddiffused
Benefits
* Viewingangledesignedforwidefieldofview applications * Superiorperformanceforoutdoorenvironments.
Applications
* Fullcolorsigns * Commercialoutdooradvertising
Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions A
8.700.20 .342.008 CATHODE LEAD NOTE 1 5.200.2 .205.008 2.540.3 0.1000.012 0.40.1 0.0160.00 24.00MIN. 0.945 1.0MIN. 0.038 Measured at base of lens 3.800.20 .150.008
0.8MAX. Epoxy Meniscus .016.
0.500.10 0.0200.004
B
11.500.20 0.453.008 8.700.20 0.342.008
24.00 0.945
1.0MIN. 0.038
Measured at base of lens
1.250.20 0.0490.008
3.80.2 .150.008 CATHODE LEAD 2.540.3 0.1000.012 0.500.10 0.0200.004 0.400.10 0.0160.00
5.200.20 0.205.008
0.8MAX. Epoxy 0.032
OTES: DimensionsinMillimeters(Inches) ForlueandGreenifheat-sinkingapplicationisrequired,theterminalforheatsinkisanode.
Device Selection Guide
Typ. Dominant Wavelength ld (nm) 630 630 0 0 Luminous Intensity Iv (cd) at 20mA Min. 1.0 1.0 .0 .0 0. 0. Max. .0 .0 .0 .0 1.0 1.0 Lens Type Tinted,diffused Tinted,diffused Tinted,diffused Tinted,diffused Tinted,diffused Tinted,diffused Standoffs o Yes o Yes o Yes
Part Number HLMP-AD8-RU0xx HLMP-AD8-RU0xx HLMP-AM86-TW0xx HLMP-AM8-TW0xx HLMP-A86-MQ0xx HLMP-A8-MQ0xx
Color Red Red Green Green lue lue
Package Drawing A A A
otes: 1. Toleranceforluminousintensitymeasurementis1% . Theluminousintensityismeasuredonthemechanicalaxisofthelamppackage. 3. Theopticalaxisiscloselyalignedwiththepackagemechanicalaxis. . ThedominantwavelengthdisderivedfromtheChromaticityDiagramandrepresentsthecolorofthelamp. . LEDlightoutputisbrightenoughtocauseinjuriestotheeyes.PrecautionsmustbetakentopreventlookingdirectlyattheLEDwithoutproper safetyequipment.
Part Numbering System
H L M P - x x 8x - x x x xx Mechanical Option 00: Bulk DD: Ammo Pack ZZ: Flexi-Bin, Ammo pack Color Bin Options 0: Full color bin distribution Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Color B: Blue 470nm M: Green 525nm D: Red 630nm Package A: 5mm Mini Oval
3
Absolute Maximum Rating at TA = 25oC
Parameters
DCforwardcurrent[1] Peakpulsedforwardcurrent Powerdissipation LEDjunctiontemperature Operatingtemperaturerange Storagetemperaturerange
otes: 1. Deratelinearlyasshowninfigure3andfigure. . Dutyfactor10%,frequency1KHz. 3. Dutyfactor30%,frequency1KHz.
Blue and Green
30 100[] 116 130 -0to+8 -0to+100
Red
0 100[3] 10 130 -0to+100 -0to+10
Unit
mA mA mW
oC oC oC
Electrical/Optical Characteristics TA = 25oC
Parameters
Forwardvoltage Red Green lue ReverseVoltage Red Green lue Thermalresistance[1] Dominantwavelength[,3] Red Green lue Peakwavelength Red Green lue Spectralhalfwidth Red Green lue LuminousEfficacy[] Red Green lue LuminousFlux Red Green lue LuminousEfficiency[] Red Green lue
Symbol
VF
Value Min.
.0 .8 .8 .0 .0 .0
Typ.
.0 3.3 3.
Max.
.0 3.8 3.8
Units
V
Test Condition
IF=0mA
VR
V
RqJ-PI ld 6 0 60
0 630 0 639 16 6 1 3 3 1 0 1300 3000 600 30 0 10 63 0 80
oC/W
IR=100mA IR=10mA IR=10mA LEDJunction-to-pin IF=0mA
nm
lPEAK
nm
Peakofwavelengthofspectral distributionatIF=0mA Wavelengthwidthatspectral distribution1/powerpointatIF =0mA Emittedluminouspower/Emitted radiantpower
Dl1/
nm
hv
lm/W
jV
mlm
IF=0mA
he
lm/W
LuminousFlux/ElectricalPower IF=0mA
otes: 1. ForAlInGaPRed,thethermalresistanceappliedtoLEDjunctiontocathodelead.ForInGalueandGreen,thethermalresistanceappliedtoLED junctiontoanodelead. . ThedominantwavelengthdisderivedfromtheChromaticityDiagramandrepresentsthecolorofthelamp. 3. Toleranceforeachcolorbinlimitis0.nm . Theradiantintensity,Ieinwatts/steradian,maybefoundfromtheequationIe=Iv/v,whereIvistheluminousintensityincandelasandvisthe luminousefficacyinlumens/watt. . he=jV/IFxVF,wherejVistheemittedluminousflux,IFiselectricalforwardcurrentandVFistheforwardvoltage.
AlInGaP Red
1.0 50 40 30 20 10 0
0.5
0
IF - FORWARD CURRENT - mA
RELATIVE INTENSITY
550
600
650
700
0
WAVELENGTH - nm
0.5 1.0 1.5 2.0 2.5 V F - FORWARD VOLTAGE - V
3.0
Figure 1. Relative intensity vs. wavelength
MAXIMUM FORWARD CURRENT - mA 60 50 40 30 20 10 0
Figure 2. Forward current vs. forward voltage
2.5 2.0 RELATIVE INTENSITY (NORMALIZED AT 20 mA) 1.5 1.0 0.5 0
MAX. -
0
IF
20 40 60 80 100 TA- AMBIENT TEMPERATURE - o C
0
10 30 20 40 FORWARD CURRENT - mA
50
Figure 3. Forward current vs. ambient temperature
Figure 4. Relative luminous intensity vs. forward current
InGaN Blue and Green
1.00 0.80 RELATIVE INTENSITY BLUE 0.60 0.40 0.20 0 350 FORWARD CURRENT - mA GREEN 35
I F - MAXIMUM FORWARD CURRENT - mA
35 30 25 20 15 10 5 0 0 20 40 60 80 100
30 25 20 15 10 5 0 0 1 2 3 4 FORWARD VOLTAGE - V
400
450
500
550
600
650
WAVELENGTH - nm
TA - AMBIENT TEMPERATURE - C
Figure 5. Relative Intensity vs. Wavelength
Figure 6. Forward current vs. forward voltage.
Figure 7. Forward Current vs. Ambient Temperature.
1.6 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.4 RELATIVE DOMINANT WAVELENGTH 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 DC FORWARD CURRENT - mA
1.020 1.015 1.010 GREEN 1.005 BLUE 1.000 0.995
0
10
20
30
FORWARD CURRENT, mA
Figure 8. Relative intensity vs. forward current
Figure 9.Relative dominant wavelength vs. DC forward current
1
NORMALIZED INTENSITY
0.5
0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT - DEGREES
Figure 10. Spatial radiation pattern for RGB - major axis
1
NORMALIZED INTENSITY
0.5
0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT - DEGREES
Figure 11. Spatial radiation pattern for RGB - minor axis
6
Intensity Bin Limit Table
in M P Q R S T U V W Intensity(mcd)at0mA Min 0 680 880 110 100 1900 00 300 00 00 Max 680 880 110 100 1900 00 300 00 00 00
Blue Color Bin Table
Bin 1 Min Dom 60.0 Max Dom 6.0 Xmin 0.10 0.1818 6.0 68.0 0.13 0.166 3 68.0 .0 0.191 0.1699 .0 6.0 0.118 0.1616 6.0 80.0 0.1063 0.11
Toleranceforeachbinlimitis0.nm
Ymin 0.09 0.090 0.03 0.0966 0.09 0.106 0.061 0.109 0.09 0.13
Xmax 0.166 0.13 0.1699 0.191 0.1616 0.118 0.11 0.1063 0.139 0.0913
Ymax 0.0966 0.03 0.106 0.09 0.109 0.061 0.13 0.09 0.18 0.13
Toleranceforeachbinlimitis1%
Green Color Bin Table
Bin 1 Min Dom 0.0 Max Dom .0 Xmin 0.03 0.160 .0 8.0 0.1060 0.186 3 8.0 3.0 0.138 0.068 3.0 36.0 0.10 0.3 36.0 0.0 0.003 0.69
Toleranceforeachbinlimitis0.nm
Ymin 0.8338 0.686 0.89 0.66 0.818 0.663 0.96 0.63 0.6 0.613
Xmax 0.186 0.1060 0.068 0.138 0.3 0.10 0.69 0.003 0.69 0.96
Ymax 0.66 0.89 0.663 0.818 0.63 0.96 0.613 0.6 0.600 0.3
Red Color Bin Table
Bin Min Dom 6 Max Dom 63 Xmin 0.690 0.66
Toleranceforeachbinlimitis0.nm
Ymin 0.309 0.3106
Xmax 0.69 0.13
Ymax 0.888 0.86
Avago Color Bin on CIE 1931 Chromaticity Diagram.
1.000
0.800 Green 1 2 3 4
5
0.600
Y 0.400
Red 0.200 5 4 3 0.000 0.000 0.100 0.200 0.300 0.400 X 0.500 0.600 0.700 0.800 2 1 Blue
10
RELATIVE LIGHT OUTPUT (NORMALIZED at TJ = 25C)
GREEN 1 RED
BLUE
0.1
-40
-20
0
20
40
60
80
100
120
T J - JUNCTION TEMPERATURE - C
8
Precautions:
Lead Forming:
* TheleadsofanLEDlampmaybepreformedorcutto lengthpriortoinsertionandsolderingonPCboard. * Forbettercontrol,itisrecommendedtousepropertool topreciselyformandcuttheleadstoapplicablelength ratherthandoingitmanually. * Ifmanualleadcuttingisnecessary,cuttheleadsafter the soldering process.The solder connection forms a mechanicalgroundwhichpreventsmechanicalstress due to lead cutting from traveling into LED package. Thisishighlyrecommendedforhandsolderoperation, astheexcessleadlengthalsoactsassmallheatsink.
ote: 1. PC with different size and design (component density) will have differentheatmass(heatcapacity).Thismightcauseachangeintemperatureexperiencedbytheboardifsamewavesolderingsettingis used.So,itisrecommendedtore-calibratethesolderingprofileagain beforeloadinganewtypeofPC. . AvagoTechnologies' high brightness LED are using high efficiency LEDdiewithsinglewirebondasshownbelow.Customerisadvised to take extra precaution during wave soldering to ensure that the maximumwavetemperaturedoesnotexceed0Candthesolder contacttimedoesnotexceeding3sec.Over-stressingtheLEDduring solderingprocessmightcauseprematurefailuretotheLEDdueto delamination.
Avago Technologies LED configuration
Soldering and Handling:
* CaremustbetakenduringPCassemblyandsoldering processtopreventdamagetotheLEDcomponent. * LED component may be effectively hand soldered to PC.However,itisonlyrecommendedunderunavoidablecircumstancessuchasrework.Theclosestmanual soldering distance of the soldering heat source (solderingiron'stip)tothebodyis1.9mm.Solderingthe LEDusingsolderingirontipcloserthan1.9mmmight damagetheLED.
1.9mm
CATHODE
ANODE
AlInGaP Device
InGaN Device
* ESDprecautionmustbeproperlyappliedonthesolderingstationandpersonneltopreventESDdamagetothe LEDcomponentthatisESDsensitive.DorefertoAvago applicationnoteA11fordetails.Thesolderingiron usedshouldhavegroundedtiptoensureelectrostatic chargeisproperlygrounded. * Recommendedsolderingcondition:
Wave Soldering [1, 2] Pre-heat temperatre Preheat time Peak temperatre well time 105 C Max. 60 sec Max 250 C Max. 3 sec Max. Manual Solder Dipping 260 C Max. 5 sec Max
* Anyalignmentfixturethatisbeingappliedduringwave solderingshouldbelooselyfittedandshouldnotapply weightorforceonLED.onmetalmaterialisrecommendedasitwillabsorblessheatduringwavesolderingprocess. * At elevated temperature, LED is more susceptible to mechanicalstress.Therefore,PCmustallowedtocool down to room temperature prior to handling, which includesremovalofalignmentfixtureorpallet. * IfPCboardcontainsboththroughhole(TH)LEDand othersurfacemountcomponents,itisrecommended thatsurfacemountcomponentsbesolderedonthetop sideofthePC.Ifsurfacemountneedtobeonthebottomside,thesecomponentsshouldbesolderedusing reflowsolderingpriortoinsertiontheTHLED. * Recommended PC board plated through holes (PTH) sizeforLEDcomponentleads.
LED component lead size 0.45 x 0.45 mm (0.018x 0.018 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) Diagonal 0.636 mm (0.025 inch) 0.707 mm (0.028 inch) Plated through hole diameter 0.98 to 1.08 mm (0.039 to 0.043 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch)
ote:ElectricalconnectionbetweenbottomsurfaceofLEDdieand theleadframeisachievedthroughconductivepaste.
ote: 1) Aboveconditionsreferstomeasurementwiththermocouplemounted atthebottomofPC. ) Itisrecommendedtouseonlybottompreheatersinordertoreduce thermalstressexperiencedbyLED.
* Wavesolderingparametersmustbesetandmaintained accordingtotherecommendedtemperatureanddwell time.Customerisadvisedtoperformdailycheckonthe solderingprofiletoensurethatitisalwaysconforming torecommendedsolderingconditions.
* Over-sizingthePTHcanleadtotwistedLEDafterclinching.OntheotherhandundersizingthePTHcancause difficultyinsertingtheTHLED.
9
RefertoapplicationnoteA33formoreinformationaboutsolderingandhandlingofhighbrightnessTHLEDlamps.
Example of Wave Soldering Temperature Profile for TH LED
TURBULENT WAVE 250 LAMINAR WAVE HOT AIR KNIFE
Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux
200
Solder bath temperature: 245C 5C (maximum peak temperature = 250C) Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force.
150
100
50 PREHEAT
0
10
20
30
40
50 60 TIME (MINUTES)
70
80
90
100
Ammo Packs Drawing
6.35 1.30 (0.25 0.0512) 12.70 1.00 (0.50 0.0394)
CATHODE
20.5 1.00 (0.8071 0.0394)
9.125 0.625 (0.3593 0.0246) 18.00 0.50 (0.7087 0.0197)
12.70 0.30 (0.50 0.0118) 0.70 0.20 (0.0276 0.0079) ALL DIMENSIONS IN MILLIMETERS (INCHES).
A VIEW A-A
A
4.00 0.20 TYP. (0.1575 0.008)
Note: Theammo-packsdrawingisapplicableforpackagingoption-DD&-ZZandregardlessofstandoffornon-standoff.
10
Packaging Box for Ammo Packs
LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD.
A
+ AN
OD
E
TEC
ANODE LEAD LEAVES THE BOX FIRST.
O AG ES AV LOGI O HN
CA
TH
OD
E
-
C
T MO
HE
RL
AB
EL
Note: ForInGadevice,theammopackpackagingboxcontainsESDlogo.
Packaging Label
(i) AvagoMotherLabel:(Availableonpackagingboxofammopackandshippingbox)
(1P) Item: Part Number (1T) Lot: Lot Number LPN (9D) MFG Date: Manufacturing Date (P) Customer Item: (V) Vendor ID
STANDARD LABEL LS0002 RoHS Compliant e1 max temp 250C (Q) QTY: Quantity CAT: Intensity Bin BIN: Refer to below information REV: DeptID:
Made In: Country of Origin
11
(ii)AvagoabyLabel(Onlyavailableonbulkpackaging)
RoHS Compliant e1 max temp 250C PART #: Part Number LOT#: Lot Number MFG DATE: Manufacturing Date C/O: Country of Origin Customer P/N: Supplier Code: CAT: Intensity Bin BIN: Refer to below information DATECODE: Date Code QUANTITY: Packing Quantity
Acronyms and Definition:
I: (i) ColorbinonlyorVFbinonly (Applicableforpartnumberwithcolorbinsbutwithout VFbinORpartnumberwithVFbinsandnocolorbin) OR (ii)ColorbinincorporatedwithVFin (Applicable for part number that have both color bin andVFbin)
Example:
(i) ColorbinonlyorVFbinonly I:(representcolorbinonly) I:V(representVFbin"V"only) (ii)ColorbinincorporatewithVFin I:V V:VFbin"V" :Colorbinonly
DISCLAIMER: AVAGO'S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For proct information an a complete list of istribtors please go to or web site: www.avagotech.com Avago Avago Technologies an the A logo are traemarks of Avago Technologies Pte. in the Unite States an other contries. ata sbject to change. Copyright (c) 2006 Avago Technologies Pte. All rights reserve. Obsoletes AV01-0304N AV02-0388N - Jly 11 2007

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