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010LF BUV50 TS1102 BUW133A BADXCF A35BD BR301 P100M1
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DIOTEC ELECTRONICS CORP
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PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
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Die Size: 0.216" Flat to Flat Hex
FEATURES
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60 AMP JUMBO DIODE CELL
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MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
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ANT PLI M CO
MECHANICAL SPECIFICATION
Data Sheet No. BUDI-6000D-1A
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