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TH72006
315MHz FSK/ASK Transmitter Features
! ! ! ! ! ! ! ! Fully integrated PLL-stabilized VCO Frequency range from 290 MHz to 350 MHz Single-ended RF output FSK through crystal pulling allows modulation from DC to 40 kbit/s High FSK deviation possible for wideband data transmission ASK achieved by on/off keying of internal power amplifier up to 40 kbit/s Wide power supply range from 1.95 V to 5.5 V Very low standby current ! ! ! ! ! ! ! ! Microcontroller clock output On-chip low voltage detector High over-all frequency accuracy FSK deviation and center frequency independently adjustable Adjustable output power range from -12 dBm to +10 dBm Adjustable current consumption from 3.6 mA to 10.7 mA Conforms to FCC part 15 and similar standards 10-pin Quad Flat No-Lead Package (QFN)
Ordering Information
Part Number TH72006 Temperature Code K (-40 C to 125 C) Package Code LD (10L QFN 3x3 Dual) Delivery Form 120 pc/tray 5000 pc/T&R
Application Examples
! ! ! ! ! ! ! ! ! General digital data transmission Tire Pressure Monitoring Systems (TPMS) Remote Keyless Entry (RKE) Wireless access control Alarm and security systems Garage door openers Remote Controls Home and building automation Low-power telemetry systems
Pin Description
top FSKDTA FSKSW ROI EN CKOUT VCC VEE OUT CKDIV PSEL
10 9 8 7 6
bottom
1 2 3 4 5
TH72006
General Description
The TH72006 FSK/ASK transmitter IC is designed for applications in the 315 MHz industrial-scientificmedical (ISM) band. It can also be used for any other system with carrier frequencies ranging from 290 MHz to 350 MHz. The transmitter's carrier frequency fc is determined by the frequency of the reference crystal fref. The integrated PLL synthesizer ensures that carrier frequencies, ranging from 290 MHz to 350 MHz, can be achieved. This is done by using a crystal with a reference frequency according to: fref = fc/N, where N = 32 is the PLL feedback divider ratio. A clock signal with selectable frequency is provided. It can be used to drive a microcontroller.
39010 72006 Rev. 005
Page 1 of 16
Data Sheet Dec/07
TH72006
315MHz FSK/ASK Transmitter Document Content
1 Theory of Operation ...................................................................................................3
1.1 1.2 General............................................................................................................................. 3 Block Diagram .................................................................................................................. 3
2
Functional Description ..............................................................................................3
2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 Crystal Oscillator .............................................................................................................. 3 FSK Modulation ................................................................................................................ 4 Crystal Pulling................................................................................................................... 4 ASK Modulation................................................................................................................ 5 Output Power Selection.................................................................................................... 5 Lock Detection.................................................................................................................. 5 Low Voltage Detection...................................................................................................... 5 Mode Control Logic .......................................................................................................... 6 Clock Output..................................................................................................................... 6 Timing Diagrams .............................................................................................................. 6
3 4
Pin Definition and Description ..................................................................................7 Electrical Characteristics ..........................................................................................8
4.1 4.2 4.3 4.4 4.5 4.6 4.7 Absolute Maximum Ratings .............................................................................................. 8 Normal Operating Conditions ........................................................................................... 8 Crystal Parameters ........................................................................................................... 8 DC Characteristics............................................................................................................ 9 AC Characteristics .......................................................................................................... 10 Output Power Steps - FSK Mode .................................................................................. 11 Output Power Steps - ASK Mode .................................................................................. 11
5
Test Circuit ...............................................................................................................12
5.1 Test circuit component list to Fig. 6 ................................................................................ 12
6
Package Description ................................................................................................13
6.1 6.2 Soldering Information ..................................................................................................... 13 Recommended PCB Footprints ...................................................................................... 13
7 8 9
Reliability Information..............................................................................................14 ESD Precautions ......................................................................................................14 Disclaimer .................................................................................................................16
39010 72006 Rev. 005
Page 2 of 16
Data Sheet Dec/07
TH72006
315MHz FSK/ASK Transmitter 1 Theory of Operation
1.1 General
As depicted in Fig.1, the TH72006 transmitter consists of a fully integrated voltage-controlled oscillator (VCO), a divide-by-32 divider (div32), a phase-frequency detector (PFD) and a charge pump (CP). An internal loop filter determines the dynamic behavior of the PLL and suppresses reference spurious signals. A Colpitts crystal oscillator (XOSC) is used as the reference oscillator of a phase-locked loop (PLL) synthesizer. The VCO's output signal feeds the power amplifier (PA). The RF signal power Pout can be adjusted in four steps from Pout = -12 dBm to +10 dBm, either by changing the value of resistor RPS or by varying the voltage VPS at pin PSEL. The open-collector output (OUT) can be used either to directly drive a loop antenna or to be matched to a 50Ohm load. Bandgap biasing ensures stable operation of the IC at a power supply range of 1.95 V to 5.5 V.
1.2 Block Diagram
RPS
CKDIV VCC PSEL
R1
ASKDTA
7
10
6
PLL
CKOUT
5
div 4 div 16
32
PA
8
OUT
antenna matching network
ROI
PFD 3
XOSC
XTAL FSKSW CX2 CX1 2 1
FSKDTA
XBUF
CP
VCO
mode control
4
EN
9
VEE
Fig. 1:
Block diagram with external components
2 Functional Description
2.1 Crystal Oscillator
A Colpitts crystal oscillator with integrated functional capacitors is used as the reference oscillator for the PLL synthesizer. The equivalent input capacitance CRO offered by the crystal oscillator input pin ROI is about 18pF. The crystal oscillator is provided with an amplitude control loop in order to have a very stable frequency over the specified supply voltage and temperature range in combination with a short start-up time.
39010 72006 Rev. 005
Page 3 of 16
Data Sheet Dec/07
TH72006
315MHz FSK/ASK Transmitter
2.2 FSK Modulation
FSK modulation can be achieved by pulling the crystal oscillator frequency. A CMOScompatible data stream applied at the pin FSKDTA digitally modulates the XOSC via an integrated NMOS switch. Two external pulling capacitors CX1 and CX2 allow the FSK deviation f and the center frequency fc to be adjusted independently. At FSKDTA = 0, CX2 is connected in parallel to CX1 leading to the lowfrequency component of the FSK spectrum (fmin); while at FSKDTA = 1, CX2 is deactivated and the XOSC is set to its high frequency fmax. An external reference signal can be directly ACcoupled to the reference oscillator input pin ROI. Then the transmitter is used without a crystal. Now the reference signal sets the carrier frequency and may also contain the FSK (or FM) modulation. Fig. 2: Crystal pulling circuitry
ROI
VCC
XTAL
FSKSW
CX2 CX1
VEE
FSKDTA 0 1
Description fmin= fc - f (FSK switch is closed) fmax= fc + f (FSK switch is open)
2.3 Crystal Pulling
A crystal is tuned by the manufacturer to the required oscillation frequency f0 at a given load capacitance CL and within the specified calibration tolerance. The only way to pull the oscillation frequency is to vary the effective load capacitance CLeff seen by the crystal. Figure 3 shows the oscillation frequency of a crystal as a function of the effective load capacitance. This capacitance changes in accordance with the logic level of FSKDTA around the specified load capacitance. The figure illustrates the relationship between the external pulling capacitors and the frequency deviation. It can also be seen that the pulling sensitivity increases with the reduction of CL. Therefore, applications with a high frequency deviation require a low load capacitance. For narrow band FSK applications, a higher load capacitance could be chosen in order to reduce the frequency drift caused by the tolerances of the chip and the external pulling capacitors.
f
XTAL L1 f max C1 R1 fc C0 CL eff
f min
CX1 CRO CX1+CRO
CL
(CX1+CX2) CRO CX1+CX2+CRO
CL eff
Fig. 3:
Crystal pulling characteristic
For ASK applications CX2 can be omitted. Then CX1 has to be adjusted for center frequency.
39010 72006 Rev. 005
Page 4 of 16
Data Sheet Dec/07
TH72006
315MHz FSK/ASK Transmitter
2.4 ASK Modulation
The TH72006 can be ASK-modulated by applying data directly at pin PSEL. This turns the PA on and off which leads to an ASK signal at the output.
2.5
Output Power Selection
The transmitter is provided with an output power selection feature. There are four predefined output power steps and one off-step accessible via the power selection pin PSEL. A digital power step adjustment was chosen because of its high accuracy and stability. The number of steps and the step sizes as well as the corresponding power levels are selected to cover a wide spectrum of different applications. The implementation of the output power control logic is shown in figure 4. There are two matched current sources with an amount of about 8 A. One current source is directly applied to the PSEL pin. The other current source is used for the generation of reference voltages with a resistor ladder. These reference voltages are defining the thresholds between the power steps. The four comparators deliver thermometer-coded control signals depending on the voltage level at the pin PSEL. In order to have a certain amount of ripple tolerance in a noisy environment the comparators are provided with a little hysteresis of about 20 mV. With these control signals, weighted current sources of the power amplifier are switched on or off to set the desired output power level (Digitally Controlled Current Source). The LOCK signal and the output of the low voltage detector are gating this current source.
RPS
PSEL
& & & & &
OUT
Fig. 4:
Block diagram of output power control circuitry
There are two ways to select the desired output power step. First by applying a DC voltage at the pin PSEL, then this voltage directly selects the desired output power step. This kind of power selection can be used if the transmission power must be changed during operation. For a fixed-power application a resistor can be used which is connected from the PSEL pin to ground. The voltage drop across this resistor selects the desired output power level. For fixed-power applications at the highest power step this resistor can be omitted. The pin PSEL is in a high impedance state during the "TX standby" mode.
2.6
Lock Detection
The lock detection circuitry turns on the power amplifier only after PLL lock. This prevents from unwanted emission of the transmitter if the PLL is unlocked.
2.7
Low Voltage Detection
The supply voltage is sensed by a low voltage detect circuitry. The power amplifier is turned off if the supply voltage drops below a value of about 1.85 V. This is done in order to prevent unwanted emission of the transmitter if the supply voltage is too low.
39010 72006 Rev. 005
Page 5 of 16
Data Sheet Dec/07
TH72006
315MHz FSK/ASK Transmitter
2.8 Mode Control Logic
EN 0 1 Mode TX standby TX active CKOUT active Description TX disabled TX / CKOUT enabled
The mode control logic allows two different modes of operation as listed in the following table. The mode control pin EN is pulled-down internally. This guarantees that the whole circuit is shut down if this pin is left floating.
2.9
Clock Output
The clock output CKOUT is CMOS-compatible and can be used to drive a microcontroller. The frequency of the clock can be changed by the clock divider control signal CKDIV, that can be selected according to the following table. A capacitor at pin CKOUT can be used to control the clock voltage swing and the spurious emission. CKDIV 0 1 Clock divider ratio 4 16 Clock frequency / fc=3.15MHz 2.46MHz 615kHz
2.10 Timing Diagrams
After enabling the transmitter by the EN signal, the power amplifier remains inactive for the time ton, the transmitter start-up time. The crystal oscillator starts oscillation and the PLL locks to the desired output frequency within the time duration ton. After successful PLL lock, the LOCK signal turns on the power amplifier, and then the RF carrier can be FSK or ASK modulated.
high
high
EN
low
high
EN
low
high
LOCK
low
LOCK
low
high
high
FSKDTA
low
PSEL
low
RF carrier
t
t
t on
t on
Fig. 5:
Timing diagrams for FSK and ASK modulation
39010 72006 Rev. 005
Page 6 of 16
Data Sheet Dec/07
TH72006
315MHz FSK/ASK Transmitter 3 Pin Definition and Description
Pin No. 1 Name FSKDTA I/O Type input
FSKDTA 1
1.5k
Functional Schematic
0: ENTX=1 1: ENTX=0
Description FSK data input, CMOS compatible with internal pull-up circuit TX standby: no pull-up TX active: pull-up XOSC FSK pulling pin, MOS switch
2
FSKSW
analog I/O
FSKSW 2
3
ROI
analog I/O
25k
ROI 3
36p
XOSC connection to XTAL, Colpitts type crystal oscillator
36p
4
EN
input
EN 4
1.5k
mode control input, CMOS-compatible with internal pull-down circuit
5
CKOUT
output
CKOUT 5
400
clock output, CMOS-compatible
6
PSEL
analog I/O
8A
PSEL 6
power select input, highimpedance comparator logic TX standby: IPSEL = 0 TX active: IPSEL = 8A clock divider control input, CMOS compatible with internal pull-down circuit
1.5k
7
CKDIV
input
CKDIV 7
0: ENTX=0 1: ENTX=1 1.5k
8
OUT
output
OUT 8
VCC
TX standby: no pull-down TX active: pull-down power amplifier output, open collector
VEE
VEE
9 10
VEE VCC
ground supply
negative power supply positive power supply
39010 72006 Rev. 005
Page 7 of 16
Data Sheet Dec/07
TH72006
315MHz FSK/ASK Transmitter 4 Electrical Characteristics
4.1 Absolute Maximum Ratings
Parameter Supply voltage Input voltage Storage temperature Junction temperature Thermal Resistance Power dissipation Electrostatic discharge Symbol VCC VIN TSTG TJ RthJA Pdiss VESD human body model (HBM) according to CDF-AECQ100-002 2.0 Condition Min 0 -0.3 -65 Max 7.0 VCC+0.3 150 150 49 0.12 Unit V V C C K/W W kV
4.2 Normal Operating Conditions
Parameter Supply voltage Operating temperature Input low voltage CMOS Input high voltage CMOS XOSC frequency VCO frequency Clock frequency FSK deviation FSK Data rate ASK Data rate Symbol VCC TA VIL VIH fref fc fCLK f R R EN, FSKDTA EN, FSKDTA set by the crystal fc = 32 * fref CKDIV=0, fCLK = fref / 4 CKDIV=1, fCLK = fref / 16 depending on CX1, CX2 and crystal parameters NRZ NRZ 0.7*VCC 9 290 2.25 563 2.5 10.9 350 2.73 681 30 40 40 Condition Min 1.95 -40 Max 5.5 125 0.3*VCC Unit V C V V MHz MHz MHz kHz kHz kbit/s kbit/s
4.3 Crystal Parameters
Parameter Crystal frequency Load capacitance Static capacitance Series resistance Spurious response Symbol f0 CL C0 R1 aspur only required for FSK Condition fundamental mode, AT Min 9 10 Max 10.9 15 7 70 -10 Unit MHz pF pF dB
39010 72006 Rev. 005
Page 8 of 16
Data Sheet Dec/07
TH72006
315MHz FSK/ASK Transmitter
4.4 DC Characteristics
all parameters under normal operating conditions, unless otherwise stated; typical values at TA = 23 C and VCC = 3 V Parameter Operating Currents Standby current Supply current in power step 0 Supply current in power step 1 Supply current in power step 2 Supply current in power step 3 Supply current in power step 4 Digital Pin Characteristics Input low voltage CMOS Input high voltage CMOS Pull down current, EN Low level input current, EN High level input current, FSKDTA Pull up current FSKDTA active mode Pull up current FSK standby mode Low level input current CKDIV Pull-down current CKDIV active mode Pull-down current CKDIV standby mode FSK Switch Resistance MOS switch On resistance MOS switch Off resistance Power Select Characteristics Power select current Power select voltage step 0 Power select voltage step 1 Power select voltage step 2 Power select voltage step 3 Power select voltage step 4 IPSEL VPS0 VPS1 VPS2 VPS3 VPS4 VLVD EN=1 EN=1 EN=1 EN=1 EN=1 EN=1 0.14 0.37 0.78 1.55 7.0 8.6 9.9 0.035 0.24 0.60 1.29 A V V V V V RON ROFF FSKDTA=0, EN=1 FSKDTA=1, EN=1 1 20 70 M VIL VIH IPDEN IINLEN IINHDTA IPUDTAa IPUDTAs EN, FSKDTA EN, FSKDTA EN=1 EN=0 FSKDTA=1 FSKDTA=0, EN=1 FSKDTA=0, EN=0 0.1 1.5 -0.3 0.7*VCC 0.2 4.0 0.3*Vcc VCC+0.3 40 0.02 0.02 12 0.02 0.02 0.1 1.5 12 0.02 V V A A A A A A A A ISBY ICC0 ICC1 ICC2 ICC3 ICC4 EN=0, TA=85C EN=0, TA=125C EN=1 EN=1 EN=1 EN=1 EN=1 1.5 2.1 3.0 4.5 7.3 2.7 3.6 4.8 6.6 10.7 0.2 200 4 5.0 6.0 7.5 9.5 14.5 nA A mA mA mA mA mA Symbol Condition Min Typ Max Unit
IINLCKDIV CKDIV=0 IPDCKDIVa CKDIV=1, EN=1 IPDCKDIVs CKDIV=1, EN=0
Low Voltage Detection Characteristic Low voltage detect threshold EN=1 1.75 1.85 1.95 V
39010 72006 Rev. 005
Page 9 of 16
Data Sheet Dec/07
TH72006
315MHz FSK/ASK Transmitter
4.5 AC Characteristics
all parameters under normal operating conditions, unless otherwise stated; typical values at TA = 23 C and VCC = 3 V; test circuit shown in Fig. 6, fc = 315 MHz Parameter CW Spectrum Characteristics Output power in step 0 (Isolation in off-state) Output power in step 1 Output power in step 2 Output power in step 3 Output power in step 4 Phase noise Spurious emissions according to EN 300 220-1 (2000.09) table 13 Poff P1 P2 P3 P4 L(fm) Pspur EN=1 EN=1 EN=1 EN=1 EN=1 @ 200kHz offset 47MHz< f <74MHz 87.5MHz< f <118MHz 174MHz< f <230MHz 470MHz< f <862MHz B=100kHz f < 1GHz, B=100kHz f > 1GHz, B=1MHz Clock output Characteristics Output low voltage CMOS Output high voltage CMOS Start-up Parameters Start-up time Frequency Stability Frequency stability vs. supply voltage Frequency stability vs. temperature Frequency stability vs. variation range of CRO dfVCC dfTA dfCRO crystal at constant temperature 3 10 20 ppm ppm ppm ton from standby to transmit mode 1.2 1.5 ms VOL VOH depending on capacitor CCK and CKDIV 0.3*VCC 0.7*VCC V V -13 -2.5 2.5 5 -12 -3 3 9 -88 -70 -9.5 1) -0.5 5 11
1) 1) 1)
Symbol
Condition
Min
Typ
Max
Unit
dBm dBm dBm dBm dBm dBc/Hz dBm
-83 -54
-36 -30
dBm dBm
1) output matching network tuned for 5V supply
39010 72006 Rev. 005
Page 10 of 16
Data Sheet Dec/07
TH72006
315MHz FSK/ASK Transmitter
4.6 Output Power Steps - FSK Mode
Power step RPS / k 0 <3 1 22 2 56 3 120 4 not connected
4.7 Output Power Steps - ASK Mode
typical values at TA = 23 C and VCC = 3 V; test circuit shown in Fig. 6 Power step RPS / k R1 / k 1 2.4 36 2 2.8 14 3 3.5 7 4 not connected 0
V PSlow
VPSlow = voltage across RPS if ASK_DTA at 0V VPShigh = voltage across RPS if ASK_DTA at Vcc
RPS
R1 V PShigh
RPS R1 Vcc
PSEL 6
PSEL 6
If the transmitter is operated at any supply voltage Vcc, the values for R1 and RPS can be calculated as follows:
R1 =
VCC VPSlow I PSEL VPShigh
RPS = R1
VPShigh VCC - VPShigh
39010 72006 Rev. 005
Page 11 of 16
Data Sheet Dec/07
TH72006
315MHz FSK/ASK Transmitter 5 Test Circuit
CM2 LM CB1
10 9 8 7 6
CM1 RPS CM3 LT
OUT
VCC
VEE
OUT
FSKDTA
FSKSW
CKDIV EN
4
1
2
ROI
3
CX2
XTAL
CCK
CX1 CB0
12 12 123
CKOUT
5
PSEL
R1
12
12
12
GND
GND
VCC
EN GND
FSK_DTA
VCC
VCC
GND ASK_DTA
Fig. 6:
Test circuit for FSK and ASK with 50 matching network
5.1
Test circuit component list to Fig. 6
Size
0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 1206 0805 SMD 6x3.5
Part
CM1 CM2 CM3 LM LT CX1_FSK CX1_ASK CX2 CCK RPS R1 CB0 CB1 XTAL
Value @ 315 MHz
10pF 15 pF 82 pF 47 nH 33 nH 10 pF 18 pF 220 pF 39 pF / 270 pF see section 4.6 see section 4.7 220 nF 330 pF 9.84375MHz
Tolerance
5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 20% 10% 30ppm cal. 30ppm temp.
CKOUT GND
CKDIV
Description
impedance matching capacitor impedance matching capacitor impedance matching capacitor impedance matching inductor, note 2 output tank inductor, note 2 XOSC FSK capacitor (f = 20 kHz), note 1 XOSC ASK capacitor, trimmed to fC, note 1 XOSC capacitor (f = 20 kHz), note 1 only needed for FSK clock spur suppression capacitor, CKDIV 0 / 1 FSK or CW mode power-select resistor ASK power-select resistor, not used at FSK
de-coupling capacitor de-coupling capacitor
fundamental wave crystal, CL = 12 pF, C0, max = 7 pF, R1 = 60
Note 1: value depending on crystal parameters Note 2: for high-power applications high-Q wire-wound inductors should be used 39010 72006 Rev. 005 Page 12 of 16 Data Sheet Dec/07
TH72006
315MHz FSK/ASK Transmitter 6 Package Description
The device TH72006 is RoHS compliant.
D 10 6 L 0.23 E E2 exposed pad 0.36 D2
0.225x45 1 5 A3 b e A A1
The "exposed pad" is not connected to internal ground, it should not be connected to the PCB.
Fig. 7: all Dimensions in mm D
min max 2.85 3.15
10L QFN 3x3 Dual
E
2.85 3.15
D2
2.23 2.48
E2
1.49 1.74
A
0.80 1.00
A1
0 0.05
A3
0.20
L
0.3 0.5
e
0.50
b
0.18 0.30
all Dimensions in inch
min 0.112 0.112 0.0878 0.051 0.0315 0 0.0118 0.0071 0.0079 0.0197 max 0.124 0.124 0.0976 0.055 0.0393 0.002 0.0197 0.0118
6.1 Soldering Information
* The device TH72006 is qualified for MSL3 with soldering peak temperature 260 deg C according to JEDEC J-STD-20
6.2
Recommended PCB Footprints
X Y
10 6
e C PL
all Dimensions in mm Z
min max 3.55 3.90
G
1.9 2.3
D2th
3.2 3.6
E2th
1.3 1.7
X
0.25 0.30
Y
0.7 1.0
CPL
0.3 0.5
e
0.5
ZG
1 5
E2 th
all Dimensions in inch
min 0.1398 0.0748 0.1260 0.0512 0.0098 0.0276 0.0591 0.0197 max 0.1535 0.0906 0.1417 0.0669 0.0118 0.0394 0.0197
D2 th
solder pad
solder stop
Fig. 8:
PCB land pattern style
39010 72006 Rev. 005
Page 13 of 16
Data Sheet Dec/07
TH72006
315MHz FSK/ASK Transmitter 7 Reliability Information
This Melexis device is classified and qualified regarding soldering technology, solderability and moisture sensitivity level, as defined in this specification, according to following test methods: Reflow Soldering SMD's (Surface Mount Devices) * * IPC/JEDEC J-STD-020 "Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2)" EIA/JEDEC JESD22-A113 "Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2)"
Wave Soldering SMD's (Surface Mount Devices) and THD's (Through Hole Devices) * * EN60749-20 "Resistance of plastic- encapsulated SMD's to combined effect of moisture and soldering heat" EIA/JEDEC JESD22-B106 and EN60749-15 "Resistance to soldering temperature for through-hole mounted devices"
Iron Soldering THD's (Through Hole Devices) * EN60749-15 "Resistance to soldering temperature for through-hole mounted devices"
Solderability SMD's (Surface Mount Devices) and THD's (Through Hole Devices) * EIA/JEDEC JESD22-B102 and EN60749-21 "Solderability"
For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD's is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualification of RoHS compliant products (RoHS = European directive on the Restriction Of the Use of Certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality_leadfree.aspx
8 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
39010 72006 Rev. 005
Page 14 of 16
Data Sheet Dec/07
TH72006
315MHz FSK/ASK Transmitter Your Notes
39010 72006 Rev. 005
Page 15 of 16
Data Sheet Dec/07
TH72006
315MHz FSK/ASK Transmitter 9 Disclaimer
1) The information included in this documentation is subject to Melexis intellectual and other property rights. Reproduction of information is permissible only if the information will not be altered and is accompanied by all associated conditions, limitations and notices. 2) Any use of the documentation without the prior written consent of Melexis other than the one set forth in clause 1 is an unfair and deceptive business practice. Melexis is not responsible or liable for such altered documentation. 3) The information furnished by Melexis in this documentation is provided 'as is'. Except as expressly warranted in any other applicable license agreement, Melexis disclaims all warranties either express, implied, statutory or otherwise including but not limited to the merchantability, fitness for a particular purpose, title and non-infringement with regard to the content of this documentation. 4) Notwithstanding the fact that Melexis endeavors to take care of the concept and content of this documentation, it may include technical or factual inaccuracies or typographical errors. Melexis disclaims any responsibility in connection herewith. 5) Melexis reserves the right to change the documentation, the specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. 6) Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the information in this documentation. 7) The product described in this documentation is intended for use in normal commercial applications. Applications requiring operation beyond ranges specified in this documentation, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. 8) Any supply of products by Melexis will be governed by the Melexis Terms of Sale, published on www.melexis.com. (c) Melexis NV. All rights reserved.
For the latest version of this document, go to our website at:
www.melexis.com
Or for additional information contact Melexis Direct: Europe, Africa:
Phone: +32 1367 0495 E-mail: sales_europe@melexis.com
Americas:
Phone: +1 603 223 2362 E-mail: sales_usa@melexis.com
Asia:
Phone: +32 1367 0495 E-mail: sales_asia@melexis.com
ISO/TS 16949 and ISO14001 Certified 39010 72006 Rev. 005 Page 16 of 16 Data Sheet Dec/07

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