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BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HE1G033B-TRB
Features:
1. Emitted Color :Hi-Eff Red and Yellow Green 2. Lens Appearance : Water Clear. 3. Bi-color type. 4. 3.2x2.7x1.1mm(1210) standard package. 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn't contain restriction Substance, comply ROHS standard.
Package Dimensions:
Applications:
1. 2. 3. Automotive : Dashboards, stop lamps, turn signals. Backlighting : LCDs, Key pads advertising. Status indicators : Comsumer & industrial electronics. NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is 0.10mm (0.004") unless otherwise specified. 3.Specifications are subject to change without notice.
4. General use.
Absolute Maximum Ratings(Ta=25)
Parameter
Power Dissipation Forward Current Peak Forward Current 1 Reverse Volage Operating Temperature Storage Temperature Soldering Temperature
Symbol
Pd IF IFP VR Topr Tstg Tsol
Hi-Eff Red
80 30 100 5
Yellow Green
80 30 100
Unit
mW mA mA V -
-25~80 -30~85 See Page5
1 Condition for IFP is pulse of 1/10 duty and 0.1msec width.
Ver.2.0 Page 1 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HE1G033B-TRB
Electrical and optical characteristics(Ta=25) Parameter
Forward Voltage Luminous Intensity Reverse Current Peak Wave Length Dominant Wave Length Spectral Line Half-width Veiwing Angle
Symbol
Vf Iv IR p d 21/2
Condition
IF=20mA IF=20mA VR=5V IF=20mA IF=20mA IF=20mA IF=20mA
Color
Hi-Eff Red Yellow Green Hi-Eff Red Yellow Green Hi-Eff Red Yellow Green Hi-Eff Red Yellow Green Hi-Eff Red Yellow Green Hi-Eff Red Yellow Green Hi-Eff Red Yellow Green
Min.
3.7 2.4 624 566 -
Typ.
2.0 2.2 10.0 8.0 640 568
Max.
2.6 2.6 100 638 576
Unit
V mcd A nm nm nm deg
40 30 120
-
Typical Electro-Optical Characteristics Curves
Fig.2 Forward current derating curve Fig.1 Relative intensity vs. wavelength
1.0
(G)
(R)
60
vs. ambient temperature
50
Forward Current (mA)
40
Relative radiant intensity
30
0.5
20
10
0
20
40
60
80
100
Ambient temperature Ta( C) 0 530 580 630 680
Wavelength (nm)
Fig.3 Forward current vs. forward voltage
(R) (G) 3.0
Fig.4 Relative luminous intensity vs. ambient temperature
40 Relative luminous intensity
2.5
Forward current (mA)
(Normalized @ 20mA)
2.0
30
1.5
20
1.0
10
0.5
0
1
2
3
4
5
0 -40
-20
0
20
40
60
Forward voltage(V)
Ambient temperature Ta( C) A
Fig.5 Relative luminous intensity vs. forward current
4.0
Fig.6 Radiation diagram
0 10 20 30
Relative luminous intensity (@20mA)
3.0 (G) 2.0 (R)
Relative radlant intensity
40 1.0 0.9 0.8 50 60 70 0.7 80 90
1.0
0
5
10
20
30
40
50
0.5
0.3
0.1
0.2
0.4
0.6
Forward current (mA)
Ver.2.0 Page 2 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HE1G033B-TRB
Tapping and packaging specifications(Units: mm)
USER DIRECTION OF FEED
1.27 0.1 13.0 0.5
ANODE
ANODE
2.82 0.1
START END
71.0 0.1
3.35 0.1
13.0 0.5
5.3 0.05
3.5 0.05
8.0 0.3
TRAILER
CATHODE
CATHODE
1.75 0.1
LEADER 0.3 FIXING TAPE
4.0 0.1 4.0 0.1
1.5 0.1 2.0 0.05
NOTE: 3000 pcs PER REEL
Package Method:(unit:mm)
10 bag/box 3000 pcs/reel
215
Bar Code Label
245 230 167
220
Aluminum Foil Bag
645
6 box/carton
230 334
Ver.2.0 Page 3 of 7
179 1
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HE1G033B-TRB
Bin Limits Intensity Bin Limits (E1) (At 20mA) BIN CODE Min. (mcd)
G H J K 3.2 4.8 7.0 11 . 0
Max. (mcd)
6.3 9.4 14.0 21.0
Intensity Bin Limits (G0) (At 20mA) BIN CODE Min. (mcd)
F G H J 2.1 3.2 4.8 7.0
Max. (mcd)
4.2 6.3 9.4 14.0
Color Bin Limits (G0) (At 20mA) BIN CODE Min. (nm)
4 5 6 7 565 567 569 571 573
Max. (nm)
569 571 573 575 577
8
B IN x - x
x
Color BIN CODE (G0) Intensity BIN CODE (G0) Intensity BIN CODE (E1)
Ver.2.0 Page 4 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HE1G033B-TRB
Reliability Test
Classification Test Item Reference Standard Test Conditions Result
Operation Life MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202:103B High Humidity JIS-C-7021 :B-11 Endurance Storage Test High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low :B-12 Temperature JIS-C-7021 Storage Temperature MIL-STD-202:107D Cycling MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 Thermal Shock MIL-STD-202:107D Environmental MIL-STD-750:1051 Test MIL-STD-883:1011 Solder MIL-STD-202:201A Resistance MIL-STD-750:2031 JIS-C-7021 :A-1
Connect with a power If=20mA Ta=Under room temperature Test time=1,000hrs Ta=+655 RH=90%-95% Test time=240hrs High Ta=+855 Test time=1,000hrs Low Ta=-355 Test time=1,000hrs -35 ~ +25 ~ +85 ~ +25 60min 20min 60min 20min Test Time=5cycle -355 ~+855 20min 20min Test Time=10cycle Preheating 140-160,within 2 minutes. Operation heating 235(Max.), within 10seconds. (Max.)
0/20
0/20
0/20
0/20
0/20
0/20
0/20
Judgment criteria of failure for the reliability
Measuring items Forward voltage Reverse current Luminous intensity Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=20mA VR=5V IF=20mA Judgement criteria for failure Over Ux1.2 Over Ux2 Below SX0.5
Note:
1.U means the upper limit of specified characteristics.
S means initial value.
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test.
Ver.2.0 Page 5 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HE1G033B-TRB
Soldering :
1. Manual Of Soldering The temperature of the iron tip should not be higher than 300(572) and Soldering within 3 seconds per solder-land is to be observed. 2. Reflow Soldering Preheating : 140~1605,within 2 minutes. Operation heating : 235(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching).
10 SEC. MAX.
3. DIP soldering (Wave Soldering) : Preheating : 120~150,within 120~180 sec. Operation heating : 245 5 within 5 sec.260 (Max) Gradual Cooling (Avoid quenching).
Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook.
Temperature Temperature
140~160
235 MAX. 4 /SEC. MAX.
4 /SEC. MAX. OVER 2 MIN.
Time
Soldering heat Max. 260 120~150 245 5 within 5 sec.
Preheat 120~180 sec.
Time
Ver.2.0 Page 6 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HE1G033B-TRB
Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs.
Storage:
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5-30(41)Humidity : RH 60Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 24 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 12 hours at 603.
Package and Label of Products:
(1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on each bag. (2) Label:
BRIGHT LED LOGO Part No. Quantity BIN. Sealing Date x xx Year xx Month xx Day
Manufacture Location
Ver.2.0 Page 7 of 7

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