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TB7004FL TOSHIBA Multi-Chip Module TB7004FL Synchronous Buck Converter Module for High-Current and Low-Voltage Applications The TB7004FL is a synchronous buck converter (step-down chopper) module. A DC-DC converter can be formed by combining the TB7004FL with a PWM control IC, inductors, and input and output capacitors. Features * * * Operating frequency: up to 1 MHz Incorporates 5-V regulator (output current: 10 mA.) VCIN undervoltage lockout (UVLO) In UVLO mode, the GH and GL outputs are set Low and REG5V is set to 0 V. (The internal voltage regulator is shut down.) Thermal shutdown (TSD) Low-side MOSFET gate drive voltage: 5 to 12 V (max 16 V) The low-side MOSFET gate drive voltage is supplied externally via VGIN. DISBL# is a digital input and can receive either a 12-V or 5-V logic High signal. DISBL#: H = Enables the internal circuitry. L = Disables the internal circuitry and turns off both the high-side and low-side MOSFETs (GH = Low, GL = Low). The internal 5-V regulator remains active. The PWM input provides for 3-state output control. H: GH = H, GL = L L: GH = L, GL = H If the PWM input stays between the rising and falling threshold voltages for the 200-ns hold-off time, the TB7004FL turns off both the high-side and low-side MOSFETs. Thereafter, setting the PWM input High causes the TB7004FL to resume normal operation. The internal dead time control circuitry optimizes the switching of the high-side and low-side MOSFETs. Incorporates boot switch. Charge switch for the bootstrap capacitor (The boot switch behaves like a Schottky barrier diode.) QFN56-P-0808-0.85A Weight: 0.19 g (typ.) * * * * * * * Marking #1 pin index TOSHIBA TB7004FL MANUFACTURING CODE MANUFACTURING CODE (10 or 11 characters) Internal management code (may be null) Production week (The first week of the year is 01, and the last week of the year is 52 or 53.) Production year (last digit of the year) Assembly lot code (7 characters) Care should be taken for static electricity when handling this product since it has a MOS structure. 1 2007-11-13 TB7004FL Simplified Block Diagram VCIN BOOT GH VIN 1 56 THDN REG5V DISBL# PWM 43 42 CGND VGIN GL PGND (Bottom view) 29 28 Driver tab MOSFET gate driver High-side MOS tab 14 15 VSWH Low-side MOS tab Detailed Block Diagram 12 V 2 V VCIN REG5V GH Up to 19 V VIN DISBL# On/Off control 5 V Reg. UVLO Boot switch BOOT THDN TSD PWM 3-state control VGIN 5 to 16 V High-side driver 1.3 V/30 A Dead-time control VSWH Low-side driver CGND Driver IC PGND GL Undervoltage Lockout Circuit Output Signal H UVLO Normal operation L VL VH VCIN (V) 2 2007-11-13 TB7004FL Pin Configuration CGND CGND BOOT VGIN VCIN VIN VIN VIN VIN VIN VIN 1 PWM DISBL# REG5V THDN GL CGND VSWH VSWH VSWH VSWH VSWH VSWH VSWH VSWH 56 55 54 53 52 51 50 49 48 47 46 45 44 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 VIN GH NC VIN VIN VIN VIN VIN VIN VSWH PGND PGND PGND PGND PGND PGND PGND CGND VIN 17 18 19 20 21 22 23 VSWH 24 25 26 27 43 28 42 41 40 39 38 37 36 35 34 33 32 31 30 29 VSWH VSWH VSWH PGND PGND PGND PGND PGND PGND PGND PGND PGND PGND (Bottom View) Pin Description Symbol CGND NC VGIN VCIN BOOT GH VIN VSWH PGND GL THDN REG5V DISBL# PWM Pin No. 1, 6, 51, Tab 2 3 4 5 7 8 to 20, Tab Description Signal ground for control circuitry No-connect pin Power supply for low-side MOSFET gate drive Power supply for control circuitry Bootstrap capacitor connection High-side MOSFET gate signal Input pins. Connected to an input of the on-chip the DC-DC converter. For monitoring purposes Notes Connect to PGND. 21, 40 to 50, Tab Output pins. Output inductor connection 22 to 39 52 53 54 55 56 Power ground Low-side MOSFET gate signal Open-drain output that indicates that thermal shutdown (TSD) has been tripped. An external pull-up resistor should be added to the THDN pin. Held Low in thermal shutdown mode. Internal 5-V regulator output Disable signal for internal circuitry. Setting DISBL# High enables internal circuitry. Setting DISBL# Low disables internal circuitry. 3-state enable input Accepts both 5-V and 12-V signals. For monitoring purposes PGND 3 2007-11-13 TB7004FL Absolute Maximum Ratings (Ta = 25C) Characteristics VIN to PGND voltage VCIN to CGND voltage VSWH to PGND voltage VGIN to CGND voltage BOOT to VSWH voltage BOOT to CGND voltage PWM to CGND voltage DISBL# to CGND voltage THDN to CGND voltage Output RMS current Operating duty cycle REG5V current Power dissipation Channel temperature Storage temperature Tpcb = 25C Tpcb = 110C Symbol VIN VCIN VSWH VGIN VBOOT-VSWH VBOOT VPWM VDISBL# VTHDN IOUT D IREG5V PD (25) PD (110) Tch Tstg Rating 30 -0.3 to 16 -2 to 30 -0.3 to 16 -0.3 to REG5V + 0.3 -0.3 to 30 -0.3 to 5.3 -0.3 to VCIN + 0.3 -0.3 to 6 35 70 -10 to 0.1 25 8 -40 to 150 -55 to 150 Unit V V V V V V V V V A % mA W W C C Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 4 2007-11-13 TB7004FL Electrical Characteristics Characteristics Power supply Operating input voltage Operating input voltage Quiescent current Operating VGIN current Undervoltage lockout threshold Undervoltage lockout hysteresis PWM signal input PWM input rising threshold PWM input falling threshold PWM input resistance 3-state window 3-state shutdown hold-off time DISBL# signal input DISBL# input rising threshold DISBL# input falling threshold DISBL# input current REG5V output REG5V output voltage Line regulation Load regulation Thermal shutdown Thermal shutdown threshold Thermal shutdown hysteresis THDN output low voltage THDN sink current Ttsdn Thys - tsdn VOUT (THDN) ITHDN THDN THDN ITHDN = 2 mA 150 15 0.4 5 C C V mA VOUT(REG5V) Reg line Reg load REG5V REG5V REG5V IREG5V = -10 mA IREG5V = -10 mA, VCIN = 10 to 14 V IREG5V = 0 to -10 mA 4.75 5.0 5.25 20 20 V mV mV VH (DISBL#) VL (DISBL#) IDISBL# DISBL# DISBL# DISBL# VDISBL# = 0 3.2 1.3 3.5 1.5 3.8 1.7 5.0 V V A VH (PWM) VL (PWM) RPWM VW (PWM) thold PWM PWM PWM PWM PWM VPWM = 5 V VPWM = VW (PWM) 3.2 1.3 33 VL (PWM) 3.5 1.5 50 200 (Note 1) 3.8 1.7 77 VH (PWM) V V k V ns VIN (OPR) VCIN (OPR) ICIN (OFF) IGIN (OPR) VUVLO Vhys-UVLO VIN VCIN VCIN VGIN VCIN VCIN VDISBL# = 0, VPWM = 0 fC = 1 MHz, duty = 10% 10 6.5 12 7.2 2.0 19 14 1.3 60 7.9 V V mA mA V V (VCIN = 12 V, VGIN = 5 V, VDISBL# = 12 V, Ta = 25C, unless otherwise specified) Symbol Pin Test Condition Min Typ. Max Unit Note 1: Design target only. Not 100% tested in production. Note 2: Don't use the TB7004FL after thermal shutdown is tripped, because the thermal shutdown circuitry operates beyond the rated absolute maximum temperature. The thermal shutdown circuitry cannot always protect the device from failure. The device may be permanently damaged before thermal shutdown is tripped, depending on usage conditions. Refer to the description of thermal shutdown on page 13. 5 2007-11-13 TB7004FL Typical Application VIN = 12 V VGIN = 5 V VCIN = 12 V VCIN DISBL# PWM CGND VGIN TB7004FL REG5V PGND VIN BOOT VSWH VCIN DISBL# PWM PWM controller CGND VGIN TB7004FL REG5V PGND VIN BOOT VSWH PWM1 PWM2 PWM3 PWM4 VCIN DISBL# PWM CGND VGIN TB7004FL REG5V PGND VIN BOOT VSWH VCIN DISBL# PWM Signal GND Power GND CGND VGIN TB7004FL REG5V PGND VIN BOOT VSWH VOUT = 1.3 V 6 2007-11-13 TB7004FL Test Circuit IIN IGIN ICIN VCIN V VCIN 5 V pulse DISBL# PWM CGND VGIN TB7004FL REG5V VIN BOOT VSWH PGND Electric load IOUT VGIN V VIN V VIN VGIN VCIN A A A Signal GND Power GND Averaging circuit Averaging V output voltage VOUT PIN = IIN x VIN + ICIN x VCIN + IGIN x VGIN POUT = IOUT x VOUT Efficiency = POUT/PIN PLOSS = PIN - POUT 7 2007-11-13 TB7004FL Performance Characteristics PLOSS - IOUT 20 VIN = 12 V VCIN = 12 V VGIN = 5 V VOUT = 1.3 V fC = 1 MHz L = 0.6 H 20 PLOSS - VIN VCIN = 12 V VGIN = 5 V VOUT = 1.3 V fC = 1 MHz L = 0.6 H (W) Power loss PLOSS 12 Power loss PLOSS (W) 16 16 12 IOUT = 30 A 8 IOUT = 25 A 4 8 4 0 0 4 8 12 16 20 24 28 32 0 4 6 8 10 12 14 16 Output current IOUT (A) Input voltage VIN (V) PLOSS - VOUT 20 VIN = 12 V VCIN = 12 V VGIN = 5 V fC = 1 MHz L = 0.6 H 20 PLOSS - fC VIN = 12 V VCIN = 12 V VGIN = 5 V VOUT = 1.3 V L = 0.6 H (W) Power loss PLOSS 12 IOUT = 30 A 8 IOUT = 25 A Power loss PLOSS (W) 16 16 12 IOUT = 30 A 8 4 4 IOUT = 25 A 0 0.6 1.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 0 200 400 600 800 1000 1200 1400 1600 Output voltage VOUT (A) Switching frequency fC (kHz) 8 2007-11-13 TB7004FL PLOSS - L 20 VIN = 12 V VCIN = 12 V VGIN = 5 V VOUT = 1.3 V fC = 1 MHz 20 PLOSS - VGIN VIN = 12 V VCIN = 12 V VOUT = 1.3 V fC = 1 MHz L = 0.6 H (W) Power loss PLOSS 12 IOUT = 30 A IOUT = 25 A 4 Power loss PLOSS (W) 16 16 12 IOUT = 30 A 8 IOUT = 25 A 8 4 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0 4 6 8 10 12 14 16 Output inductance L (H) VGIN (V) IGIN - fC 500 VIN = 12 V VCIN = 12 V VOUT = 1.3 V IOUT = 0 A L = 0.6 H 100 ICIN - fC VIN=12 V VCIN = 12 V VOUT = 1.3 V IOUT = 0 A L = 0.6 H 400 80 (mA) Average IGIN 200 VGIN = 16 V Average IGIN 300 (mA) 60 40 VGIN = 5 V VGIN = 12 V 100 VGIN = 12 V VGIN = 5 V 20 VGIN = 16 V 1600 0 200 400 600 800 1000 1200 1400 1600 0 200 400 600 800 1000 1200 1400 Switching frequency fC (kHz) Switching frequency fC (kHz) 9 2007-11-13 TB7004FL Safe Operting Area 40 35 (A) Output current (A) 30 25 20 15 10 5 0 0 25 50 75 o 100 125 150 () PCB temperature ( C) VIN = 12 V, VCIN = 12 V, VGIN = 5 V, VOUT = 1.3 V, fC = 1 MHz, L = 0.6 H Note: This safe operating area was obtained using the following evaluation board. The safe operating area varies with board conditions. Board conditions Material: FR-4 Number of layers: 4 Copper thickness: 35 m Board size: 75 mm x 55 mm Board thickness: 2.4 mm 10 2007-11-13 TB7004FL Operational Description Power Supplies VGIN: Power supply for low-side MOSFET gate drive The low-side gate drive voltage can be selected, independent of VCIN. Supply voltage: 5 to 16 V VCIN: Power supply for the internal control circuitry Incorporates undervoltage lockout (UVLO.) UVLO threshold voltage: 7.2 V (typ.) UVLO hysteresis voltage: 2.0 V (typ.) In UVLO mode, the TB7004FL turns off both the high-side and low-side MOSFETs and shuts down the internal 5-V regulator. UVLO Normal operation 7.2 9.2 VCIN (V) DISBL# The DISBL# input enables and disables the MOSFET drivers. H: Normal operation L: Turns off both the high-side and low-side MOSFETs. Rising threshold voltage: 3.5 V (typ.) Falling threshold voltage: 1.5 V (typ.) While the MOSFET drivers are disabled, the 5-V regulator remains active. Disabled Enabled 1.5 3.5 DISBL# (V) PWM Control input for the internal power MOSFET drivers H: Turns on the high-side MOSFET and turns off the low-side MOSFET. L: Turns off the high-side MOSFET and turns on the low-side MOSFET. Rising threshold voltage: 3.5 V (typ.) Falling threshold voltage: 1.5 V (typ.) If the PWM input stays between the rising and falling threshold voltages for the 200-ns hold-off time, the TB7004FL turns off both the high-side and low-side MOSFETs. Thereafter, setting the PWM input High causes the TB7004FL to resume normal operation. 11 2007-11-13 TB7004FL 200 ns 200 ns PWM 3.5 V 1.5 V ON High-side MOSFET OFF ON Low-side MOSFET OFF 200 ns 200 ns PWM 3.5 V 1.5 V ON High-side MOSFET OFF ON Low-side MOSFET OFF Inputs VCIN L H H H H DISBL# L Open H H PWM L H REG5V OFF ON ON ON ON Outputs High-Side MOSFET OFF OFF OFF OFF ON Low-Side MOSFET OFF OFF OFF ON OFF 12 2007-11-13 TB7004FL Thermal Shutdown If the integrated driver IC temperature exceeds 165C, thermal shutdown is tripped. TSD hysteresis: 15C (typ.) If the integrated MOS chip is the heating source, it takes some time for the overtemperature to be detected at the sensor due to the distance between them. The chip temperature might exceed the TSD threshold before the thermal shutdown circuitry is tripped. In the TSD mode, the TB7004FL turns off both the low-side and high-side MOSFETs and keeps the internal 5-V regulator active. Normal operation Thermal shutdown 135 150 TIC (C) THDN THDN is an open-drain output that indicates thermal shutdown. An external pull-up resistor should be connected to this pin. During normal operation, the internal switch is off, causing THDN to be High. In thermal shutdown mode, the internal switch is on, causing THDN to be Low. BOOT BOOT is an input pin from which the bootstrap capacitor is charged. The bootstrap capacitor should be connected between this pin and VSWH. While the PWM signal is Low (i.e., the high-side MOSFET is off), the bootstrap capacitor is charged from the internal 5-V regulator. Be sure to use a sufficiently large capacitor. Typical capacitance: > 0.2 F (VIN = 12 V, VOUT = 1.3 V, fC = 1 MHz) 13 2007-11-13 TB7004FL Package Dimensions Top View Bottom View Side View Weight: 0.19 g (typ.) 14 2007-11-13 TB7004FL Recommended PCB Footprint Unit: mm 0.55 2.20 0.75 1 0.75 0.55 0.30 29 0.23 0.50 42 2.25 0.75 3.50 28 43 7.80 7.80 0.75 14 3.55 15 56 Note On Drypacking After the drypack is opened, the devices should be soldered within 168 hours of exposure to 30C / 60% RH. 15 2007-11-13 TB7004FL RESTRICTIONS ON PRODUCT USE * The information contained herein is subject to change without notice. 20070701-EN * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 16 2007-11-13 |
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