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HSMB-Cxxx
Surface Mount Chip LEDs
Data Sheet
HSMB-C190, HSMB-C170, HSMB-C110, HSMB-C150, HSMB-C191
Description
TheseBluechipLEDsaredesignedinanindustrystandard package for ease of handling and use. Blue color chip LEDisanewproductthatofferscolordifferentiationfor backlightingapplications. TheHSMB-C150hastheindustrystandard3.2x1.6mm footprintthatisexcellentforallarounduse.TheHSMBC170hasthewidelyused2.0x1.25mmfootprint.The HSMB-C190andHSMB-C191havetheindustrystandard 1.6x0.8mmfootprint,andtheirlowprofiles(0.8mmfor HSMB-C190and0.6mmforHSMB-C191)andwideviewinganglesmaketheseLEDsexceptionalforbacklighting applications. TheHSMB-C110isaright-anglepackagewiththeuniversallyaccepteddimensionsof3.2x1.0x1.5mm.Thispartis idealforLCDbacklightingandsidelightingapplications. All packages are compatible with IR reflow solder processes.Thesmallsizeandwideviewinganglemakethese LEDsprimechoicesforbacklightingapplicationsandfront panelilluminationespeciallywherespaceisapremium.
Features
* * * * * * * * SmallSize IndustryStandardFootprint CompatiblewithIRSolder DiffusedOptics OperatingTemperatureRangeof-30Cto+85C RightAnglePackageAvailable SiCBlueColor Availablein8mmTapeon7"(178mm)Diameter Reels
Applications
* * * * * KeypadBacklighting Push-ButtonBacklighting LCDBacklighting SymbolBacklighting FrontPanelIndicator
Device Selection Guide
Footprint (mm) 2.00 x 1.25 1.60 x 0.80 3.20 x 1.00[1] 3.20 x 1.60 Note: SiC Blue HSMB-C170 HSMB-C190/C191 HSMB-C110 HSMB-C150 Parts Per Reel 4000 4000 3000 3000
1. Right-anglepackage.
CAUTION: HSMB-C1xx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Package Dimensions
LED DIE CATHODE MARK
LED DIE
CATHODE MARK
0.8 (0.031) 1.6 (0.063 ) 0.4 (0.016)
1.25 (0.049)
2.0 (0.079 )
0.62 (0.024)
1.0 (0.039) 0.3 (0.012) DIFFUSED EPOXY PC BOARD
POLARITY
DIFFUSED EPOXY 0.3 (0.012) PC BOARD
1.4 (0.055)
POLARITY
0.8 (0.031)
0.8 (0.031) 0.3 (0.012)
0.3 (0.012) CATHODE LINE 0.4 0.15 (0.016 0.006) 0.4 0.15 (0.016 0.006)
CATHODE LINE 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006) 0.7 (0.028) MIN.
SOLDERING TERMINAL
SOLDERING TERMINAL
HSMB-C190
HSMB-C190 Pkg Dimen - a (C190) CATHODE
HSMB-C170
HSMB-C190 Pkg Dimen - b (C170)
LED DIE
LINE
1.0 (0.039)
LED DIE
CATHODE MARK
2.6 (0.102 ) 3.2 (0.126 ) CLEAR EPOXY 1.5 (0.059) PC BOARD 1.6 (0.063 ) 3.2 (0.126 ) 0.8 (0.031) CATHODE LINE 0.5 (0.020)
DIFFUSED EPOXY 0.6 (0.024)
1.6 (0.063) 0.8 (0.031)
POLARITY
3.2 (0.126 )
2.0 (0.079)
POLARITY
1.1 (0.043) PC BOARD CATHODE LINE 0.50 0.2 (0.020 0.008) 0.5 (0.020) 0.50 0.2 (0.020 0.008)
1.0 (0.039)
SOLDERING TERMINAL
SOLDERING TERMINAL
HSMB-C110
2
HSMB-C110
HSMx-C190 Pkg Dimen - a (C150)
HSMB-C150
LED DIE
CATHODE MARK
0.8 (0.031) 0.4 (0.016)
1.6 (0.063 ) 1.0 (0.039) 0.3 (0.012) DIFFUSED EPOXY PC BOARD
POLARITY
CATHODE LINE 0.3 0.15 (0.012 0.006)
0.6 (0.023) 0.3 (0.012) 0.3 0.15 (0.012 0.006) 0.7 (0.028) MIN.
SOLDERING TERMINAL
HSMB-C191
NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
HSMx-C191
Absolute Maximum Ratings at TA=25C
Parameter HSMB-C190/C170/C110/C150/C191 DCForwardCurrent[1] 20 [2] PeakPulsingCurrent 100 PowerDissipation 92 ReverseVoltage(IR=100A) 5 MaximumLEDJunctionTemperature 95 OperatingTemperatureRange -30to+85 StorageTemperatureRange -40to+85 SolderingTemperature Seereflowsolderingprofile(Figure7&8) Notes:
1. DeratelinearlyasshowninFigure4fortemperatureabove25C. 2.Pulseconditionof1/10dutyand0.1msec.width.
Units mA mA mW V C C C
3
Optical Characteristics at TA=25C
Part No. HSMB- C190/C170/ C150/C191 HSMB-C110 Notes: Color SiCBlue SiCBlue Luminous Intensity[1] Iv (mcd) @ 20 mA Min. Typ. 1.80 6.0 1.80 6.5 Peak Wavelength peak (nm) Typ. 428 428 Dominant Wavelength d (nm) Typ. 466 466 Viewing Angle 21/2 (degrees)[2] Typ. 170 130
1. Theluminousintensity,Iv,ismeasuredatthepeakofthespatialradiationpattern,whichmaynotbealignedwiththemechanicalaxisofthe lamppackage. 2.u1/2istheoff-axisanglewheretheluminousintensityis1/2thepeakintensity.
Electrical Characteristics at TA=25C
Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 3.8 4.6 3.8 4.6 Reverse Breakdown VR (Volts) @ IR = 100 A Min. 5 5 Thermal Resistance RJ-P (C/W) Typ. 300 300 Capacitance C (pF) @ VF = 0 V, f = 1 MHz Typ. 67 67
Part No. HSMB-C190/C170/C150/C191 HSMB-C110
VFTolerance:0.1V
Light Intensity (Iv) Bin Limits[1]
Blue Color Bins[1] Dom. Wavelength (nm) Min. Max. 460.0 465.0 465.0 470.0 470.0 475.0 475.0 480.0 Intensity (mcd) Bin ID Min. Max. A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 Tolerance:15% Bin ID N P Q R S T U V W X Y Intensity (mcd) Min. 28.50 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 Max. 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 4500.00

Bin ID A B C D
Tolerance:1nm Note: 1.Bincategoriesareestablishedforclassificationofproducts.Productsmaynotbe availableinallcategories.Pleasecontact yourAvagorepresentativeforinformation oncurrentlyavailablebins.
Note: 1.Bincategoriesareestablishedforclassificationofproducts.Productsmaynotbeavailablein allcategories.PleasecontactyourAvagorepresentativeforinformationoncurrentlyavailablebins.
4
100 IF - FORWARD CURRENT - mA RELATIVE INTENSITY - % 80 60 40 20 0 380
100
RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
1.2 1.0 0.8 0.6 0.4 0.2 0
10
1
480
580
680
0.1
3.0
3.2
3.4
3.6
3.8
4.0
0
5
10
15
20
25
WAVELENGTH - nm
VF - FORWARD VOLTAGE - V
IF - FORWARD CURRENT - mA
Figure 1. Relative Intensity vs. Wavelength.
HSMB-C190 fig 1
Figure 2. Forward Current vs. Forward Voltage.
HSMB-C190 fig 2
Figure 3. Relative Luminous Intensity vs. Forward Current.
HSMB-C190 fig 3
IF MAX. - MAXIMUM FORWARD CURRENT - mA
25 20 15 10 5 0
100 90
RELATIVE INTENSITY - %
80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10
0
20
40
60
80
100
0
10 20 30 40 50 60 70 80 90
TA - AMBIENT TEMPERATURE - C
ANGLE
Figure 4. Maximum Forward Current vs. Ambient Temperature. HSMB-C190 fig 4
RELATIVE INTENSITY - %
100 90 80 70 60 50 40 30 20 10
HSMB-C190 fig 5a
0 -90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative Intensity vs. Angle for HSMB-C110. fig 5b HSMB-C190
5
100 90
RELATIVE INTENSITY - %
80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
TEMPERATURE 10 SEC. MAX. 230C MAX. 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 4C/SEC. MAX. -3C/SEC. MAX.
ANGLE
Figure 6. Relative Intensity vs. Angle for HSMB-C170, HSMB-C190, HSMB-C150, and HSMB-C191.
HSMB-C190 fig 6
Figure 7. Recommended reflow soldering profile.
HSMB-C190 fig 7
10 - 30 SEC.
TEMPERATURE
217 C 200 C 150 C
255 - 260 C 3 C/SEC. MAX. 6 C/SEC. MAX.
1.2 (0.047)
3 C/SEC. MAX. 60 - 120 SEC. TIME 100 SEC. MAX.
1.2 (0.047)
1.2 (0.047)
0.9 (0.035)
(Acc. to J-STD-020C)
Figure 8. Recommended Pb-free Reflow Soldering Profile.
Figure 9. Recommended Soldering Pattern for HSMB-C170.
HSMB-C190 fig 8
5.0 (0.200)
0.8 (0.031)
0.9 (0.035) 0.9 (0.035)
0.8 (0.031)
0.7 (0.028)
0.8 (0.031)
0.2 (0.008)
1.0 (0.039)
Figure 10. Recommended Soldering Pattern for HSMB-C190 and C191.
HSMB-C190 fig 9
1.5 (0.059)
2.0 (0.079)
1.5 (0.059)
Figure 11. Recommended Soldering Pattern for HSMB-C110.
Note: 1. Alldimensionsinmillimeters(inches).
HSSM-C110 fig 8
6
USER FEED DIRECTION
1.5 (0.059) CATHODE SIDE
1.5 (0.059)
2.0 (0.079)
1.5 (0.059) PRINTED LABEL
Figure 12. Recommended Soldering Pattern for HSMB-C150.
HSMX-C190 fig 8
Figure 13. Reeling Orientation.
8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) O 13.1 0.5 (O 0.516 0.020)
O 20.20 MIN. (O 0.795 MIN.) 3.0 0.5 (0.118 0.020)
178.40 1.00 (7.024 0.039)
59.60 1.00 (2.346 0.039)
4.0 0.5 (0.157 0.020)
6 PS
5.0 0.5 (0.197 0.020)
Figure 14. Reel Dimensions.
Note: 1. Alldimensionsinmillimeters(inches).
7
4.00 (0.157)
1.50 (0.059)
CATHODE
DIM. C (SEE TABLE 1)
0.20 0.05 (0.008 0.002)
1.75 (0.069) 3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012) CARRIER TAPE COVER TAPE
DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002)
USER FEED DIRECTION 4.00 (0.157)
TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMx-C191 SERIES HSMx-C190 SERIES HSMx-C170 SERIES HSMx-C110 SERIES HSMx-C150 SERIES R 1.0 0.05 (0.039 0.002) DIM. A DIM. B DIM. C 0.10 ( 0.004) 0.10 ( 0.004) 0.10 ( 0.004) 1.85 (0.073) 1.80 (0.071) 2.30 (0.091) 3.40 (0.134) 3.50 (0.138) 0.88 (0.035) 0.95 (0.037) 1.45 (0.057) 1.70 (0.067) 1.88 (0.074) 0.85 (0.033) 0.87 (0.034) 0.95 (0.037) 1.20 (0.047) 1.27 (0.050)
HSMx-C110 POSITION IN CARRIER TAPE
DIM. A (SEE TABLE 1)
DIM. B (SEE TABLE 1)
Figure 15. Tape Dimensions.
END START
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
MOUNTED WITH COMPONENTS
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE.
Figure 16. Tape Leader and Trailer Dimensions. Notes: HSMB-C190 fig 14 1. Alldimensionsinmillimeters(inches). 2.Toleranceis0.1mm(0.004in.)unlessotherwisespecified.
8
Reflow Soldering:
Formoreinformationonreflowsoldering,refertoApplicationNoteAN-1060,SurfaceMountingSMTLEDIndicator Components.
Storage Condition: 5to30C@60%RHmax.
Bakingisrequiredbeforemounting,if: 1. HumidityIndicatorCardis>10%whenreadat235C. 2. Deviceexposetofactoryconditions<30C/60%RHmorethan672hours.
Recommended baking condition: 605Cfor20hours.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-0417EN AV02-0613EN - July 27, 2007

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