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| STB140NF55 - STB140NF55-1 STP140NF55 N-channel 55V - 0.0065 - 80A - D2PAK - I2PAK - TO-220 STripFETTM II Power MOSFET General features Type STB140NF55 STB140NF55-1 STP140NF55 VDSS 55V 55V 55V RDS(on) <0.008 <0.008 <0.008 ID (1) 80A 80A 80A 3 1 2 1. Current limited by package 3 1 3 12 Description This Power MOSFET is the latest development of STMicroelectronics unique "Single Feature SizeTM" strip-based process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalance characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility. TO-220 DPAK IPAK Internal schematic diagram Applications Motor control High current, switching application Order codes Part number STB140NF55 STB140NF55-1 STP140NF55 Marking B140NF55 B140NF55 P140NF55 Package DPAK IPAK TO-220 Packaging Tape & reel Tube Tube March 2007 Rev 4 1/15 www.st.com Contents STB140NF55 - STB140NF55-1 - STP140NF55 Contents 1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 6 3 4 5 6 Test circuit ................................................ 8 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2/15 STB140NF55 - STB140NF55-1 - STP140NF55 Electrical ratings 1 Electrical ratings Table 1. Symbol VDS VGS ID (1) Absolute maximum ratings Parameter Drain-source voltage (VGS = 0) Gate- source voltage Drain current (continuous) at TC = 25C Drain current (continuous) at TC = 100C Drain current (pulsed) Total dissipation at TC = 25C Derating factor Value 55 20 80 80 320 300 2 10 1.3 -55 to 175 Operating junction temperature Unit V V A A A W W/C V/ns J C ID (1) IDM (2) PTOT dv/dt (3) EAS (4) Peak diode recovery voltage slope Single pulse avalance energy Storage temperature Tstg Tj 1. Current limited by package 2. Pulse width limited by safe operating area 3. ISD < 80A, di/dt < 300A/s, VDD=80%V(BR)DSS 4. Starting Tj = 25C, ID = 40A, VDD = 30V Table 2. Symbol Rthj-case Rthj-amb Thermal data Value Parameter TO-220 - IPAK Thermal resistance junction-case max Thermal resistance junction-ambient max 62.5 -300 0.5 -- Unit DPAK C/W C/W C/W C Rthj-pcb (1) Thermal resistance junction-pcb max Tl Maximum lead temperature for soldering purpose (for 10 sec, 1.6mm from case) 35 1. When mounted on 1 inch, FR4 board, 2 oz Cu 3/15 Electrical characteristics STB140NF55 - STB140NF55-1 - STP140NF55 2 Electrical characteristics (TCASE=25C unless otherwise specified) Table 3. Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on) On/off states Parameter Drain-source breakdown voltage Zero gate voltage drain current (VGS = 0) Gate-body leakage current (VDS = 0) Gate threshold voltage Static drain-source on resistance Test conditions ID = 250 A, VGS = 0 VDS = Max rating VDS = Max rating, TC = 125 C VGS = 20V VDS = VGS, ID = 250A VGS = 10 V, ID = 40 A 2 3 Min. 55 1 10 100 4 Typ. Max. Unit V A A nA V 0.0065 0.008 Table 4. Symbol gfs (1) Ciss Coss Crss Qg Qgs Qgd Dynamic Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-source charge Gate-drain charge Test conditions VDS = 15V, ID= 40 A VDS = 25V, f = 1 MHz VGS = 0 VDD = 44V, ID= 80A VGS =10V (see Figure 14) Min. Typ. 100 5300 1000 290 142 27 55 Max. Unit S pF pF pF nC nC nC 1. Pulsed: pulse duration = 300s, duty cycle 1.5% 4/15 STB140NF55 - STB140NF55-1 - STP140NF55 Electrical characteristics Table 5. Symbol td(on) tr td(off) tf Switching times Parameter Turn-on delay time Rise time Turn-off-delay time Fall time Test conditions VDD = 27.5 V, ID = 40A RG = 4.7 , VGS = 10V (see Figure 13) VDD = 27.5V, ID = 40A, RG = 4.7, VGS = 10V (see Figure 13) Min. Typ. 30 150 125 45 Max. Unit ns ns ns ns Table 6. Symbol ISD ISDM (1) VSD (2) trr Qrr IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 80A, VGS = 0 ISD = 80A, di/dt = 100 A/s, VDD = 20V, Tj = 150C (see Figure 15) 90 275 6.5 Test conditions Min. Typ. Max. 80 320 1.5 Unit A A V ns nC A 1. Pulse width limited safe operating area 2. Pulsed: pulse duration = 300s, duty cycle 1.5% 5/15 Electrical characteristics STB140NF55 - STB140NF55-1 - STP140NF55 2.1 Figure 1. Electrical characteristics (curves) Safe operating area Figure 2. Thermal impedance Figure 3. Output characteristics Figure 4. Transfer characteristics Figure 5. Transconductance Figure 6. Static drain-source on resistance 6/15 STB140NF55 - STB140NF55-1 - STP140NF55 Figure 7. Gate charge vs gate-source voltage Figure 8. Electrical characteristics Capacitance variations Figure 9. Normalized gate threshold voltage vs temperature Figure 10. Normalized on resistance vs temperature Figure 11. Source-drain diode forward characteristics Figure 12. Normalized BVDSS vs temperature 7/15 Test circuit STB140NF55 - STB140NF55-1 - STP140NF55 3 Test circuit Figure 14. Gate charge test circuit Figure 13. Switching times test circuit for resistive load Figure 15. Test circuit for inductive load Figure 16. Unclamped inductive load test switching and diode recovery times circuit Figure 17. Unclamped inductive waveform Figure 18. Switching time waveform 8/15 STB140NF55 - STB140NF55-1 - STP140NF55 Package mechanical data 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 9/15 Package mechanical data STB140NF55 - STB140NF55-1 - STP140NF55 TO-220 mechanical data mm Dim Min A b b1 c D D1 E e e1 F H1 J1 L L1 L20 L30 P Q 4.40 0.61 1.14 0.49 15.25 1.27 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 Typ Max 4.60 0.88 1.70 0.70 15.75 Min 0.173 0.024 0.044 0.019 0.6 inch Typ Max 0.181 0.034 0.066 0.027 0.62 0.050 0.409 0.106 0.202 0.051 0.256 0.107 0.551 0.154 0.645 1.137 0.151 0.116 10/15 STB140NF55 - STB140NF55-1 - STP140NF55 Package mechanical data TO-262 (I2PAK) MECHANICAL DATA mm. DIM. MIN. A A1 b b1 c c2 D e e1 E L L1 L2 4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27 TYP MAX. 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40 MIN. 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.194 0.393 0.511 0.137 0.050 TYP. MAX. 0.181 0.107 0.034 0.066 0.027 0.052 0.368 0.106 0.202 0.410 0.551 0.154 0.055 inch 11/15 Package mechanical data STB140NF55 - STB140NF55-1 - STP140NF55 D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA mm. DIM. MIN. A A1 A2 B B2 C C2 D D1 E E1 G L L2 L3 M R V2 0 4.88 15 1.27 1.4 2.4 0.4 4 10 8.5 5.28 15.85 1.4 1.75 3.2 0.192 0.590 0.050 0.055 0.094 0.015 4.4 2.49 0.03 0.7 1.14 0.45 1.23 8.95 8 10.4 0.393 0.334 0.208 0.625 0.055 0.068 0.126 TYP MAX. 4.6 2.69 0.23 0.93 1.7 0.6 1.36 9.35 MIN. 0.173 0.098 0.001 0.027 0.044 0.017 0.048 0.352 0.315 TYP. MAX. 0.181 0.106 0.009 0.036 0.067 0.023 0.053 0.368 inch 3 1 12/15 STB140NF55 - STB140NF55-1 - STP140NF55 Packaging mechanical data 5 Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. A B C D G N T 1.5 12.8 20.2 24.4 100 30.4 26.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0795 0.960 1.039 3.937 1.197 BULK QTY 1000 inch MIN. MAX. 12.992 TAPE MECHANICAL DATA DIM. A0 B0 D D1 E F K0 P0 P1 P2 R T W mm MIN. 10.5 15.7 1.5 1.59 1.65 11.4 4.8 3.9 11.9 1.9 50 0.25 23.7 24.3 MAX. 10.7 15.9 1.6 1.61 1.85 11.6 5.0 4.1 12.1 2.1 inch MIN. MAX. 0.413 0.421 0.618 0.626 0.059 0.063 0.062 0.063 0.065 0.073 0.449 0.456 0.189 0.197 0.153 0.161 0.468 0.476 0.075 0.082 1.574 0.35 0.0098 0.0137 0.933 0.956 BASE QTY 1000 * on sales type 13/15 Revision history STB140NF55 - STB140NF55-1 - STP140NF55 6 Revision history Table 7. Date 07-Dec-2004 07-Apr-2006 04-Aug-2006 02-Mar-2007 Revision history Revision 1 2 3 4 Initial release. Updated Figure 8 New template, modified Figure 1 Applications have been updated Changes 14/15 STB140NF55 - STB140NF55-1 - STP140NF55 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. 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